KR950004829U - 반도체 팩키지의 리이드 성형장치 - Google Patents

반도체 팩키지의 리이드 성형장치

Info

Publication number
KR950004829U
KR950004829U KR2019930013204U KR930013204U KR950004829U KR 950004829 U KR950004829 U KR 950004829U KR 2019930013204 U KR2019930013204 U KR 2019930013204U KR 930013204 U KR930013204 U KR 930013204U KR 950004829 U KR950004829 U KR 950004829U
Authority
KR
South Korea
Prior art keywords
semiconductor package
forming device
lead forming
package lead
semiconductor
Prior art date
Application number
KR2019930013204U
Other languages
English (en)
Other versions
KR960004871Y1 (ko
Inventor
곽노권
Original Assignee
주식회사 한미금형
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 한미금형 filed Critical 주식회사 한미금형
Priority to KR2019930013204U priority Critical patent/KR960004871Y1/ko
Publication of KR950004829U publication Critical patent/KR950004829U/ko
Application granted granted Critical
Publication of KR960004871Y1 publication Critical patent/KR960004871Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019930013204U 1993-07-16 1993-07-16 반도체 팩키지의 리이드 성형장치 KR960004871Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930013204U KR960004871Y1 (ko) 1993-07-16 1993-07-16 반도체 팩키지의 리이드 성형장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930013204U KR960004871Y1 (ko) 1993-07-16 1993-07-16 반도체 팩키지의 리이드 성형장치

Publications (2)

Publication Number Publication Date
KR950004829U true KR950004829U (ko) 1995-02-18
KR960004871Y1 KR960004871Y1 (ko) 1996-06-12

Family

ID=19359222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930013204U KR960004871Y1 (ko) 1993-07-16 1993-07-16 반도체 팩키지의 리이드 성형장치

Country Status (1)

Country Link
KR (1) KR960004871Y1 (ko)

Also Published As

Publication number Publication date
KR960004871Y1 (ko) 1996-06-12

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