TWI334190B - Substrate transportation processing apparatus and method of trouble measures of substrate transportation processing apparatus and computer readable medium encoded with a program for trouble measures of substrate transportation processing apparatus - Google Patents

Description

1334190 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate transport processing apparatus that performs, for example, a semiconductor wafer or an fD glass substrate in a plurality of places, and performs pre-exposure processing and exposure. After the heat treatment, in particular, the substrate transport processing device has a countermeasure against the occurrence of an obstacle in any of the processing modules. [Prior Art] Liang·τ Ϊ 'film or electrode photolithography technology for semiconductor crystal or LCD (manufacturing of liquid crystal display lining substrate, ί ΪΪ Ϊ (oxidized sulphur tin 'IndiUm Τώ ide xide). The substrate transport processing is applied to a plurality of processing modules to apply a photoresist to the substrate, and the exposure is further developed. The mold device is configured as follows, including: loading The substrate is placed on each of the slaves. The substrate of the 'transport module' is divided into $mu, the army, and its grain is transported by the Yunyu group. :s 5丄 Each processing module 'sludges the substrate in each of the majority of the processing modules' (4) smoothing and polishing the filaments. The dispersing plate is sent to the processing device in the majority of the processing modules. , will be shipped ===== group ^ set = \tT ^ ?;, t:: ^9·50948 2] 曰本特开平1Μ_3 bulletin (patent application scope) [Summary of the invention] (invention to solve The problem) 1334190 The substrate of the touch-type agent is made to resist the money by exposure processing ^= Sending a catalyst reaction, the ship's hot ship keeps the line width of the electric switch case as J and = the substrate is dispersed in most modules and the processing steps are due to the processing ί 2 ' Therefore, if there is a module The obstacle occurs, and: Ϊ ΐ ΐ ΐ ΐ 变更 变更 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ Consistent ====_, t fine control of the lack of money in view of the above circumstances, the material is expected to be from the exposure processing of the substrate to the force: the device and its obstacles to the county In order to solve the above problems, the substrate transport processing apparatus of the present invention, package two, ΐΓ 收容 accommodating a plurality of unprocessed processed boards; most of the processing molds,: before and after the reading of the silk The processing plate of the county plate is transported between the modules; the substrate to be processed is dispersed and transported by the upper layer and the film is processed before exposure and exposure; :---Ϊ^ίίίϊ ^, '任处理模In the event of an obstacle, the device will be transported to the unoccupied portion of the buffer module, and the substrate to be processed will be transported to the exposure processing unit. At the same time, ^ 1334190 ίίίϊϊ^ = = where the obstacle occurs __ in the case of repair, the heat is not taken after the above exposure (application for patent (5). %), such as the transport of other substrates to be processed, the countermeasures "substrate S; i For the middle of the obstacle ==; fixed at 1; and most of the transport mode "== S5EF==^ The control of the above-mentioned control of the control of the two models" is based on the control of the above control mechanism i is in the case of impediment, after the exposed substrate is processed, transported to the unoccupied portion of the buffer module, and the processed substrate is transported to the exposure processing unit, and transported to the top. ^When the processing module is repaired, the situation will be corrected: ϊίίϊ The unprocessed substrate is subjected to the above-mentioned post-exposure heating ===, _, into the 彳 嫩 嫩 version of the transport, processing (medium In the office, the processing of the substrate is as long as it is translucent, exposed, and heat treated. Substrate can be any substrate, preferably, the processing stage 3 'is coated with the axis of the wire against the _ (2,9 brother cap item). ^ 'The above-mentioned control agency' is preferably a case where the town has a reward for any one, and the module has an obstacle, and the unused portion of the buffer module is included in the application. In addition, in the obstacles that occur in the above-mentioned processing module, the car is also the obstacle for the L3 to transport the damaged substrate to the transport module between the processing modules (the 90th and nth items of the patent scope). I仏 is to heat-treat the substrate to be processed, and then transport it to the buffer module (items 3 and 12 of the patent application). Preferably, n t is controlled by the control means to control the time from the post-exposure processing to the substrate to be processed (items 6 and 13 of the patent application). ^ In the case of the above-mentioned obstacle measures, the obstacle-resistance method of the present invention is the obstacle countermeasure method in the substrate transport processing device, the substrate transport device, the cassette module for loading, and the plurality of unprocessed cases are accommodated. The substrate to be processed; a plurality of places, 'the substrate to be processed is subjected to a predetermined process before and after exposure; and the substrate is transported between the modules; The substrate to be processed of the touch box module is dispersed and transported to various places, and, in each processing module, the substrate to be processed is subjected to pre-exposure processing and post-exposure addition, and the process is characterized by Let the computer implement the following steps: the detection-processing mode is continued; the exposed substrate is processed, and the heat treatment is sent to the frequency of the buffered fish; the substrate to be processed and the exposure portion are transported. The step of the treatment; the step of the exposure before the exposure = the board is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Group The processing unit of the occupied portion reverses the step of transporting and processing after the post-exposure heat treatment; and the transport and processing of the other processed substrate other than the substrate to be processed that has been transported to the unoccupied portion of the buffer module Step (Apply for patents 15). According to the above configuration, the substrate to be processed from the loading cassette module by the transport module is dispersed and transported to each of the processing modules, and the processed substrate is dispersed in each of the plurality of processing modules. That is, the state of pre-exposure treatment and post-exposure heat treatment, if any obstacle occurs in any of the processing modules, the control mechanism detects the obstacle. And based on the control signal of the control mechanism, it is detected that the obstacle is blocked in any of the processing modules. In the case, the exposed substrate is transported after the processing and the substrate is transported to the exposure processing unit. ί 时光:Transportation and treatment after heat treatment 'At the same time: (Effect of the invention): The composition is as described above, and the following effects can be obtained. Cup One Application for the invention of the second, the eighth, the third, the third, the

= Dealing with the situation in which she has an obstacle, due to the treatment of the substrate J after the light, the heat treatment and transported to the unoccupied part of the buffer module, IJ line heat treatment until the date of the sale, the circuit can be gamified to the processing mode In the case of an obstacle in the group, the Wei of the processing light of the substrate before the exposure is temporarily stopped, and it is expected that the treatment module will be repaired when the treatment module is in the process of anger and dysfunction. The substrate to be processed in the unoccupied portion is subjected to the above-described post-exposure heating unit = delivery and processing, and at the same time, the situation in which the transport portion of the other processed substrate is hindered can be smoothly performed. Cycle time (4), (2) According to the 2nd, 3rd, 7th, 9th, and 2nd, 14th production range of the patent scope, the substrate to be treated after the exposure and heat treatment is prevented from being subjected to the processing of the rail and the chemical amplification type. The acid-catalyst reaction of the anti-surname agent, therefore, the stability of the treatment and the improvement of the reliability of the device. (3) According to the invention of the fourth and first paragraphs of the patent application scope, because the control = the obstacle in the case of the in-service module, the reserved buffer module can be reserved for the heat treatment from the light portion to the post-exposure treatment. Self-contained substrate

ΐ In addition to the above (1) to (2), HIM 更 can be further improved, and 4 devices are not improved in reliability. A / 生里诙1334190 r loyalty The invention of the scope of the patents No. 5, 11 occurs in the processing module, and the transport module that transports the substrate to be processed between the processing modules is “obstructed” and therefore can be adapted to all In the processing of the substrate to be processed, it is possible to further improve the device in addition to the above (1) to (3). Therefore, in the [Embodiment] (the best mode for implementing the invention) = 'The best practice in the county _g secret place Fig. 1 shows a schematic plan view of a substrate coating/exposure/development processing system to which the substrate transport processing device of the present invention is applied. The anti-corrosion resistance of the bovine body The coating, exposure, and development processing system (hereinafter referred to as * in FIG. 1 includes: a cassette module i for loading, a plurality of processing substrate vocal conductors, and a gamma wafer π; The cartridge module 2 is removed, and a plurality of processing modules described later are applied to the wafer w, and the surface portion 6 is placed on the loading/unloading unit 3 and the processing unit 4, and the first boundary is disposed.

The two blocks, the face 2a and the auxiliary interface, which are disposed between the processing unit 4 and the exposure wire 5, are configured. P main interface. In addition, the processing unit 4 includes the respective modules: the coating module U, and the anti-money agent is applied to the wafer W; and the development process is followed by the processing. Further, the processing unit 4 is disposed adjacent to the second interface g 6 in a state of being superposed and laminated: the adhesion module 13 is used, and the wafer w = · ' and the second heating plate module 15 are processed. m匕^ The position where the second interface portion 7 is adjacent to the main interface portion 7a, the shirt segment mm is placed on the first heating plate module 14, and the wafer of the anti-surname agent is coated with %%. The exposure is performed at the exposure point _ w towel 11 1334190 The anti-money agent induces heating for the acid catalyst reaction; and the cooling module 17 performs cooling for preventing the acid catalyst reaction. Moreover, the cooling module 17 may be provided, and the cooling module n may be disposed in the baking module 16 to transfer the central portion of the wafer processing unit 4 therebetween, and the wafer W may be in the coating module u, The main transport module 20 transmitted between the developing module, the adhesive module 13, the first and second heating plate modules 14, 15 and the post-exposure bake module 16 for horizontal χ, γ direction and rotation _ It is easy to move in the direction of the wrong direction. In the first interface unit 6, the first transport unit 31 that transfers the wafer W between the loading/unloading unit 3 and the loading/unloading cassette module 2 is in the horizontal X and Υ directions. And rotation 0 and vertical 2: The direction is free to move. The first transport die and the group 3 will be housed in the reloading module! The unprocessed inside circle ^ is taken, transported* to the adhesion module 13, and the wafer is evaluated by the adhesion module 13 to be hydrophobic

Hi' is wrongly applied to the wafer W after the development process by the second heating plate mold and the group 15, and after processing, the wafer w in the second heating plate module 15 is transported by the second The group 31 is picked up and transported (accommodated) to the carry-out cassette module 2. Further, in the main interface portion 7a of the second interface portion 7, the anti-cracking agent for removing the periphery of the wafer w coated with the anti-side is disposed; and the wafer transferred between the portion and the exposed portion 5 W temporarily stands by; the second transport moves in the X direction in the X and Y directions and the straight direction, and the wafer 2 and the thief group 5 are described as the first or second transfer mode! : / 夕 $ pass ^. Further, the main interface portion and the auxiliary interface portion 7b are separated from each other by a second state: the first transfer module 61 receives the second transfer mode from the main interface portion (four), and picks up the auxiliary interface portion - the first Alternatively, the third transport module 33' is disposed to carry the wafer between the upper V μ transfer group 61' 62 and the exposure unit 5. Group 12, etc. processing system A, the above coating module η, developing mold > 5 basin detection ancient π ΐ, main transport group 20, first to third transport modules 31 to 33, ', Wu And, it is electrically connected to the central computer of the control unit 12 1334190 to select or switch (the program of change, as described later, the injury policy). 运® W transport steps and processing steps are optimal The method of the step, the obstacle is applied to the process of the formula (four) system, based on the execution of the above-mentioned CRI70 signal, with the following steps to search for the job _ wafer first), first set in the first interface The first transport module of the part 6 is taken out, and the unprocessed crystals in the E-box module 1 are taken out, and are taken to the adhesion module 13 for crystallizing and thinning by the adhesion module 13: The hydrophobized slave wafer w, after the main transport of the Wei plate, sequentially moves a large number, for example, two coating modules „. The photoresist is coated on the surface of the wafer W with a uniform film thickness. , ° soil, ',, inside, = resistance, after the agent, the main transport module 20 will wafer ~ from ί into the majority, for example, 3 sets of first heating plate module

= baking treatment. After the pre-baking is completed from the film on the wafer boundary, the wafer w in the first heating plate module 14 and the second transfer module 32 in the portion 7a are taken out and moved into the peripheral exposure module J. The wafer W is subjected to exposure processing at the edge portion. After the exposure process, the wafer w 2 transport module 32 in the peripheral wire *4Q is taken out to the first transfer module 6 and then the 3rd transfer module 33 in the 7b receives the i 1 in the transfer module 61 is inside the exposure unit 5. After the exposure process of the exposure unit 5 is completed, the third transport module 33, 5 picks up the wafer W, and transports the picked wafer W to the second transfer module, which is connected to the p 13 1334190. The transport module 32 is connected to the glow module 16 from the second transfer module 62, and is exposed to the acid catalyst in the exposed sample by exposure to the post-bake mold. Therefore, from the time of exposure, precise control is required. ^ Shaped until ΐϊ 曝光 曝光 曝光 舰 舰 舰 舰 舰 舰 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光 曝光After that, s ', and 2 搬 are carried into the order in order, for example, 2 sets of developing dies & 运 = = group W surface anti-painting test, applying development ===', applying a flush to the Ba round W surface Liquid, wash off the developer. After the development step is completed, the main transport tank 2 〇, the wafer w is taken out from a = , and then, the second heating plate mold 15 is sequentially carried. In the heating 2 of the ^ 2, the wafer W is processed by, for example, a shoe at a predetermined time: the hunting is performed, and the resist which is swollen by the development is hardened, and the resistance σ is introduced after the baking is finished, i The transport module 31 carries out the "finishing 2" heating plate core group 15 and carries out the 'sequential loading and unloading box module 2, = the shape is correct = for the first place', for example, the above two coating dies One of the groups U handles the situation in which the circle W (A14) has an obstacle, and the processing module and the transportation: the reward axis society. Next, (10) the number of wafers from the U7G to the post-exposure heat treatment (exposure bake module 16), based on the detection signal, the control signal is transmitted to the buffer module and 5〇, the punch module 50 The reservation has detected the vacancy of the number of slices. And; 'after the light treatment (after the exposure to the baking module 16), the circle W (A5 ~ A10) into the lamp heat treatment (exposure bake treatment), after the cooling module is processed ' The second transport module 32 is transported to the buffer module 5〇; 14 1334190 FIG. 3) ° At this time, based on the post-exposure bake of each wafer W after heat treatment in most of the post-exposure bake modules 16 The memory of the module 16 transports the wafer W to the unoccupied portion of the buffer module 50. As a result, the time from the exposure processing to the post-exposure baking treatment and the cooling treatment can be kept constant, so that the line width of the circuit pattern formed on the wafers W (A5 to A10) can be made constant. Further, as shown in Fig. 2, after the coating process, the wafer W (A12' A13) is temporarily stopped from being transported to the exposure unit 5. Further, the wafers W (A12, A13) other than the wafer W (A11) of the cooling module located in the second surface portion 7 are transported into the buffer module 5A by the second transport module 32 (refer to the figure). 4). Further, when the coating group 11 has an obstacle, the conveyance of the wafers W (A15 to A17) before the coating processing is stopped, and the loading of the secondary wafer W (B1) to the processing unit 4 is stopped. In the case of the obstacle repair with the enamel coating module 11, if the error flag (the café detects 'and based on the control signal from the CPU 7G, start a 曰li on the one hand' based on the exposure of the majority of the post-exposure bake module 16 The memory of the baking module 16 is retracted (the 6 wafers W of the unoccupied portion (A5~e piece by piece, ί=circular hot plate module 15, 'developed to the f shadow module 12 and the second加 ) 于 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = In case, 15 1334190 ΊυΖ ^ after the baking mold 2 6) il'ai = 2f ~ = / exposure level plus honesty (exposure _ heart 八旦二二 (A1 〇) number, pre-supplied in the buffer module 50 The sister f' will be heated from the exposure section 5 to the post-exposure treatment (the exposure of the illuminator: there is a wafer • ~ai〇) to the heating place 50, the A, the Qi, the ϋ 'Λ by the second delivery mode The group 32 is transported to the buffer module for fine processing, and the illuminating process is performed until the post-exposure bake process, and the cold two: holding the fixed 'can be formed on the wafer W(8)~tick) In the case of birth, at the time of the occurrence of the obstacle, the material of the stop ~ Α 17), (4) stop the wafer of the second batch of fin ° and 'developed wafers ~ α4) delivery, processing (post-baking treatment) also stops ( Refer to Figure 4). In the embodiment, the description is based on the fact that the coating module 11 and the main transport module have a right to occur, but the processing module other than the coated U disk main transport module 20, for example, The development module, the hot plate modules 14, 15 have obstacles, and of course can also be the same as the above: Further, in the above embodiment, the substrate transport processing apparatus, the method, and the obstacle-to-wafer application processing of the wafer are described in the above embodiments, but the application can also be applied to the coating of the LCD glass substrate. Development 16 1334190 [Simple description of the drawing] The anti-surname application coating and exposure of the processing device of the development processing system is the state in which the obstacle occurs in the coating module of the processing module of the present invention. FIG. 3 shows that the obstacle occurs. A state in which the exposure is transported to the state of the relief group. Fig. 4 shows a schematic plan view of the state in which the obstacle is generated and the coating is transported to the buffer module. Figure 5 shows the situation where the obstacle has been repaired, and the ith platelet before shipment and exposure to the buffer die_transport, processing=slightly=slices s曰® Figure 6 shows that the obstacle has been repaired , transported to the moderation = the second wafer before the transfer and processing, processing ^ slightly = film 曰曰Η Figure 7 shows the obstacle has been repaired, shipped to. Figure 8 shows the transportation and processing of the third wafer before exposure. The obstacles have been repaired. The shipment and the fourth wafer before the exposure are summarized and processed. 曰® Figure 9 Obsessed the situation that has been fixed, shipped to $

The rough plane of the shipment. 5 ^ aalU Figure 10 shows the situation where the obstacle has been repaired, and the transportation to the buffer is roughly the same. 6 pieces of 曰曰^ Figure 11 shows the situation where it has been repaired, and it is a schematic plan view of the transportation and processing of the wafer to the buffer module. FIG. 12 shows a schematic plan view of the wafer transport and processing before the exposure processing after the exposure processing and before the development processing, and the description of the component symbol is performed. W Semiconductor wafer (processed substrate) 1 With cassette module 17 1334190

2 Carrying out cassette module 3 Loading and unloading unit 4 Processing unit 5 Exposure unit 6 First interface unit 7 Second interface unit 7a Main interface unit 7b Auxiliary interface unit 11 Coating module (processing module) 12 Development module ( Processing module) 13 Adhesive module (processing module) 14 First heating plate module (processing module) 15 Second heating plate module (processing module) 16 Post-exposure baking module (processing module) 17 Cooling module 20 main transport module 31 first transport module 32 second transport module 33 third transport module 40 peripheral exposure module (processing module) 50 buffer module 61 first transfer module 62 second pass Module 70 CPU (Control Mechanism) 18

Claims (1)

' Ί 7:2, No. 2 patent application Chinese application, monthly search for the right to do the correction (no underline) X. Patent application scope: 'A kind of substrate transport processing device, including. September 16, 2009 revision 17" ?! is "moving into the box module, housing the majority of the processing module, the substrate to be treated; applying the mosquito button; and the exposure button on the substrate, the touch substrate group will: =:== = 2 processing substrate processing and before the exposure of each processing module to the substrate to be processed is characterized in that: comprising: 2 = transferring a plurality of processed substrates between the transport modules; and The obstacles and obstacles that have been repaired, the Japanese ί ί ί 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等 等The control signal of the control mechanism, the board = 1 贞 = the situation where the processing module is in an obstacle, and the exposed portion is processed to the unoccupied portion of the buffer module to make the pre-exposure group; Temporarily stopped, at the same time, shipped to the 2 ^ 2 = punch die case of the processing module repair occurred, to transport to the production ί ΐ tarpitting ,, after the subtraction processing operation to he = 5 transports the substrate to be processed after the substrate processing bribe light riding secret process. In the substrate transport processing apparatus of the i target, the substrate is processed by a chemically magnified wafer. Further, the substrate transport processing apparatus of the first or second item is cooled by a person. The cold part module, the substrate to be processed after the exposure and heat treatment is 19 1334190 4 · If the substrate transfer processing device of the first or second item of the special fiber circumference is changed to the page-buffer remaining - the processing module is in an obstacle, The board transport processing apparatus according to the first or second item, wherein the obstacle for the occurrence of the handle is included in the transport of the substrate to be processed between the processing modules. Obstacles to the delivery of modules. 6. In the case of the substrate transport processing device of the 丨 丨 丨 , , , , , , , 盆 盆 盆 盆 盆 盆 盆 盆 盆 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 The device comprises: a cassette 收容 accommodating a plurality of unprocessed substrates to be processed; and a processing module for applying the number of substrates to be processed before and after exposure of the substrate to be processed; Ϊ́ϊϋΐϊΐ 运送 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The feature is: the control mechanism of the integrated control of the module, and the repair of the debt-receiving module is controlled to be fixed by the 31 substrate from the exposure to the heat treatment, and the line after the development is maintained. The uniformity is constant; based on the control signal of the control mechanism, the processing module is in an obstacle condition, and the exposed portion is processed to the unoccupied portion of the buffer module, so that the exposure is before the exposure. Ϊ́ί ^ The delivery of the Ministry temporarily stopped, and at the same time, the situation of the processing module repaired by the 贞 , ^ ^ ^ ^ ^ 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴 吴After 20 *1 4190 f transport, processing, and other methods of processing the substrate at the same time, 8 of which are applied to the substrate processing device of the seventh item, the chemical plate is spliced by the county Anti-(four) substrate. In the case of the law, the obstacles of the substrate transport processing device of the seventh or the eighth item are detected. The device 2 detects that there is an obstacle in the processing module, and the heating is performed after the pre-transmission of the clear light =· The obstacle countermeasures for the substrate transport processing device of the seventh or eighth item are included in the obstacle handling measures for transporting the substrate to be processed between the processing modules, such as the If fiber (4) 7 or 8 substrate transport processing. , the method of countermeasures for the substrate transport processing device of the seventh application of the patent application scope is carried out The fixed time of the control includes from the exposure of the substrate to be processed to the cooling treatment. </ br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> Most of the processing modules do not have a predetermined treatment on the processed substrate before and after exposure of the substrate to be processed; and ''the majority of the transport module, the substrate to be processed is transported between the modules; buffer module 'Transfers a large number of substrates to be processed between the transport module; and 1334190 is a replacement page control mechanism for detecting the obstacles and numbers generated by the processing module, and coordinating control Once the _ control is fixed, 俾 keeps the line width of the development after the development is everywhere == in the future, the substrate is moved into the module to be treated; and Ϊ first; Liya in each processing module The characteristic of the 5 recorded media is that the computer performs the following steps: detecting the obstacles occurring in any of the processing modules; and occupying the substrate to be processed after being heated and transported to the buffer module without exposing the processed substrate to the substrate deal with The step of temporarily stopping the transportation of the part; the step of transporting the processed substrate after the exposure to the buffer module; the step of detecting the repair of the processing module having the obstacle; ', after the processing module is repaired, Carrying out the post-exposure addition and subtraction of the processed substrate that has been transported to the unoccupied portion of the buffer module, and performing the processing on the unprocessed portion of the buffer module. The steps of transporting and processing the substrate to be processed.