KR101703511B1 - 박막 트랜지스터 - Google Patents
박막 트랜지스터 Download PDFInfo
- Publication number
- KR101703511B1 KR101703511B1 KR1020117002075A KR20117002075A KR101703511B1 KR 101703511 B1 KR101703511 B1 KR 101703511B1 KR 1020117002075 A KR1020117002075 A KR 1020117002075A KR 20117002075 A KR20117002075 A KR 20117002075A KR 101703511 B1 KR101703511 B1 KR 101703511B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- semiconductor layer
- region
- crystal
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6732—Bottom-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008169286 | 2008-06-27 | ||
| JPJP-P-2008-169286 | 2008-06-27 | ||
| JPJP-P-2009-046433 | 2009-02-27 | ||
| JP2009046433 | 2009-02-27 | ||
| JPJP-P-2009-129313 | 2009-05-28 | ||
| JP2009129313 | 2009-05-28 | ||
| PCT/JP2009/061795 WO2009157574A1 (en) | 2008-06-27 | 2009-06-22 | Thin film transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110029157A KR20110029157A (ko) | 2011-03-22 |
| KR101703511B1 true KR101703511B1 (ko) | 2017-02-07 |
Family
ID=41444634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117002075A Expired - Fee Related KR101703511B1 (ko) | 2008-06-27 | 2009-06-22 | 박막 트랜지스터 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8637866B2 (enExample) |
| EP (1) | EP2291856A4 (enExample) |
| JP (1) | JP5448603B2 (enExample) |
| KR (1) | KR101703511B1 (enExample) |
| CN (1) | CN102077331B (enExample) |
| TW (1) | TWI460863B (enExample) |
| WO (1) | WO2009157574A1 (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5436017B2 (ja) | 2008-04-25 | 2014-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5518366B2 (ja) * | 2008-05-16 | 2014-06-11 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ |
| WO2009157573A1 (en) | 2008-06-27 | 2009-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, semiconductor device and electronic device |
| US8284142B2 (en) | 2008-09-30 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP5498762B2 (ja) * | 2008-11-17 | 2014-05-21 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
| US8530897B2 (en) * | 2008-12-11 | 2013-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device including an inverter circuit having a microcrystalline layer |
| US7989325B2 (en) * | 2009-01-13 | 2011-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing crystalline semiconductor film and method for manufacturing thin film transistor |
| WO2010103906A1 (en) | 2009-03-09 | 2010-09-16 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor |
| US9312156B2 (en) * | 2009-03-27 | 2016-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor |
| JP5888802B2 (ja) | 2009-05-28 | 2016-03-22 | 株式会社半導体エネルギー研究所 | トランジスタを有する装置 |
| US8772627B2 (en) * | 2009-08-07 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method thereof |
| JP5466933B2 (ja) * | 2009-12-03 | 2014-04-09 | 株式会社ジャパンディスプレイ | 薄膜トランジスタおよびその製造方法 |
| KR101836067B1 (ko) | 2009-12-21 | 2018-03-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터와 그 제작 방법 |
| TWI535028B (zh) | 2009-12-21 | 2016-05-21 | 半導體能源研究所股份有限公司 | 薄膜電晶體 |
| US8476744B2 (en) | 2009-12-28 | 2013-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with channel including microcrystalline and amorphous semiconductor regions |
| US8383434B2 (en) * | 2010-02-22 | 2013-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and manufacturing method thereof |
| US8830278B2 (en) | 2010-04-09 | 2014-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for driving the same |
| DE112011101260T5 (de) | 2010-04-09 | 2013-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Flüssigkristall-Anzeigevorrichtung und Verfahren zum Ansteuern derselben |
| CN102754187A (zh) * | 2010-05-10 | 2012-10-24 | 松下电器产业株式会社 | 结晶性半导体膜的制造方法、带结晶性半导体膜的基板、薄膜晶体管 |
| JP5933188B2 (ja) | 2010-05-14 | 2016-06-08 | 株式会社半導体エネルギー研究所 | 微結晶シリコン膜及びその作製方法、並びに半導体装置 |
| KR101758297B1 (ko) | 2010-06-04 | 2017-07-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
| WO2011158948A1 (en) | 2010-06-18 | 2011-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing power storage device |
| US8564529B2 (en) | 2010-06-21 | 2013-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for driving liquid crystal display device |
| US9286848B2 (en) | 2010-07-01 | 2016-03-15 | Semiconductor Energy Laboratory Co., Ltd. | Method for driving liquid crystal display device |
| US8988337B2 (en) | 2010-07-02 | 2015-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of liquid crystal display device |
| US9336739B2 (en) | 2010-07-02 | 2016-05-10 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| TWI606490B (zh) * | 2010-07-02 | 2017-11-21 | 半導體能源研究所股份有限公司 | 半導體膜的製造方法,半導體裝置的製造方法,和光電轉換裝置的製造方法 |
| CN106057144B (zh) | 2010-07-02 | 2019-03-12 | 株式会社半导体能源研究所 | 液晶显示装置及驱动液晶显示装置的方法 |
| TWI541782B (zh) | 2010-07-02 | 2016-07-11 | 半導體能源研究所股份有限公司 | 液晶顯示裝置 |
| JP2012048220A (ja) | 2010-07-26 | 2012-03-08 | Semiconductor Energy Lab Co Ltd | 液晶表示装置及びその駆動方法 |
| JP5825895B2 (ja) | 2010-08-06 | 2015-12-02 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| JP5948025B2 (ja) * | 2010-08-06 | 2016-07-06 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| US9230826B2 (en) | 2010-08-26 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Etching method using mixed gas and method for manufacturing semiconductor device |
| US8704230B2 (en) | 2010-08-26 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8643580B2 (en) | 2010-08-31 | 2014-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for driving liquid crystal display device |
| TWI538218B (zh) | 2010-09-14 | 2016-06-11 | 半導體能源研究所股份有限公司 | 薄膜電晶體 |
| US8338240B2 (en) | 2010-10-01 | 2012-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing transistor |
| KR20120044042A (ko) * | 2010-10-27 | 2012-05-07 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| CN102096228B (zh) * | 2010-12-17 | 2012-07-04 | 湖南创图视维科技有限公司 | 一种显示系统和显示方法 |
| US8730416B2 (en) | 2010-12-17 | 2014-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US9048327B2 (en) * | 2011-01-25 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Microcrystalline semiconductor film, method for manufacturing the same, and method for manufacturing semiconductor device |
| TWI569041B (zh) | 2011-02-14 | 2017-02-01 | 半導體能源研究所股份有限公司 | 顯示裝置 |
| US9035860B2 (en) | 2011-02-16 | 2015-05-19 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| WO2012111427A1 (en) | 2011-02-16 | 2012-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US8629445B2 (en) | 2011-02-21 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and electronic appliance |
| US9443455B2 (en) | 2011-02-25 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device having a plurality of pixels |
| US8994763B2 (en) | 2011-03-25 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and driving method of the same |
| US9024927B2 (en) | 2011-06-15 | 2015-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for driving the same |
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| KR20130010834A (ko) | 2011-07-19 | 2013-01-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| JP5998397B2 (ja) * | 2011-10-25 | 2016-09-28 | 株式会社Joled | 薄膜半導体装置及びその製造方法 |
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| KR102245780B1 (ko) | 2014-11-03 | 2021-04-29 | 삼성디스플레이 주식회사 | 레이저 결정화 시스템, 레이저 결정화방법 및 표시장치의 제조방법 |
| KR102365963B1 (ko) * | 2015-06-23 | 2022-02-23 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이의 제조 방법 및 이를 갖는 액정 표시 장치 |
| CN105826398A (zh) * | 2016-06-15 | 2016-08-03 | 京东方科技集团股份有限公司 | 一种薄膜晶体管、阵列基板及制作方法 |
| CN105870203B (zh) * | 2016-06-24 | 2019-05-10 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
| CN109728098B (zh) * | 2019-01-03 | 2022-05-17 | 合肥鑫晟光电科技有限公司 | 薄膜晶体管、传感器、检测方法、检测装置及检测系统 |
| JP2021002633A (ja) * | 2019-06-25 | 2021-01-07 | 日新電機株式会社 | 酸化物半導体の加工法方法及び薄膜トランジスタの製造方法 |
| US10964811B2 (en) | 2019-08-09 | 2021-03-30 | Micron Technology, Inc. | Transistor and methods of forming transistors |
| US11024736B2 (en) | 2019-08-09 | 2021-06-01 | Micron Technology, Inc. | Transistor and methods of forming integrated circuitry |
| US11637175B2 (en) * | 2020-12-09 | 2023-04-25 | Micron Technology, Inc. | Vertical transistors |
| CN115458588A (zh) * | 2022-09-23 | 2022-12-09 | 武汉华星光电技术有限公司 | 显示面板 |
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2009
- 2009-06-22 WO PCT/JP2009/061795 patent/WO2009157574A1/en not_active Ceased
- 2009-06-22 CN CN200980124705.1A patent/CN102077331B/zh not_active Expired - Fee Related
- 2009-06-22 KR KR1020117002075A patent/KR101703511B1/ko not_active Expired - Fee Related
- 2009-06-22 EP EP09770284.9A patent/EP2291856A4/en not_active Withdrawn
- 2009-06-24 US US12/490,447 patent/US8637866B2/en not_active Expired - Fee Related
- 2009-06-26 JP JP2009152189A patent/JP5448603B2/ja not_active Expired - Fee Related
- 2009-06-26 TW TW098121640A patent/TWI460863B/zh not_active IP Right Cessation
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| JP2008124392A (ja) * | 2006-11-15 | 2008-05-29 | Sharp Corp | 半導体装置、その製造方法及び表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2291856A1 (en) | 2011-03-09 |
| WO2009157574A1 (en) | 2009-12-30 |
| JP5448603B2 (ja) | 2014-03-19 |
| TWI460863B (zh) | 2014-11-11 |
| CN102077331B (zh) | 2014-05-07 |
| EP2291856A4 (en) | 2015-09-23 |
| CN102077331A (zh) | 2011-05-25 |
| TW201013933A (en) | 2010-04-01 |
| KR20110029157A (ko) | 2011-03-22 |
| JP2011009506A (ja) | 2011-01-13 |
| US8637866B2 (en) | 2014-01-28 |
| US20090321737A1 (en) | 2009-12-31 |
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