DE69407064D1 - In Harz versiegelte Halbleiteranordnung - Google Patents
In Harz versiegelte HalbleiteranordnungInfo
- Publication number
- DE69407064D1 DE69407064D1 DE69407064T DE69407064T DE69407064D1 DE 69407064 D1 DE69407064 D1 DE 69407064D1 DE 69407064 T DE69407064 T DE 69407064T DE 69407064 T DE69407064 T DE 69407064T DE 69407064 D1 DE69407064 D1 DE 69407064D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- sealed semiconductor
- resin sealed
- resin
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP364693 | 1993-01-13 | ||
| JP5104849A JPH06268102A (ja) | 1993-01-13 | 1993-05-06 | 樹脂封止形半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69407064D1 true DE69407064D1 (de) | 1998-01-15 |
| DE69407064T2 DE69407064T2 (de) | 1998-06-04 |
Family
ID=26337276
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69407064T Expired - Lifetime DE69407064T2 (de) | 1993-01-13 | 1994-01-07 | In Harz versiegelte Halbleiteranordnung |
| DE69427995T Expired - Lifetime DE69427995T2 (de) | 1993-01-13 | 1994-01-07 | Im Harz versiegelte Halbleitervorrichtung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69427995T Expired - Lifetime DE69427995T2 (de) | 1993-01-13 | 1994-01-07 | Im Harz versiegelte Halbleitervorrichtung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5606200A (de) |
| EP (2) | EP0608051B1 (de) |
| JP (1) | JPH06268102A (de) |
| DE (2) | DE69407064T2 (de) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3201187B2 (ja) * | 1994-12-08 | 2001-08-20 | 富士電機株式会社 | 半導体装置 |
| DE19649798A1 (de) * | 1996-12-02 | 1998-06-04 | Abb Research Ltd | Leistungshalbleitermodul |
| CA2255441C (en) * | 1997-12-08 | 2003-08-05 | Hiroki Sekiya | Package for semiconductor power device and method for assembling the same |
| US6184464B1 (en) * | 1998-04-27 | 2001-02-06 | Square D Company | Protective containment apparatus for potted electronic circuits |
| US6222263B1 (en) * | 1999-10-19 | 2001-04-24 | International Business Machines Corporation | Chip assembly with load-bearing lid in thermal contact with the chip |
| JP4623987B2 (ja) * | 2003-06-27 | 2011-02-02 | 京セラ株式会社 | コンデンサ及びその実装構造 |
| EP2750187B1 (de) * | 2011-08-25 | 2020-01-01 | Fuji Electric Co., Ltd. | Halbleiterbauelement und herstellungsverfahren für ein halbleiterbauelement |
| DE102012211446B4 (de) * | 2012-07-02 | 2016-05-12 | Infineon Technologies Ag | Explosionsgeschütztes halbleitermodul |
| KR101543100B1 (ko) * | 2013-12-02 | 2015-08-07 | 현대자동차주식회사 | 컨트롤러 일체형 연료펌프 모듈 |
| JP6451257B2 (ja) * | 2014-11-21 | 2019-01-16 | 富士電機株式会社 | 半導体装置 |
| US10483176B2 (en) * | 2015-12-04 | 2019-11-19 | Mitsubishi Electric Corporation | Semiconductor module |
| JP6081042B1 (ja) * | 2015-12-16 | 2017-02-15 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2017104159A1 (ja) * | 2015-12-16 | 2017-06-22 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| DE102016202600A1 (de) * | 2016-02-19 | 2017-08-24 | Siemens Aktiengesellschaft | Elektrisches Modul mit elektrischer Komponente |
| JP6699742B2 (ja) * | 2016-09-20 | 2020-05-27 | 三菱電機株式会社 | 半導体装置 |
| US10978366B2 (en) | 2017-05-11 | 2021-04-13 | Mitsubishi Electric Corporation | Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module |
| DE112018004816T5 (de) * | 2017-09-05 | 2020-06-10 | Mitsubishi Electric Corporation | Leistungsmodul, verfahren zur herstellung desselben und leistungswandler |
| US11227808B2 (en) | 2017-09-05 | 2022-01-18 | Mitsubishi Electric Corporation | Power module and method for fabricating the same, and power conversion device |
| JP7045975B2 (ja) | 2018-11-20 | 2022-04-01 | 三菱電機株式会社 | 半導体装置およびその製造方法、ならびに電力変換装置 |
| US11935799B2 (en) * | 2019-06-25 | 2024-03-19 | Intel Corporation | Integrated circuit package lids with polymer features |
| DE112019007915T5 (de) * | 2019-11-27 | 2022-09-08 | Mitsubishi Electric Corporation | Halbleitermodul |
| JP7247124B2 (ja) | 2020-01-07 | 2023-03-28 | 三菱電機株式会社 | 半導体モジュール |
| JP2021111669A (ja) * | 2020-01-08 | 2021-08-02 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
| US20220415735A1 (en) * | 2020-01-17 | 2022-12-29 | Mitsubishi Electric Corporation | Power module and power conversion device |
| JP2021132080A (ja) * | 2020-02-18 | 2021-09-09 | 富士電機株式会社 | 半導体装置 |
| JP7559432B2 (ja) * | 2020-08-27 | 2024-10-02 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
| CN117198901B (zh) * | 2023-11-07 | 2024-01-23 | 通富微电子股份有限公司 | 功率模块封装方法及功率模块 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60119759A (ja) * | 1983-11-30 | 1985-06-27 | Mitsubishi Electric Corp | 半導体装置 |
| JPS60254350A (ja) * | 1984-05-31 | 1985-12-16 | Nec Ic Microcomput Syst Ltd | デ−タ通信制御装置 |
| JPS60254643A (ja) * | 1984-05-31 | 1985-12-16 | Toshiba Corp | 樹脂封止型半導体装置 |
| JPS61148845A (ja) * | 1984-12-21 | 1986-07-07 | Mitsubishi Electric Corp | 半導体装置 |
| JPS63164245A (ja) * | 1986-12-26 | 1988-07-07 | Hitachi Ltd | 電子部品 |
| JPH0834271B2 (ja) * | 1987-03-09 | 1996-03-29 | 住友ベークライト株式会社 | Ｐｐｓ封止電子部品 |
| JPS63219145A (ja) * | 1987-03-09 | 1988-09-12 | Sumitomo Bakelite Co Ltd | Ｐｐｓ封止電子部品 |
| JPH0428764A (ja) * | 1990-05-24 | 1992-01-31 | Sumitomo Bakelite Co Ltd | ポリフェニレンスルフィド樹脂組成物 |
| US5243217A (en) * | 1990-11-03 | 1993-09-07 | Fuji Electric Co., Ltd. | Sealed semiconductor device with protruding portion |
| JPH04198267A (ja) * | 1990-11-27 | 1992-07-17 | Dainippon Ink & Chem Inc | ポリアリーレンスルフィド系樹脂組成物 |
| JPH04206554A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 半導体装置 |
| JP2867753B2 (ja) * | 1991-02-25 | 1999-03-10 | 富士電機株式会社 | 半導体装置 |
| JPH04274350A (ja) * | 1991-03-01 | 1992-09-30 | Fuji Electric Co Ltd | 半導体装置 |
| JP2642548B2 (ja) * | 1991-09-26 | 1997-08-20 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP2936855B2 (ja) * | 1991-12-26 | 1999-08-23 | 富士電機株式会社 | 電力用半導体装置 |
-
1993
- 1993-05-06 JP JP5104849A patent/JPH06268102A/ja active Pending
-
1994
- 1994-01-07 DE DE69407064T patent/DE69407064T2/de not_active Expired - Lifetime
- 1994-01-07 DE DE69427995T patent/DE69427995T2/de not_active Expired - Lifetime
- 1994-01-07 EP EP94300096A patent/EP0608051B1/de not_active Expired - Lifetime
- 1994-01-07 EP EP96114416A patent/EP0749159B1/de not_active Expired - Lifetime
- 1994-01-12 US US08/180,481 patent/US5606200A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0749159A3 (de) | 1997-04-02 |
| EP0749159B1 (de) | 2001-08-16 |
| EP0608051B1 (de) | 1997-12-03 |
| JPH06268102A (ja) | 1994-09-22 |
| EP0608051A2 (de) | 1994-07-27 |
| EP0749159A2 (de) | 1996-12-18 |
| US5606200A (en) | 1997-02-25 |
| DE69407064T2 (de) | 1998-06-04 |
| EP0608051A3 (en) | 1994-09-21 |
| DE69427995T2 (de) | 2001-11-29 |
| DE69427995D1 (de) | 2001-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69407064D1 (de) | In Harz versiegelte Halbleiteranordnung | |
| DE69323025D1 (de) | In Harz versiegeltes Halbleiterbauelement | |
| DE69533600D1 (de) | Eine mit lichtdurchlässigem Harz versiegelte Halbleitervorrichtung | |
| DE69227937D1 (de) | Leiterrahmen und in Harz versiegelte Halbleitervorrichtung dafür | |
| DE69221440D1 (de) | Harzverkapselte Halbleiteranordnung | |
| TW338559U (en) | Resin package type semiconductor device | |
| SG87012A1 (en) | Epoxy resin composition and semiconductor device using the same | |
| KR950012657B1 (en) | Resin sealed semiconductor integrated circuit | |
| DE69400694D1 (de) | Halbleitervorrichtung | |
| DE69425521D1 (de) | Halbleitermodulbauteil | |
| DE69417329D1 (de) | In Harz versiegelte Halbleiteranordnung | |
| DE69411239D1 (de) | Lichtempfangendes Halbleiter-Bauelement | |
| GB2250379B (en) | Sealed semiconductor device | |
| EP0479127A3 (en) | Semiconductor device sealed with mold resin | |
| DE69603531D1 (de) | Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung | |
| EP0439171A3 (en) | Epoxy resin composition and semiconductor device encapsulated therewith | |
| ITCT910010A0 (it) | Dispositivo a semiconduttore incapsulato in resina e completamente isolato per alte tensioni | |
| DE4496282T1 (de) | Halbleiter-Einrichtung | |
| DE69321966D1 (de) | Leistungs-Halbleiterbauelement | |
| DE69429567D1 (de) | Nichtflüchtige Halbleiteranordnung | |
| DE69210423D1 (de) | Halbleiteranordnung mit Plastikpackung | |
| DE69124198D1 (de) | In Harz versiegelte Halbleitervorrichtung | |
| DE69502641D1 (de) | Mit Harz eingekapseltes Halbleiterbauelement | |
| IL109283A0 (en) | Improvements in semiconductor devices | |
| DE69423996D1 (de) | Halbleiterspeicheranordnung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8320 | Willingness to grant licences declared (paragraph 23) | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: FUJI ELECTRIC SYSTEMS CO., LTD., TOKYO/TOKIO, JP |