DE60127017D1 - Aufschlämmungsrückfluss-Vorrichtung - Google Patents

Aufschlämmungsrückfluss-Vorrichtung

Info

Publication number
DE60127017D1
DE60127017D1 DE60127017T DE60127017T DE60127017D1 DE 60127017 D1 DE60127017 D1 DE 60127017D1 DE 60127017 T DE60127017 T DE 60127017T DE 60127017 T DE60127017 T DE 60127017T DE 60127017 D1 DE60127017 D1 DE 60127017D1
Authority
DE
Germany
Prior art keywords
aufschlämmungsrückfluss
aufschlämmungsrückfluss device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60127017T
Other languages
English (en)
Other versions
DE60127017T2 (de
Inventor
Mitsuyoshi Uto
Nobuki Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoko Kagaku Co Ltd Jp
Renesas Electronics Corp
Original Assignee
NEC Electronics Corp
Toyoko Kagaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp, Toyoko Kagaku Co Ltd filed Critical NEC Electronics Corp
Publication of DE60127017D1 publication Critical patent/DE60127017D1/de
Application granted granted Critical
Publication of DE60127017T2 publication Critical patent/DE60127017T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
DE60127017T 2000-04-06 2001-04-05 Schleifaufschlämmungsrezyklierungsvorrichtung Expired - Lifetime DE60127017T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000104806A JP2001287163A (ja) 2000-04-06 2000-04-06 研磨用スラリー再生装置
JP2000104806 2000-04-06

Publications (2)

Publication Number Publication Date
DE60127017D1 true DE60127017D1 (de) 2007-04-19
DE60127017T2 DE60127017T2 (de) 2007-12-13

Family

ID=18618290

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60127017T Expired - Lifetime DE60127017T2 (de) 2000-04-06 2001-04-05 Schleifaufschlämmungsrezyklierungsvorrichtung

Country Status (6)

Country Link
US (1) US6547961B2 (de)
EP (1) EP1142672B1 (de)
JP (1) JP2001287163A (de)
KR (1) KR20010098452A (de)
DE (1) DE60127017T2 (de)
TW (1) TW575478B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1273391B1 (de) * 2001-07-03 2010-06-30 Nidek Co., Ltd. Wassertankeinheit für die Speicherung und Wiederverwendung von Schleifabwasser
KR100393007B1 (ko) * 2001-07-09 2003-07-31 (주)풍남반도체테크 반도체 웨이퍼 제조공정에서 발생하는 폐슬러리 재생방법및 그 재생시스템
ES2199064B1 (es) * 2002-07-01 2005-06-01 Luis Castro Gomez Aserrado de piedras sin ruido agudo.
DE202004003593U1 (de) 2004-03-09 2005-07-14 Wik Far East Ltd. Applikationshandhabe zum Eindrehen von Lockenwicklern
KR100636021B1 (ko) 2005-02-04 2006-10-18 삼성전자주식회사 사이클론, 이를 갖는 슬러리 분류 장치, 이 장치를 이용한슬러리 공급 시스템 및 방법
WO2007097046A1 (ja) * 2006-02-24 2007-08-30 Ihi Compressor And Machinery Co., Ltd. シリコン粒子の処理方法及び装置
CN101401192B (zh) * 2006-07-25 2010-07-28 张煐哲 对硅晶片制造工艺中产生的使用后浆料进行再循环的设备
ITRM20060692A1 (it) * 2006-12-22 2008-06-23 Garbo S R L Procedimento per il trattamento di sospensioni abrasive esauste dal processo di lappatura per il recupero della componente di abrasivo riciclabile e relativo impianto.
KR100788994B1 (ko) 2007-06-15 2007-12-28 주식회사 유스테크코리아 초음파를 이용한 폐슬러리용 입자 분산기
KR100985861B1 (ko) * 2008-09-24 2010-10-08 씨앤지하이테크 주식회사 반도체용 슬러리 공급장치 및 슬러리 공급방법
JP2011011307A (ja) * 2009-07-03 2011-01-20 Sumco Corp ウェーハ研磨用スラリーのリサイクル方法およびそのリサイクル装置
JP5038378B2 (ja) * 2009-11-11 2012-10-03 株式会社コガネイ 薬液供給装置および薬液供給方法
US8557134B2 (en) * 2010-01-28 2013-10-15 Environmental Process Solutions, Inc. Accurately monitored CMP recycling
EP2555211B1 (de) 2010-03-31 2019-11-27 Hitachi Metals, Ltd. Verfahren für recycling eines schlamms, verfahren zur herstellung eines sintermagneten auf seltenerdbasis und vorrichtung für recycling eines schlamms
DE102014216640A1 (de) * 2014-08-21 2016-02-25 Siemens Aktiengesellschaft Aufbereitung von festen, Metall aufweisenden Rückständen aus Schlämmen, insbesondere der Magnetproduktion, zur metallurgischen Weiterverarbeitung
JP6654457B2 (ja) * 2016-02-10 2020-02-26 株式会社荏原製作所 基板処理装置用排水システム、排水方法及び排水制御装置並びに記録媒体
CN112536723A (zh) * 2019-09-23 2021-03-23 夏泰鑫半导体(青岛)有限公司 研磨浆供应系统、化学机械研磨装置及研磨浆供应方法
CN113510611A (zh) * 2021-06-16 2021-10-19 江苏澳洋顺昌集成电路股份有限公司 一种衬底研磨装置及其研磨方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741535B2 (ja) * 1991-04-10 1995-05-10 中小企業事業団 ラップ加工装置の砥粒液再生・循環装置
US5772900A (en) * 1994-06-22 1998-06-30 Noritake Co., Limited Method and apparatus for reclaiming used working fluid
JPH09239661A (ja) 1996-03-04 1997-09-16 Nippei Toyama Corp 廃スラリ処理方法及びその装置
JP3830619B2 (ja) 1997-07-02 2006-10-04 株式会社フジミインコーポレーテッド ラップ加工装置の使用済み組成物の再生循環方法および再生循環装置
JP3708748B2 (ja) 1999-04-23 2005-10-19 松下電器産業株式会社 研磨剤の再生装置および研磨剤の再生方法

Also Published As

Publication number Publication date
US6547961B2 (en) 2003-04-15
EP1142672A1 (de) 2001-10-10
KR20010098452A (ko) 2001-11-08
EP1142672B1 (de) 2007-03-07
JP2001287163A (ja) 2001-10-16
DE60127017T2 (de) 2007-12-13
TW575478B (en) 2004-02-11
US20020014448A1 (en) 2002-02-07

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