KR900012355A - 반도체장치 패키지 - Google Patents
반도체장치 패키지Info
- Publication number
- KR900012355A KR900012355A KR1019900001013A KR900001013A KR900012355A KR 900012355 A KR900012355 A KR 900012355A KR 1019900001013 A KR1019900001013 A KR 1019900001013A KR 900001013 A KR900001013 A KR 900001013A KR 900012355 A KR900012355 A KR 900012355A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- device package
- package
- semiconductor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1020212A JPH02201949A (ja) | 1989-01-30 | 1989-01-30 | 半導体装置 |
JP1-20212 | 1989-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900012355A true KR900012355A (ko) | 1990-08-03 |
KR930009012B1 KR930009012B1 (ko) | 1993-09-18 |
Family
ID=12020860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900001013A KR930009012B1 (ko) | 1989-01-30 | 1990-01-30 | 반도체장치 패키지 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5093713A (ko) |
EP (1) | EP0381054A3 (ko) |
JP (1) | JPH02201949A (ko) |
KR (1) | KR930009012B1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5170312A (en) * | 1991-11-04 | 1992-12-08 | Motorola, Inc. | Protection circuit on a lead of a power device |
DE59402033D1 (de) * | 1993-09-30 | 1997-04-17 | Siemens Ag | Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung |
KR0155843B1 (ko) * | 1995-07-07 | 1998-12-01 | 이대원 | 반도체장치 |
EP1566846B1 (de) * | 1997-07-29 | 2016-02-03 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
GB2338827B (en) * | 1998-06-27 | 2002-12-31 | Motorola Gmbh | Electronic package assembly |
DE10125697B4 (de) | 2001-05-25 | 2019-01-03 | Infineon Technologies Ag | Leistungshalbleitermodul und Verfahren zum Herstellen eines Leistungshalbleitermoduls |
TW488054B (en) * | 2001-06-22 | 2002-05-21 | Advanced Semiconductor Eng | Semiconductor package for integrating surface mount devices |
DE10149774A1 (de) * | 2001-10-09 | 2003-04-24 | Bosch Gmbh Robert | Verfahren zum Verpacken von elektronischen Baugruppen und Mehrfachchipverpackung |
JP4100332B2 (ja) * | 2003-11-12 | 2008-06-11 | 株式会社デンソー | 電子装置およびその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1614865A1 (de) * | 1967-09-27 | 1970-12-23 | Telefunken Patent | Optoelektronische Halbleiteranordnung |
US3715633A (en) * | 1971-07-15 | 1973-02-06 | J Nier | Semiconductor unit with integrated circuit |
US3935501A (en) * | 1975-02-13 | 1976-01-27 | Digital Components Corporation | Micro-miniature light source assemblage and mounting means therefor |
DE2510982A1 (de) * | 1975-03-13 | 1976-09-30 | Bosch Gmbh Robert | Hybrides halbleiterbauelement |
DE2610136A1 (de) * | 1976-03-11 | 1977-09-22 | Bosch Gmbh Robert | Spannungsregler fuer generatoren |
US4203792A (en) * | 1977-11-17 | 1980-05-20 | Bell Telephone Laboratories, Incorporated | Method for the fabrication of devices including polymeric materials |
JPS5753947A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Transistor and electronic device containing it |
JPS6041249A (ja) * | 1983-08-17 | 1985-03-04 | Nec Corp | 混成集積回路装置 |
DE3540551C1 (en) * | 1984-06-01 | 1990-02-15 | Piller Gmbh Co Kg Anton | Semiconductor module for fast switching arrangement |
IT1221585B (it) * | 1987-05-18 | 1990-07-12 | S G S Microelettronica Spa Ora | Circuito modulare a piu' piastrine a semiconduttore in capsulato in resina,e relativo procedimento di fabbrivazione |
IT1222152B (it) * | 1987-07-28 | 1990-09-05 | Sgs Microelettronica Spa | Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina |
US4783428A (en) * | 1987-11-23 | 1988-11-08 | Motorola Inc. | Method of producing a thermogenetic semiconductor device |
GB2219435B (en) * | 1988-06-02 | 1991-07-03 | Burr Brown Corp | Plastic encapsulated multichip hybrid integrated circuit |
-
1989
- 1989-01-30 JP JP1020212A patent/JPH02201949A/ja active Pending
-
1990
- 1990-01-25 EP EP19900101489 patent/EP0381054A3/en not_active Withdrawn
- 1990-01-30 KR KR1019900001013A patent/KR930009012B1/ko not_active IP Right Cessation
-
1991
- 1991-05-08 US US07/700,301 patent/US5093713A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR930009012B1 (ko) | 1993-09-18 |
US5093713A (en) | 1992-03-03 |
JPH02201949A (ja) | 1990-08-10 |
EP0381054A3 (en) | 1993-03-31 |
EP0381054A2 (en) | 1990-08-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20030901 Year of fee payment: 11 |
|
LAPS | Lapse due to unpaid annual fee |