IT1222152B - Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina - Google Patents

Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina

Info

Publication number
IT1222152B
IT1222152B IT2147287A IT2147287A IT1222152B IT 1222152 B IT1222152 B IT 1222152B IT 2147287 A IT2147287 A IT 2147287A IT 2147287 A IT2147287 A IT 2147287A IT 1222152 B IT1222152 B IT 1222152B
Authority
IT
Italy
Prior art keywords
plates
metal
resin container
container
resin
Prior art date
Application number
IT2147287A
Other languages
English (en)
Other versions
IT8721472A0 (it
Inventor
Carlo Cini
Luigi Sisti
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Priority to IT2147287A priority Critical patent/IT1222152B/it
Publication of IT8721472A0 publication Critical patent/IT8721472A0/it
Priority to FR888809863A priority patent/FR2618944B1/fr
Priority to DE19883825534 priority patent/DE3825534A1/de
Priority to US07/227,539 priority patent/US4924296A/en
Application granted granted Critical
Publication of IT1222152B publication Critical patent/IT1222152B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT2147287A 1987-07-28 1987-07-28 Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina IT1222152B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT2147287A IT1222152B (it) 1987-07-28 1987-07-28 Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina
FR888809863A FR2618944B1 (fr) 1987-07-28 1988-07-21 Dispositif a semi-conducteur encapsule dans un boitier comprenant un support metallique et un corps en resine synthetique
DE19883825534 DE3825534A1 (de) 1987-07-28 1988-07-27 Mehrere halbleiterchips enthaltende vorrichtung mit einem metall-kunstharz-gehaeuse
US07/227,539 US4924296A (en) 1987-07-28 1988-07-28 Multiple-chip semiconductor element in a case of metal and resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2147287A IT1222152B (it) 1987-07-28 1987-07-28 Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina

Publications (2)

Publication Number Publication Date
IT8721472A0 IT8721472A0 (it) 1987-07-28
IT1222152B true IT1222152B (it) 1990-09-05

Family

ID=11182323

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2147287A IT1222152B (it) 1987-07-28 1987-07-28 Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina

Country Status (4)

Country Link
US (1) US4924296A (it)
DE (1) DE3825534A1 (it)
FR (1) FR2618944B1 (it)
IT (1) IT1222152B (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02201949A (ja) * 1989-01-30 1990-08-10 Toshiba Corp 半導体装置
JPH0671061B2 (ja) * 1989-05-22 1994-09-07 株式会社東芝 樹脂封止型半導体装置
DE4031051C2 (de) * 1989-11-14 1997-05-07 Siemens Ag Modul mit mindestens einem Halbleiterschaltelement und einer Ansteuerschaltung
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
IT1247304B (it) * 1991-04-30 1994-12-12 Sgs Thomson Microelectronics Complesso circuitale di potenza a struttura modulare ad elevata compattezza e ad alta efficienza di dissipazione termica
US5170312A (en) * 1991-11-04 1992-12-08 Motorola, Inc. Protection circuit on a lead of a power device
FR2690274B1 (fr) * 1992-04-15 1997-08-22 Motorola Semiconducteurs Boitier pour dispositif a semiconducteur et procede de formation de boitier pour dispositif a semiconducteur.
DE4222973A1 (de) * 1992-07-13 1994-01-20 Asea Brown Boveri Bidirektionaler Halbleiterschalter
CN102339818B (zh) * 2010-07-15 2014-04-30 台达电子工业股份有限公司 功率模块及其制造方法
US8847385B2 (en) * 2012-03-27 2014-09-30 Infineon Technologies Ag Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132048A (en) * 1979-04-03 1980-10-14 Toshiba Corp Semiconductor device
FR2495376A1 (fr) * 1980-12-02 1982-06-04 Thomson Csf Boitiers pour composants semiconducteurs de puissance a cosses de type faston
WO1982002980A1 (en) * 1981-02-27 1982-09-02 Inc Motorola High current package with multi-level leads
JPS60160154A (ja) * 1984-01-30 1985-08-21 Nec Kansai Ltd Ｈｉｃ
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device

Also Published As

Publication number Publication date
FR2618944A1 (fr) 1989-02-03
US4924296A (en) 1990-05-08
FR2618944B1 (fr) 1994-07-01
DE3825534A1 (de) 1989-02-09
IT8721472A0 (it) 1987-07-28

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19950729