DE69722106D1 - Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen - Google Patents

Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen

Info

Publication number
DE69722106D1
DE69722106D1 DE69722106T DE69722106T DE69722106D1 DE 69722106 D1 DE69722106 D1 DE 69722106D1 DE 69722106 T DE69722106 T DE 69722106T DE 69722106 T DE69722106 T DE 69722106T DE 69722106 D1 DE69722106 D1 DE 69722106D1
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
semiconductor devices
encapsulated semiconductor
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69722106T
Other languages
English (en)
Other versions
DE69722106T2 (de
Inventor
Noriaki Higuchi
Takaaki Fukumoto
Toshio Shiobara
Eiichi Asano
Kazutoshi Tomiyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd, Mitsubishi Electric Corp filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE69722106D1 publication Critical patent/DE69722106D1/de
Publication of DE69722106T2 publication Critical patent/DE69722106T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69722106T 1996-08-29 1997-08-25 Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen Expired - Lifetime DE69722106T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24702496 1996-08-29
JP24702496 1996-08-29

Publications (2)

Publication Number Publication Date
DE69722106D1 true DE69722106D1 (de) 2003-06-26
DE69722106T2 DE69722106T2 (de) 2004-04-01

Family

ID=17157278

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69722106T Expired - Lifetime DE69722106T2 (de) 1996-08-29 1997-08-25 Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen

Country Status (8)

Country Link
US (1) US5940688A (de)
EP (1) EP0827159B1 (de)
KR (1) KR100251853B1 (de)
CN (1) CN1139626C (de)
DE (1) DE69722106T2 (de)
MY (1) MY113659A (de)
SG (1) SG60109A1 (de)
TW (1) TW474968B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3611066B2 (ja) * 1996-08-29 2005-01-19 株式会社ルネサステクノロジ 無機質充填剤及びエポキシ樹脂組成物の製造方法
US6221689B1 (en) * 1997-10-24 2001-04-24 Apack Technologies Inc. Method for improving the reliability of underfill process for a chip
JP3853979B2 (ja) * 1998-06-16 2006-12-06 日東電工株式会社 半導体装置の製法
US6376923B1 (en) * 1999-06-08 2002-04-23 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
DE60011199T2 (de) * 1999-10-06 2004-09-30 Nitto Denko Corp., Ibaraki Harzzusammensetzung zur Einkapselung von Halbleitern, Halbleiteranordnungen die diese enthalten und Verfahren für die Herstellung von diesen Halbleiteranordnungen
JP3836649B2 (ja) 1999-11-22 2006-10-25 協和化学工業株式会社 半導体封止用樹脂組成物およびその成型品
US6617399B2 (en) 1999-12-17 2003-09-09 Henkel Loctite Corporation Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
US6670430B1 (en) 1999-12-17 2003-12-30 Henkel Loctite Corporation Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes
DE60128656T2 (de) * 2000-02-25 2007-10-04 Ibiden Co., Ltd., Ogaki Mehrschichtige leiterplatte und verfahren zu ihrer herstellung
JP4438973B2 (ja) * 2000-05-23 2010-03-24 アムコア テクノロジー，インコーポレイテッド シート状樹脂組成物及びそれを用いた半導体装置の製造方法
CN1901177B (zh) 2000-09-25 2010-05-12 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
DE10144871A1 (de) * 2001-09-12 2003-03-27 Bosch Gmbh Robert Vergußmasse mit hoher thermischer Stabilität
EP1300439A1 (de) * 2001-09-26 2003-04-09 Abb Research Ltd. Füllstoff für die Verwendung in elektrischen Feststoff-Isolatoren
US6951907B1 (en) 2001-11-19 2005-10-04 Henkel Corporation Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex
US6893736B2 (en) * 2001-11-19 2005-05-17 Henkel Corporation Thermosetting resin compositions useful as underfill sealants
DE10208644A1 (de) * 2002-02-28 2003-09-11 Bakelite Ag Verfahren zur Herstellung und Verarbeitung von Epoxidharz-Formmassen
JP4421972B2 (ja) * 2004-04-30 2010-02-24 日東電工株式会社 半導体装置の製法
CN101208386B (zh) * 2005-08-02 2012-07-18 第一毛织株式会社 一种用于封装半导体设备的环氧树脂组合物
JP2007169602A (ja) * 2005-11-01 2007-07-05 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
JP2014091744A (ja) * 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
KR101692668B1 (ko) * 2016-03-10 2017-01-04 (주)호전에이블 칙소성이 우수한 에폭시 플럭스 페이스트 조성물
KR102450897B1 (ko) * 2017-03-31 2022-10-04 쇼와덴코머티리얼즈가부시끼가이샤 전자 회로용 보호재, 전자 회로용 보호재용 밀봉재, 밀봉 방법 및 반도체 장치의 제조 방법
KR101965620B1 (ko) * 2017-11-07 2019-04-03 (주)호전에이블 방열성 에폭시 플럭스 필름 및 이를 이용한 솔더링 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2864584B2 (ja) * 1989-12-05 1999-03-03 日立化成工業株式会社 半導体用エポキシ樹脂組成物および半導体装置の製造法
JP3080276B2 (ja) * 1992-09-24 2000-08-21 住友ベークライト株式会社 半導体封止用樹脂組成物

Also Published As

Publication number Publication date
EP0827159B1 (de) 2003-05-21
US5940688A (en) 1999-08-17
SG60109A1 (en) 1999-02-22
DE69722106T2 (de) 2004-04-01
EP0827159A3 (de) 1998-04-15
CN1179444A (zh) 1998-04-22
MY113659A (en) 2002-04-30
KR19980019140A (ko) 1998-06-05
TW474968B (en) 2002-02-01
KR100251853B1 (ko) 2000-04-15
CN1139626C (zh) 2004-02-25
EP0827159A2 (de) 1998-03-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SHIN-ETSU CHEMICAL CO., LTD., TOKIO/TOKYO, JP