KR101140939B1 - 패턴 형성 방법, 패턴 또는 패턴에 의해 형성되는 몰드 - Google Patents
패턴 형성 방법, 패턴 또는 패턴에 의해 형성되는 몰드 Download PDFInfo
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- KR101140939B1 KR101140939B1 KR1020097026103A KR20097026103A KR101140939B1 KR 101140939 B1 KR101140939 B1 KR 101140939B1 KR 1020097026103 A KR1020097026103 A KR 1020097026103A KR 20097026103 A KR20097026103 A KR 20097026103A KR 101140939 B1 KR101140939 B1 KR 101140939B1
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- resist
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- 238000000034 method Methods 0.000 title claims abstract description 91
- 238000005530 etching Methods 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000010409 thin film Substances 0.000 claims abstract description 39
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- 238000012546 transfer Methods 0.000 claims description 22
- 239000011651 chromium Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 230000000295 complement effect Effects 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 230000007261 regionalization Effects 0.000 abstract description 10
- 238000012545 processing Methods 0.000 description 23
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- 229920005989 resin Polymers 0.000 description 10
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- 238000004519 manufacturing process Methods 0.000 description 8
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- 239000010453 quartz Substances 0.000 description 6
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- 230000003287 optical effect Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
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- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
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- -1 silicon oxide compound Chemical class 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- 229910008812 WSi Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007137234A JP5144127B2 (ja) | 2007-05-23 | 2007-05-23 | ナノインプリント用のモールドの製造方法 |
| JPJP-P-2007-137234 | 2007-05-23 | ||
| PCT/JP2008/059862 WO2008146869A2 (en) | 2007-05-23 | 2008-05-22 | Pattern forming method, pattern or mold formed thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100011975A KR20100011975A (ko) | 2010-02-03 |
| KR101140939B1 true KR101140939B1 (ko) | 2012-05-03 |
Family
ID=40072723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097026103A Active KR101140939B1 (ko) | 2007-05-23 | 2008-05-22 | 패턴 형성 방법, 패턴 또는 패턴에 의해 형성되는 몰드 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7960090B2 (enExample) |
| JP (1) | JP5144127B2 (enExample) |
| KR (1) | KR101140939B1 (enExample) |
| CN (1) | CN101681095B (enExample) |
| WO (1) | WO2008146869A2 (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7255805B2 (en) * | 2004-01-12 | 2007-08-14 | Hewlett-Packard Development Company, L.P. | Photonic structures, devices, and methods |
| JP4533358B2 (ja) * | 2005-10-18 | 2010-09-01 | キヤノン株式会社 | インプリント方法、インプリント装置およびチップの製造方法 |
| JP5067848B2 (ja) * | 2007-07-31 | 2012-11-07 | キヤノン株式会社 | パターンの形成方法 |
| KR101463290B1 (ko) * | 2008-05-23 | 2014-12-08 | 코넬 유니버시티 | 전자 및 전기 장치에 사용되는 유기 물질의 직교 프로세싱 |
| JP5261165B2 (ja) | 2008-12-25 | 2013-08-14 | チェイル インダストリーズ インコーポレイテッド | 微細パターンの形成方法 |
| EP2230206B1 (fr) * | 2009-03-13 | 2013-07-17 | Nivarox-FAR S.A. | Moule pour galvanoplastie et son procédé de fabrication |
| EP2230207A1 (fr) * | 2009-03-13 | 2010-09-22 | Nivarox-FAR S.A. | Moule pour galvanoplastie et son procédé de fabrication |
| WO2010123032A1 (ja) * | 2009-04-24 | 2010-10-28 | 日産化学工業株式会社 | パターン反転膜形成用組成物及び反転パターン形成方法 |
| JP5428636B2 (ja) * | 2009-06-17 | 2014-02-26 | 住友電気工業株式会社 | 回折格子の形成方法 |
| JP2011088340A (ja) * | 2009-10-22 | 2011-05-06 | Toshiba Corp | テンプレート及びパターン形成方法 |
| KR101108162B1 (ko) * | 2010-01-11 | 2012-01-31 | 서울대학교산학협력단 | 고해상도 유기 박막 패턴 형성 방법 |
| CN102478764B (zh) * | 2010-11-30 | 2013-08-07 | 中芯国际集成电路制造(北京)有限公司 | 双重图形化方法 |
| JP2012234057A (ja) * | 2011-05-02 | 2012-11-29 | Elpida Memory Inc | フォトマスクおよび半導体装置 |
| JP5743718B2 (ja) * | 2011-05-31 | 2015-07-01 | キヤノン株式会社 | 成形型の製造方法及び光学素子 |
| JP2013069920A (ja) * | 2011-09-22 | 2013-04-18 | Toshiba Corp | 成膜方法およびパターン形成方法 |
| JP6028378B2 (ja) * | 2011-09-27 | 2016-11-16 | 凸版印刷株式会社 | フォトマスクの製造方法 |
| US8921135B2 (en) * | 2012-03-07 | 2014-12-30 | Ulvac, Inc. | Method for manufacturing device |
| JP6028384B2 (ja) * | 2012-05-07 | 2016-11-16 | 大日本印刷株式会社 | ナノインプリントリソグラフィ用テンプレートの製造方法 |
| JP6019967B2 (ja) * | 2012-09-10 | 2016-11-02 | 大日本印刷株式会社 | パターン形成方法 |
| JP2014072226A (ja) * | 2012-09-27 | 2014-04-21 | Tokyo Electron Ltd | パターン形成方法 |
| JP5673900B2 (ja) * | 2012-12-28 | 2015-02-18 | 大日本印刷株式会社 | ナノインプリントモールドの製造方法 |
| US9576773B2 (en) * | 2013-07-30 | 2017-02-21 | Corporation For National Research Initiatives | Method for etching deep, high-aspect ratio features into glass, fused silica, and quartz materials |
| KR101860243B1 (ko) * | 2013-11-08 | 2018-05-21 | 도쿄엘렉트론가부시키가이샤 | Euv 리소그래피를 가속화하기 위한 사후처리 방법을 이용한 방법 |
| TWI662359B (zh) * | 2013-12-30 | 2019-06-11 | 佳能奈米科技股份有限公司 | 次20奈米之形貌體的均勻壓印圖案轉移方法 |
| JP6301672B2 (ja) * | 2014-02-12 | 2018-03-28 | 旭化成株式会社 | 反転構造体の製造方法及びこれを用いた凹凸構造付基板 |
| US11049725B1 (en) * | 2014-05-29 | 2021-06-29 | Corporation For National Research Initiatives | Method for etching deep, high-aspect ratio features into silicon carbide and gallium nitride |
| US10620532B2 (en) * | 2014-11-11 | 2020-04-14 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, mold, and article manufacturing method |
| US9418886B1 (en) * | 2015-07-24 | 2016-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming conductive features |
| KR101846644B1 (ko) * | 2016-02-15 | 2018-05-18 | 울산과학기술원 | 수처리 멤브레인 제조용 마이크로 구조 템플릿 제조 방법 |
| JP6213610B2 (ja) * | 2016-04-27 | 2017-10-18 | 大日本印刷株式会社 | ナノインプリントリソグラフィ用テンプレートの製造方法 |
| JP6802969B2 (ja) * | 2016-09-21 | 2020-12-23 | 大日本印刷株式会社 | テンプレートの製造方法、及び、テンプレート |
| US10854455B2 (en) * | 2016-11-21 | 2020-12-01 | Marvell Asia Pte, Ltd. | Methods and apparatus for fabricating IC chips with tilted patterning |
| JP6972581B2 (ja) * | 2017-03-01 | 2021-11-24 | 大日本印刷株式会社 | インプリントモールド及びインプリントモールドの製造方法 |
| JP6800779B2 (ja) * | 2017-03-06 | 2020-12-16 | Hoya株式会社 | 転写用マスクの製造方法、および半導体デバイスの製造方法 |
| KR102881023B1 (ko) | 2017-08-31 | 2025-11-04 | 메탈렌츠 인코포레이티드 | 투과성 메타표면 렌즈 통합 |
| JP6512254B2 (ja) * | 2017-09-20 | 2019-05-15 | 大日本印刷株式会社 | ナノインプリントリソグラフィ用テンプレートの製造方法 |
| JP2019201079A (ja) * | 2018-05-15 | 2019-11-21 | 大日本印刷株式会社 | テンプレートの製造方法およびテンプレート |
| US10867854B2 (en) * | 2019-01-08 | 2020-12-15 | Tokyo Electron Limited | Double plug method for tone inversion patterning |
| US11501969B2 (en) * | 2019-01-22 | 2022-11-15 | International Business Machines Corporation | Direct extreme ultraviolet lithography on hard mask with reverse tone |
| US11978752B2 (en) | 2019-07-26 | 2024-05-07 | Metalenz, Inc. | Aperture-metasurface and hybrid refractive-metasurface imaging systems |
| KR102825590B1 (ko) | 2020-10-07 | 2025-06-27 | 다이니폰 인사츠 가부시키가이샤 | 규소 함유 레지스트용 경화성 수지 조성물, 패턴 형성 방법, 임프린트 몰드의 제조 방법, 및 반도체 디바이스의 제조 방법 |
| US20220319838A1 (en) * | 2021-04-01 | 2022-10-06 | Tokyo Electron Limited | Method of Line Roughness Reduction and Self-Aligned Multi-Patterning Formation Using Tone Inversion |
| CN113433795A (zh) * | 2021-06-23 | 2021-09-24 | 南方科技大学 | 一种黑色矩阵的制备方法 |
| EP4500265A2 (en) | 2022-03-31 | 2025-02-05 | Metalenz, Inc. | Polarization sorting metasurface microlens array device |
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2007
- 2007-05-23 JP JP2007137234A patent/JP5144127B2/ja active Active
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2008
- 2008-05-21 US US12/124,492 patent/US7960090B2/en active Active
- 2008-05-22 CN CN2008800166086A patent/CN101681095B/zh active Active
- 2008-05-22 WO PCT/JP2008/059862 patent/WO2008146869A2/en not_active Ceased
- 2008-05-22 KR KR1020097026103A patent/KR101140939B1/ko active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20060128673A (ko) * | 2005-06-08 | 2006-12-14 | 캐논 가부시끼가이샤 | 몰드, 패턴형성방법 및 패턴형성장치 |
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| Publication number | Publication date |
|---|---|
| JP2008290316A (ja) | 2008-12-04 |
| US20080292976A1 (en) | 2008-11-27 |
| JP5144127B2 (ja) | 2013-02-13 |
| WO2008146869A3 (en) | 2009-05-22 |
| WO2008146869A2 (en) | 2008-12-04 |
| US7960090B2 (en) | 2011-06-14 |
| KR20100011975A (ko) | 2010-02-03 |
| CN101681095B (zh) | 2012-05-30 |
| CN101681095A (zh) | 2010-03-24 |
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