KR100905508B1 - 기판 반송 처리 장치 및 기판 반송 처리 장치에 있어서의 장해 대책 방법 및 기판 반송 처리 장치에 있어서의 장해 대책용 프로그램을 수록한 기록매체 - Google Patents

기판 반송 처리 장치 및 기판 반송 처리 장치에 있어서의 장해 대책 방법 및 기판 반송 처리 장치에 있어서의 장해 대책용 프로그램을 수록한 기록매체 Download PDF

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KR100905508B1
KR100905508B1 KR1020077018932A KR20077018932A KR100905508B1 KR 100905508 B1 KR100905508 B1 KR 100905508B1 KR 1020077018932 A KR1020077018932 A KR 1020077018932A KR 20077018932 A KR20077018932 A KR 20077018932A KR 100905508 B1 KR100905508 B1 KR 100905508B1
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South Korea
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module
substrate
processed
modules
carrying
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KR20070094862A (ko
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토모히로 카네코
요시타카 하라
아키라 미야타
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020077018932A 2005-01-21 2006-01-18 기판 반송 처리 장치 및 기판 반송 처리 장치에 있어서의 장해 대책 방법 및 기판 반송 처리 장치에 있어서의 장해 대책용 프로그램을 수록한 기록매체 Expired - Lifetime KR100905508B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005013481A JP4577886B2 (ja) 2005-01-21 2005-01-21 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
JPJP-P-2005-00013481 2005-01-21

Publications (2)

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KR20070094862A KR20070094862A (ko) 2007-09-21
KR100905508B1 true KR100905508B1 (ko) 2009-07-01

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KR1020077018932A Expired - Lifetime KR100905508B1 (ko) 2005-01-21 2006-01-18 기판 반송 처리 장치 및 기판 반송 처리 장치에 있어서의 장해 대책 방법 및 기판 반송 처리 장치에 있어서의 장해 대책용 프로그램을 수록한 기록매체

Country Status (6)

Country Link
US (1) US8393845B2 (enExample)
JP (1) JP4577886B2 (enExample)
KR (1) KR100905508B1 (enExample)
CN (1) CN100555595C (enExample)
TW (1) TWI287250B (enExample)
WO (1) WO2006077843A1 (enExample)

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JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
JP4388563B2 (ja) 2007-03-27 2009-12-24 東京エレクトロン株式会社 基板の処理方法、基板処理装置及びコンピュータ読み取り可能な記憶媒体
DE102007025339A1 (de) * 2007-05-31 2008-12-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP4986784B2 (ja) * 2007-09-18 2012-07-25 東京エレクトロン株式会社 処理システムの制御装置、処理システムの制御方法および制御プログラムを記憶した記憶媒体
JP4770938B2 (ja) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 基板処理装置
JP4761326B2 (ja) * 2010-01-15 2011-08-31 シャープ株式会社 薄膜形成装置システムおよび薄膜形成方法
JP5246184B2 (ja) 2010-02-24 2013-07-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5168300B2 (ja) * 2010-02-24 2013-03-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5338757B2 (ja) * 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5473857B2 (ja) * 2010-10-14 2014-04-16 東京エレクトロン株式会社 搬送装置および処理システム
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP6013792B2 (ja) * 2012-06-12 2016-10-25 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
JP5928283B2 (ja) * 2012-09-28 2016-06-01 東京エレクトロン株式会社 基板処理装置、基板搬送方法及び記憶媒体
JP6049394B2 (ja) * 2012-10-22 2016-12-21 東京エレクトロン株式会社 基板処理システム及び基板の搬送制御方法
JP6860365B2 (ja) * 2017-01-31 2021-04-14 キヤノン株式会社 基板処理装置、基板処理システム、基板処理方法、物品製造方法、およびプログラム
JP7109287B2 (ja) * 2018-07-09 2022-07-29 東京エレクトロン株式会社 基板処理システム、基板処理方法、および制御プログラム
CN113851403A (zh) * 2021-08-30 2021-12-28 北京北方华创微电子装备有限公司 物料调度方法和半导体设备
CN116643544A (zh) * 2023-05-31 2023-08-25 西安奕斯伟材料科技股份有限公司 半导体物料搬送的控制方法、装置、设备、介质及产品

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JP2002252263A (ja) * 2001-02-23 2002-09-06 Tokyo Electron Ltd 処理システム及び処理システムの被処理体の搬送方法

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DE69113553T2 (de) * 1990-07-23 1996-06-20 Dainippon Screen Mfg Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten.
JP2662450B2 (ja) 1990-07-24 1997-10-15 大日本スクリーン製造株式会社 基板処理装置間のインターフェイス装置
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JP3552178B2 (ja) * 1995-09-27 2004-08-11 大日本スクリーン製造株式会社 基板収納カセット、インターフェイス機構および基板処理装置
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JP4462912B2 (ja) * 2003-12-10 2010-05-12 大日本スクリーン製造株式会社 基板処理装置および基板処理装置の管理方法
JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置

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Publication number Publication date
WO2006077843A1 (ja) 2006-07-27
CN101107701A (zh) 2008-01-16
JP2006203003A (ja) 2006-08-03
CN100555595C (zh) 2009-10-28
KR20070094862A (ko) 2007-09-21
US20090016860A1 (en) 2009-01-15
JP4577886B2 (ja) 2010-11-10
TWI287250B (en) 2007-09-21
US8393845B2 (en) 2013-03-12
TW200629365A (en) 2006-08-16

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