KR101236120B1 - 기판 처리 방법, 노광 장치 및 디바이스 제조 방법 - Google Patents

기판 처리 방법, 노광 장치 및 디바이스 제조 방법 Download PDF

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Publication number
KR101236120B1
KR101236120B1 KR1020077003267A KR20077003267A KR101236120B1 KR 101236120 B1 KR101236120 B1 KR 101236120B1 KR 1020077003267 A KR1020077003267 A KR 1020077003267A KR 20077003267 A KR20077003267 A KR 20077003267A KR 101236120 B1 KR101236120 B1 KR 101236120B1
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South Korea
Prior art keywords
substrate
liquid
board
immersion
exposure
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Expired - Fee Related
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English (en)
Korean (ko)
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KR20070068341A (ko
Inventor
가츠시 나카노
마사히코 오쿠무라
다로우 스기하라
다케유키 미즈타니
도모하루 후지와라
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가부시키가이샤 니콘
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020077003267A 2004-10-26 2005-10-25 기판 처리 방법, 노광 장치 및 디바이스 제조 방법 Expired - Fee Related KR101236120B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00310993 2004-10-26
JP2004310993 2004-10-26
PCT/JP2005/019604 WO2006046562A1 (ja) 2004-10-26 2005-10-25 基板処理方法、露光装置及びデバイス製造方法

Related Child Applications (1)

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KR1020127016035A Division KR101285951B1 (ko) 2004-10-26 2005-10-25 기판 처리 방법, 노광 장치 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20070068341A KR20070068341A (ko) 2007-06-29
KR101236120B1 true KR101236120B1 (ko) 2013-02-28

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KR1020077003267A Expired - Fee Related KR101236120B1 (ko) 2004-10-26 2005-10-25 기판 처리 방법, 노광 장치 및 디바이스 제조 방법
KR1020127016035A Expired - Fee Related KR101285951B1 (ko) 2004-10-26 2005-10-25 기판 처리 방법, 노광 장치 및 디바이스 제조 방법

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Country Status (7)

Country Link
US (3) US8040489B2 (enExample)
EP (1) EP1814144B1 (enExample)
JP (2) JP4665712B2 (enExample)
KR (2) KR101236120B1 (enExample)
CN (2) CN101044594B (enExample)
TW (1) TWI436403B (enExample)
WO (1) WO2006046562A1 (enExample)

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KR101520591B1 (ko) 2003-06-13 2015-05-14 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
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JP6099883B2 (ja) * 2011-05-24 2017-03-22 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び部品
KR102625921B1 (ko) * 2015-05-28 2024-01-16 가부시키가이샤 니콘 물체 유지 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
US11014103B2 (en) * 2017-07-26 2021-05-25 Taiwan Semiconductor Manufacturing Company Ltd. Substrate processing apparatus and substrate processing method
CN107255907B (zh) * 2017-08-17 2021-01-22 京东方科技集团股份有限公司 一种补偿装置、曝光装置及曝光补偿方法
CN107561747A (zh) * 2017-10-12 2018-01-09 惠科股份有限公司 一种显示基板的预烘烤装置及预烘烤系统
TWI673567B (zh) * 2018-02-13 2019-10-01 特銓股份有限公司 光罩靜電清潔設備以及光罩靜電清潔方法
CN110597021B (zh) * 2019-09-20 2021-04-23 上海华力微电子有限公司 浸没式光刻工艺中晶圆表面残水缺陷的改善方法

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US20120008112A1 (en) 2012-01-12
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TW200631073A (en) 2006-09-01
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US8941808B2 (en) 2015-01-27
TWI436403B (zh) 2014-05-01
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JP4665712B2 (ja) 2011-04-06
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