KR940025562U - 반도체 장치의 팩케지 - Google Patents

반도체 장치의 팩케지

Info

Publication number
KR940025562U
KR940025562U KR2019930006154U KR930006154U KR940025562U KR 940025562 U KR940025562 U KR 940025562U KR 2019930006154 U KR2019930006154 U KR 2019930006154U KR 930006154 U KR930006154 U KR 930006154U KR 940025562 U KR940025562 U KR 940025562U
Authority
KR
South Korea
Prior art keywords
semiconductor device
device package
package
semiconductor
Prior art date
Application number
KR2019930006154U
Other languages
English (en)
Other versions
KR0136825Y1 (ko
Inventor
장태식
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019930006154U priority Critical patent/KR0136825Y1/ko
Publication of KR940025562U publication Critical patent/KR940025562U/ko
Application granted granted Critical
Publication of KR0136825Y1 publication Critical patent/KR0136825Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
KR2019930006154U 1993-04-19 1993-04-19 반도체 장치의 팩케지 KR0136825Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930006154U KR0136825Y1 (ko) 1993-04-19 1993-04-19 반도체 장치의 팩케지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930006154U KR0136825Y1 (ko) 1993-04-19 1993-04-19 반도체 장치의 팩케지

Publications (2)

Publication Number Publication Date
KR940025562U true KR940025562U (ko) 1994-11-18
KR0136825Y1 KR0136825Y1 (ko) 1999-02-18

Family

ID=19353854

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930006154U KR0136825Y1 (ko) 1993-04-19 1993-04-19 반도체 장치의 팩케지

Country Status (1)

Country Link
KR (1) KR0136825Y1 (ko)

Also Published As

Publication number Publication date
KR0136825Y1 (ko) 1999-02-18

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