DE69202608T2 - Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen. - Google Patents

Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen.

Info

Publication number
DE69202608T2
DE69202608T2 DE69202608T DE69202608T DE69202608T2 DE 69202608 T2 DE69202608 T2 DE 69202608T2 DE 69202608 T DE69202608 T DE 69202608T DE 69202608 T DE69202608 T DE 69202608T DE 69202608 T2 DE69202608 T2 DE 69202608T2
Authority
DE
Germany
Prior art keywords
epoxy resin
semiconductor devices
resin compositions
encapsulated semiconductor
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69202608T
Other languages
English (en)
Other versions
DE69202608D1 (de
Inventor
Toshio Shiobara
Takayuki Aoki
Kazutoshi Tomiyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE69202608D1 publication Critical patent/DE69202608D1/de
Publication of DE69202608T2 publication Critical patent/DE69202608T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69202608T 1991-03-29 1992-03-25 Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen. Expired - Lifetime DE69202608T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3091475A JPH04300914A (ja) 1991-03-29 1991-03-29 エポキシ樹脂組成物及び半導体装置

Publications (2)

Publication Number Publication Date
DE69202608D1 DE69202608D1 (de) 1995-06-29
DE69202608T2 true DE69202608T2 (de) 1996-01-18

Family

ID=14027425

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69202608T Expired - Lifetime DE69202608T2 (de) 1991-03-29 1992-03-25 Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen.

Country Status (5)

Country Link
US (1) US5418266A (de)
EP (1) EP0506360B1 (de)
JP (1) JPH04300914A (de)
KR (1) KR0181716B1 (de)
DE (1) DE69202608T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230170A (ja) * 1991-06-25 1993-09-07 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH05230187A (ja) * 1991-06-25 1993-09-07 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
IT1261171B (it) * 1992-03-03 1996-05-09 Ruetgerswerke Ag Miscuglio resinoso a basso contenuto di prodotti di scissione.
US7041771B1 (en) * 1995-08-11 2006-05-09 Kac Holdings, Inc. Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
SG63803A1 (en) * 1997-01-23 1999-03-30 Toray Industries Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
TW452944B (en) * 1997-06-03 2001-09-01 Hitachi Chemical Co Ltd Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
JPH11140277A (ja) * 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
JPH11140166A (ja) * 1997-11-11 1999-05-25 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
DE69934153T2 (de) * 1998-02-02 2007-09-20 Shin-Etsu Chemical Co., Ltd. Verfahren zur Montage von Flip-Chip-Halbleiterbauelementen
AU2003228106A1 (en) * 2002-05-24 2003-12-12 Nippon Shokubai Co., Ltd. Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica
JP3627736B2 (ja) * 2002-10-11 2005-03-09 住友ベークライト株式会社 エポキシ樹脂組成物並びにこれを用いた半導体装置
US7709085B2 (en) * 2003-12-08 2010-05-04 Sekisui Chemical Co., Ltd. Thermosetting resin composition, resin sheet and resin sheet for insulated substrate
US7943706B2 (en) * 2005-03-24 2011-05-17 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP4844725B2 (ja) * 2005-04-25 2011-12-28 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US8048969B2 (en) * 2005-04-25 2011-11-01 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
US20060241215A1 (en) * 2005-04-25 2006-10-26 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
KR20070090108A (ko) * 2006-03-01 2007-09-05 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 캡슐화 에폭시 수지 조성물 및 반도체 장치
KR101388750B1 (ko) * 2012-07-31 2014-04-25 삼성전기주식회사 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판
JP6025967B2 (ja) 2013-03-28 2016-11-16 パナソニック株式会社 絶縁熱伝導性樹脂組成物
JP6924292B2 (ja) * 2020-01-22 2021-08-25 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3384618A (en) * 1960-11-24 1968-05-21 Imoto Minoru Method of producing synthetic resins from aromatic glycols and a phenol
US3275708A (en) * 1966-07-11 1966-09-27 Dow Chemical Co Phenolic adducts of diphenyloxides or biphenyls, with epoxy resins
JPS53299A (en) * 1976-06-25 1978-01-05 Hitachi Ltd Epoxy resin composition
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPS59230017A (ja) * 1983-05-25 1984-12-24 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テル及びその製法
JPS60112813A (ja) * 1983-11-24 1985-06-19 Dainippon Ink & Chem Inc 成形材料用エポキシ樹脂組成物
EP0218228B1 (de) * 1985-10-07 1993-09-15 Shin-Etsu Chemical Co., Ltd. Epoxyharzzusammensetzung
JPH0617458B2 (ja) * 1987-03-16 1994-03-09 信越化学工業株式会社 エポキシ樹脂組成物
JPH06104712B2 (ja) * 1987-04-08 1994-12-21 東レ株式会社 半導体封止用樹脂組成物
JPS6460623A (en) * 1987-08-31 1989-03-07 Toshiba Corp Epoxy resin composition for semiconductor sealing
JPH0657740B2 (ja) * 1988-09-27 1994-08-03 三菱電機株式会社 半導体封止用エポキシ樹脂組成物
JPH0291118A (ja) * 1988-09-29 1990-03-30 Nippon Steel Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0791364B2 (ja) * 1988-10-06 1995-10-04 東レ株式会社 半導体封止用半田耐熱性エポキシ樹脂組成物
JPH02189326A (ja) * 1989-01-18 1990-07-25 Mitsubishi Petrochem Co Ltd 電子部品封止用エポキシ樹脂組成物
JPH0617440B2 (ja) * 1989-05-30 1994-03-09 新日鐵化学株式会社 新規エポキシ樹脂及びその製造法
CA2033978C (en) * 1989-06-20 1995-02-14 Hiromi Morita Phenolic novolak resins, cured substances therefrom and method for production thereof
JPH0390075A (ja) * 1989-09-01 1991-04-16 Nippon Steel Chem Co Ltd エポキシ樹脂及びその中間体並びにその製造法
KR950009152B1 (ko) * 1990-01-25 1995-08-16 신에쓰 가가꾸 고오교 가부시끼가이샤 에폭시 수지 조성물 및 반도체 장치
JP2823056B2 (ja) * 1990-12-10 1998-11-11 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
JP3032315B2 (ja) * 1991-01-14 2000-04-17 健二 片桐 脂肪肝治療剤
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP3000717U (ja) 1994-02-03 1994-08-16 株式会社博進紙器製作所 電報用装飾台紙

Also Published As

Publication number Publication date
JPH04300914A (ja) 1992-10-23
US5418266A (en) 1995-05-23
KR920018142A (ko) 1992-10-21
EP0506360A3 (en) 1993-01-13
DE69202608D1 (de) 1995-06-29
EP0506360A2 (de) 1992-09-30
EP0506360B1 (de) 1995-05-24
KR0181716B1 (ko) 1999-05-15

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