CN101044594B - 衬底处理方法、曝光装置及器件制造方法 - Google Patents

衬底处理方法、曝光装置及器件制造方法 Download PDF

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Publication number
CN101044594B
CN101044594B CN2005800359899A CN200580035989A CN101044594B CN 101044594 B CN101044594 B CN 101044594B CN 2005800359899 A CN2005800359899 A CN 2005800359899A CN 200580035989 A CN200580035989 A CN 200580035989A CN 101044594 B CN101044594 B CN 101044594B
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substrate
liquid
exposure
immersion
processing method
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Expired - Fee Related
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Chinese (zh)
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CN101044594A (zh
Inventor
中野胜志
奥村正彦
杉原太郎
水谷刚之
藤原朋春
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2005800359899A 2004-10-26 2005-10-25 衬底处理方法、曝光装置及器件制造方法 Expired - Fee Related CN101044594B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP310993/2004 2004-10-26
JP2004310993 2004-10-26
PCT/JP2005/019604 WO2006046562A1 (ja) 2004-10-26 2005-10-25 基板処理方法、露光装置及びデバイス製造方法

Related Child Applications (1)

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CN2010101407110A Division CN101866113B (zh) 2004-10-26 2005-10-25 衬底处理方法、曝光装置及器件制造方法

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CN101044594A CN101044594A (zh) 2007-09-26
CN101044594B true CN101044594B (zh) 2010-05-12

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CN2010101407110A Expired - Fee Related CN101866113B (zh) 2004-10-26 2005-10-25 衬底处理方法、曝光装置及器件制造方法

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US (3) US8040489B2 (enExample)
EP (1) EP1814144B1 (enExample)
JP (2) JP4665712B2 (enExample)
KR (2) KR101236120B1 (enExample)
CN (2) CN101044594B (enExample)
TW (1) TWI436403B (enExample)
WO (1) WO2006046562A1 (enExample)

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CN107615169B (zh) * 2015-05-28 2021-02-23 株式会社尼康 物体保持装置、曝光装置、平板显示器的制造方法及器件制造方法
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CN107561747A (zh) * 2017-10-12 2018-01-09 惠科股份有限公司 一种显示基板的预烘烤装置及预烘烤系统
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US8941808B2 (en) 2015-01-27
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US20120008112A1 (en) 2012-01-12
CN101044594A (zh) 2007-09-26
TWI436403B (zh) 2014-05-01
JP4665712B2 (ja) 2011-04-06
CN101866113A (zh) 2010-10-20
EP1814144B1 (en) 2012-06-06
CN101866113B (zh) 2013-04-24
KR101236120B1 (ko) 2013-02-28
WO2006046562A1 (ja) 2006-05-04
JP2006156974A (ja) 2006-06-15
US20080143980A1 (en) 2008-06-19
TW200631073A (en) 2006-09-01
JP5408006B2 (ja) 2014-02-05
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US20080246931A1 (en) 2008-10-09
US8040489B2 (en) 2011-10-18
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EP1814144A1 (en) 2007-08-01
HK1147567A1 (en) 2011-08-12
KR20070068341A (ko) 2007-06-29

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