TWI287250B - Substrate transfer and processing apparatus, obstacle measure method in substrate transfer and processing apparatus and program for an obstacle measure in the substrate transfer and processing apparatus - Google Patents

Substrate transfer and processing apparatus, obstacle measure method in substrate transfer and processing apparatus and program for an obstacle measure in the substrate transfer and processing apparatus Download PDF

Info

Publication number
TWI287250B
TWI287250B TW094145035A TW94145035A TWI287250B TW I287250 B TWI287250 B TW I287250B TW 094145035 A TW094145035 A TW 094145035A TW 94145035 A TW94145035 A TW 94145035A TW I287250 B TWI287250 B TW I287250B
Authority
TW
Taiwan
Prior art keywords
module
substrate
processed
processing
transport
Prior art date
Application number
TW094145035A
Other languages
English (en)
Chinese (zh)
Other versions
TW200629365A (en
Inventor
Tomohiro Kaneko
Yoshitaka Hara
Akira Miyata
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200629365A publication Critical patent/TW200629365A/zh
Application granted granted Critical
Publication of TWI287250B publication Critical patent/TWI287250B/zh

Links

Classifications

    • H10P72/0462—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H10P72/0464—
    • H10P72/0612—
    • H10P72/3302—
    • H10P72/3304—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW094145035A 2005-01-21 2005-12-19 Substrate transfer and processing apparatus, obstacle measure method in substrate transfer and processing apparatus and program for an obstacle measure in the substrate transfer and processing apparatus TWI287250B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005013481A JP4577886B2 (ja) 2005-01-21 2005-01-21 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム

Publications (2)

Publication Number Publication Date
TW200629365A TW200629365A (en) 2006-08-16
TWI287250B true TWI287250B (en) 2007-09-21

Family

ID=36692232

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145035A TWI287250B (en) 2005-01-21 2005-12-19 Substrate transfer and processing apparatus, obstacle measure method in substrate transfer and processing apparatus and program for an obstacle measure in the substrate transfer and processing apparatus

Country Status (6)

Country Link
US (1) US8393845B2 (enExample)
JP (1) JP4577886B2 (enExample)
KR (1) KR100905508B1 (enExample)
CN (1) CN100555595C (enExample)
TW (1) TWI287250B (enExample)
WO (1) WO2006077843A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5283842B2 (ja) 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
JP4388563B2 (ja) 2007-03-27 2009-12-24 東京エレクトロン株式会社 基板の処理方法、基板処理装置及びコンピュータ読み取り可能な記憶媒体
DE102007025339A1 (de) * 2007-05-31 2008-12-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP4986784B2 (ja) * 2007-09-18 2012-07-25 東京エレクトロン株式会社 処理システムの制御装置、処理システムの制御方法および制御プログラムを記憶した記憶媒体
JP4770938B2 (ja) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 基板処理装置
JP4761326B2 (ja) * 2010-01-15 2011-08-31 シャープ株式会社 薄膜形成装置システムおよび薄膜形成方法
JP5246184B2 (ja) 2010-02-24 2013-07-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5168300B2 (ja) 2010-02-24 2013-03-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5338757B2 (ja) * 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5473857B2 (ja) * 2010-10-14 2014-04-16 東京エレクトロン株式会社 搬送装置および処理システム
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP6013792B2 (ja) * 2012-06-12 2016-10-25 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
JP5928283B2 (ja) * 2012-09-28 2016-06-01 東京エレクトロン株式会社 基板処理装置、基板搬送方法及び記憶媒体
JP6049394B2 (ja) * 2012-10-22 2016-12-21 東京エレクトロン株式会社 基板処理システム及び基板の搬送制御方法
JP6860365B2 (ja) * 2017-01-31 2021-04-14 キヤノン株式会社 基板処理装置、基板処理システム、基板処理方法、物品製造方法、およびプログラム
JP7109287B2 (ja) * 2018-07-09 2022-07-29 東京エレクトロン株式会社 基板処理システム、基板処理方法、および制御プログラム
CN113851403A (zh) * 2021-08-30 2021-12-28 北京北方华创微电子装备有限公司 物料调度方法和半导体设备
CN116643544A (zh) * 2023-05-31 2023-08-25 西安奕斯伟材料科技股份有限公司 半导体物料搬送的控制方法、装置、设备、介质及产品

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
JP2662450B2 (ja) 1990-07-24 1997-10-15 大日本スクリーン製造株式会社 基板処理装置間のインターフェイス装置
DE69113553T2 (de) * 1990-07-23 1996-06-20 Dainippon Screen Mfg Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten.
JP3032999B2 (ja) * 1992-11-09 2000-04-17 東京エレクトロン株式会社 処理装置
TW309503B (enExample) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH0950948A (ja) 1995-08-08 1997-02-18 Kokusai Electric Co Ltd 半導体製造装置の障害対処システム
JP3552178B2 (ja) * 1995-09-27 2004-08-11 大日本スクリーン製造株式会社 基板収納カセット、インターフェイス機構および基板処理装置
JP2981844B2 (ja) * 1996-05-16 1999-11-22 住友重機械工業株式会社 薄膜製造装置
JPH1116983A (ja) 1997-06-24 1999-01-22 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置における搬送制御方法
US6275744B1 (en) * 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
JP2000094233A (ja) * 1998-09-28 2000-04-04 Tokyo Electron Ltd 収容装置
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
JP4770035B2 (ja) * 2001-02-23 2011-09-07 東京エレクトロン株式会社 処理システム及び処理システムの被処理体の搬送方法
US6945258B2 (en) * 2001-04-19 2005-09-20 Tokyo Electron Limited Substrate processing apparatus and method
JP4254116B2 (ja) * 2002-03-22 2009-04-15 東京エレクトロン株式会社 位置合わせ用基板
JP4712379B2 (ja) * 2002-07-22 2011-06-29 ブルックス オートメーション インコーポレイテッド 基板処理装置
JP4233285B2 (ja) * 2002-08-23 2009-03-04 大日本スクリーン製造株式会社 基板処理装置
JP4378114B2 (ja) * 2003-06-18 2009-12-02 東京エレクトロン株式会社 処理システム
JP4342923B2 (ja) * 2003-12-09 2009-10-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4462912B2 (ja) * 2003-12-10 2010-05-12 大日本スクリーン製造株式会社 基板処理装置および基板処理装置の管理方法
JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置

Also Published As

Publication number Publication date
US8393845B2 (en) 2013-03-12
JP4577886B2 (ja) 2010-11-10
WO2006077843A1 (ja) 2006-07-27
CN100555595C (zh) 2009-10-28
KR20070094862A (ko) 2007-09-21
US20090016860A1 (en) 2009-01-15
CN101107701A (zh) 2008-01-16
TW200629365A (en) 2006-08-16
KR100905508B1 (ko) 2009-07-01
JP2006203003A (ja) 2006-08-03

Similar Documents

Publication Publication Date Title
TWI287250B (en) Substrate transfer and processing apparatus, obstacle measure method in substrate transfer and processing apparatus and program for an obstacle measure in the substrate transfer and processing apparatus
CN101536151B (zh) 衬底处理方法和衬底处理系统
KR101535317B1 (ko) 기판 처리 시스템 및 기판 처리 방법
US20080138176A1 (en) Apparatus for manufacturing semiconductor device
JP4542984B2 (ja) 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
US20100199911A1 (en) Substrate processing apparatus
TW200524026A (en) Coater/developer and coating/developing method
JP5463066B2 (ja) ロット処理開始判定方法及び制御装置
JP2011253897A5 (enExample)
US10656524B2 (en) Substrate processing apparatus including transport device
WO2006006364A1 (ja) 基板の回収方法及び基板処理装置
TWI594355B (zh) 基板處理裝置及基板搬送方法
KR101715440B1 (ko) 기판 처리 시스템 및 기판의 반송 제어 방법
CN110047778A (zh) 基片处理装置、基片处理方法和存储介质
TW201330159A (zh) 基板處理系統
US20090149982A1 (en) Substrate processing apparatus, substrate processing method, and computer program
WO2016208103A1 (ja) 基板処理装置および基板処理方法
CN102479689A (zh) 基板处理系统及基板处理方法
CN1979338A (zh) 涂敷显影装置及方法、计算机程序及记录有其的记录介质
JP2002043208A (ja) 塗布現像処理方法
US20170185077A1 (en) Processing system and processing program
CN103915367B (zh) 刻蚀清洗工艺中的硅片搬送方法及设备
JP2009164523A (ja) 基板処理装置
JP2004119462A (ja) 基板の処理システム
WO2008059686A1 (en) Substrate processing method and substrate processing system