CN102077336A - 低热质半导体晶片支承 - Google Patents

低热质半导体晶片支承 Download PDF

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Publication number
CN102077336A
CN102077336A CN2009801252789A CN200980125278A CN102077336A CN 102077336 A CN102077336 A CN 102077336A CN 2009801252789 A CN2009801252789 A CN 2009801252789A CN 200980125278 A CN200980125278 A CN 200980125278A CN 102077336 A CN102077336 A CN 102077336A
Authority
CN
China
Prior art keywords
wafer
support
plate
platform
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801252789A
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English (en)
Chinese (zh)
Inventor
B·L·吉尔摩
L·G·赫尔维格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of CN102077336A publication Critical patent/CN102077336A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2009801252789A 2008-06-30 2009-06-22 低热质半导体晶片支承 Pending CN102077336A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/165,048 2008-06-30
US12/165,048 US8042697B2 (en) 2008-06-30 2008-06-30 Low thermal mass semiconductor wafer support
PCT/US2009/048126 WO2010002617A1 (en) 2008-06-30 2009-06-22 Low thermal mass semiconductor wafer support

Publications (1)

Publication Number Publication Date
CN102077336A true CN102077336A (zh) 2011-05-25

Family

ID=40912053

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801252789A Pending CN102077336A (zh) 2008-06-30 2009-06-22 低热质半导体晶片支承

Country Status (7)

Country Link
US (3) US8042697B2 (https=)
EP (3) EP2311080B1 (https=)
JP (1) JP5436552B2 (https=)
KR (1) KR20110025781A (https=)
CN (1) CN102077336A (https=)
TW (1) TWI430391B (https=)
WO (1) WO2010002617A1 (https=)

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CN113964071A (zh) * 2021-11-25 2022-01-21 滁州钰顺企业管理咨询合伙企业(有限合伙) 一种降低晶圆包装破损的方法
US12261068B2 (en) * 2022-10-27 2025-03-25 Intel Corporation Wafer support member and method of manufacturing a wafer support member
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TWI911672B (zh) * 2024-03-13 2026-01-11 力晶積成電子製造股份有限公司 晶圓承載裝置

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Also Published As

Publication number Publication date
US8220647B2 (en) 2012-07-17
US8042697B2 (en) 2011-10-25
US20090321372A1 (en) 2009-12-31
WO2010002617A1 (en) 2010-01-07
TW201009998A (en) 2010-03-01
US20120074081A1 (en) 2012-03-29
US20120077138A1 (en) 2012-03-29
US8220646B2 (en) 2012-07-17
JP2011527109A (ja) 2011-10-20
EP2311080A1 (en) 2011-04-20
TWI430391B (zh) 2014-03-11
JP5436552B2 (ja) 2014-03-05
EP2311080B1 (en) 2013-02-27
EP2597672A2 (en) 2013-05-29
KR20110025781A (ko) 2011-03-11
EP2597673A2 (en) 2013-05-29

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SE01 Entry into force of request for substantive examination
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Application publication date: 20110525