DE60140982D1 - Polierverfahren und Vorrichtung - Google Patents

Polierverfahren und Vorrichtung

Info

Publication number
DE60140982D1
DE60140982D1 DE60140982T DE60140982T DE60140982D1 DE 60140982 D1 DE60140982 D1 DE 60140982D1 DE 60140982 T DE60140982 T DE 60140982T DE 60140982 T DE60140982 T DE 60140982T DE 60140982 D1 DE60140982 D1 DE 60140982D1
Authority
DE
Germany
Prior art keywords
polishing method
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140982T
Other languages
English (en)
Inventor
Hiroomi Torii
Hiroshi Kojima
Suguru Ogura
Soichi Isobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60140982D1 publication Critical patent/DE60140982D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60140982T 2000-05-26 2001-05-28 Polierverfahren und Vorrichtung Expired - Lifetime DE60140982D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000156690A JP2001334458A (ja) 2000-05-26 2000-05-26 ポリッシング方法

Publications (1)

Publication Number Publication Date
DE60140982D1 true DE60140982D1 (de) 2010-02-25

Family

ID=18661445

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140982T Expired - Lifetime DE60140982D1 (de) 2000-05-26 2001-05-28 Polierverfahren und Vorrichtung

Country Status (6)

Country Link
US (1) US6746312B2 (de)
EP (1) EP1157783B1 (de)
JP (1) JP2001334458A (de)
KR (1) KR100777342B1 (de)
DE (1) DE60140982D1 (de)
TW (1) TW577784B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4323129B2 (ja) * 2002-02-15 2009-09-02 株式会社ディスコ 板状物の搬送機構
JP2004193289A (ja) * 2002-12-10 2004-07-08 Ebara Corp ポリッシング方法
US6908366B2 (en) * 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
EP1590127A1 (de) * 2003-01-10 2005-11-02 3M Innovative Properties Company Unterlagenkonstruktionen für chemisch-mechanische planarisierungsanwendungen
JP4086722B2 (ja) * 2003-06-24 2008-05-14 株式会社荏原製作所 基板保持装置及び研磨装置
US7338569B2 (en) * 2004-09-29 2008-03-04 Agere Systems Inc. Method and system of using offset gage for CMP polishing pad alignment and adjustment
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
CN108466131A (zh) * 2018-05-30 2018-08-31 四川欧瑞特光电科技有限公司 一种光学元件加工设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658190A (en) * 1995-12-15 1997-08-19 Micron Technology, Inc. Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
JP3705670B2 (ja) 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US6132294A (en) * 1998-09-28 2000-10-17 Siemens Aktiengesellschaft Method of enhancing semiconductor wafer release
US6280291B1 (en) * 1999-02-16 2001-08-28 Speedfam-Ipec Corporation Wafer sensor utilizing hydrodynamic pressure differential
KR100335485B1 (ko) * 1999-07-02 2002-05-04 윤종용 화학적-기계적 폴리싱 장치 및 방법

Also Published As

Publication number Publication date
KR100777342B1 (ko) 2007-11-20
EP1157783A2 (de) 2001-11-28
JP2001334458A (ja) 2001-12-04
US20020002028A1 (en) 2002-01-03
KR20010107761A (ko) 2001-12-07
TW577784B (en) 2004-03-01
US6746312B2 (en) 2004-06-08
EP1157783B1 (de) 2010-01-06
EP1157783A3 (de) 2003-10-15

Similar Documents

Publication Publication Date Title
DE60128768D1 (de) Polierverfahren und vorrichtung
NO20025507L (no) Brönnreferanseapparat samt fremgangsmåte
DE60133359D1 (de) Informationsverarbeitungsvorrichtung und verarbeitungsverfahren
DE60233840D1 (de) Elektrooptische Vorrichtung und zugehöriges Herstellungsverfahren
DE60120093D1 (de) Bildgebende Vorrichtung und bildgebendes Verfahren
DE60139045D1 (de) Kommunikationsvorrichtung und Kommunikationsverfahren
DE60139037D1 (de) RFID Kommunikationsverfahren und Vorrichtung
DE60125913D1 (de) Datenübertragungsverfahren und vorrichtung
DE60139567D1 (de) Datenverarbeitungsgerät und verfahren zur sicherung des zurückzustands
DE60234299D1 (de) FFS-Verfahren und Vorrichtung
DE60326702D1 (de) Polierverfahren und poliervorrichtung
DE60129897D1 (de) Datenverarbeitungsverfahren und Gerät
DE60100579D1 (de) Bilderzeugungsverfahren und Gerät
DE69829919D1 (de) Polierverfahren und Vorrichtung
DE50112910D1 (de) Navigationsverfahren und -vorrichtung
DE10085264T1 (de) Drahtentladungsbearbeitungsverfahren und Vorrichtung
DE60104583D1 (de) Bördelvorrichtung und Bördelverfahren
DE60232497D1 (de) Poliervorrichtung und -verfahren
DE60238229D1 (de) Sendevorrichtung und sendeverfahren
DE60224493D1 (de) Spinnvorrichtung und -verfahren
DE69913476D1 (de) Polierverfahren und vorrichtung
DE60118450D1 (de) Kommunikationsverfahren und Kommunikationsgerät
DE60139736D1 (de) Kommunikationsverfahren und Gerät
DE60025792D1 (de) Bearbeitungsvorrichtung und Bearbeitungsverfahren
DE60110971D1 (de) Zerstäubungsvorrichtung und Verfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition