KR101022278B1 - 구동 칩 및 이를 갖는 표시장치 - Google Patents

구동 칩 및 이를 갖는 표시장치 Download PDF

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Publication number
KR101022278B1
KR101022278B1 KR1020030091364A KR20030091364A KR101022278B1 KR 101022278 B1 KR101022278 B1 KR 101022278B1 KR 1020030091364 A KR1020030091364 A KR 1020030091364A KR 20030091364 A KR20030091364 A KR 20030091364A KR 101022278 B1 KR101022278 B1 KR 101022278B1
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KR
South Korea
Prior art keywords
driving chip
long side
output terminal
terminal portion
along
Prior art date
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Expired - Fee Related
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KR1020030091364A
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English (en)
Korean (ko)
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KR20050059655A (ko
Inventor
황성용
오원식
최성락
송춘호
윤주영
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삼성전자주식회사
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Priority to KR1020030091364A priority Critical patent/KR101022278B1/ko
Priority to JP2004354058A priority patent/JP4504795B2/ja
Priority to TW093138131A priority patent/TW200529139A/zh
Priority to CNB2004100987908A priority patent/CN100433083C/zh
Priority to US11/011,746 priority patent/US7486284B2/en
Publication of KR20050059655A publication Critical patent/KR20050059655A/ko
Application granted granted Critical
Publication of KR101022278B1 publication Critical patent/KR101022278B1/ko
Assigned to 삼성디스플레이 주식회사 reassignment 삼성디스플레이 주식회사 권리의 전부이전등록 Assignors: 삼성전자주식회사
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13456—Cell terminals located on one side of the display only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
KR1020030091364A 2003-12-15 2003-12-15 구동 칩 및 이를 갖는 표시장치 Expired - Fee Related KR101022278B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020030091364A KR101022278B1 (ko) 2003-12-15 2003-12-15 구동 칩 및 이를 갖는 표시장치
JP2004354058A JP4504795B2 (ja) 2003-12-15 2004-12-07 駆動チップ及びこれを有する表示装置
TW093138131A TW200529139A (en) 2003-12-15 2004-12-09 Driver chip and display apparatus having the same
CNB2004100987908A CN100433083C (zh) 2003-12-15 2004-12-14 驱动芯片及具有该驱动芯片的显示装置
US11/011,746 US7486284B2 (en) 2003-12-15 2004-12-15 Driver chip and display apparatus having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030091364A KR101022278B1 (ko) 2003-12-15 2003-12-15 구동 칩 및 이를 갖는 표시장치

Publications (2)

Publication Number Publication Date
KR20050059655A KR20050059655A (ko) 2005-06-21
KR101022278B1 true KR101022278B1 (ko) 2011-03-21

Family

ID=34793177

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030091364A Expired - Fee Related KR101022278B1 (ko) 2003-12-15 2003-12-15 구동 칩 및 이를 갖는 표시장치

Country Status (5)

Country Link
US (1) US7486284B2 (https=)
JP (1) JP4504795B2 (https=)
KR (1) KR101022278B1 (https=)
CN (1) CN100433083C (https=)
TW (1) TW200529139A (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051013B1 (ko) * 2003-12-16 2011-07-21 삼성전자주식회사 구동 칩 및 이를 갖는 표시장치
KR100736395B1 (ko) * 2005-07-07 2007-07-09 삼성전자주식회사 액정 표시 장치의 드라이버 ｉｃ 및 이를 위한 패드 배치방법
CN100397165C (zh) * 2005-12-02 2008-06-25 群康科技(深圳)有限公司 液晶显示装置
NL1031241C2 (nl) 2006-02-24 2007-08-27 Wilmink Productontwikkeling Oorstukje voor inbrengen in een gehoorkanaal.
KR101241761B1 (ko) * 2006-07-18 2013-03-14 삼성디스플레이 주식회사 구동 칩, 이를 구비한 표시 장치 및 리페어 방법
JP4116055B2 (ja) * 2006-12-04 2008-07-09 シャープ株式会社 半導体装置
TWI373107B (en) * 2008-04-24 2012-09-21 Hannstar Display Corp Chip having a driving integrated circuit and liquid crystal display having the same
US8299631B2 (en) 2008-09-01 2012-10-30 Sharp Kabushiki Kaisha Semiconductor element and display device provided with the same
BRPI1012742A2 (pt) * 2009-06-16 2019-09-24 Sharp Kabushiki Kaisha "chip semicondutor módulo de cristal líquido e estrutura de montagem do chip semicondutor"
TWI418906B (zh) * 2009-10-06 2013-12-11 Au Optronics Corp 閘極驅動器之接墊佈局最佳化之顯示面板
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
JP2012227480A (ja) * 2011-04-22 2012-11-15 Japan Display East Co Ltd 表示装置及び半導体集積回路装置
KR102514158B1 (ko) * 2013-12-20 2023-03-27 데쿠세리아루즈 가부시키가이샤 전자 부품, 접속체, 접속체의 제조 방법 및 전자 부품의 접속 방법
JP2016029698A (ja) * 2014-07-22 2016-03-03 デクセリアルズ株式会社 接続体、及び接続体の製造方法
CN104392976A (zh) * 2014-10-11 2015-03-04 合肥京东方光电科技有限公司 一种驱动芯片及显示装置
CN106571116A (zh) * 2015-10-13 2017-04-19 中华映管股份有限公司 显示面板
JP2017116798A (ja) * 2015-12-25 2017-06-29 株式会社ジャパンディスプレイ 表示装置、表示装置の製造方法、及びドライバｉｃ
CN107290885A (zh) * 2017-08-17 2017-10-24 京东方科技集团股份有限公司 一种集成电路芯片绑定结构及显示装置
CN107479276B (zh) 2017-08-28 2020-08-04 厦门天马微电子有限公司 触控显示面板及包含其的触控显示装置
CN109634003B (zh) * 2019-02-21 2021-12-07 厦门天马微电子有限公司 一种显示面板及显示装置
JP7267837B2 (ja) * 2019-05-20 2023-05-02 株式会社ジャパンディスプレイ 表示装置
CN113823241B (zh) * 2021-09-30 2022-09-27 武汉华星光电技术有限公司 驱动芯片及显示面板
CN114373390B (zh) * 2022-01-06 2023-06-02 武汉华星光电半导体显示技术有限公司 显示面板和驱动芯片

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10319419A (ja) * 1997-05-19 1998-12-04 Matsushita Electric Ind Co Ltd 液晶表示装置
JP2001056479A (ja) 1999-08-17 2001-02-27 Casio Comput Co Ltd 半導体装置及びその接合構造
JP2002217237A (ja) * 2001-01-17 2002-08-02 Toshiba Corp 平面表示装置
JP2003263117A (ja) * 2002-03-08 2003-09-19 Hitachi Ltd 表示装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3293135B2 (ja) * 1990-04-24 2002-06-17 セイコーエプソン株式会社 回路セル・アレイを備えた半導体装置
US5386228A (en) * 1991-06-20 1995-01-31 Canon Kabushiki Kaisha Image pickup device including means for adjusting sensitivity of image pickup elements
US5335002A (en) * 1991-09-30 1994-08-02 Rohm Co., Ltd. Printing head and printer incorporating the same
JPH05326622A (ja) * 1992-05-22 1993-12-10 Toshiba Corp 液晶表示駆動用集積回路装置
JP2732553B2 (ja) * 1993-11-26 1998-03-30 インターナショナル・ビジネス・マシーンズ・コーポレイション 液晶ディスプレイ、接続方法、熱応力伝搬防止方法
JPH07333636A (ja) * 1994-06-07 1995-12-22 Hitachi Ltd 液晶表示装置
US6037654A (en) * 1995-01-13 2000-03-14 Seiko Epson Corporation Semiconductor device, tape carrier package, and display panel module
JP3556315B2 (ja) * 1995-03-20 2004-08-18 株式会社東芝 表示装置及び半導体素子
US6172732B1 (en) * 1995-06-16 2001-01-09 Hitachi, Ltd. Liquid crystal display device suited to narrow frame
CN1178093C (zh) * 1997-10-20 2004-12-01 西铁城时计株式会社 用于驱动液晶的集成电路
JPH11305254A (ja) * 1998-04-24 1999-11-05 Hitachi Ltd 液晶表示装置
JP3784177B2 (ja) * 1998-09-29 2006-06-07 株式会社沖データ ドライバｉｃ
JP3730037B2 (ja) * 1998-11-20 2005-12-21 株式会社 日立ディスプレイズ 液晶表示装置
EP1081739B1 (en) * 1999-03-05 2010-06-02 Canon Kabushiki Kaisha Image forming device
DE60027342T2 (de) * 1999-03-26 2007-01-04 Seiko Epson Corp. Flexible gedruckte Leiterplatte, elektrooptische Vorrichtung, und elektronisches Gerät
JP2000315058A (ja) * 1999-04-30 2000-11-14 Toshiba Corp 表示装置用アレイ基板
JP2000347206A (ja) * 1999-06-02 2000-12-15 Hitachi Ltd 液晶表示装置
JP2001083546A (ja) * 1999-07-12 2001-03-30 Hitachi Ltd 液晶表示装置
JP4034915B2 (ja) * 1999-09-22 2008-01-16 株式会社ルネサステクノロジ 半導体チップおよび液晶表示装置
US6433414B2 (en) * 2000-01-26 2002-08-13 Casio Computer Co., Ltd. Method of manufacturing flexible wiring board
US6754802B1 (en) * 2000-08-25 2004-06-22 Micron Technology, Inc. Single instruction multiple data massively parallel processor systems on a chip and system using same
WO2002021199A1 (en) * 2000-09-08 2002-03-14 Citizen Watch Co., Ltd. Liquid crystal display
JP3744450B2 (ja) * 2001-05-09 2006-02-08 セイコーエプソン株式会社 電気光学装置、駆動用ｉｃ及び電子機器
TW506103B (en) * 2001-08-06 2002-10-11 Au Optronics Corp Bump layout on a chip
US7149090B2 (en) * 2001-09-11 2006-12-12 Brother Kogyo Kabushiki Kaisha Structure of flexible printed circuit board
JP3645511B2 (ja) * 2001-10-09 2005-05-11 株式会社ルネサステクノロジ 半導体装置の製造方法
US6984027B2 (en) * 2001-11-30 2006-01-10 Brother Kogyo Kabushiki Kaisha Ink-jet head and ink-jet printer having ink-jet head
JP4008245B2 (ja) * 2002-01-25 2007-11-14 シャープ株式会社 表示装置用駆動装置
JP4006284B2 (ja) * 2002-07-17 2007-11-14 株式会社 日立ディスプレイズ 液晶表示装置
US6992001B1 (en) * 2003-05-08 2006-01-31 Kulicke And Soffa Industries, Inc. Screen print under-bump metalization (UBM) to produce low cost flip chip substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10319419A (ja) * 1997-05-19 1998-12-04 Matsushita Electric Ind Co Ltd 液晶表示装置
JP2001056479A (ja) 1999-08-17 2001-02-27 Casio Comput Co Ltd 半導体装置及びその接合構造
JP2002217237A (ja) * 2001-01-17 2002-08-02 Toshiba Corp 平面表示装置
JP2003263117A (ja) * 2002-03-08 2003-09-19 Hitachi Ltd 表示装置

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JP4504795B2 (ja) 2010-07-14
KR20050059655A (ko) 2005-06-21
US7486284B2 (en) 2009-02-03
US20050195130A1 (en) 2005-09-08
CN100433083C (zh) 2008-11-12
TW200529139A (en) 2005-09-01
CN1629917A (zh) 2005-06-22

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