DE69024851D1 - Halbleiterspeicheranordnung - Google Patents

Halbleiterspeicheranordnung

Info

Publication number
DE69024851D1
DE69024851D1 DE69024851T DE69024851T DE69024851D1 DE 69024851 D1 DE69024851 D1 DE 69024851D1 DE 69024851 T DE69024851 T DE 69024851T DE 69024851 T DE69024851 T DE 69024851T DE 69024851 D1 DE69024851 D1 DE 69024851D1
Authority
DE
Germany
Prior art keywords
memory device
semiconductor memory
semiconductor
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69024851T
Other languages
English (en)
Other versions
DE69024851T2 (de
Inventor
Tohru Kohno
Masao Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69024851D1 publication Critical patent/DE69024851D1/de
Publication of DE69024851T2 publication Critical patent/DE69024851T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1006—Data managing, e.g. manipulating data before writing or reading out, data bus switches or control circuits therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Semiconductor Memories (AREA)
DE69024851T 1989-06-06 1990-06-06 Halbleiterspeicheranordnung Expired - Fee Related DE69024851T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14341389 1989-06-06

Publications (2)

Publication Number Publication Date
DE69024851D1 true DE69024851D1 (de) 1996-02-29
DE69024851T2 DE69024851T2 (de) 1996-09-05

Family

ID=15338191

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69024851T Expired - Fee Related DE69024851T2 (de) 1989-06-06 1990-06-06 Halbleiterspeicheranordnung

Country Status (5)

Country Link
US (1) US5502675A (de)
EP (1) EP0401792B1 (de)
JP (1) JPH0814985B2 (de)
KR (1) KR970004996B1 (de)
DE (1) DE69024851T2 (de)

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JPH06195973A (ja) * 1992-10-12 1994-07-15 Nec Corp ダイナミックｒａｍ
JP3048498B2 (ja) * 1994-04-13 2000-06-05 株式会社東芝 半導体記憶装置
JP3135795B2 (ja) 1994-09-22 2001-02-19 東芝マイクロエレクトロニクス株式会社 ダイナミック型メモリ
JP3267462B2 (ja) * 1995-01-05 2002-03-18 株式会社東芝 半導体記憶装置
US5812478A (en) * 1995-01-05 1998-09-22 Kabushiki Kaisha Toshiba Semiconductor memory having improved data bus arrangement
US5943693A (en) * 1995-03-29 1999-08-24 Intel Corporation Algorithmic array mapping to decrease defect sensitivity of memory devices
JPH0973778A (ja) * 1995-09-01 1997-03-18 Texas Instr Japan Ltd アドレスアクセスパスのコントロール回路
JPH09161476A (ja) 1995-10-04 1997-06-20 Toshiba Corp 半導体メモリ及びそのテスト回路、並びにデ−タ転送システム
JP3477018B2 (ja) * 1996-03-11 2003-12-10 株式会社東芝 半導体記憶装置
TW348266B (en) 1996-03-11 1998-12-21 Toshiba Co Ltd Semiconductor memory device
US6072719A (en) 1996-04-19 2000-06-06 Kabushiki Kaisha Toshiba Semiconductor memory device
US5815456A (en) * 1996-06-19 1998-09-29 Cirrus Logic, Inc. Multibank -- multiport memories and systems and methods using the same
JPH1050958A (ja) * 1996-08-05 1998-02-20 Toshiba Corp 半導体記憶装置、半導体記憶装置のレイアウト方法、半導体記憶装置の動作方法および半導体記憶装置の回路配置パターン
US5781483A (en) * 1996-12-31 1998-07-14 Micron Technology, Inc. Device and method for repairing a memory array by storing each bit in multiple memory cells in the array
US5822268A (en) * 1997-09-11 1998-10-13 International Business Machines Corporation Hierarchical column select line architecture for multi-bank DRAMs
JP3229267B2 (ja) * 1997-09-11 2001-11-19 インターナショナル・ビジネス・マシーンズ・コーポレーション マルチバンクｄｒａｍ用の階層カラム選択ライン・アーキテクチャ
US6034914A (en) * 1997-10-30 2000-03-07 Kabushiki Kaisha Toahiba Semiconductor memory device having column redundancy function
US5896331A (en) * 1997-12-23 1999-04-20 Lsi Logic Corporation Reprogrammable addressing process for embedded DRAM
US5901095A (en) * 1997-12-23 1999-05-04 Lsi Logic Corporation Reprogrammable address selector for an embedded DRAM
US5907511A (en) * 1997-12-23 1999-05-25 Lsi Logic Corporation Electrically selectable redundant components for an embedded DRAM
KR19990061991A (ko) * 1997-12-31 1999-07-26 김영환 다수개의 리던던시 입출력 라인들을 구비하는 반도체 장치
US6002275A (en) * 1998-02-02 1999-12-14 International Business Machines Corporation Single ended read write drive for memory
US6246630B1 (en) 1998-02-02 2001-06-12 International Business Machines Corporation Intra-unit column address increment system for memory
US6038634A (en) * 1998-02-02 2000-03-14 International Business Machines Corporation Intra-unit block addressing system for memory
US6118726A (en) * 1998-02-02 2000-09-12 International Business Machines Corporation Shared row decoder
US6064588A (en) * 1998-03-30 2000-05-16 Lsi Logic Corporation Embedded dram with noise-protected differential capacitor memory cells
US5999440A (en) * 1998-03-30 1999-12-07 Lsi Logic Corporation Embedded DRAM with noise-protecting substrate isolation well
US6049505A (en) 1998-05-22 2000-04-11 Micron Technology, Inc. Method and apparatus for generating memory addresses for testing memory devices
US5978304A (en) * 1998-06-30 1999-11-02 Lsi Logic Corporation Hierarchical, adaptable-configuration dynamic random access memory
US6005824A (en) * 1998-06-30 1999-12-21 Lsi Logic Corporation Inherently compensated clocking circuit for dynamic random access memory
US6115300A (en) * 1998-11-03 2000-09-05 Silicon Access Technology, Inc. Column redundancy based on column slices
JP2000182390A (ja) 1998-12-11 2000-06-30 Mitsubishi Electric Corp 半導体記憶装置
KR100351048B1 (ko) * 1999-04-27 2002-09-09 삼성전자 주식회사 데이터 입출력 라인의 부하를 최소화하는 칼럼 선택 회로, 이를 구비하는 반도체 메모리 장치
US6477082B2 (en) * 2000-12-29 2002-11-05 Micron Technology, Inc. Burst access memory with zero wait states
US6549476B2 (en) 2001-04-09 2003-04-15 Micron Technology, Inc. Device and method for using complementary bits in a memory array
JP5119563B2 (ja) * 2001-08-03 2013-01-16 日本電気株式会社 不良メモリセル救済回路を有する半導体記憶装置
US6941493B2 (en) * 2002-02-27 2005-09-06 Sun Microsystems, Inc. Memory subsystem including an error detection mechanism for address and control signals
US20030163769A1 (en) * 2002-02-27 2003-08-28 Sun Microsystems, Inc. Memory module including an error detection mechanism for address and control signals
US6976194B2 (en) * 2002-06-28 2005-12-13 Sun Microsystems, Inc. Memory/Transmission medium failure handling controller and method
US6996766B2 (en) * 2002-06-28 2006-02-07 Sun Microsystems, Inc. Error detection/correction code which detects and corrects a first failing component and optionally a second failing component
US6973613B2 (en) * 2002-06-28 2005-12-06 Sun Microsystems, Inc. Error detection/correction code which detects and corrects component failure and which provides single bit error correction subsequent to component failure
JP4425532B2 (ja) * 2002-08-29 2010-03-03 富士通マイクロエレクトロニクス株式会社 半導体メモリ
US6996686B2 (en) * 2002-12-23 2006-02-07 Sun Microsystems, Inc. Memory subsystem including memory modules having multiple banks
US7779285B2 (en) * 2003-02-18 2010-08-17 Oracle America, Inc. Memory system including independent isolated power for each memory module
US7530008B2 (en) 2003-08-08 2009-05-05 Sun Microsystems, Inc. Scalable-chip-correct ECC scheme
US7188296B1 (en) 2003-10-30 2007-03-06 Sun Microsystems, Inc. ECC for component failures using Galois fields
US20060182187A1 (en) * 2005-02-11 2006-08-17 Likovich Robert B Jr Automatic reconfiguration of an I/O bus to correct for an error bit
EP2062264B1 (de) * 2006-07-31 2015-10-07 Sandisk 3D LLC Verfahren 8nd vorrichtung für einen speichert mit zwei datenbussen zur speicherblockauswahl
US7499366B2 (en) 2006-07-31 2009-03-03 Sandisk 3D Llc Method for using dual data-dependent busses for coupling read/write circuits to a memory array
US8279704B2 (en) 2006-07-31 2012-10-02 Sandisk 3D Llc Decoder circuitry providing forward and reverse modes of memory array operation and method for biasing same
JP5018074B2 (ja) 2006-12-22 2012-09-05 富士通セミコンダクター株式会社 メモリ装置，メモリコントローラ及びメモリシステム
US20080309532A1 (en) * 2007-06-12 2008-12-18 Silicon Optronics, Inc. Solid-state imaging device and method of manufacturing thereof

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US4006467A (en) * 1975-11-14 1977-02-01 Honeywell Information Systems, Inc. Error-correctible bit-organized RAM system
JPS5298433A (en) * 1976-02-16 1977-08-18 Hitachi Ltd Semiconductor memory
JPS57198592A (en) * 1981-05-29 1982-12-06 Hitachi Ltd Semiconductor memory device
US4943967A (en) * 1982-02-15 1990-07-24 Hitachi, Ltd. Semiconductor memory with an improved dummy cell arrangement and with a built-in error correction code circuit
JPS58139399A (ja) * 1982-02-15 1983-08-18 Hitachi Ltd 半導体記憶装置
US4483001A (en) * 1982-06-16 1984-11-13 International Business Machines Corporation Online realignment of memory faults
JPS5975494A (ja) * 1982-10-25 1984-04-28 Hitachi Ltd 半導体記憶装置
JPS60179859A (ja) * 1984-02-27 1985-09-13 Nippon Telegr & Teleph Corp <Ntt> 半導体記憶装置
JPS6180597A (ja) * 1984-09-26 1986-04-24 Hitachi Ltd 半導体記憶装置
US4692923A (en) * 1984-09-28 1987-09-08 Ncr Corporation Fault tolerant memory
JPS61105800A (ja) * 1984-10-29 1986-05-23 Nec Corp 半導体メモリ
JPH0652632B2 (ja) * 1985-01-23 1994-07-06 株式会社日立製作所 ダイナミツク型ｒａｍ
JPS6247900A (ja) * 1985-08-27 1987-03-02 Toshiba Corp メモリ装置
US4747080A (en) * 1985-11-12 1988-05-24 Nippon Telegraph & Telephone Corporation Semiconductor memory having self correction function
JPS62134899A (ja) * 1985-12-06 1987-06-17 Mitsubishi Electric Corp 半導体記憶装置
JPH0612613B2 (ja) * 1986-03-18 1994-02-16 富士通株式会社 半導体記憶装置
JPS62250600A (ja) * 1986-04-22 1987-10-31 Sharp Corp 半導体集積回路装置
JPS63239675A (ja) * 1986-11-27 1988-10-05 Toshiba Corp 半導体記憶装置
JPS63140493A (ja) * 1986-12-01 1988-06-13 Mitsubishi Electric Corp 半導体記憶装置
JPS63204600A (ja) * 1987-02-18 1988-08-24 Mitsubishi Electric Corp 半導体記憶装置
JP2629697B2 (ja) * 1987-03-27 1997-07-09 日本電気株式会社 半導体記憶装置
JPS63304496A (ja) * 1987-06-03 1988-12-12 Mitsubishi Electric Corp 半導体記憶装置
JPS6457495A (en) * 1987-08-28 1989-03-03 Hitachi Ltd Semiconductor memory device
JPH0752583B2 (ja) * 1987-11-30 1995-06-05 株式会社東芝 半導体メモリ

Also Published As

Publication number Publication date
JPH0386992A (ja) 1991-04-11
DE69024851T2 (de) 1996-09-05
US5502675A (en) 1996-03-26
EP0401792A2 (de) 1990-12-12
EP0401792A3 (de) 1992-02-26
KR910001769A (ko) 1991-01-31
JPH0814985B2 (ja) 1996-02-14
EP0401792B1 (de) 1996-01-17
KR970004996B1 (ko) 1997-04-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee