KR20010034799A - 웨이퍼 처리 장치와 함께 사용하기 위한 자동화된 웨이퍼버퍼 - Google Patents

웨이퍼 처리 장치와 함께 사용하기 위한 자동화된 웨이퍼버퍼 Download PDF

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Publication number
KR20010034799A
KR20010034799A KR1020007011698A KR20007011698A KR20010034799A KR 20010034799 A KR20010034799 A KR 20010034799A KR 1020007011698 A KR1020007011698 A KR 1020007011698A KR 20007011698 A KR20007011698 A KR 20007011698A KR 20010034799 A KR20010034799 A KR 20010034799A
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KR
South Korea
Prior art keywords
wafer
processing system
transfer
wafers
port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020007011698A
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English (en)
Korean (ko)
Inventor
무카리차드에스.
Original Assignee
베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. filed Critical 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Publication of KR20010034799A publication Critical patent/KR20010034799A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020007011698A 1998-04-22 1999-04-12 웨이퍼 처리 장치와 함께 사용하기 위한 자동화된 웨이퍼버퍼 Withdrawn KR20010034799A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/064,375 1998-04-22
US09/064,375 US6079927A (en) 1998-04-22 1998-04-22 Automated wafer buffer for use with wafer processing equipment
PCT/US1999/007910 WO1999054921A1 (en) 1998-04-22 1999-04-12 Automated wafer buffer for use with wafer processing equipment

Publications (1)

Publication Number Publication Date
KR20010034799A true KR20010034799A (ko) 2001-04-25

Family

ID=22055514

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007011698A Withdrawn KR20010034799A (ko) 1998-04-22 1999-04-12 웨이퍼 처리 장치와 함께 사용하기 위한 자동화된 웨이퍼버퍼

Country Status (6)

Country Link
US (1) US6079927A (enExample)
EP (1) EP1080487A1 (enExample)
JP (1) JP4353450B2 (enExample)
KR (1) KR20010034799A (enExample)
TW (1) TW408357B (enExample)
WO (1) WO1999054921A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR100905565B1 (ko) * 2000-03-16 2009-07-02 어플라이드 머티어리얼스, 인코포레이티드 카세트 저장 및 이송 장치
KR20100113625A (ko) * 2008-02-05 2010-10-21 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 베어 스토커용 자동 취급 버퍼

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