KR20070001191A - 감광성 수지 조성물, 그 경화물 및 그것을 사용하는 프린트배선 기판의 제조 방법 - Google Patents
감광성 수지 조성물, 그 경화물 및 그것을 사용하는 프린트배선 기판의 제조 방법 Download PDFInfo
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
- C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
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- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
Claims (17)
- 우레탄 아크릴레이트 화합물(A)과 상기 우레탄 아크릴레이트 화합물(A) 이외의 에틸렌성 불포화기를 갖는 화합물(B)을 포함하는 광중합 성분, 열경화성 수지(C), 광중합 개시제(D), 및 열중합 촉매(E)를 함유하고;상기 우레탄 아크릴레이트 화합물(A)은 하기 일반식 (1):CH2=CH-COO-R-NCO (1)(여기서, R은 탄소 원자 1∼30을 갖는 탄화수소기를 의미함)의 이소시아네이트 화합물(a-1)과 폴리히드록시 화합물(a-2)의 반응 산물인 감광성 수지 조성물.
- 제 1 항에 있어서,상기 폴리히드록시 화합물(a-2)은 하기 (Ⅰ)∼(Ⅴ):(Ⅰ) 폴리에스테르 폴리올 화합물;(Ⅱ) 폴리카보네이트 폴리올 화합물;(Ⅲ) 폴리알킬렌 옥사이드 화합물;(Ⅳ) 폴리우레탄 폴리올 화합물; 및(Ⅴ) 히드록시알킬 (메타)아크릴레이트의 단독 중합체 또는 공중합체로 이루어지는 군으로부터 선택된 1종 이상의 화합물인 감광성 수지 조성물.
- 제 1 항에 있어서,상기 우레탄 아크릴레이트 화합물(A)은 카르복실기를 갖는 감광성 수지 조성물.
- 제 3 항에 있어서,상기 우레탄 아크릴레이트 화합물(A)의 수평균 분자량은 1,000∼40,000이고, 상기 우레탄 아크릴레이트 화합물(A)의 산가는 5∼150㎎ KOH/g인 감광성 수지 조성물.
- 제 1 항에 있어서,유기 용매를 더 포함하는 감광성 수지 조성물.
- 제 5 항에 있어서,상기 조성물의 25℃에서의 점도는 500∼500,000mPaㆍs인 감광성 수지 조성물.
- 제 1 항에 있어서,상기 열경화성 수지(C)는 에폭시 수지인 감광성 수지 조성물.
- 제 1 항에 있어서,상기 조성물은 레지스트로 사용되는 감광성 수지 조성물.
- 제 1 항에 있어서,상기 조성물은 솔더 레지스트로 사용되는 감광성 수지 조성물.
- 제 1 항에 기재된 감광성 수지 조성물로 형성된 감광층을 지지체상에 갖는 드라이 필름 레지스트.
- 제 10 항에 있어서,상기 지지체는 폴리에스테르 필름인 드라이 필름 레지스트.
- 제 1 항에 기재된 감광성 수지 조성물이 지지체상에 도포되어 건조되는 감광층 형성 공정을 갖는 드라이 필름 레지스트의 제조 방법.
- 제 1 항에 기재된 감광성 수지 조성물로 형성된 경화물.
- 제 1 항에 기재된 감광성 수지 조성물로 형성된 절연 보호 피막.
- 제 14 항에 기재된 절연 보호 피막을 갖는 프린트 배선 기판.
- 제 15 항에 있어서,플렉시블 프린트 배선 기판인 프린트 배선 기판.
- 제 10 항 또는 제 11 항에 기재된 드라이 필름 레지스트의 감광층과 기판을 적층하는 적층 공정;상기 감광층을 노광하는 노광 공정;상기 노광 공정후의 현상 공정; 및상기 감광층을 열경화시키는 열경화 공정을 포함하는 프린트 배선 기판의 제조 방법.
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JP2004127186 | 2004-04-22 | ||
JPJP-P-2004-00127186 | 2004-04-22 |
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KR20070001191A true KR20070001191A (ko) | 2007-01-03 |
KR100808070B1 KR100808070B1 (ko) | 2008-02-28 |
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KR1020067019137A KR100808070B1 (ko) | 2004-04-22 | 2005-04-21 | 감광성 수지 조성물, 그 경화물 및 그것을 사용하는 프린트배선 기판의 제조 방법 |
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US (1) | US7790354B2 (ko) |
EP (1) | EP1741006B1 (ko) |
JP (1) | JP4587865B2 (ko) |
KR (1) | KR100808070B1 (ko) |
CN (1) | CN101073037B (ko) |
AT (1) | ATE383593T1 (ko) |
DE (1) | DE602005004273T2 (ko) |
TW (1) | TW200538471A (ko) |
WO (1) | WO2005103822A2 (ko) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
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US20060199920A1 (en) * | 2003-04-15 | 2006-09-07 | Koji Okada | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof |
JP5190976B2 (ja) * | 2004-09-21 | 2013-04-24 | 昭和電工株式会社 | ウレタン樹脂を用いた熱硬化性樹脂組成物 |
KR101189646B1 (ko) | 2004-09-21 | 2012-10-12 | 쇼와 덴코 가부시키가이샤 | 열경화성 우레탄 수지 조성물 |
JP4793815B2 (ja) * | 2005-12-28 | 2011-10-12 | 日本化薬株式会社 | 感光性樹脂組成物、並びにその硬化物 |
WO2007105713A1 (ja) * | 2006-03-16 | 2007-09-20 | Showa Denko K.K. | 熱硬化性樹脂組成物、フレキシブル回路基板用オーバーコート剤および表面保護膜 |
US20100221552A1 (en) * | 2006-03-31 | 2010-09-02 | Mitsui Chemicals, Inc. | Photocurable Coating Materials |
JP4994922B2 (ja) * | 2007-04-06 | 2012-08-08 | 太陽ホールディングス株式会社 | ソルダーレジスト組成物およびその硬化物 |
CN101360397B (zh) | 2007-08-03 | 2011-09-21 | 富葵精密组件(深圳)有限公司 | 镂空电路板的制作方法 |
US20110077334A1 (en) * | 2008-05-23 | 2011-03-31 | Showa Denko K.K. | Curable composition containing reactive (meth) acrylate polymer and cured products thereof |
JP2010163594A (ja) * | 2008-12-15 | 2010-07-29 | Hitachi Chem Co Ltd | 硬化性樹脂組成物、硬化性樹脂フィルム及びそれを用いためっき方法 |
JP5113782B2 (ja) * | 2009-02-18 | 2013-01-09 | 大日精化工業株式会社 | 合成擬革、その製造方法、プレポリマーおよび接着剤組成物 |
JP5305972B2 (ja) * | 2009-02-20 | 2013-10-02 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、ドライフィルム及びそれらの硬化物 |
JP5567290B2 (ja) * | 2009-05-12 | 2014-08-06 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP5620656B2 (ja) * | 2009-08-19 | 2014-11-05 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物 |
JP5575436B2 (ja) * | 2009-09-01 | 2014-08-20 | 太陽ホールディングス株式会社 | アルカリ現像性の光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
MX349838B (es) | 2009-11-16 | 2017-08-16 | Tokuyama Corp | Monomero de (met)acrilato de uretano y proceso de produccion del mismo. |
KR101393467B1 (ko) | 2009-12-14 | 2014-05-13 | 쇼와 덴코 가부시키가이샤 | 중합성 화합물 및 그 화합물을 포함하는 경화성 조성물 |
JP2011221463A (ja) * | 2010-04-14 | 2011-11-04 | Samsung Electronics Co Ltd | 感光性樹脂組成物 |
CN101942277A (zh) * | 2010-09-02 | 2011-01-12 | 东莞市贝特利新材料有限公司 | 一种紫外光固化转印胶 |
WO2012035857A1 (ja) * | 2010-09-13 | 2012-03-22 | 株式会社カネカ | 補強板一体型フレキシブルプリント基板、及び補強板一体型フレキシブルプリント基板の製造方法 |
TWI586749B (zh) * | 2010-11-19 | 2017-06-11 | 漢高日本股份有限公司 | 單組分環氧樹脂組成物 |
JP5764040B2 (ja) * | 2010-11-25 | 2015-08-12 | 株式会社日本触媒 | 光学用紫外線硬化型樹脂組成物、硬化物及び表示装置 |
JP6084353B2 (ja) * | 2010-12-28 | 2017-02-22 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法 |
CN102093764B (zh) * | 2010-12-31 | 2013-04-10 | 长安大学 | 沥青路面用多色系选择性太阳热反射涂料 |
CN102181192A (zh) * | 2011-01-24 | 2011-09-14 | 上海宏盾防伪材料有限公司 | 双重固化涂料及其制备方法 |
JP5745886B2 (ja) * | 2011-02-16 | 2015-07-08 | 株式会社カネカ | 新規な白色感光性樹脂組成物及びその利用 |
CN102799070B (zh) * | 2012-08-27 | 2014-03-05 | 珠海市能动科技光学产业有限公司 | 双层涂布的负性光致抗蚀干膜 |
JPWO2015002071A1 (ja) * | 2013-07-04 | 2017-02-23 | 味の素株式会社 | 感光性樹脂組成物 |
JP2013225151A (ja) * | 2013-07-09 | 2013-10-31 | Taiyo Holdings Co Ltd | 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
CN103616800B (zh) * | 2013-10-21 | 2016-08-10 | 溧阳市东大技术转移中心有限公司 | 感光固化树脂组合物 |
JP5882510B2 (ja) * | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
CN104387843A (zh) * | 2014-11-26 | 2015-03-04 | 东莞市康庄电路有限公司 | 一种铁灰色不反光油墨 |
JP6263138B2 (ja) * | 2015-02-12 | 2018-01-17 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
EP3277693B1 (en) * | 2015-04-03 | 2020-10-14 | Henkel IP & Holding GmbH | (meth)acrylate-functionalized extended isosorbide |
JP6090537B1 (ja) * | 2015-04-21 | 2017-03-08 | 東レ株式会社 | 積層部材及びタッチパネル |
JP6787493B2 (ja) * | 2017-07-21 | 2020-11-18 | Dic株式会社 | 組成物及び印刷インキ |
TWI789506B (zh) * | 2018-03-27 | 2023-01-11 | 日商迪愛生股份有限公司 | 硬化性黏接劑組成物、使用此組成物之黏接片、含有此黏接片之疊層體及其製造方法 |
DE102018121067A1 (de) * | 2018-08-29 | 2020-03-05 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Härtbare Zweikomponentenmasse |
KR102553649B1 (ko) * | 2018-10-05 | 2023-07-11 | 엘란타스 피디쥐, 인코포레이티드. | 고전압 적용을 위한 하이브리드 수지 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4717643A (en) | 1985-08-06 | 1988-01-05 | Hercules Incorporated | No thermal cure dry film solder mask |
EP0259726A3 (de) | 1986-09-11 | 1989-05-10 | Siemens Aktiengesellschaft | Photopolymere auf Epoxidharzbasis |
US5089376A (en) * | 1986-12-08 | 1992-02-18 | Armstrong World Industries, Inc. | Photoimagable solder mask coating |
US5006436A (en) * | 1988-09-20 | 1991-04-09 | Atochem North America, Inc. | UV curable compositions for making tentable solder mask coating |
JPH02217857A (ja) * | 1988-09-27 | 1990-08-30 | Hitachi Chem Co Ltd | 感光性樹脂組成物および感光性エレメント |
JPH02123359A (ja) * | 1988-11-01 | 1990-05-10 | Hitachi Chem Co Ltd | 感光性樹脂組成物および感光性エレメント |
EP0419043B1 (en) * | 1989-08-24 | 1995-10-11 | Mitsubishi Rayon Co., Ltd. | Thermosetting (meth)acrylate liquid resins and compositions containing them |
JPH04109250A (ja) * | 1990-08-30 | 1992-04-10 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント及びプリント配線板の製造法 |
JPH04353850A (ja) * | 1991-05-31 | 1992-12-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント及びプリント配線板の製造法 |
JPH05179158A (ja) * | 1991-12-19 | 1993-07-20 | Nippon Kayaku Co Ltd | 樹脂組成物、ソルダーレジスト樹脂組成物及びその硬化物 |
JPH06298886A (ja) * | 1993-01-18 | 1994-10-25 | Dainippon Ink & Chem Inc | 光硬化型樹脂組成物及びこの光硬化型樹脂組成物を用いた光学レンズ |
AU7315194A (en) * | 1993-06-23 | 1995-01-17 | Union Carbide Chemicals & Plastics Technology Corporation | Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated isocyanates |
EP0671659B1 (en) * | 1994-03-03 | 1998-05-27 | Mitsubishi Chemical Corporation | Photosensitive composition |
JPH08183823A (ja) * | 1994-12-28 | 1996-07-16 | Takemoto Oil & Fat Co Ltd | 光学的立体造形用樹脂及び光学的立体造形用樹脂組成物 |
JPH08183822A (ja) * | 1994-12-28 | 1996-07-16 | Takemoto Oil & Fat Co Ltd | 光学的立体造形用樹脂 |
JP4341997B2 (ja) * | 1997-07-29 | 2009-10-14 | 東京応化工業株式会社 | 光重合性樹脂組成物 |
CA2252240C (en) * | 1997-12-01 | 2002-02-26 | Daniel E. Lundy | Photoimageable compositions |
TW494277B (en) * | 1998-05-29 | 2002-07-11 | Nichigo Morton Co Ltd | Photoimageable composition having improved flexibility |
US6432614B1 (en) | 1998-07-31 | 2002-08-13 | Dai Nippon Printing Co., Ltd. | Photosensitive resin composition and color filter |
US6410206B1 (en) | 1999-02-25 | 2002-06-25 | Dai Nippon Printing Co., Ltd. | Photosensitive resin composition, color filter, and copolymer resin useful for them |
US6458509B1 (en) * | 1999-04-30 | 2002-10-01 | Toagosei Co., Ltd. | Resist compositions |
JP3357014B2 (ja) * | 1999-07-23 | 2002-12-16 | 大日本印刷株式会社 | 光硬化性樹脂組成物及び凹凸パターンの形成方法 |
JP2001106765A (ja) | 1999-10-08 | 2001-04-17 | Dainippon Printing Co Ltd | 高感度硬化性樹脂、硬化性樹脂組成物、それらの製造方法、カラーフィルター及び液晶パネル |
US6268111B1 (en) * | 1999-10-20 | 2001-07-31 | Rohm And Haas Company | Photoimageable composition having photopolymerizeable binder oligomer |
EP1276011B1 (en) | 2000-03-29 | 2004-05-26 | Kanagawa University | Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same |
JP4611554B2 (ja) * | 2000-12-01 | 2011-01-12 | 昭和電工株式会社 | 感光性組成物およびその硬化物ならびにそれを用いたプリント配線基板 |
EP1317691A2 (en) * | 2000-09-11 | 2003-06-11 | Showa Denko K.K. | Photosensitive composition, cured article thereof, and printed circuit board using the same |
JP4623890B2 (ja) * | 2000-09-11 | 2011-02-02 | 昭和電工株式会社 | 感光性組成物及びその硬化物並びにそれを用いたプリント配線基板 |
JP2002128865A (ja) * | 2000-10-31 | 2002-05-09 | Showa Highpolymer Co Ltd | 感光性樹脂組成物 |
JP3984488B2 (ja) * | 2001-03-27 | 2007-10-03 | 日本ペイント株式会社 | 硬化性塗料組成物および塗膜形成方法 |
US6620887B2 (en) * | 2001-06-25 | 2003-09-16 | Mitsubishi Rayon Co., Ltd. | Crosslinked fine particles and curable resin composition |
EP1402321A1 (en) * | 2001-07-04 | 2004-03-31 | Showa Denko K.K. | Resist curable resin composition and cured article thereof |
JP2003195486A (ja) * | 2001-12-27 | 2003-07-09 | Showa Denko Kk | 感光性組成物およびその硬化物ならびにそれを用いたプリント配線基板 |
JP2003212954A (ja) * | 2002-01-21 | 2003-07-30 | Showa Denko Kk | リン含有ウレタン(メタ)アクリレート化合物および感光性組成物 |
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- 2005-04-21 WO PCT/JP2005/008100 patent/WO2005103822A2/en active IP Right Grant
- 2005-04-21 US US11/587,162 patent/US7790354B2/en not_active Expired - Fee Related
- 2005-04-21 TW TW94112785A patent/TW200538471A/zh not_active IP Right Cessation
- 2005-04-21 DE DE200560004273 patent/DE602005004273T2/de active Active
- 2005-04-21 KR KR1020067019137A patent/KR100808070B1/ko active IP Right Grant
- 2005-04-21 EP EP05737083A patent/EP1741006B1/en not_active Not-in-force
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CN101073037B (zh) | 2010-06-16 |
US7790354B2 (en) | 2010-09-07 |
TW200538471A (en) | 2005-12-01 |
WO2005103822A3 (en) | 2006-12-14 |
DE602005004273T2 (de) | 2009-01-08 |
EP1741006B1 (en) | 2008-01-09 |
JP2005331932A (ja) | 2005-12-02 |
TWI359819B (ko) | 2012-03-11 |
US20070218305A1 (en) | 2007-09-20 |
JP4587865B2 (ja) | 2010-11-24 |
KR100808070B1 (ko) | 2008-02-28 |
CN101073037A (zh) | 2007-11-14 |
EP1741006A2 (en) | 2007-01-10 |
WO2005103822A2 (en) | 2005-11-03 |
DE602005004273D1 (de) | 2008-02-21 |
ATE383593T1 (de) | 2008-01-15 |
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