CN100555595C - 基板搬送处理装置和基板搬送处理装置的故障对策方法 - Google Patents

基板搬送处理装置和基板搬送处理装置的故障对策方法 Download PDF

Info

Publication number
CN100555595C
CN100555595C CNB2006800026096A CN200680002609A CN100555595C CN 100555595 C CN100555595 C CN 100555595C CN B2006800026096 A CNB2006800026096 A CN B2006800026096A CN 200680002609 A CN200680002609 A CN 200680002609A CN 100555595 C CN100555595 C CN 100555595C
Authority
CN
China
Prior art keywords
station
processing
processed
transfer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2006800026096A
Other languages
English (en)
Chinese (zh)
Other versions
CN101107701A (zh
Inventor
金子知广
原圭孝
宫田亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101107701A publication Critical patent/CN101107701A/zh
Application granted granted Critical
Publication of CN100555595C publication Critical patent/CN100555595C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB2006800026096A 2005-01-21 2006-01-18 基板搬送处理装置和基板搬送处理装置的故障对策方法 Expired - Lifetime CN100555595C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005013481A JP4577886B2 (ja) 2005-01-21 2005-01-21 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
JP013481/2005 2005-01-21

Publications (2)

Publication Number Publication Date
CN101107701A CN101107701A (zh) 2008-01-16
CN100555595C true CN100555595C (zh) 2009-10-28

Family

ID=36692232

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006800026096A Expired - Lifetime CN100555595C (zh) 2005-01-21 2006-01-18 基板搬送处理装置和基板搬送处理装置的故障对策方法

Country Status (6)

Country Link
US (1) US8393845B2 (enExample)
JP (1) JP4577886B2 (enExample)
KR (1) KR100905508B1 (enExample)
CN (1) CN100555595C (enExample)
TW (1) TWI287250B (enExample)
WO (1) WO2006077843A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
JP4388563B2 (ja) 2007-03-27 2009-12-24 東京エレクトロン株式会社 基板の処理方法、基板処理装置及びコンピュータ読み取り可能な記憶媒体
DE102007025339A1 (de) * 2007-05-31 2008-12-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP4986784B2 (ja) * 2007-09-18 2012-07-25 東京エレクトロン株式会社 処理システムの制御装置、処理システムの制御方法および制御プログラムを記憶した記憶媒体
JP4770938B2 (ja) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 基板処理装置
JP4761326B2 (ja) * 2010-01-15 2011-08-31 シャープ株式会社 薄膜形成装置システムおよび薄膜形成方法
JP5246184B2 (ja) 2010-02-24 2013-07-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5168300B2 (ja) * 2010-02-24 2013-03-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5338757B2 (ja) * 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5473857B2 (ja) * 2010-10-14 2014-04-16 東京エレクトロン株式会社 搬送装置および処理システム
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP6013792B2 (ja) * 2012-06-12 2016-10-25 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
JP5928283B2 (ja) * 2012-09-28 2016-06-01 東京エレクトロン株式会社 基板処理装置、基板搬送方法及び記憶媒体
JP6049394B2 (ja) * 2012-10-22 2016-12-21 東京エレクトロン株式会社 基板処理システム及び基板の搬送制御方法
JP6860365B2 (ja) * 2017-01-31 2021-04-14 キヤノン株式会社 基板処理装置、基板処理システム、基板処理方法、物品製造方法、およびプログラム
JP7109287B2 (ja) * 2018-07-09 2022-07-29 東京エレクトロン株式会社 基板処理システム、基板処理方法、および制御プログラム
CN113851403A (zh) * 2021-08-30 2021-12-28 北京北方华创微电子装备有限公司 物料调度方法和半导体设备
CN116643544A (zh) * 2023-05-31 2023-08-25 西安奕斯伟材料科技股份有限公司 半导体物料搬送的控制方法、装置、设备、介质及产品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
JP2002252263A (ja) * 2001-02-23 2002-09-06 Tokyo Electron Ltd 処理システム及び処理システムの被処理体の搬送方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69113553T2 (de) * 1990-07-23 1996-06-20 Dainippon Screen Mfg Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten.
JP2662450B2 (ja) 1990-07-24 1997-10-15 大日本スクリーン製造株式会社 基板処理装置間のインターフェイス装置
JP3032999B2 (ja) * 1992-11-09 2000-04-17 東京エレクトロン株式会社 処理装置
TW309503B (enExample) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH0950948A (ja) 1995-08-08 1997-02-18 Kokusai Electric Co Ltd 半導体製造装置の障害対処システム
JP3552178B2 (ja) * 1995-09-27 2004-08-11 大日本スクリーン製造株式会社 基板収納カセット、インターフェイス機構および基板処理装置
JP2981844B2 (ja) * 1996-05-16 1999-11-22 住友重機械工業株式会社 薄膜製造装置
JPH1116983A (ja) 1997-06-24 1999-01-22 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置における搬送制御方法
US6275744B1 (en) * 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
JP2000094233A (ja) * 1998-09-28 2000-04-04 Tokyo Electron Ltd 収容装置
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US6945258B2 (en) * 2001-04-19 2005-09-20 Tokyo Electron Limited Substrate processing apparatus and method
JP4254116B2 (ja) * 2002-03-22 2009-04-15 東京エレクトロン株式会社 位置合わせ用基板
TWI304391B (en) * 2002-07-22 2008-12-21 Brooks Automation Inc Substrate processing apparatus
JP4233285B2 (ja) * 2002-08-23 2009-03-04 大日本スクリーン製造株式会社 基板処理装置
JP4378114B2 (ja) * 2003-06-18 2009-12-02 東京エレクトロン株式会社 処理システム
JP4342923B2 (ja) * 2003-12-09 2009-10-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4462912B2 (ja) * 2003-12-10 2010-05-12 大日本スクリーン製造株式会社 基板処理装置および基板処理装置の管理方法
JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
JP2002252263A (ja) * 2001-02-23 2002-09-06 Tokyo Electron Ltd 処理システム及び処理システムの被処理体の搬送方法

Also Published As

Publication number Publication date
WO2006077843A1 (ja) 2006-07-27
CN101107701A (zh) 2008-01-16
JP2006203003A (ja) 2006-08-03
KR100905508B1 (ko) 2009-07-01
KR20070094862A (ko) 2007-09-21
US20090016860A1 (en) 2009-01-15
JP4577886B2 (ja) 2010-11-10
TWI287250B (en) 2007-09-21
US8393845B2 (en) 2013-03-12
TW200629365A (en) 2006-08-16

Similar Documents

Publication Publication Date Title
CN100555595C (zh) 基板搬送处理装置和基板搬送处理装置的故障对策方法
KR101535317B1 (ko) 기판 처리 시스템 및 기판 처리 방법
JP4542984B2 (ja) 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
KR101443420B1 (ko) 기판의 처리 방법 및 기판의 처리 시스템
CN100468685C (zh) 基板回收方法以及基板处理装置
CN107785288B (zh) 基板处理装置和基板处理方法
KR101715440B1 (ko) 기판 처리 시스템 및 기판의 반송 제어 방법
CN102974500B (zh) 基板处理装置和基板处理方法
KR102207311B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2002324740A (ja) 処理装置
KR101010157B1 (ko) 기판 처리 시스템 및 기판 처리 방법
JP2014067910A (ja) 塗布膜形成装置、塗布膜形成方法、塗布、現像装置、塗布、現像方法及び記憶媒体
KR100580403B1 (ko) 이중 설비 시스템 및 그 제어 방법
JP2006005285A (ja) 露光処理ライン
US20120061021A1 (en) Substrate processing method, substrate processing system, and computer-readable storage medium
KR20030094903A (ko) 반도체 제조용 포토설비의 웨이퍼 이송장치
JPH08181186A (ja) 基板搬送制御方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20091028

CX01 Expiry of patent term