KR20110025781A - 낮은 열 질량 반도체 웨이퍼 서포트 - Google Patents

낮은 열 질량 반도체 웨이퍼 서포트 Download PDF

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Publication number
KR20110025781A
KR20110025781A KR1020107029664A KR20107029664A KR20110025781A KR 20110025781 A KR20110025781 A KR 20110025781A KR 1020107029664 A KR1020107029664 A KR 1020107029664A KR 20107029664 A KR20107029664 A KR 20107029664A KR 20110025781 A KR20110025781 A KR 20110025781A
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KR
South Korea
Prior art keywords
wafer
support
plate
holes
boat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107029664A
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English (en)
Korean (ko)
Inventor
브라이언 엘. 질모어
랜스 지. 헬위그
Original Assignee
엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠이엠씨 일렉트로닉 머티리얼즈, 인크. filed Critical 엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Publication of KR20110025781A publication Critical patent/KR20110025781A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020107029664A 2008-06-30 2009-06-22 낮은 열 질량 반도체 웨이퍼 서포트 Ceased KR20110025781A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/165,048 2008-06-30
US12/165,048 US8042697B2 (en) 2008-06-30 2008-06-30 Low thermal mass semiconductor wafer support

Publications (1)

Publication Number Publication Date
KR20110025781A true KR20110025781A (ko) 2011-03-11

Family

ID=40912053

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107029664A Ceased KR20110025781A (ko) 2008-06-30 2009-06-22 낮은 열 질량 반도체 웨이퍼 서포트

Country Status (7)

Country Link
US (3) US8042697B2 (https=)
EP (3) EP2311080B1 (https=)
JP (1) JP5436552B2 (https=)
KR (1) KR20110025781A (https=)
CN (1) CN102077336A (https=)
TW (1) TWI430391B (https=)
WO (1) WO2010002617A1 (https=)

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US10072892B2 (en) * 2015-10-26 2018-09-11 Globalwafers Co., Ltd. Semiconductor wafer support ring for heat treatment
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US20210233783A1 (en) * 2018-06-25 2021-07-29 LINDENBERG Ralph Carrier for a substrate and method for carrying a substrate
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US12046495B2 (en) * 2020-06-26 2024-07-23 Globalwafers Co., Ltd. Wafer boats for supporting semiconductor wafers in a furnace
JP7734211B2 (ja) * 2021-05-12 2025-09-04 アプライド マテリアルズ インコーポレイテッド 低質量基板支持体
CN113964071A (zh) * 2021-11-25 2022-01-21 滁州钰顺企业管理咨询合伙企业(有限合伙) 一种降低晶圆包装破损的方法
US12261068B2 (en) * 2022-10-27 2025-03-25 Intel Corporation Wafer support member and method of manufacturing a wafer support member
EP4498411A3 (en) * 2023-06-28 2025-03-26 ASM IP Holding B.V. Wafer boat system, holder ring and use thereof
TWI911672B (zh) * 2024-03-13 2026-01-11 力晶積成電子製造股份有限公司 晶圓承載裝置

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Also Published As

Publication number Publication date
US8220647B2 (en) 2012-07-17
US8042697B2 (en) 2011-10-25
US20090321372A1 (en) 2009-12-31
WO2010002617A1 (en) 2010-01-07
TW201009998A (en) 2010-03-01
US20120074081A1 (en) 2012-03-29
US20120077138A1 (en) 2012-03-29
US8220646B2 (en) 2012-07-17
JP2011527109A (ja) 2011-10-20
EP2311080A1 (en) 2011-04-20
TWI430391B (zh) 2014-03-11
JP5436552B2 (ja) 2014-03-05
EP2311080B1 (en) 2013-02-27
EP2597672A2 (en) 2013-05-29
EP2597673A2 (en) 2013-05-29
CN102077336A (zh) 2011-05-25

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