DE60132528D1 - Microlötverfahren und -vorrichtung - Google Patents

Microlötverfahren und -vorrichtung

Info

Publication number
DE60132528D1
DE60132528D1 DE60132528T DE60132528T DE60132528D1 DE 60132528 D1 DE60132528 D1 DE 60132528D1 DE 60132528 T DE60132528 T DE 60132528T DE 60132528 T DE60132528 T DE 60132528T DE 60132528 D1 DE60132528 D1 DE 60132528D1
Authority
DE
Germany
Prior art keywords
microloading
microloading process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60132528T
Other languages
English (en)
Other versions
DE60132528T2 (de
Inventor
Yaoling Pan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Fiber IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Fiber IP Singapore Pte Ltd filed Critical Avago Technologies Fiber IP Singapore Pte Ltd
Publication of DE60132528D1 publication Critical patent/DE60132528D1/de
Application granted granted Critical
Publication of DE60132528T2 publication Critical patent/DE60132528T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
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    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H05K2201/10621—Components characterised by their electrical contacts
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    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
DE60132528T 2000-10-02 2001-08-27 Mikrolötverfahren und -vorrichtung Expired - Lifetime DE60132528T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US678288 2000-10-02
US09/678,288 US6423939B1 (en) 2000-10-02 2000-10-02 Micro soldering method and apparatus

Publications (2)

Publication Number Publication Date
DE60132528D1 true DE60132528D1 (de) 2008-03-13
DE60132528T2 DE60132528T2 (de) 2009-01-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE60132528T Expired - Lifetime DE60132528T2 (de) 2000-10-02 2001-08-27 Mikrolötverfahren und -vorrichtung

Country Status (4)

Country Link
US (1) US6423939B1 (de)
EP (1) EP1193750B1 (de)
JP (1) JP2002176074A (de)
DE (1) DE60132528T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US6423939B1 (en) 2002-07-23
EP1193750A3 (de) 2002-07-10
DE60132528T2 (de) 2009-01-15
EP1193750A2 (de) 2002-04-03
JP2002176074A (ja) 2002-06-21
EP1193750B1 (de) 2008-01-23

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