DE69427995D1 - Im Harz versiegelte Halbleitervorrichtung - Google Patents

Im Harz versiegelte Halbleitervorrichtung

Info

Publication number
DE69427995D1
DE69427995D1 DE69427995T DE69427995T DE69427995D1 DE 69427995 D1 DE69427995 D1 DE 69427995D1 DE 69427995 T DE69427995 T DE 69427995T DE 69427995 T DE69427995 T DE 69427995T DE 69427995 D1 DE69427995 D1 DE 69427995D1
Authority
DE
Germany
Prior art keywords
semiconductor device
sealed semiconductor
resin sealed
resin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69427995T
Other languages
English (en)
Other versions
DE69427995T2 (de
Inventor
Koichi Haraguchi
Yuji Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE69427995D1 publication Critical patent/DE69427995D1/de
Application granted granted Critical
Publication of DE69427995T2 publication Critical patent/DE69427995T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69427995T 1993-01-13 1994-01-07 Im Harz versiegelte Halbleitervorrichtung Expired - Lifetime DE69427995T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP364693 1993-01-13
JP5104849A JPH06268102A (ja) 1993-01-13 1993-05-06 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
DE69427995D1 true DE69427995D1 (de) 2001-09-20
DE69427995T2 DE69427995T2 (de) 2001-11-29

Family

ID=26337276

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69427995T Expired - Lifetime DE69427995T2 (de) 1993-01-13 1994-01-07 Im Harz versiegelte Halbleitervorrichtung
DE69407064T Expired - Lifetime DE69407064T2 (de) 1993-01-13 1994-01-07 In Harz versiegelte Halbleiteranordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69407064T Expired - Lifetime DE69407064T2 (de) 1993-01-13 1994-01-07 In Harz versiegelte Halbleiteranordnung

Country Status (4)

Country Link
US (1) US5606200A (de)
EP (2) EP0749159B1 (de)
JP (1) JPH06268102A (de)
DE (2) DE69427995T2 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3201187B2 (ja) * 1994-12-08 2001-08-20 富士電機株式会社 半導体装置
DE19649798A1 (de) * 1996-12-02 1998-06-04 Abb Research Ltd Leistungshalbleitermodul
CN1146988C (zh) * 1997-12-08 2004-04-21 东芝株式会社 半导体功率器件的封装及其组装方法
US6184464B1 (en) * 1998-04-27 2001-02-06 Square D Company Protective containment apparatus for potted electronic circuits
US6222263B1 (en) * 1999-10-19 2001-04-24 International Business Machines Corporation Chip assembly with load-bearing lid in thermal contact with the chip
JP4623987B2 (ja) * 2003-06-27 2011-02-02 京セラ株式会社 コンデンサ及びその実装構造
CN103650138B (zh) * 2011-08-25 2016-06-22 富士电机株式会社 半导体装置及其制造方法
DE102012211446B4 (de) * 2012-07-02 2016-05-12 Infineon Technologies Ag Explosionsgeschütztes halbleitermodul
KR101543100B1 (ko) * 2013-12-02 2015-08-07 현대자동차주식회사 컨트롤러 일체형 연료펌프 모듈
JP6451257B2 (ja) * 2014-11-21 2019-01-16 富士電機株式会社 半導体装置
JP6407451B2 (ja) * 2015-12-04 2018-10-17 三菱電機株式会社 半導体モジュール
WO2017104159A1 (ja) * 2015-12-16 2017-06-22 三菱電機株式会社 半導体装置およびその製造方法
JP6081042B1 (ja) * 2015-12-16 2017-02-15 三菱電機株式会社 半導体装置およびその製造方法
DE102016202600A1 (de) * 2016-02-19 2017-08-24 Siemens Aktiengesellschaft Elektrisches Modul mit elektrischer Komponente
WO2018055667A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
US10978366B2 (en) 2017-05-11 2021-04-13 Mitsubishi Electric Corporation Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module
CN111033736A (zh) * 2017-09-05 2020-04-17 三菱电机株式会社 功率模块及其制造方法及电力变换装置
US11227808B2 (en) 2017-09-05 2022-01-18 Mitsubishi Electric Corporation Power module and method for fabricating the same, and power conversion device
JP7045975B2 (ja) 2018-11-20 2022-04-01 三菱電機株式会社 半導体装置およびその製造方法、ならびに電力変換装置
US11935799B2 (en) * 2019-06-25 2024-03-19 Intel Corporation Integrated circuit package lids with polymer features
JP7173375B2 (ja) * 2019-11-27 2022-11-16 三菱電機株式会社 半導体モジュール
JP7247124B2 (ja) 2020-01-07 2023-03-28 三菱電機株式会社 半導体モジュール
JP2021111669A (ja) * 2020-01-08 2021-08-02 三菱電機株式会社 半導体装置および電力変換装置
JPWO2021144980A1 (de) * 2020-01-17 2021-07-22
JP2021132080A (ja) * 2020-02-18 2021-09-09 富士電機株式会社 半導体装置
JP2022039118A (ja) * 2020-08-27 2022-03-10 富士電機株式会社 半導体モジュール及び半導体モジュールの製造方法
CN117198901B (zh) * 2023-11-07 2024-01-23 通富微电子股份有限公司 功率模块封装方法及功率模块

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119759A (ja) * 1983-11-30 1985-06-27 Mitsubishi Electric Corp 半導体装置
JPS60254643A (ja) * 1984-05-31 1985-12-16 Toshiba Corp 樹脂封止型半導体装置
JPS60254350A (ja) * 1984-05-31 1985-12-16 Nec Ic Microcomput Syst Ltd デ−タ通信制御装置
JPS61148845A (ja) * 1984-12-21 1986-07-07 Mitsubishi Electric Corp 半導体装置
JPS63164245A (ja) * 1986-12-26 1988-07-07 Hitachi Ltd 電子部品
JPH0834271B2 (ja) * 1987-03-09 1996-03-29 住友ベークライト株式会社 Ｐｐｓ封止電子部品
JPS63219145A (ja) * 1987-03-09 1988-09-12 Sumitomo Bakelite Co Ltd Ｐｐｓ封止電子部品
JPH0428764A (ja) * 1990-05-24 1992-01-31 Sumitomo Bakelite Co Ltd ポリフェニレンスルフィド樹脂組成物
US5243217A (en) * 1990-11-03 1993-09-07 Fuji Electric Co., Ltd. Sealed semiconductor device with protruding portion
JPH04198267A (ja) * 1990-11-27 1992-07-17 Dainippon Ink & Chem Inc ポリアリーレンスルフィド系樹脂組成物
JPH04206554A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 半導体装置
JP2867753B2 (ja) * 1991-02-25 1999-03-10 富士電機株式会社 半導体装置
JPH04274350A (ja) * 1991-03-01 1992-09-30 Fuji Electric Co Ltd 半導体装置
JP2642548B2 (ja) * 1991-09-26 1997-08-20 株式会社東芝 半導体装置およびその製造方法
JP2936855B2 (ja) * 1991-12-26 1999-08-23 富士電機株式会社 電力用半導体装置

Also Published As

Publication number Publication date
EP0749159A2 (de) 1996-12-18
DE69407064D1 (de) 1998-01-15
US5606200A (en) 1997-02-25
EP0608051A3 (en) 1994-09-21
EP0608051B1 (de) 1997-12-03
DE69407064T2 (de) 1998-06-04
EP0749159A3 (de) 1997-04-02
JPH06268102A (ja) 1994-09-22
DE69427995T2 (de) 2001-11-29
EP0749159B1 (de) 2001-08-16
EP0608051A2 (de) 1994-07-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: FUJI ELECTRIC SYSTEMS CO., LTD., TOKYO/TOKIO, JP