JP7222606B2 - エッチングマスク構造を形成するための方法 - Google Patents
エッチングマスク構造を形成するための方法 Download PDFInfo
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Description
一実施形態において、1つの方法は、存在するトポグラフィ変動の上に小さなパターンフィーチャを形成するために使用される。この方法は、平坦でない表面変動を有する表面を有する基板を準備する工程と、第1下地層がその下地である前記基板の前記平坦でない表面変動に対応する平坦でない表面変動を有するように前記基板の上に前記第1下地層を配置し、前記第1下地層の上に第2平坦化層を配置することによって、前記基板の上にマルチスタック層を形成し、前記マルチスタック層の上にハードマスクを堆積させ、前記ハードマスクの上にパターン化された層を形成し、前記パターン化された層は、フィーチャを有し、前記マルチスタック層は、最小のフィーチャ崩壊で、50nm以下のフィーチャ寸法および2.5:1以上のアスペクト比を有する、1以上のエッチングされたフィーチャを維持するために十分な複合有効機械的剛性(Eeff)を有する。他の側面において、前記マルチスタック層に前記パターン化された層のフィーチャをエッチングで形成するために1以上のエッチング工程が実施される。
一実施形態の他の側面において、マルチスタック層が提供され、前記マルチスタック層は、平坦でない表面変動を有する表面を有する基板と、前記基板の上に形成され、前記基板の前記平坦でない表面変動に対応する平坦でない表面変動を有する第1炭素層と、前記第1炭素層の上に形成され、平坦な表面を有する第2平坦化層と、を備えることができ、前記マルチスタック層は、最小のフィーチャ崩壊で、2.5:1以上のアスペクト比で50nm以下のフィーチャを維持するために十分な複合有効機械的剛性(Eeff)を有するマルチスタック層が提供される。
ここで、γは表面張力、θはレジストフィーチャの頂部での水の接線角度、H/Wはアスペクト比(幅に対する高さの比)、S1はレジストパターン間の間隔である。式1に見られるように、より小さいフィーチャサイズWは、レジストパターンが受ける毛細管応力をより高くする。
ここで、δはフィーチャの横方向の移動量、Fは与えられた力(例えば、毛細管応力σ、または他の力)、Eはヤング率、Hはフィーチャの高さ、wlはフィーチャの幅である。この式から分かるように、アスペクト比H/wlおよびレジスト膜の機械的剛性(ヤング率)Eは、フィーチャ崩壊において重要な役割を果たす。したがって、任意の与えられたアスペクト比について、フィーチャの曲がりの量は、材料の機械的剛性に反比例する。
(1)クリティカルフィーチャに不均一性エラーを生じさせることなく、または、他の欠陥の問題を生じさせることなく、または、全てのパターン化されたフィーチャを形成するために多数のリソグラフィ工程を使用する必要性を生じさせることなく、パターン化されたフィーチャを容易に定義することができるように、平坦な表面を生成する。
(2)それにより、転写エッチング後も依然として良好なエッチング耐性を有し、高いアスペクト比のフィーチャ(アスペクト比2.5:1のフィーチャ以上)が標準的な処理条件では曲がったり、揺れたり、崩壊したりしない機械的に安定した構造を提供する。
ここで、δはフィーチャの横方向のたわみ量(または移動量)、fは与えられた力、lは慣性モーメント、aはSOC層714の厚さ(または高さ)、EaはSOC層714のヤング率、bは平坦化層716の厚さ(または高さ)、Ebは平坦化層716のヤング率である。説明の便宜上、EaとEbとの比が5(すなわちEa/Eb=5)であるように、Eaを5GPa、Ebを1GPaとする。全フィーチャの厚さ(または高さ)がa+b=1となるように正規化される場合、たわみδは次の式(式4)の形をとる。
式4を使用して、フィーチャの相対的な横方向のたわみの量(または「たわみ率」)は、複合フィーチャの全高(a+b)における比率としてのSOC層の高さaの関数としてプロットされうる。図8において、プロット820は、Ea/Ebが5に等しい状況におけるたわみ率を示す。この状況では、aの比率が1.0になるようにフィーチャの全体がSOC層714で構成される場合、相対的なたわみは最小値1.0であり、aの比率が0になるようにフィーチャの全体が平坦化層716(すなわち材料b)で構成される場合、相対的なたわみは5倍大きく、あるいは、5.0となる。同様に、プロット830は、Ea/Ebが3に等しい状況におけるたわみ率を示す。ここで、aの比率が1.0になるようにフィーチャの全体がSOC層714で構成される場合、相対的なたわみは最小値1.0であり、aの比率が0になるようにフィーチャの全体が材料bで構成される場合、相対的なたわみは3倍大きく、あるいは、3.0となる。
ここで、fはフィーチャに与えられる力であり、Iは慣性モーメントである。説明のために、EaとEbとの比が5(すなわち、Ea/Eb=5)となるように、Eaが5GPaであり、Ebが1GPaであると仮定する。複合厚さがa+b=1となるように正規化される場合、たわみは次の式(式6)の形をとる。
式6を使用して、「たわみ率」または相対的なたわみの量が、平坦化材料の高さb(すなわち、図10の「bの組成」)の関数として、図7にプロットされている。このプロットから、平坦化材料がフィーチャに組み込まれていない場合、すなわちフィーチャの全体がSOC材料で構成されている場合、相対的なたわみが最小の1であることが分かる。SOC材料が塗布されていない場合、すなわち、フィーチャの全体が平坦化材料で構成されている場合、たわみは5倍に跳ね上がり、先に説明したように、平坦化材料自体の使用時の機械的剛性が低いため、2.5:1よりも大きいアスペクト比を支持することができない。
Claims (14)
- 平坦でない表面を有する基板を準備する工程と、
前記基板の上に、前記基板の前記平坦でない表面に対応する平坦でない表面を有する第1下地層を配置し、前記第1下地層の上に第2平坦化層を配置することによって、前記基板の上にマルチスタック層を形成し、
前記マルチスタック層の上にハードマスクを堆積させ、
前記ハードマスクの上に、フィーチャを有するパターン化された層を形成し、
前記パターン化された層の前記フィーチャによって前記マルチスタック層をエッチングすることにより、前記マルチスタック層にフィーチャを形成し、
前記マルチスタック層における前記フィーチャを前記基板に転写し、
前記マルチスタック層における前記フィーチャは、50nm以下のフィーチャ寸法および2.5:1以上のアスペクト比を有し、
前記第2平坦化層の最大厚さは、前記マルチスタック層の最大厚さの30%以下である、
ことを特徴とする方法。 - 前記第1下地層は、炭素層を含む、
ことを特徴とする請求項1に記載の方法。 - 前記第1下地層は、スピンオン炭素(SOC;spin-on carbon)層を含む、
ことを特徴とする請求項1に記載の方法。 - 前記第2平坦化層は、有機材料を含む、
ことを特徴とする請求項1に記載の方法。 - 前記第2平坦化層は、前記第1下地層のヤング率より小さいヤング率を有する、
ことを特徴とする請求項1に記載の方法。 - 前記マルチスタック層における前記フィーチャは、5:1以上のアスペクト比を有する、
ことを特徴とする請求項1に記載の方法。 - 前記マルチスタック層における前記フィーチャの崩壊は、前記第2平坦化層の材料で全体が形成された層に同じ条件の下でエッチングによって形成された同じフィーチャと比べて低減される、
ことを特徴とする請求項1に記載の方法。 - 前記第2平坦化層の最大厚さは、前記マルチスタック層の最大厚さの20%以下である、
ことを特徴とする請求項1乃至7のいずれか1項に記載の方法。 - 前記パターン化された層の前記フィーチャは、特定のクリティカルディメンジョン(CD)を有し、前記マルチスタック層における前記フィーチャは、前記第1下地層の材料で全体が形成された層にエッチングによって形成された同じ層と比べて高いクリティカルディメンジョン(CD)均一性を有する、
ことを特徴とする請求項1に記載の方法。 - 前記第2平坦化層は、インプリントリソグラフィ技術によって配置される、
ことを特徴とする請求項1に記載の方法。 - 形成された前記パターン化された層の前記フィーチャを前記基板に転写するための1以上の追加的なエッチング工程を更に含む、
ことを特徴とする請求項1に記載の方法。 - 前記第1下地層が形成される前の前記基板は、60nm以下のトポグラフィ変動を有する、
ことを特徴とする請求項1乃至11のいずれか1項に記載の方法。 - デバイスを製造する方法であって、
請求項12に記載の方法で、形成されたパターン化された層のフィーチャを基板に転写することと、
前記基板を処理して前記デバイスを製造することと、
を含むことを特徴とする方法。 - 前記基板は、半導体基板を含み、製造される前記デバイスは、半導体デバイスである、
ことを特徴とする請求項13に記載の方法。
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