IT1095885B - Contenitore in metallo e resina ad elevata ermeticita'per dispositivo a semiconduttore - Google Patents

Contenitore in metallo e resina ad elevata ermeticita'per dispositivo a semiconduttore

Info

Publication number
IT1095885B
IT1095885B IT23432/78A IT2343278A IT1095885B IT 1095885 B IT1095885 B IT 1095885B IT 23432/78 A IT23432/78 A IT 23432/78A IT 2343278 A IT2343278 A IT 2343278A IT 1095885 B IT1095885 B IT 1095885B
Authority
IT
Italy
Prior art keywords
metal
semiconductor device
resin container
high hermeticity
hermeticity
Prior art date
Application number
IT23432/78A
Other languages
English (en)
Other versions
IT7823432A0 (it
Inventor
Luigi Romano'
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT23432/78A priority Critical patent/IT1095885B/it
Publication of IT7823432A0 publication Critical patent/IT7823432A0/it
Priority to GB7916238A priority patent/GB2021315A/en
Priority to DE19792919540 priority patent/DE2919540A1/de
Priority to FR7912275A priority patent/FR2426333A1/fr
Priority to DE19797914024U priority patent/DE7914024U1/de
Priority to JP5874579A priority patent/JPS553692A/ja
Application granted granted Critical
Publication of IT1095885B publication Critical patent/IT1095885B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
IT23432/78A 1978-05-16 1978-05-16 Contenitore in metallo e resina ad elevata ermeticita'per dispositivo a semiconduttore IT1095885B (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT23432/78A IT1095885B (it) 1978-05-16 1978-05-16 Contenitore in metallo e resina ad elevata ermeticita'per dispositivo a semiconduttore
GB7916238A GB2021315A (en) 1978-05-16 1979-05-10 Container for a semiconductor device
DE19792919540 DE2919540A1 (de) 1978-05-16 1979-05-15 Abgedichtetes gehaeuse aus metall und kunststoff fuer halbleiter-vorrichtungen
FR7912275A FR2426333A1 (fr) 1978-05-16 1979-05-15 Boitier pour dispositif semi-conducteur
DE19797914024U DE7914024U1 (de) 1978-05-16 1979-05-15 Abgedichtetes gehaeuse aus metall und kunststoff fuer halbleiter-vorrichtungen
JP5874579A JPS553692A (en) 1978-05-16 1979-05-15 Container for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT23432/78A IT1095885B (it) 1978-05-16 1978-05-16 Contenitore in metallo e resina ad elevata ermeticita'per dispositivo a semiconduttore

Publications (2)

Publication Number Publication Date
IT7823432A0 IT7823432A0 (it) 1978-05-16
IT1095885B true IT1095885B (it) 1985-08-17

Family

ID=11207026

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23432/78A IT1095885B (it) 1978-05-16 1978-05-16 Contenitore in metallo e resina ad elevata ermeticita'per dispositivo a semiconduttore

Country Status (5)

Country Link
JP (1) JPS553692A (it)
DE (2) DE2919540A1 (it)
FR (1) FR2426333A1 (it)
GB (1) GB2021315A (it)
IT (1) IT1095885B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
DE102010005771B4 (de) * 2010-01-25 2012-12-13 Heraeus Materials Technology Gmbh & Co. Kg Modulares Metallband, Verfahren zur seiner Herstellung und Bauteil mit verbesserter Ebenheit

Also Published As

Publication number Publication date
IT7823432A0 (it) 1978-05-16
GB2021315A (en) 1979-11-28
DE2919540A1 (de) 1979-11-22
FR2426333A1 (fr) 1979-12-14
JPS553692A (en) 1980-01-11
DE7914024U1 (de) 1983-04-07
FR2426333B3 (it) 1982-03-19

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