JP5128918B2 - Substrate processing equipment - Google Patents

Substrate processing equipment Download PDF

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JP5128918B2
JP5128918B2 JP2007310677A JP2007310677A JP5128918B2 JP 5128918 B2 JP5128918 B2 JP 5128918B2 JP 2007310677 A JP2007310677 A JP 2007310677A JP 2007310677 A JP2007310677 A JP 2007310677A JP 5128918 B2 JP5128918 B2 JP 5128918B2
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substrate
processing
unit
transport mechanism
main transport
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JP2009135294A (en
Inventor
浩之 小椋
毅 三橋
義光 福冨
健也 森西
康夫 川松
広路 長嶋
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株式会社Sokudo
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling

Description

  The present invention relates to a substrate processing apparatus for performing a series of processes on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter simply referred to as “substrate”).

Conventionally, as this type of apparatus, there is a substrate processing apparatus that forms a resist film on a substrate and develops the substrate exposed by a separate exposure machine. This apparatus includes a processing unit configured by arranging a coating processing block for forming a coating film such as a resist film and a developing processing block for developing a substrate. Each processing block includes a single main transport mechanism and various processing units. The main transport mechanism of each processing block transfers the substrate to and from the main transport mechanism of another adjacent processing block via the mounting table while transporting the substrate to the processing unit provided in the processing block. A series of processes is performed on the substrate (see, for example, Patent Document 1).
JP 2003-324139 A

However, the conventional example having such a configuration has the following problems.
That is, in the conventional apparatus, when the main transfer mechanism of any processing block becomes in a state where the substrate cannot be transferred due to a failure or the like (abnormal state), the substrate cannot be transferred to any adjacent processing block. As described above, since the substrate is transferred between the processing blocks with only a single route (transfer route), the substrate cannot be processed at all even if the main transfer mechanism of another processing block is normal. There is.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing apparatus capable of flexibly transporting a substrate between adjacent processing blocks.

In order to achieve such an object, the present invention has the following configuration.
That is, in the substrate processing apparatus for processing a substrate, the invention according to claim 1 is provided for each level in the vertical direction, and is provided for each level and a processing unit for processing the substrate. A plurality of processing blocks having a main transport mechanism for transporting the substrate to the unit are arranged in the horizontal direction, and the substrate can be transported between the same layers of the adjacent processing blocks, and at least one of the adjacent processing blocks The substrate can be transported by changing the layer.

  [Operation and Effect] According to the first aspect of the present invention, a series of processing can be performed on a substrate by transporting the substrate between the same layers of adjacent processing blocks. Thus, a substrate transport path corresponding to the number of layers is provided. In addition, the substrate can be transported by changing the hierarchy in at least one of the adjacent processing blocks, and a series of processing can be performed on the substrate. Thereby, the board | substrate conveyance path | route can be made more than the number of hierarchy. Thus, in this apparatus, the substrate can be flexibly transferred between adjacent processing blocks. Therefore, even if an abnormal main transport mechanism that cannot transport the substrate occurs, a series of processes can be performed on the substrate by transporting the substrate through a transport path that does not include the main transport mechanism.

  In the present invention, between processing blocks capable of transporting a substrate by changing the level, a movable mounting part for mounting the substrate is provided between the processing blocks that can be moved up and down over a plurality of levels. It is preferable that the plurality of main transport mechanisms provided in a plurality of layers can transport the substrate to the movable mounting portion moved to a height position corresponding to the layer. The movable mounting portion that moves up and down over a plurality of levels can move the substrate placed by the main transfer mechanism of one level to a position that can be received by the main transfer mechanism of another level. For this reason, the main transport mechanisms having different levels provided in the respective processing blocks on both sides of the movable placement unit can suitably transfer the substrate through the movable placement unit.

  In the present invention, it is preferable that when the substrate is placed on the movable placing portion, the movable placing portion moves to a layer different from the layer on which the substrate is placed. The movable mounting unit on which the substrate is mounted moves to a layer different from the layer on which the substrate is mounted, so that the processing blocks sandwiching the movable mounting unit transfer the substrates at different levels. be able to.

  In this invention, it is preferable that the said movable mounting part is movable over all the hierarchy (Claim 4). Among the processing blocks sandwiching the movable mounting portion, each layer of one processing block can transfer the substrate to and from all the layers of the other processing block, and each layer of the other processing block is also one side The substrate can be transferred between all the layers of the processing block.

  In the present invention, there are a plurality of fixed placement units provided for each level between processing blocks capable of transporting a substrate by changing the level, and each main part of the level provided for each of the processing blocks. It is preferable that the transport mechanism includes the fixed placement unit capable of transporting the substrate and the placement unit transport mechanism for transporting the substrate between the fixed placement units. The transfer mechanism for the placement unit moves the substrate placed on the fixed placement unit on the first level to the fixed placement unit on the other level, so that the main transfer mechanism on the other level receives the substrate. Can do. For this reason, the main transport mechanisms having different levels provided in the processing blocks on both sides sandwiching the mounting unit transport mechanism and the plurality of fixed mounting units are configured such that the mounting unit transport mechanism and the plurality of fixed mounting units are separated from each other. Thus, the substrate can be suitably delivered.

  In the present invention, when there is a main transport mechanism in an abnormal state in one processing block between processing blocks that can transport a substrate at different levels, each main transport mechanism of the other processing block is the one processing block. It is preferable to transfer the substrate to / from a main transport mechanism other than the abnormal main transport mechanism. Even when there is an abnormal main transport mechanism, the substrate is transported through a transport path that does not include the main transport mechanism, so that a series of processes can be performed on the substrate.

  In the present invention, the processing blocks capable of transporting substrates at different levels are a coating processing block and a development processing block provided adjacent to the coating processing block, and the coating processing unit applies a resist film to the substrate. A coating processing unit and a heat treatment unit for forming are provided as the processing unit, and a first main transport mechanism for transporting a substrate to the coating processing unit and the heat treatment unit is provided as the main transport mechanism, and the development processing unit includes: A development processing unit for developing the substrate and a heat treatment unit as the processing unit, and a second main transport mechanism for transporting the substrate to the development processing unit and the heat treatment unit as the main transport mechanism, Hierarchy between the processing block and the development processing block Is preferably capable of transporting the substrate is changed (claim 7). Between the coating processing block and the development processing block, the substrate can be transported between the same layers, and the substrate can be transported by changing the layers. Since the substrate can be transported flexibly as described above, the process of forming a resist film on the substrate and the process of developing the substrate can be suitably performed.

  In the present invention, it is preferable that each layer of the coating processing block is capable of transporting a substrate between all the layers of the development processing block. The substrate can be transported more flexibly between the coating processing block and the development processing block.

  In the present invention, in a part of the layer of the coating processing block, a process for forming a resist film on the substrate is performed exclusively, and the substrate on which the resist film is formed is discharged toward the development processing block, and the coating is performed. It is preferable that the substrate discharged from the development processing block is received exclusively in some other layers of the processing block. No processing is performed on the substrate in the layer of the coating processing block that receives the substrate paid out from the development processing block exclusively. For example, even if the processing unit of the coating processing block is in an abnormal state, this layer is completely used by receiving the substrate discharged from the development processing block exclusively at the level where the processing unit is provided. A decrease in the processing efficiency of the substrate can be suppressed as compared with the case where it is not.

  According to a tenth aspect of the present invention, in the substrate processing apparatus for processing a substrate, the processing unit is provided for each level in the vertical direction, the processing unit for processing the substrate, and the processing for the level is provided for each level. A plurality of processing blocks having a main transport mechanism for transporting the substrate to the unit are arranged in the horizontal direction, and the substrate can be transported between the same layers of the adjacent processing blocks, and at least one of the adjacent processing blocks The substrate can be transported between at least one layer of one processing block and a different layer of the other processing block.

  [Operation / Effect] According to the invention described in claim 10, a series of processing can be performed on the substrate by transporting the substrate between the same layers of adjacent processing blocks. Thus, a substrate transport path corresponding to the number of layers is provided. It is also possible to transfer a substrate between different levels in at least one of adjacent processing blocks and perform a series of processing on the substrate. Thereby, the board | substrate conveyance path | route can be made more than the number of hierarchy. In this way, the substrate can be flexibly transferred between adjacent processing blocks. Therefore, even if an abnormal main transport mechanism that cannot transport the substrate occurs, a series of processes can be performed on the substrate by transporting the substrate through a transport path that does not include the main transport mechanism.

  In the present invention, the main transport mechanism of the one layer is configured to be extendable / descendable / lowerable over a plurality of layers including the one layer in the processing block, and the plurality of layers of the adjacent processing blocks. It is preferable that the substrate can be transferred to and from the main transport mechanism. By providing a main transport mechanism configured to be extendable and retractable over a plurality of levels, the main transport mechanism preferably performs substrate transfer between main transport mechanisms of different levels in adjacent processing blocks. Can do.

  In the present invention, it is preferable that the one layer can transfer a substrate to and from all the layers of adjacent processing blocks. The substrate can be transferred more flexibly between the processing blocks.

  In the present invention, the main transport mechanism of the one layer is configured to be extendable / descendable / liftable over all layers in the processing block, and the substrate is connected to the main transport mechanism of all layers of the adjacent processing block. It is preferable to be able to deliver (claim 13). The substrate can be transferred more flexibly between the processing blocks.

  In the present invention, processing blocks capable of transporting substrates between different layers are a coating processing block and a development processing block provided adjacent to the coating processing block, and the coating processing unit applies a resist film to the substrate. A coating processing unit and a heat treatment unit for forming are provided as the processing unit, and a first main transport mechanism for transporting a substrate to the coating processing unit and the heat treatment unit is provided as the main transport mechanism, and the development processing unit includes: And a development processing unit and a heat treatment unit for developing the substrate as the processing unit, and a second main transport mechanism for transporting the substrate to the development processing unit and the heat treatment unit as the main transport mechanism. Between the first main transport mechanism and the second main transport mechanism In addition to delivering, the first main transport mechanism of at least one of the layers is configured to be extendable / descendable up and down over a plurality of layers including the layer in the coating processing block, and with the plurality of second main transport mechanisms It is preferable that the substrate can be transferred between them (claim 14). Between the coating processing block and the development processing block, the substrate can be transported between the same layers, and the substrate can be transported between different layers. Since the substrate can be transported flexibly as described above, the process of forming a resist film on the substrate and the process of developing the substrate can be suitably performed.

  In the present invention, the second main transport mechanism in at least one of the layers is configured to be extendable and retractable over a plurality of layers including the layer in the development processing block, and between the plurality of first main transport mechanisms. It is preferable that the substrate can be delivered by (Claim 15). The substrate can be transported more flexibly between the coating processing block and the development processing block.

  In the present invention, processing blocks capable of transporting substrates between different layers are a coating processing block and a development processing block provided adjacent to the coating processing block, and the coating processing unit applies a resist film to the substrate. A coating processing unit and a heat treatment unit for forming are provided as the processing unit, and a first main transport mechanism for transporting a substrate to the coating processing unit and the heat treatment unit is provided as the main transport mechanism, and the development processing unit includes: And a development processing unit and a heat treatment unit for developing the substrate as the processing unit, and a second main transport mechanism for transporting the substrate to the development processing unit and the heat treatment unit as the main transport mechanism. Between the first main transport mechanism and the second main transport mechanism The second main transport mechanism in at least one of the layers is configured to be extendable and retractable over a plurality of layers including the layer in the development processing block, and is capable of extending and lowering. It is preferable that the substrate can be transferred between them (claim 16). Between the coating processing block and the development processing block, the substrate can be transported between the same layers, and the substrate can be transported between different layers. Since the substrate can be transported flexibly as described above, the process of forming a resist film on the substrate and the process of developing the substrate can be suitably performed.

  The present specification also discloses an invention relating to the following substrate processing apparatus.

  (1) In a substrate processing apparatus that performs processing on a substrate, a processing unit that is provided for each level in the vertical direction and that performs processing on the substrate, and is provided for each level and transports the substrate to the processing unit of the level. A plurality of processing blocks having a main transfer mechanism are arranged in the horizontal direction, and the substrate can be transferred between the same layers of adjacent processing blocks, and at least one of the adjacent processing blocks is at least one of the processing blocks. A substrate processing apparatus, wherein any one of the layers can transfer a substrate to a plurality of layers of the other processing block.

  According to the substrate processing apparatus described in (1), a series of processing can be performed on a substrate by transporting the substrate between the same layers of adjacent processing blocks. Thus, a substrate transport path corresponding to the number of layers is provided. In addition, at least one of the adjacent processing blocks is configured such that at least one layer of one processing block transports the substrate to a plurality of layers of the other processing block and performs a series of processing on the substrate. You can also. Thereby, the board | substrate conveyance path | route can be made more than the number of hierarchy. In this way, the substrate can be flexibly transferred between adjacent processing blocks. As a result, even if the main transport mechanism provided in any one of the plurality of levels of the other processing block cannot transport the substrate, the substrate is transported by a transport path that does not include the main transport mechanism, Processing can be performed.

  (2) The substrate processing apparatus according to claim 7, wherein the substrate is transferred from one layer of the coating processing block to a layer of the development processing block different from the one layer.

  According to the substrate processing apparatus described in (2), the substrate can be flexibly transported from the coating processing block to the development processing block.

  (3) The substrate processing apparatus according to claim 7, wherein the substrate can be transferred between one level of the coating processing block and all levels of the development processing block. .

  According to the substrate processing apparatus described in (3), the substrate can be flexibly transported between the coating processing block and the development processing block.

  (4) The substrate processing apparatus according to claim 7, wherein the substrate is transferred from one layer of the development processing block to a layer of the coating processing block different from the one layer.

  According to the substrate processing apparatus described in (4), the substrate can be flexibly transported from the development processing block to the coating processing block.

  (5) The substrate processing apparatus according to claim 7, wherein the substrate can be transferred between one level of the development processing block and all levels of the coating processing block. .

  According to the substrate processing apparatus described in (5), the substrate can be flexibly transported between the coating processing block and the development processing block.

  According to the substrate processing apparatus of the present invention, a series of processing can be performed on a substrate by transporting the substrate between the same layers of adjacent processing blocks. Thus, a substrate transport path corresponding to the number of layers is provided. In addition, the substrate can be transported by changing the hierarchy in at least one of the adjacent processing blocks, and a series of processing can be performed on the substrate. Thereby, the board | substrate conveyance path | route can be made more than the number of hierarchy. In this way, the substrate can be flexibly transferred between adjacent processing blocks. Therefore, even if an abnormal main transport mechanism that cannot transport the substrate occurs, the substrate can be transported through a transport path that does not include the main transport mechanism and a series of processes can be performed on the substrate.

Embodiments of the present invention will be described below with reference to the drawings.
First, an outline of the present embodiment will be described. FIG. 1 is a schematic diagram illustrating a schematic configuration of a substrate processing apparatus according to an embodiment.

  The embodiment is a substrate processing apparatus that forms a resist film on a substrate (for example, a semiconductor wafer) W and develops the exposed substrate W. The apparatus includes an indexer section (hereinafter referred to as “ID section”) 1, a processing section 3, and an interface section (hereinafter referred to as “IF section”) 5. The ID unit 1, the processing unit 3, and the IF unit 5 are provided adjacent to each other in this order. The IF unit 5 is further provided with an exposure device EXP that is an external device separate from the present apparatus.

  The ID unit 1 transfers the substrate W transferred from the outside to the apparatus to the processing unit 3. The processing unit 3 performs a process of forming a resist film on the substrate W transported from the ID 1 and a process of developing the substrate W. The IF unit 5 transports the substrate W between the processing unit 3 and the exposure apparatus EXP. The exposure machine EXP exposes the substrate W.

  The processing unit 3 includes a coating processing block Ba and a development processing block Bb. The coating processing block Ba and the development processing block Bb are provided side by side in the horizontal direction connecting the ID portion 1 and the IF portion 5. A coating processing block Ba is adjacent to the ID portion 1, and a development processing block Bb is adjacent to the IF portion 5. The coating process block Ba forms a resist film on the substrate W. The development processing block Bb develops the substrate W.

  Each processing block Ba, Bb is divided into a plurality of hierarchies K in the vertical direction. In the present embodiment, the coating processing block Ba has an upper level K1 and a lower level K3. Similarly, the development processing block Bb has an upper level K2 and a lower level K4. The hierarchies K1 and K2 are at the same level (height position), and the hierarchies K3 and K4 are also at the same level (height position). Thus, the processing unit 3 as a whole has a hierarchical structure in which the hierarchies K1 and K2 are the upper hierarchies and the hierarchies K3 and K4 are the lower hierarchies. Here, the hierarchies K1 and K2 are provided in separate processing blocks Ba and Bb, respectively, but in this specification, the hierarchies K1 and K2 are defined as “the same hierarchies” and “hierarchies” in the sense of hierarchies at the same level. “Same level” is appropriately described. Similarly, the hierarchy K3 and the hierarchy K4 are appropriately described as “the same hierarchy” or the like.

  Each level K of each processing block Ba, Bb includes a processing unit that processes the substrate W, and a main transport mechanism that transports the substrate W to the processing unit of the level. The processing units of the layers K1 and K3 of the coating processing block Ba are coating processing units for forming a resist film on the substrate W. Examples of the coating processing unit include a resist film coating processing unit RESIST that coats a substrate W with a resist film material. The processing units in the respective layers K2 and K4 of the development processing block Bb are development processing units DEV for developing the substrate W and the like. FIG. 1 shows only the resist film coating processing unit RESIST and the development processing unit DEV. The coating processing block Ba and the development processing block Bb correspond to processing blocks in the present invention.

  The apparatus configured as described above operates as follows. The substrate W is transferred from the ID unit 1 to the layers K1 and K3 of the coating processing block Ba. In the layers K1 and K3, a process of forming a resist film on the substrate W is performed. When the processing is completed, the substrate W on which the resist film is formed is transferred from the layer K1 to any one of the layers K2 and K4. Similarly, the substrate W on which the resist film is formed is transported from the level K3 to one of the levels K2 and K4.

  Each of the levels K2 and K4 transports the substrate W to the IF unit 5. The IF unit 5 transports the substrate W to the exposure machine EXP. The exposure machine EXP exposes the substrate W on which the resist film is formed. When the exposure is completed, the exposed substrate W is transported from the exposure machine EXP to the IF unit 5.

  The substrate W is transported from the IF unit 5 to the layers K2 and K4 of the development processing block Bb. In the layers K2 and K4, processing for developing the exposed substrate W is performed. When the processing is completed, the processed substrate W is transported from the level K2 to one of the levels K1 and K3. Similarly, the processed substrate W is transferred from the level K4 to one of the levels K1 and K3. Each of the levels K1 and K3 transfers each substrate W transferred to the level to the ID unit 1.

  In this way, the substrate W can be transported between the same layers of the adjacent processing blocks Ba and Bb (between the layers K1 and K2 and between the layers K3 and K4). At the same time, the substrate W can be transferred between the adjacent processing blocks Ba and Bb by changing the layer K between the layers K1 and K4 or between the layers K2 and K4.

  Thereby, the transport path of the substrate W between the processing blocks Ba and Bb is the hierarchy K1-hierarchy K2 (r1 in FIG. 1), the hierarchy K2-hierarchy K4 (same r2), and the hierarchy K1-hierarchy K4 (same r3). , There are four kinds of hierarchy K3-hierarchy K2 (same r4). If the conveyance direction is distinguished, there are eight times the double. For this reason, even if a certain level K cannot process the substrate W or cannot transfer the substrate W, it is possible to flexibly cope with such a case that the substrate W is transferred by a transfer path not including the level K. it can.

  For example, in this apparatus, the substrate W can be transported along two transport paths R1 and R2 as shown in FIG. The transport path R1 transports the substrate W between the same (upper) layers K1 and K3 of the processing blocks Ba and Bb. The transport route R2 transports the substrate W between the upper layer K1 of the processing block Ba and the lower layer K4 of the processing block Bb. Accordingly, as shown in the drawing, the hierarchy K3 is not included in any of the transport routes R1 and R2. Such transfer paths R1 and R2 are used when the processing unit (for example, resist film coating unit RESIST) in the level K3 cannot process the substrate W, or when the main transfer mechanism in the level K3 transfers the substrate W. It is effective when it becomes impossible (abnormal state). Further, since all the substrates W developed in the development processing block Bb are transported to the level K1, the substrate W developed in the development processing block Bb is transported to different levels K1 and K3, respectively. The processing quality between the substrates W can be made more uniform. Furthermore, each of the transport paths R1 and R2 performs a process of forming a resist film on the substrate W at the same level K1, and performs a process of developing the substrate W at different levels K2 and K4. It is also effective in that the processing quality and the like in the layers K2 and K4 can be compared and verified by performing a series of processing on the substrate W through the transport paths R1 and R2.

  Further, in this apparatus, the substrate W can be transported through two transport paths R2 and R3 as shown in FIG. The transport path R3 transports the substrate W between the same (lower) layers K2 and K4 of the processing blocks Ba and Bb. Therefore, as shown in the drawing, the hierarchy K2 is not included in any of the transport routes R2 and R3. Such transport paths R2 and R3 are in a state where the processing unit (for example, the development processing unit DEV) in the level K2 cannot process the substrate W or the main transport mechanism in the level K2 cannot transport the substrate W ( This is effective when an abnormal state occurs. In addition, each of the transport paths R2 and R3 performs a process of forming a resist film on the substrate W at different levels K1 and K3, and performs a process of developing the substrate W at the same level K4. It is also effective in that the processing qualities and the like in the layers K1 and K3 can be compared and verified by performing a series of processing on the substrate W along the transport paths R2 and R3.

  Further, in this apparatus, the substrate W can be transported through two transport paths R4 and R5 as shown in FIG. The transport route R4 transports the substrate W from the level K3 to the level K4 and transports the substrate W from the level K4 to the level K1. The transport route R5 transports the substrate W from the level K3 to the level K4 and transports the substrate W from the level K2 to the level K1. Therefore, as shown in the drawing, each layer K1, K3 of the coating processing block Ba carries the substrate W in one direction. Specifically, the level K3 of the coating processing block Ba exclusively receives the substrate W from the ID unit 1, and pays out the substrate W exclusively to the development processing block Bb (level K4). Further, the layer K1 of the coating processing block Ba exclusively receives the substrate W from the development processing block Bb and pays out the substrate W exclusively to the ID unit 1. Further, since the process in the coating process block Ba is a process before the substrate W is exposed, this process is performed only in the layer K3 on which the substrate W before the exposure is transported. Such transport paths R4 and R5 are effective when the processing unit of the layer K1 becomes unable to process the substrate W. In other words, the layer K1 bears the operation of receiving the substrate W from the development processing block Bb and paying out the substrate W to the ID unit 1, whereby the processing capability in the layer K3 can be enhanced.

  In the present invention, the transport path r of the substrate W between the processing blocks Ba and Bb is not limited to the above-described four transport paths r1 to r4. In other words, there may be three ways in which one of the transport routes r3 and r4 between different layers K is added to the transport routes r1 and r2 between the same layers K. For example, in the operation example described with reference to FIG. 3, the transport paths r1, r2, and r3 are sufficient, and in the operation example described with reference to FIGS. 2 and 4, the transport paths r1, r2, and r4 are sufficient. Further, the transport paths r3 and r4 may be capable of transporting the substrate W only in one direction in addition to the case where the substrate W can be transported in both directions. For example, the operation example described with reference to FIG. 4 only transports the substrate W in one direction from the development processing block Bb to the coating processing block Ba in the transport path r3.

Below, the structure of each part of a present Example is demonstrated in detail.
FIG. 5 is a plan view showing a schematic configuration of the substrate processing apparatus according to the embodiment. FIGS. 6 and 7 are schematic side views showing the arrangement of the processing units included in the substrate processing apparatus. FIGS. FIG. 6 is a vertical sectional view taken along arrows aa, bb, cc, dd, and dd in FIG. 5.

[ID part 1]
The ID unit 1 takes out the substrate W from the cassette C that accommodates a plurality of substrates W, and accommodates the substrate W in the cassette C. The ID unit 1 includes a cassette mounting table 9 on which the cassette C is mounted. The cassette mounting table 9 is configured to be able to mount four cassettes C in a row. The ID unit 1 includes an ID transport mechanism T ID . The ID transport mechanism T ID transports the substrate W to each cassette C and transports the substrate W to a placement unit PASS 1 and a placement unit PASS 3 to be described later. The ID transport mechanism T ID includes a movable table 21 that horizontally moves the side of the cassette mounting table 9 in the direction in which the cassettes C are arranged, a lifting shaft 23 that expands and contracts in the vertical direction with respect to the movable table 21, and the lifting shaft 23. And a holding arm 25 that holds the substrate W by moving back and forth in the turning radius direction. The ID transport mechanism T ID corresponds to the indexer transport mechanism in the present invention.

[Processing unit 3]
As shown in FIGS. 5 and 8, etc., main transport mechanisms T 1 and T 3 are provided in the respective layers K 1 and K 3 of the coating processing block Ba. Further, main transport mechanisms T 2 and T 4 are provided in the respective levels K 2 and K 4 of the development processing block Bb. In the following, description will be given separately for each processing block Ba, Bb.

[Processing unit 3—Coating process block Ba]
Between the layers K1 and K3 of the ID unit 1 and the processing block Ba, mounting units PASS 1 and PASS 3 for mounting the substrate W are provided. On the platform PASS 1 , the substrate W transferred between the ID transport mechanism T ID and the main transport mechanism T 1 is placed. Similarly, the substrate W transferred between the ID transport mechanism T ID and the main transport mechanism T 3 is placed on the placement unit PASS 3 . In cross-sectional view, the placement portion PASS 1 is disposed at a height position near the lower portion of the upper layer K1, and the placement portion PASS 3 is disposed at a height near the upper portion of the lower layer K3. As described above, since the positions of the placement unit PASS 1 and the placement unit PASS 3 are relatively close, the ID transport mechanism T ID moves between the placement unit PASS 1 and the placement unit PASS 3 with a small ascending / descending amount. be able to.

Between the processing blocks Ba and Bb, mounting parts PASS 2 and PASS 4 for mounting the substrate W are fixedly provided for each layer. Specifically, the placement unit PASS 2 is disposed between the layers K1 and K2, and the placement unit PASS 4 is disposed between the layers K3 and K4. The main transport mechanism T I and the main transport mechanism T 2 deliver the substrate W via the placement unit PASS 2 , and the main transport mechanism T 3 and the main transport mechanism T 4 transfer the substrate W via the placement unit PASS 4. Deliver. Thus, the placement units PASS 2 and PASS 4 are for transporting the substrate W between the same layers. The placement units PASS 2 and PASS 4 correspond to the fixed placement unit in the present invention.

Between the processing blocks Ba and Bb, a movable placement unit MPASS for placing the substrate W is further provided so as to be moved up and down over each level in the vertical direction. Specifically, the movable placement unit MPASS is moved in the vertical direction between the placement unit PASS 2 and the placement unit PASS 4 by a driving mechanism (not shown). And it can move to the height position according to the hierarchy K1 (K2), and the height position according to the hierarchy K3 (K4). Height position corresponding to the story K1 (K2) is slightly lower than the mounting portion PASS 2, a position indicated by the solid line in FIG. 8. The height position corresponding to the hierarchy K3 (K4) is slightly above the placement unit PASS 4 and is a position indicated by a dotted line in FIG. For movable receiver MPASS having moved to the height position corresponding to the story K1 (K2), can be the main transport mechanism T I and the main transport mechanism T 2 is placed on the substrate W, also placed The substrate W being processed can be received (that is, it can be transferred). Similarly, with respect to the movable receiver MPASS having moved to the height position corresponding to the story K3 (K4), the main transport mechanism T 3 and the main transport mechanism T 4 is capable of transporting the substrate W. The movable placement unit MPASS can be used for transporting the substrate W between the same layers, but in this embodiment, it is used exclusively for transporting the substrate W between different layers.

Each mounting unit PASS 1 to PASS 4 , each mounting unit PASS 5 , PASS 6, and movable mounting unit MPASS described later are plural (two in this embodiment), and are arranged close to each other in the vertical direction. ing. Then, one of the placement units PASS is selected according to the direction in which the substrate W is delivered.

For example, the mounting unit PASS 1 has two mounting units PASS 1A and PASS 1B that are arranged close to each other in the vertical direction. Then, in the one mounting unit PASS 1A, a substrate W placed thereon to pass from the ID transport mechanism T ID to the main transport mechanism T 1, for ID from the main transport mechanism T 1 to the other mounting portion PASS 1B A substrate W to be transferred to the transport mechanism T ID is placed.

Further, for example, the placement unit PASS 2 includes placement units PASS 2A and PASS 2B . Then, the main transport mechanism T 1 into one of the mounting unit PASS 2A is placing a substrate W, the substrate W is the main transport mechanism T 2 receives. The main transport mechanism T 2 on the other mounting portion PASS 2B is placed on the substrate W, the substrate W is the main transport mechanism T 1 receives.

Further, for example, the movable placement unit MPASS has movable placement units MPASS A and MPASS B. Then, on one of the movable mounting part mpass A main transport mechanism T 1 or main transport mechanism T 3 and placing the substrate W, the substrate W is the main transport mechanism T 2 or the main transport mechanism T 4 receives. The main transport mechanism on the other of the movable mounting part mpass B T 2 or the main transport mechanism T 4 is placed on the substrate W, the substrate W is the main transport mechanism T 1 or main transport mechanism T 3 receives.

Each of the placement units PASS 1 to PASS 6 and the movable placement unit MPASS has a plurality of projecting support pins, and is configured so that the substrate W can be placed in a substantially horizontal posture by these support pins. Further, sensors (not shown) for detecting the presence or absence of the substrate W are attached to each of the placement units PASS 1 to PASS 6 and the movable placement unit MPASS. The detection signal of each sensor is input to the control unit 90 described later. The control unit 90 determines whether or not the substrate W is placed on the placement units PASS and MPASS based on the detection result of each sensor, and performs each transfer via the placement units PASS and MPASS. The main transport mechanism T is controlled.

The hierarchy K1 will be described.
The processing units provided in the layer K1 are a coating processing unit 31 and a heat treatment unit 41 for forming a resist film on the substrate W. The main transport mechanism T 1 transports the substrate W to the coating processing unit 31 and the heat treatment unit 41. The main transport mechanism T 1, is provided movably transporting space A 1 substantially central parallel and street conveying direction of the story K1 in plan view. Coating units 31 are arranged on one side of the transporting space A 1, and heat-treating units 41 are arranged on the other side.

The coating units 31 are arranged vertically and horizontally, respectively facing the transporting space A 1. In the present embodiment, a total of four coating processing units 31 are arranged in two rows and two stages along the transport path of the substrate W.

  The coating processing unit 31 includes an antireflection film coating processing unit BARC that forms an antireflection film on the substrate W, and a resist film coating processing unit RESIST that forms a resist film (performs a resist film forming process) on the substrate W. Including.

  The antireflection film coating processing unit BARC applies the antireflection film processing liquid to the substrate W. The resist film coating processing unit RESIST applies a resist film material to the substrate W. There are a plurality (two) of antireflection film coating processing units BARC, and they are arranged side by side so as to be at substantially the same height in the lower stage. There are also a plurality (two) of resist film coating processing units RESIST, which are arranged side by side so as to be at substantially the same height in the upper stage. There are no partition walls or partition walls between the antireflection coating application units BARC. That is, all the antireflection coating application units BARC are only accommodated in a common chamber, and the atmosphere around each antireflection coating application unit BARC is not blocked (communicated). Similarly, the atmosphere around each resist film coating unit RESIST is not blocked from each other.

  Please refer to FIG. FIG. 12A is a plan view of the coating processing unit, and FIG. 12B is a cross-sectional view of the coating processing unit. Each coating processing unit 31 includes a rotation holding unit 32 that rotatably holds the substrate W, a cup 33 provided around the substrate W, a supply unit 34 that supplies a processing liquid to the substrate W, and the like.

  The supply unit 34 has a plurality of nozzles 35, a gripping unit 36 that grips one nozzle 35, and moves the gripping unit 36 so that the one nozzle 35 is displaced from the processing position above the substrate W and the top of the substrate W. And a nozzle moving mechanism 37 for moving between the standby positions. One end of a processing liquid pipe 38 is connected to each nozzle 35 in communication. The processing liquid pipe 38 is provided movably (flexibly) so as to allow movement of the nozzle 35 between the standby position and the processing position. The other end of each processing liquid pipe 38 is connected to a processing liquid supply source (not shown). Specifically, in the case of the antireflection film coating processing unit BARC, the processing liquid supply source supplies different types of antireflection film processing liquids to the nozzles 35. In the case of the resist film coating processing unit RESIST, the processing liquid supply source supplies different types of resist film materials to the nozzles 35.

  The nozzle moving mechanism 37 includes a first guide rail 37a and a second guide rail 37b. The first guide rails 37a are arranged in parallel with each other with the two cups 33 arranged side by side. The second guide rail 37 b is slidably supported by the two first guide rails 37 a and is installed on the two cups 33. The grip portion 36 is slidably supported by the second guide rail 37b. Here, the directions guided by the first guide rail 37a and the second guide rail 37b are both substantially horizontal directions and are substantially orthogonal to each other. The nozzle moving mechanism 37 further includes a drive unit (not shown) that slides and moves the second guide rail 37b and slides the grip portion 36. When the driving unit is driven, the nozzle 35 held by the holding unit 36 is moved to a position above the two rotation holding units 32 corresponding to the processing position.

Heat-treating units 41 are a plurality, are arranged vertically and horizontally, each facing the transporting space A 1. In this embodiment, three heat treatment units 41 can be arranged in the horizontal direction, and five heat treatment units 41 can be stacked in the vertical direction. Each heat treatment unit 41 includes a plate 43 on which the substrate W is placed. The heat treatment unit 41 includes a cooling unit CP that cools the substrate W, a heating / cooling unit PHP that performs heat treatment and cooling processing continuously, and a vapor atmosphere of hexamethyldisilazane (HMDS) in order to improve the adhesion between the substrate W and the film. It includes an adhesion processing unit AHL for heat treatment. The heating / cooling unit PHP has two plates 43 and a local transport mechanism (not shown) that moves the substrate W between the two plates 43. There are a plurality of various heat treatment units CP, PHP, and AHL, which are arranged at appropriate positions.

The main transport mechanism T 1 will be described in detail. Please refer to FIG. FIG. 13 is a perspective view of the main transport mechanism. The main transport mechanism T 1 has a fourth guide rail 52 for guiding the third guide rail 51 and the lateral two guiding in the vertical direction. Third guide rails 51 are fixed opposite each other at one side of the transporting space A 1. In this embodiment, it is arranged on the coating processing unit 31 side. The fourth guide rail 52 is slidably attached to the third guide rail 51. A base portion 53 is slidably provided on the fourth guide rail 52. The base 53 extends transversely, substantially to the center of the transporting space A 1. Further, a drive unit (not shown) that moves the fourth guide rail 52 in the vertical direction and moves the base unit 53 in the horizontal direction is provided. When the drive unit is driven, the base unit 53 is moved to each position of the coating processing unit 31 and the heat treatment unit 41 arranged vertically and horizontally.

The base 53 is provided with a turntable 55 that can rotate about the vertical axis Q. On the turntable 55, two holding arms 57a and 57b for holding the substrate W are provided so as to be movable in the horizontal direction. The two holding arms 57a and 57b are arranged at positions close to each other in the vertical direction. Furthermore, a drive unit (not shown) is provided for rotating the turntable 55 and moving the holding arms 57a and 57b back and forth. When the driving unit is driven, the coating unit 31 and the heat treatment unit 41, the mounting units PASS 1 and PASS 2, and the movable mounting unit MPASS moved to the height position corresponding to the layer K1 (K2) are rotated. The stand 55 is made to face, and the holding arms 57a and 57b are moved forward and backward with respect to the coating processing unit 31 and the like.

The hierarchy K3 will be described. In addition, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol about the same structure as the hierarchy K1. The main transport mechanism T 3 and processing unit in plan view with the layout of the hierarchical K3 (arrangement) is substantially the same as those hierarchies K1. Therefore, the arrangement of the various treating units of the story K3 as seen from the main transport mechanism T 3 is substantially the same as the arrangement of the various treating units of the hierarchy K1 as seen from the main transport mechanism T 1. The coating processing unit 31 and the heat treatment unit 41 in the layer K3 are respectively stacked below the coating processing unit 31 and the heat treatment unit 41 in the layer K1.

In the following, when distinguishing the resist film coating processing units RESIST and the like provided in the layers K1 and K3, subscripts “1” or “3” are respectively attached (for example, resist films provided in the layer K1). The coating processing unit RESIST is described as “resist film coating processing unit RESIST 1 ”).

Other configurations of the processing block Ba will be described. In the transport spaces A 1 and A 3 , a first blowing unit 61 that blows clean gas and a discharge unit 62 that sucks gas are provided. The first blowout unit 61 and exhaust unit 62 is a flat box having substantially the same area as the transporting space A 1 in plan view. A first outlet 61 a and a discharge outlet 62 a are formed on one surface of the first outlet unit 61 and the discharge unit 62, respectively. In the present embodiment, the first air outlet 61a and the outlet 62a are constituted by a large number of small holes f. The first blow-out unit 61 is arranged in the upper part of the transport spaces A 1 and A 3 with the first blow-out opening 61a facing downward. Further, the discharge unit 62 is disposed below the transport spaces A 1 and A 3 with the discharge port 62a facing upward. Atmosphere of the transporting space A 1 and the transporting space A 3 are blocked off by the exhaust unit 62 of the transporting space A 1 and the first blowout unit 61 of the transporting space A 3. Therefore, the atmospheres of the layers K1 and K3 are blocked from each other.

The first blowing units 61 in the transfer spaces A 1 and A 3 are connected to the same first gas supply pipe 63 in communication. The first gas supply pipe 63 is provided at a lateral position of the placement parts PASS 2 and PASS 4 from the upper part of the transport space A 1 to the lower part of the transport space A 3 and horizontally below the transport space A 2. Is bent. The other end of the first gas supply pipe 63 is connected to a gas supply source (not shown). Similarly, the discharge units 62 of the transfer spaces A 1 and A 3 are connected to the same first gas discharge pipe 64. The first gas discharge pipe 64 is provided at a lateral position of the placement parts PASS 2 and PASS 4 from the lower part of the transfer space A 1 to the lower part of the transfer space A 3 , and in the horizontal direction below the transfer space A 2. Is bent. Then, by sucking / discharging gas from the discharge port 62a causes blown gas from the first outlet 61a of the transporting space A 1, A 3, flows from top to bottom in the transport space A 1, A 3 An air flow is formed, and each of the transfer spaces A 1 and A 3 is individually kept clean.

  In each coating processing unit 31 of the layers K1 and K3, a pothole part PS penetrating in the vertical direction is formed. A second gas supply pipe 65 for supplying clean gas and a second gas discharge pipe 66 for exhausting gas are provided in the vertical hole PS in the vertical direction. Each of the second gas supply pipe 65 and the second gas discharge pipe 66 is branched at a predetermined height position of each coating processing unit 31 and drawn out in a substantially horizontal direction from the pothole portion PS. The plurality of branched second gas supply pipes 65 are connected to a second blowing unit 67 that blows gas downward. The plurality of branched second gas discharge pipes 66 are connected to the bottom of each cup 33, respectively. The other end of the second gas supply pipe 65 is connected in communication with the first gas supply pipe 63 below the level K3. The other end of the second gas exhaust pipe 66 is connected to the first gas exhaust pipe 64 below the level K3. Then, while the gas is blown out from the second blowing unit 67 and the gas is discharged through the second gas discharge pipe 66, the atmosphere in each cup 33 is always kept clean, and the substrate held in the rotation holding unit 32. W can be processed suitably.

  In addition, piping and electric wiring (both not shown) through which the processing liquid is passed are installed in the hole portion PS. Thus, since the piping, wiring, etc. attached to the coating processing unit 31 of the hierarchy K1, K3 can be accommodated in the pothole part PS, the length of piping, wiring, etc. can be shortened.

Further, the processing block Ba is accommodated in one housing 75. A processing block Bb to be described later is also housed in a separate housing 75. In this manner, the processing unit 3 can be easily manufactured by providing the housing 75 that collectively accommodates the main transport mechanism T and the processing unit for each of the processing blocks Ba and Bb. The main transport mechanism T 1 and the main transport mechanism T 3 corresponds to the first main transport mechanism in the present invention.

[Processing unit 3—Development processing block Bb]
The hierarchy K2 will be described. About the same structure as the hierarchy K1, detailed description is abbreviate | omitted by attaching | subjecting a same sign. Transporting space A 2 in the hierarchy K2 is formed as an extension of the transporting space A 1.

The processing units in the level K2 are a development processing unit DEV that develops the substrate W, a heat treatment unit 42 that performs heat treatment on the substrate W, and an edge exposure unit EEW that exposes the peripheral portion of the substrate W. Developing units DEV are arranged at one side of the transporting space A 2, heat-treating units 42 and edge exposing unit EEW are arranged at the other side of the transporting space A 2. Here, the development processing unit DEV is preferably disposed on the same side as the coating processing unit 31. Further, it is preferable that the heat treatment unit 42 and the edge exposure unit EEW are aligned with the heat treatment unit 41.

Developing units DEV is four, which are arranged two horizontally along the transporting space A 2 are stacked in upper and lower stages. Each development processing unit DEV includes a rotation holding unit 77 that holds the substrate W in a rotatable manner, and a cup 79 provided around the substrate W. Two development processing units DEV arranged side by side are provided without being partitioned by a partition wall or the like. Further, a supply unit 81 that supplies a developing solution to the two development processing units DEV is provided. The supply unit 81 has two slit nozzles 81a having slits or small hole arrays for discharging the developer. The length in the longitudinal direction of the slit or small hole array is preferably equivalent to the diameter of the substrate W. The two slit nozzles 81a are preferably configured to discharge different types or concentrations of developing solutions. The supply unit 81 further includes a moving mechanism 81b that moves each slit nozzle 81a. Thereby, each slit nozzle 81a is movable above the two rotation holding portions 77 arranged in the horizontal direction.

Heat-treating units 42 are a plurality, more aligned with are horizontally along the transporting space A 2, are stacked in a vertical direction. The heat treatment unit 42 includes a heating unit HP that heats the substrate W, a cooling unit CP that cools the substrate W, and a heating and cooling unit PHP that continuously performs the heating process and the cooling process.

There are a plurality of heating / cooling units PHP. Each heating / cooling unit PHP is stacked in the vertical direction in the row closest to the IF unit 5, and one side portion of the heating / cooling unit PHP faces the IF unit 5 side. About the heating-cooling unit PHP provided in the hierarchy K2, the conveyance opening of the board | substrate W is formed in the side part. For the heating / cooling unit PHP, an IF transport mechanism TIF, which will be described later, transports the substrate W through the transport port. Then, a post-exposure heating (PEB) process is performed on the exposed substrate W by the heating / cooling unit PHP provided in the layer K2. Similarly, the heating / cooling unit PHP provided in the level K4 performs a post-exposure heating (PEB) process on the exposed substrate W.

  The edge exposure unit EEW is single and is provided at a predetermined position. The edge exposure unit EEW includes a rotation holding unit (not shown) that rotatably holds the substrate W, and a light irradiation unit (not shown) that exposes the periphery of the substrate W held by the rotation holding unit. .

Further, a placement portion PASS 5 is stacked on the upper side of the heating / cooling unit PHP. Through the mounting part PASS 5, and IF's transport mechanisms T IF performs the transfer of wafers W to be described later and the main transport mechanism T 2.

The main transport mechanism T 2 is disposed substantially at the center of the transporting space A 2 in plan view. The main transport mechanism T 2 has the same structure as the main transport mechanism T 1.
The placement unit PASS 2 , the movable placement unit MPASS moved to a height position corresponding to the level K 1 (K 2), the development processing unit DEV, the various heat treatment units 42, the edge exposure unit EEW, and the placement unit PASS. 5 , the main transport mechanism T 2 transports the substrate W.

The hierarchy K4 will be briefly described. The relationship between the hierarchies K2 and K4 is the same as the relationship between the hierarchies K1 and K3. The transport spaces A 2 and A 4 on the floors K 2 and K 4 are also provided with configurations corresponding to the first blow-out unit 61 and the discharge unit 62, respectively. In addition, the development processing units DEV in the levels K2 and K4 are provided with configurations corresponding to the second blowing unit 67, the second gas discharge pipe 66, and the like.

In the following, when distinguishing the development processing units DEV, edge exposure units EEW, and the like provided in the hierarchies K2 and K4, subscripts “2” and “4” are respectively attached (for example, provided in the hierarchy K2). The heating unit HP is described as “heating unit HP 2 ”). Each main transport mechanism T 2, and a main transport mechanism T 4 corresponds to the second main transport mechanism in the present invention.

[IF unit 5]
The IF unit 5 delivers the substrate W between the processing unit 3 (more specifically, each level K2, K4 of the development processing block Bb) and the exposure apparatus EXP. IF section 5 is provided with an IF's transport mechanisms T IF for transporting the substrate W. The IF transport mechanism TIF includes an IF first transport mechanism TIFA and an IF second transport mechanism TIFB that can transfer the substrate W to each other. The first IF transport mechanism TIFA mainly transports the substrate W to the development processing block Bb. The IF second transport mechanism T IFB mainly transports the substrate W to the exposure apparatus EXP.

The second transport mechanism T IFB first transport mechanism T IFA and the IF IF, are arranged in the array direction and a direction substantially orthogonal to the main transport mechanism T provided in each layer of the processing unit 3. The first IF transport mechanism TIFA is disposed on the processing block Bb on the side where the heat treatment unit 42 and the like are located. The IF second transport mechanism T IFB is disposed on the side of the processing block Bb where the development processing unit DEV is located.

The first IF transport mechanism TIFA includes a base 83 that is fixedly provided, a lifting shaft 85 that expands and contracts vertically relative to the base 83, a swing radius that is pivotable with respect to the lifting shaft 85. And a holding arm 87 that moves forward and backward in the direction to hold the substrate W. The IF second transport mechanism T IFB also includes a base 83, a lifting shaft 85, and a holding arm 87.

Between the first and second transport mechanisms T IFA and T IFB for IF, a placement unit PASS-CP for placing and cooling the substrate W, a placement unit PASS 7 for placing the substrate W, and the substrate W buffer BF IF for temporarily accommodating a are stacked in multiple stages. The buffer unit BF IF includes a sending buffer unit BF IFS that temporarily stores a substrate W to be sent to the exposure apparatus EXP, and a return buffer unit BF IFR that temporarily stores a substrate W to be returned to the processing unit 3. And divided. In the return buffer unit BF IFR , the substrate W that has been subjected to post-exposure heating (PEB) processing is placed on the exposed substrate W.

The first IF transport mechanism TIFA includes the placement units PASS 5 and PASS 6 , the heating / cooling unit PHP of each level K 3 and K 4, the placement unit PASS-CP, the placement unit PASS 7, and the buffer unit BF IF . The substrate W is transferred to the substrate. The second IF transport mechanism T IFB transports the substrate W to the exposure apparatus EXP, the placement unit PASS-CP, and the placement unit PASS 7 . The delivery of the substrate W between the first and second transport mechanisms T IFA and T IFB for IF is performed via the placement unit PASS-CP and the placement unit PASS 7 . The IF transport mechanism TIF corresponds to the interface transport mechanism in the present invention.

  Next, the control system of this apparatus will be described. FIG. 14 is a control block diagram of the substrate processing apparatus according to the embodiment. As shown in the figure, the control unit 90 of the present apparatus includes a main controller 91 and first to seventh controllers 93, 94, 95, 96, 97, 98 and 99.

The main controller 91 comprehensively controls the first to seventh controllers 93 to 99. The main controller 91 can communicate with an exposure controller provided in the exposure apparatus EXP via a host computer. The first controller 93 controls substrate transport by the ID transport mechanism T ID . The second controller 94 transports the substrate by the main transport mechanism T 1 , resist film coating unit RESIST 1 , antireflection film coating unit BARC 1 , cooling unit CP 1 , heating / cooling unit PHP 1, and adhesion processing unit AHL 1. Control the substrate processing at. The third controller 95 controls substrate transport by the main transport mechanism T 2, and substrate treatment in the edge exposing unit EEW 2, developing units DEV 2, heating units HP 2 and cooling units CP 2. The control of the fourth and fifth controllers 96 and 97 corresponds to the control of the second and third controllers 94 and 95, respectively. The sixth controller 98 controls substrate transport by the IF first transport mechanism TIFA and substrate processing in the heating / cooling units PHP 2 and PHP 4 . The seventh controller 99 controls substrate transport by the IF second transport mechanism T IFB . Furthermore, the 2nd-5th controllers 94-97 control the raising / lowering of movable mounting part MPASS, respectively. The first to seventh controllers 93 to 99 described above perform control independently of each other.

  Each of the main controller 91 and the first to seventh controllers 93 to 99 is a central processing unit (CPU) that executes various processes, a RAM (Random-Access Memory) that is a work area for arithmetic processing, It is realized by a storage medium such as a fixed disk for storing various information such as a processing recipe (processing program). The processing recipe includes information related to the transport path for transporting each substrate W.

  Next, the operation of the substrate processing apparatus according to the embodiment will be described. Here, the operation examples corresponding to the various transport paths described with reference to FIGS. 2 to 4 are realized by a combination of the operations of the transport mechanisms. For this reason, below, it demonstrates for every conveyance mechanism. FIG. 15 is a flowchart for performing a series of processes on the substrate W, and shows a processing unit or a placement unit on which the substrates W are sequentially transferred. FIG. 16 is a diagram schematically showing the operation repeatedly performed by each transport mechanism, and clearly shows the order of processing units, placement units, cassettes, and the like accessed by the transport mechanism.

[ID transport mechanism T ID ]
The ID transport mechanism T ID moves to a position facing the one cassette C, holds one unprocessed substrate W accommodated in the cassette C in the holding arm 25 and carries it out of the cassette C. The ID transport mechanism T ID turns the holding arm 25 and moves the lifting shaft 23 up and down to move to a position facing the mounting portion PASS 1 to place the held substrate W on the mounting portion PASS 1A ( This corresponds to step S1a in Fig. 15. Hereinafter, only step numbers will be added. At this time, the substrate W is normally placed on the placement unit PASS 1B , and the substrate W is received and stored in the cassette C (step S23). In addition, when there is no substrate W in the placement unit PASS 1B , step S23 is omitted. Subsequently, the ID transport mechanism T ID accesses the cassette C, and transports the substrate W accommodated in the cassette C to the placement unit PASS 3A (step S1b). Also here, if the substrate W is placed on the placement part PASS 3B , the substrate W is stored in the cassette C (step S23). The ID transport mechanism T ID repeatedly performs the above-described operation.

The operation of the ID transport mechanism T ID is controlled by the first controller 93. Thus, the substrate W of the cassette C is sent to the level K1, and the substrate W discharged from the level K1 is accommodated in the cassette C. Similarly, the substrate W of the cassette C is sent to the level K3, and the substrate W discharged from the level K3 is accommodated in the cassette C.

[Main transport mechanisms T 1 , T 3 ]
Since the operation of the main transport mechanism T 3 is substantially the same as operation of the main transport mechanism T 1, a description will be given only the main transport mechanism T 1. That is, the operation in the hierarchy K1 will be described. The main transport mechanism T 1 moves to a position facing the placement unit PASS 1 . At this time, the main transport mechanism T 1 holds the substrate W received from the portion PASS 2B placing just before the one holding arm 57 (e.g., 57 b). Substrate on which the main transport mechanism T 1 is placed on (step S22), and mounting the other holding arm 57 (e.g. 57a) portion PASS 1A with placing the portion PASS 1B mounting the wafer W held Hold W.

The main transport mechanism T 1 accesses a predetermined one of the cooling units CP 1. The cooling unit CP 1 there are other substrate W already finished heat treatment (cooling). With unloaded from the main transport mechanism T 1 cooling unit CP 1 holds the other substrate W in an empty (not holding the substrate W) holding arm 57, cooling the wafer W received from the mounting portion PASS 1A It carried into the unit CP 1. Then, the main transport mechanism T 1 moves holding the cooled wafer W into the film coating units BARC 1. The cooling unit CP 1 starts heat treatment (cooling) to the loaded wafer W (step S2). In the following description, also in the heat-treating units 41 and coating units 31 of various other, when the main transport mechanism T 1 is accessed, to that substrate W respectively in the unit has completed a predetermined process is already To do.

When the antireflection film coating unit BARC 1 is accessed, the main transport mechanism T 1 unloads the substrate W on which the antireflection film is formed from the antireflection film coating unit BARC 1 and reflects the cooled substrate W. It is placed on the rotation holding unit 32 of the coating treatment unit BARC 1 for the prevention film. Thereafter, the main transport mechanism T 1 holds the substrate W on which the antireflection film is formed and moves to the heating / cooling unit PHP 1 . The antireflection film coating processing unit BARC 1 starts processing the substrate W placed on the rotation holding unit 32 (step S3).

  Specifically, the rotation holding unit 32 rotates the substrate W in a horizontal posture, holds one nozzle 35 by the holding unit 36, and moves the held nozzle 35 above the substrate W by driving the nozzle moving mechanism 37. Then, the processing liquid for the antireflection film is supplied from the nozzle 35 to the substrate W. The supplied processing liquid spreads over the entire surface of the substrate W and is discarded from the substrate W. The cup 33 collects the discarded processing liquid. In this way, the process of coating and forming the antireflection film on the substrate W is performed.

The main transport mechanism T 1 accesses the the heating and cooling unit PHP 1, with unloading the wafer W having the heat treatment from the heating and cooling unit PHP 1, turning on the wafer W having antireflection film formed thereon into the heating and cooling unit PHP 1 . Then, the main transport mechanism T 1 holds and moves the wafer W taken out of the heating and cooling unit PHP 1 to the cooling unit CP 1. In the heating / cooling unit PHP 1 , the substrates W are sequentially placed on the two plates 43, and after heating the substrate W on one plate 43, the substrate W is cooled on the other plate 43 (step S 4).

The main transport mechanism T 1 moved to the cooling unit CP 1, with a wafer W out of the cooling unit CP 1, and loads the wafer W held in the cooling unit CP 1. The cooling unit CP 1 cools the loaded wafer W (step S5).

Subsequently, the main transport mechanism T 1 moves to the resist film coating unit RESIST 1 . The main transport mechanism T 1 takes a wafer W having resist film formed from the resist film coating units RESIST 1, the substrate W held in the resist film coating units RESIST 1 carries the substrate W. The resist film coating processing unit RESIST 1 supplies the resist film material while rotating the loaded substrate W to form a resist film on the substrate W (step S6).

The main transport mechanism T 1 further moves to the heating / cooling unit PHP 1 and the cooling unit CP 1 . Then, the wafer W having resist film formed thereon is carried into the heating and cooling unit PHP 1, transfers a wafer W to the cooling unit CP 1 having undergone the processing in the heating and cooling unit portion PHP 1, the processing in the cooling unit CP 1 The finished substrate W is received. The heating / cooling unit PHP 1 and the cooling unit CP 1 each perform a predetermined process on the unprocessed substrate W. (Steps S7 and S8).

The main transport mechanism T 1, in accordance with the conveyance path of the substrate W held to convey the substrate W with respect to mounting portion PASS 2 or movable mounting part mpass. As a result, the substrate W is dispensed from the coating processing block Ba (hierarchy K1) toward one of the development processing blocks Bb. In addition, the conveyance path | route of the board | substrate W currently hold | maintained is preset by the process recipe.

Specifically, it is as follows. When transporting the wafer W to the story K2 from the story K1 (corresponding to r1 in FIG. 1), the main transport mechanism T 1 moves to a position opposed to the receiver PASS 2. Then, the held substrate W is placed on the placement portion PASS 2A (step S9a).

In addition, when transporting the substrate W from the story K1 to hierarchical K4 (corresponding to r3 in FIG. 1), the main transport mechanism T 1 moves to a position opposed to the movable mounting part mpass. In this case, the movable placement unit MPASS A has moved to a height position corresponding to the layer K1 (K2). Then, the main transport mechanism T 1 places the wafer W it is holding on the movable mounting part mpass A (step S9c). When the substrate W is placed on the movable placement unit MPASS, the movable placement unit MPASS descends to a height position corresponding to the transport destination level K3 (K4).

Subsequently, the main transport mechanism T 1, in accordance with the conveyance path of the substrate W received from the developing block Bb, receive are placed on the placing portion PASS 2 or movable receiver MPASS substrate W. The transport path of the substrate W is also set in advance in the processing recipe.

Specifically, it is as follows. If the story K1 receives a wafer W fed from the story K2 (corresponding to r1 in FIG. 1), the main transport mechanism T 1 receives the substrate W placed on the placing portion PASS 2B (step S21a ). Also, if the story K1 receives a wafer W fed from the story K4 (corresponding to r3 in FIG. 1), the main transport mechanism T 1 receives the substrate W placed on a movable placing part mpass B ( Step S21c).

Thereafter, the main transport mechanism T 1 accesses the placement unit PASS 1 again and repeats the above-described operation. This operation is controlled by the second controller 94. Thereby, the main transport mechanism T 1 receives the substrate W placed on the placement unit PASS 1 and transports the substrate W to a predetermined processing unit (cooling unit CP 1 in the present embodiment), and performs processing from the processing unit. The finished substrate W is taken out. Subsequently, the taken-out substrate W is transported to another processing unit, and the processed substrate W is taken out from the other processing unit. In this manner, the substrates W that have been processed in the respective processing units are moved to new processing units, so that the processing is performed in parallel on the plurality of substrates W. And it pays out from the hierarchy K1 toward the development processing block Bb in order from the substrate W previously placed on the placement unit PASS 1 .

In this case, placing the case of transporting the substrate W to part PASS 2 placing in between the same level K2 hierarchical K1, if paid out instead of the different layers K4 hierarchical K1 mounting the movable receiver MPASS Put. Further, the substrate W discharged from the development processing block Bb toward the level K1 is received. In this case, if the substrate W is transported from the same hierarchy K2 hierarchical K1 receives the substrate W from the mounting portion PASS 2. In addition, when the substrate W is transported from the layer K4 different from the layer K1, the substrate W is received from the movable placement unit MPASS. In this way, the substrate W received by either the placement unit PASS 2 or the movable placement unit MPASS is paid out to the ID unit 1.

[Main transport mechanisms T 2 , T 4 ]
Since the operation of the main transport mechanism T 4 is substantially the same as the operation of the main transport mechanism T 2, a description will be given only the main transport mechanism T 2. That is, the operation in the hierarchy K2 will be described. The main transport mechanism T 2, in accordance with the conveyance path of the substrate W received from the coating block Ba, receive are placed on the placing portion PASS 2 or movable receiver MPASS substrate W. The transport path of the substrate W is also set in advance in the processing recipe.

Specifically, it is as follows. If the hierarchy K2 receives a wafer W fed from the story K1 (corresponding to r1 in FIG. 1), the main transport mechanism T 2 receives a wafer W placed on the placement unit PASS 2A (step S9a ). Also, if the hierarchy K2 receives a wafer W fed from the story K3 (corresponding to r3 in FIG. 1), the main transport mechanism T 2 receives a wafer W placed on the movable mounting part mpass A ( Step S9c).

At this time, the main transport mechanism T 2 holds a wafer W received from a cooling unit CP 2 accessed immediately before. The main transport mechanism T 2 in accordance with the conveyance path of the substrate W held by, and places the substrate W to one of the mounting portion PASS 2 or movable mounting part mpass. As a result, the substrate W is paid out from the development processing block Bb (hierarchy K2) toward any one of the coating processing blocks Ba.

Specifically, it is as follows. When transporting the wafer W to the story K1 from the story K2 (corresponding to r1 in FIG. 1), the main transport mechanism T 2 places the part PASS 2B mounting the wafer W held (step S21a). Also, if (corresponding to r4 in FIG. 1) for transporting the substrate W to the story K3 from the hierarchy K2, the main transport mechanism T 2 places the wafer W it is holding on the movable mounting portion mpass B (step S21c ). When the substrate W is placed on the movable placement unit MPASS, the movable placement unit MPASS descends to a height position corresponding to the transport destination level K3 (K4).

The main transport mechanism T 2 accesses into the edge exposing unit EEW 2. Then, the substrate W that has been subjected to the predetermined processing in the edge exposure unit EEW 2 is received, and the cooled substrate W is carried into the edge exposure unit EEW 2 . The edge exposure unit EEW 2 irradiates the peripheral edge of the substrate W from a light irradiation unit (not shown) while rotating the loaded substrate W. Thereby, the periphery of the substrate W is exposed (step S10).

The main transport mechanism T 2 holds the substrate W received from the edge exposure unit EEW 2 and accesses the placement unit PASS 5 . Then, the substrate W held is placed on the placement unit PASS 5A (step S11), and the substrate W placed on the placement unit PASS 5B is held (step S16).

The main transport mechanism T 2 moves to one of the cooling units CP 2, the wafer W held by replacing the substrate W in the cooling unit CP 2. The main transport mechanism T 2 accesses the developing units DEV 2 holds the wafer W having received cooling treatment. Cooling unit CP 2 starts treatment of the newly loaded wafer W (step S17).

The main transport mechanism T 2 takes a wafer W that has been developed from the developing unit DEV 2, and places the cooled wafer W on the spin holder 77 of the developing unit DEV 2. The development processing unit DEV 2 develops the substrate W placed on the rotation holding unit 77 (step S18). Specifically, while the rotation holding unit 77 rotates the substrate W in a horizontal posture, the developing solution is supplied to the substrate W from any of the slit nozzles 81a to develop the substrate W.

The main transport mechanism T 2 accesses one of the heating units HP 2 holding the wafer W is developed. Then, the substrate W is unloaded from the heating unit HP 2 and the substrate W to be held is put into the heating unit HP 2 . Subsequently, the main transport mechanism T 2 transports the substrate W unloaded from the heating unit HP 2 to the cooling unit CP 2 and takes out the substrate W that has already been processed in the cooling unit CP 1 . Each of the heating unit HP 2 and the cooling unit CP 2 performs a predetermined process on the unprocessed substrate W (steps S19 and S20).

Thereafter, the main transport mechanism T 2 accesses the placement unit PASS 2 and / or the movable placement unit MPASS again and repeats the above-described operation. This operation is controlled by the third controller 95. Thereby, the substrate W is paid out to the placement unit PASS 5A in the order received from the placement unit PASS 2A or the movable placement unit MPASS A. Similarly, the substrate W is discharged to the placement unit PASS 2B or the movable placement unit MPASS B in the order in which the substrates W are placed on the placement unit PASS 5B .

In the case where the substrate W is conveyed to and from the same level K1 hierarchical K2, carried through the receiver PASS 2. Further, when the substrate W is transported between the layer K2 and the layer K4 different from the layer K2, it is performed via the movable placement unit MPASS.

[IF transport mechanism T IF to IF first transport mechanism T IFA ]
IF first transport mechanism T IFA is accesses the receiver PASS 5, and receives the substrate W placed on the placing part PASS 5A (step S11a). The first IF transport mechanism TIFA holds the received substrate W, moves to the placement unit PASS-CP, and carries it into the placement unit PASS-CP (step S12).

Next, it receives the substrate W from the first transport mechanism T IFA mounting portion PASS 7 for IF (step S14), and moves to a position opposed to the heating and cooling units PHP 2. The first transport mechanism T IFA IF fetches of the heating and cooling unit PHP 2 already heated after exposure from (PEB) processing has finished substrate W, the substrate W received from the placing part PASS 7 of the heating and cooling units PHP 2 Carry in. The heating / cooling unit PHP 2 heat-treats the unprocessed substrate W (step S15).

The first IF transport mechanism TIFA transports the substrate W taken out from the heating / cooling unit PHP 2 to the placement unit PASS 5B (step S16). Subsequently, the first IF transport mechanism TIFA transports the substrate W placed on the placement unit PASS 6A to the placement unit PASS-CP (steps S11b and S12). Next, the IF first transport mechanism TIFA is transported from the mounting portion PASS 7 to the heating / cooling unit PHP 4 . At this time, the substrate W that has been subjected to post-exposure heating (PEB) processing in the heating / cooling unit PHP 4 is taken out and placed on the placement unit PASS 4B .

Thereafter, the first IF transport mechanism TIFA accesses the placement unit PASS 5 again and repeats the above-described operation. This operation is controlled by the sixth controller 98.

[IF transport mechanism T IF to IF second transport mechanism T IFB ]
The second IF transport mechanism T IFB takes out the substrate W from the placement unit PASS-CP and transports it to the exposure apparatus EXP. Then, when the exposed substrate W delivered from the exposure machine EXP is received, it is transported to the placement unit PASS 7 .

Thereafter, the second IF transport mechanism T IFB accesses the placement unit PASS-CP again and repeats the above-described operation.

  As described above, according to the substrate processing apparatus according to the first embodiment, the movable placement unit MPASS that moves up and down over the upper layer K1 (K2) and the lower layer K3 (K4) is developed with the adjacent coating processing block Ba and the development. Since it is provided between the processing block Bb, the coating processing block Ba and the development processing block Bb can be transported at different levels.

  In addition, since the range in which the movable placement unit MPASS moves up and down covers all levels of the processing blocks Ba and Bb, each level of the coating processing block Ba transports the substrate W between all levels of the development processing block Bb. Is possible. Conversely, each layer of the development processing block Bb can transfer the substrate W between all the layers of the coating processing block Ba. That is, the movable platform MPASS can transport the substrate W between the layers of the processing blocks Ba and Bb through four transport paths r1 to r4. Including the transport direction, there are eight ways.

  As described above, since the substrate W can be flexibly transported between the processing blocks Ba and Bb, even if one of the main transport mechanisms T falls into an abnormal state, the substrate is transported along the transport path that does not include the main transport mechanism T. W can be transported. Thereby, the normal main transport mechanism T and the processing unit are efficiently operated and a series of processing is performed on the substrate W, so that it is possible to prevent the processing capability of the apparatus from being extremely lowered.

Further, since the substrate W can be flexibly transported between the processing blocks Ba and Bb, it is possible to flexibly select the transport path of the substrate W of the entire apparatus described with reference to FIGS.
Thereby, the processing quality can be compared between the layers of the coating processing block Ba, or the processing quality can be compared between the layers of the development processing block Bb.

In addition, since the mounting units PASS 2 and PASS 4 that are fixedly provided are provided between the processing blocks Ba and Bb, the substrate W is transported between the same layers of the processing blocks Ba and Bb. Can do.

Furthermore, by using the movable platform MPASS exclusively for transporting the substrate W to different levels, and using the platforms PASS 2 and PASS 4 exclusively for transporting the substrate W between the same levels,
The burden and movement amount of the movable placement unit MPASS can be suppressed. Thereby, the substrate W can be smoothly transported even if the hierarchy is changed between the processing blocks Ba and Bb. In addition, the movable placement unit MPASS can be controlled more easily.

Embodiment 2 of the present invention will be described below with reference to the drawings. In the second embodiment, in the substrate processing apparatus described in the first embodiment, the movable placement unit MPASS is omitted, and the main transport mechanisms T 2 and T 4 provided in the development processing block Bb described in the first embodiment. The configuration of is changed. For this reason, the description will focus on the main transport mechanisms T 2M and T 4M of the second embodiment.

FIG. 17 is a longitudinal sectional view of each conveyance space of the substrate processing apparatus according to the second embodiment. As shown in the drawing, the first blow-out unit 61 and the discharge unit 62 are not provided between the transport spaces A 2 and A 4 of the respective levels K 2 and K 4 of the development processing block Bb. Therefore, in communication from the transporting space A 2 and the transporting space A 4.

The main transport mechanisms T 2M and T 4M are both provided on a common column 101 so as to be movable up and down. The support column 101 extends in the vertical direction from the top of the transport space A 2 to the bottom of the transport space A 4 . The main transport mechanisms T 2M and T 4M are each provided with an elevating member 103, a base portion 105, a turntable 55, and two holding arms 57a and 57b. The elevating member 103 is attached to the support column 101 and moves up and down along the support column 101. The base member 105 is connected to the elevating member 103. The turntable 55 is supported by the base member 103 so as to be rotatable about the vertical axis. The two holding arms 57 a and 57 b are provided so as to be able to advance and retract in the horizontal direction with respect to the turntable 55.

As described above, the main transport mechanism T 2M transports the substrate W to the processing unit provided in the level K2 and the placement unit PASS 2 provided corresponding to the level K2. Further, the main transport mechanism T 2M is capable transports the substrate W to part PASS 4 mounting lowered to hierarchy K4. At this time, the main transport mechanism T 4M moves so as not to interfere with the main transport mechanism T 2M below the hierarchy K4. Thus, the main transport mechanism T 2M is vertically movably configured for each layer K2, K4 in developing block Bb, the main transport mechanism T 1 of the respective layers K1, K3 of the coating block Ba adjacent, T The substrate W can be transferred to and from 3 .

Similarly, the main transport mechanism T4M transports the substrate W to the processing unit provided in the level K4 and the placement unit PASS 4 provided corresponding to the level K4. Further, the main transport mechanism T 4M can be transported to the substrate W to part PASS 2 placing increased to hierarchy K2. At this time, the main transport mechanism T2M moves above the level K2 so as not to interfere with the main transport mechanism T4M . As described above, the main transport mechanism T 4M is also configured to be movable up and down over the layers K2 and K4 in the development processing block Bb, and the main transport mechanisms T 1 and T3 of the layers K1 and K3 of the adjacent coating processing block Ba. The substrate W can be transferred to and from 3 .

Then, the main transport mechanism T 2M transports the substrate W to the placement unit PASS 4 so that the substrate W can be transported between the layers K2 and K4 (corresponding to r4 in FIG. 1). Further, the main transport mechanism T 4M transports the substrate W to the placement unit PASS 2 so that the substrate W can be transported between the layers K4 and K1 (corresponding to r3 in FIG. 1).

Thus, according to the substrate processing apparatus according to the second embodiment, the main transport mechanism T 2M hierarchy K2 is for transferring the main transport mechanism T 1 and the substrate W in the same level K1 through the receiver PASS 2 it is possible, it can deliver the main transport mechanism T 3 and the substrate W of a different story K3 through the receiver PASS 4. Similarly, the main transport mechanism T 4M hierarchy K4, together can deliver the main transport mechanism T 3 and the substrate W in the same level K3 through the receiver PASS 4, through the receiver PASS 2 it can deliver the main transport mechanism T 1 and the substrate W of a different hierarchy K1. Therefore, similarly to the first embodiment, the substrate W can be transported between the layers of the processing blocks Ba and Bb through the four transport paths r1 to r4. Including the transport direction, there are eight ways.

  For this reason, in the apparatus according to the second embodiment, similarly to the first embodiment, the transport path R for transporting the substrate W can be variously selected and changed, and a series of processes can be suitably performed on the substrate W.

Further, the main transport mechanisms T 2M and T 4M perform the transfer via the mounting portions PASS 2 and PASS 4 that are fixedly provided when the main transport mechanisms T 1 and T 3 and the substrate W are transferred. For this reason, in addition to the four main transport mechanisms T 1 to T 4 , a mechanism for moving the substrate W, for example, the movable mounting portion MPASS described in the first embodiment is not required. Therefore, the configuration of the apparatus and the transport control of the substrate W can be simplified.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above-described first embodiment, the movable placement unit MPASS is provided, but is not limited thereto. Please refer to FIG. 18 and FIG. 18 is a plan view of a substrate processing apparatus according to a modified embodiment, and FIG. 19 is a vertical sectional view taken along the line ee in FIG. In addition, about the same structure as Example 1, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

As shown in FIGS. 18 and 19, on the side of mounting portion PASS 2, PASS 4 are provided, and a transport mechanism T P for placing portion. Carrying placement unit mechanism T P transports the substrate W between the mounting portion PASS 2, PASS 4. The mounting unit transport mechanism T P includes a lift base member 111 and a holding arm 113. The elevating base member 111 moves up and down over the respective height positions of the placement portions PASS 2 and PASS 4 by a drive mechanism (not shown). The holding arm 113 is provided so as to be movable back and forth in the horizontal direction with respect to the lifting base member 111 and holds the substrate W.

Then, by conveying the main transport mechanism T substrate W placed on the placing portion PASS 2 by 1 hierarchy K1, in part PASS 4 mounting unit transport mechanism T P is the placement, the hierarchy the substrate W it can be received by the main transport mechanism T 4 of K4. Conversely, by conveying the main transport mechanism T 4 by the part PASS 2 mounting part PASS 4 in the placed transport mechanism T P for the platform substrate W is mounting, primary hierarchical K1 the substrate W it can be received by the transport mechanism T 1. By thus mounting unit transport mechanism T P is conveyed between a portion PASS 4 mounting a portion PASS 2 mounting the the substrate W, to transfer the substrate W between the story K1 and story K4 (Conveyance path r3 in FIG. 1). In the case of transporting the substrate W in the same hierarchy each other, no need to transfer the substrate W between the part PASS 2, PASS 4 mounting unit transport mechanism T P is mounting.

Further, by conveying the main transport mechanism T substrate W placed on the portion PASS 4 placing the third hierarchy K3, the part PASS 2 mounting unit transport mechanism T P is the placement, the hierarchy the substrate W it can be received by the main transport mechanism T 2 of the K2. Conversely, by transporting mainly transport mechanism T 2 by the transfer portion mounting the substrate W placed on the mounting unit PASS 2 mechanism T P is mounting unit PASS 4, the main hierarchy K3 the substrate W it can be received by the transport mechanism T 3. Thus mounting unit transport mechanism T P is by conveying between part PASS 2, PASS 4 mounting the substrate W, thereby transporting the substrate W between the story K2 and hierarchy K3 (Fig. 1 Transport route r4).

(2) In the first embodiment described above, but equipped with a part PASS 2, PASS 4 mounting is not limited thereto. Since the substrate W can be transported between the same layers via the movable platform MPASS, the platforms PASS 2 and PASS 4 may be omitted.

(3) In Embodiment 2 described above, each main transport mechanism T 2M , T 4M of the development processing block Bb is configured to transport the substrate W to both the placement units PASS 2 , PASS 4. Not limited to. For example, only the main transport mechanisms T 1 and T 3 of the coating processing block Ba may be changed so that the substrate W can be transported to both the placement units PASS 2 and PASS 4 . Alternatively, all the main transport mechanisms T 1 to T 4 of the processing blocks Ba and Bb may be changed so that the substrate W can be transported to both the placement units PASS 2 and PASS 4 .

(4) In the second embodiment described above, each main transport mechanism T 2M , T 4M of the development processing block Bb is configured to transport the substrate W to both the placement units PASS 2 , PASS 4. Not limited to. For example, only the main transport mechanism T 2M can transport the substrate W to both the placement units PASS 2 and PASS 4 , and the main transport mechanism T 4M is changed so that the substrate W cannot be transported to the placement unit PASS 2. May be. Even in this case, the substrate W can be transported between the level K2 and the level K3. Conversely, only the main transport mechanism T 4M can transport the substrate W to both the placement units PASS 2 and PASS 4 , and the main transport mechanism T 2M is changed so that the substrate W cannot be transported to the placement unit PASS 4. May be. Even in this case, the substrate W can be transported between the level K4 and the level K1.

(5) In the above-described second embodiment, each of the main transport mechanisms T 2M and T 4M can be moved up and down over the layers K2 and K4 in the development processing block Bb, and each layer of the adjacent coating processing block Ba. Although the substrate W can be transferred between the main transport mechanisms T 1 and T 3 of K1 and K3, the present invention is not limited to this. For example, each of the main transport mechanisms T 2M and T 4M is configured to be extendable and contractable over the respective layers K2 and K4 in the development processing block Bb, and the main transport mechanisms T of the respective layers K1 and K3 of the adjacent coating processing block Ba. 1 and T 3 may be changed so as to deliver the substrate W.

  (6) In each embodiment described above, each processing block Ba, Bb has two hierarchies, but is not limited thereto. For example, you may change so that it may have three or more hierarchies.

  Even in the case where there are three or more levels in the vertical direction, it is sufficient if there is at least one transport path r that can be transported by changing the level between the coating processing block Ba and the development processing block Bb. Of course, each layer of the coating processing block Ba may be configured to transport the substrate W between all the layers of the development processing block Bb.

  That is, when each processing block Ba, Bb is divided into three or more layers, the movable placement unit MPASS may be configured to be movable up and down over two or more layers. Of course, you may comprise movable mounting part MPASS so that raising / lowering is possible over all the hierarchy.

Further, when each processing block Ba, Bb is divided into three or more layers, each main transport mechanism T 2M , T 4M may be configured to be movable up and down over two or more layers in the development processing block Bb. Of course, each main transport mechanism T 2M , T 4M may be configured to be movable up and down over all levels.

  (7) In each of the above-described embodiments, the processing unit 3 is configured by arranging two processing blocks Ba and Bb side by side, but is not limited thereto. For example, the processing unit 3 may be changed to include three or more processing blocks.

  Note that when three or more processing blocks are arranged, the processing blocks are adjacent to each other at two or more locations, but it is only necessary that the hierarchy can be changed and transported at at least one of them. Of course, the processing blocks may be changed so that they can be transported at different levels in all locations where the processing blocks are adjacent.

  (8) In each of the embodiments described above, the application processing block Ba and the development processing block Bb are illustrated as the processing blocks, but the present invention is not limited to this. You may change suitably to the process block which performs other processes, such as a cleaning process, to the board | substrate W. FIG. Further, depending on the processing contents of the processing unit 3, a separate exposure unit EXP provided adjacent to the present apparatus may be omitted.

  (9) You may change so that each structure of each Example mentioned above and each modification Example may be combined suitably.

It is a schematic diagram which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic diagram which shows an example of the conveyance path | route of the board | substrate in the substrate processing apparatus which concerns on an Example. It is a schematic diagram which shows an example of the conveyance path | route of the board | substrate in the substrate processing apparatus which concerns on an Example. It is a schematic diagram which shows an example of the conveyance path | route of the board | substrate in the substrate processing apparatus which concerns on an Example. It is a top view which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is each vertical sectional view of the aa arrow in FIG. It is each vertical sectional view of the bb arrow in FIG. It is each vertical sectional view of cc arrow in FIG. It is each vertical sectional view of the dd arrow in FIG. (A) is a top view of a coating processing unit, (b) is sectional drawing of a coating processing unit. It is a perspective view of a main conveyance mechanism. It is a control block diagram of the substrate processing apparatus which concerns on an Example. It is a flowchart of a series of processes performed on a substrate. It is a figure which shows typically the operation | movement which each conveyance mechanism repeats, respectively. 6 is a longitudinal sectional view of each transfer space of a substrate processing apparatus according to Embodiment 2. FIG. It is a top view of the substrate processing apparatus concerning a modification. It is each vertical sectional view of the ee arrow in FIG.

Explanation of symbols

1 ... Indexer part (ID part)
3 ... Processing unit 5 ... Interface unit (IF unit)
DESCRIPTION OF SYMBOLS 31 ... Application | coating processing unit 41, 42 ... Heat processing unit 61 ... 1st blowing unit 61a ... 1st blower outlet 62 ... Discharge unit 62a ... Discharge port 65 ... 2nd gas supply pipe 66 ... 2nd gas discharge pipe 90 ... Control part 91 ... main controllers 93 to 99 ... first to seventh controllers K, K1, K2, K3, K4 ... hierarchy B, ... processing block Ba ... coating processing block Bb ... development processing block BARC ... antireflection film coating processing unit RESIST ... Resist film coating unit DEV Development unit EEW Edge exposure unit PHP Heating / cooling unit T ID ID transport mechanism T 1 , T 2 , T 2M , T 3 , T 4 , T 4M ... main transport mechanism T IF ... transport mechanism PASS for IF, PASS-CP ... mounting portion mpass ... movable Portion T P ... mounting unit transport mechanism A 1, A 2, A 3 , A 4 ... transporting space EXP ... exposure machine C ... cassette W ... substrate

Claims (16)

  1. In a substrate processing apparatus for processing a substrate,
    A plurality of processing blocks in the horizontal direction are provided for each level in the vertical direction, each having a processing unit for processing a substrate, and a main transfer mechanism provided for each level and transferring a substrate to the processing unit in the level. Side by side
    A substrate processing apparatus characterized in that a substrate can be transported between the same layers of adjacent processing blocks, and a substrate can be transported by changing the layer in at least one of the adjacent processing blocks.
  2. The substrate processing apparatus according to claim 1,
    Between the processing blocks that can transport the substrate by changing the hierarchy, it is provided so as to be able to move up and down over a plurality of levels, and includes a movable placement part for placing the substrate,
    A substrate having a plurality of levels of main transfer mechanisms provided in each of the processing blocks can transfer a substrate to the movable mounting portion moved to a height position corresponding to the level. Processing equipment.
  3. The substrate processing apparatus according to claim 2,
    When the substrate is placed on the movable placement unit, the movable placement unit moves to a level different from the level on which the substrate is placed.
  4. In the substrate processing apparatus of Claim 2 or Claim 3,
    The substrate processing apparatus, wherein the movable mounting portion is movable across all levels.
  5. The substrate processing apparatus according to claim 1,
    Between processing blocks that can transport substrates by changing the hierarchy,
    A plurality of fixed placement units provided for each level, each fixed transfer unit capable of transporting a substrate by each main transport mechanism of the level provided in each of the processing blocks; and
    A placement unit transport mechanism for transporting a substrate between the fixed placement units;
    A substrate processing apparatus comprising:
  6. In the substrate processing apparatus in any one of Claims 1-5,
    When there is a main transport mechanism in an abnormal state in one processing block between processing blocks capable of transporting substrates by changing the hierarchy, each main transport mechanism of the other processing block has the one processing block, A substrate processing apparatus for transferring a substrate to and from a main transport mechanism other than a main transport mechanism in an abnormal state.
  7. In the substrate processing apparatus in any one of Claims 1-6,
    Processing blocks that can transport the substrate by changing the hierarchy are a coating processing block and a development processing block provided adjacent to the coating processing block,
    The coating processing block includes a coating processing unit and a heat treatment unit for forming a resist film on a substrate as the processing unit, and a first main transport mechanism for transporting the substrate to the coating processing unit and the heat treatment unit. As a main transport mechanism,
    The development processing block includes a development processing unit and a heat treatment unit for developing a substrate as the processing unit, and a second main transport mechanism for transporting the substrate to the development processing unit and the heat treatment unit is the main transport mechanism. As
    A substrate processing apparatus, wherein a substrate can be transported by changing a hierarchy between the coating processing block and the development processing block.
  8. The substrate processing apparatus according to claim 7,
    The substrate processing apparatus according to claim 1, wherein each layer of the coating processing block is capable of transporting a substrate between all levels of the development processing block.
  9. The substrate processing apparatus according to claim 8,
    In a part of the coating processing block, the processing of forming a resist film on the substrate is performed exclusively, and the substrate on which the resist film is formed is discharged toward the development processing block.
    The substrate processing apparatus characterized in that the substrate discharged from the development processing block is received exclusively in another part of the layer of the coating processing block.
  10. In a substrate processing apparatus for processing a substrate,
    A plurality of processing blocks in the horizontal direction are provided for each level in the vertical direction, each having a processing unit for processing a substrate, and a main transfer mechanism provided for each level and transferring a substrate to the processing unit in the level. Side by side
    A substrate can be transported between the same layers of adjacent processing blocks, and at least one of the adjacent processing blocks has at least one layer of one processing block between a different layer of the other processing block. A substrate processing apparatus, wherein the substrate processing apparatus is capable of transporting the substrate.
  11. The substrate processing apparatus according to claim 10, wherein
    The main transport mechanism of the one layer is configured to be extendable / descendable / lowerable over a plurality of layers including the one layer in the processing block, and between the main transport mechanisms of the plurality of layers of adjacent processing blocks. A substrate processing apparatus characterized in that a substrate can be delivered with a substrate.
  12. The substrate processing apparatus according to claim 10, wherein
    The substrate processing apparatus according to claim 1, wherein the one layer can transfer a substrate to and from all the layers of adjacent processing blocks.
  13. The substrate processing apparatus according to claim 12, wherein
    The main transport mechanism of the first layer is configured to be extendable / descendable / liftable over all layers in the processing block, and can transfer a substrate to / from the main transport mechanism of all layers of the adjacent processing block. There is provided a substrate processing apparatus.
  14. The substrate processing apparatus according to claim 10, wherein
    Processing blocks capable of transporting substrates between different layers are a coating processing block and a development processing block provided adjacent to this coating processing block,
    The coating processing block includes a coating processing unit and a heat treatment unit for forming a resist film on a substrate as the processing unit, and a first main transport mechanism for transporting the substrate to the coating processing unit and the heat treatment unit. As a main transport mechanism,
    The development processing block includes a development processing unit and a heat treatment unit for developing a substrate as the processing unit, and a second main transport mechanism for transporting the substrate to the development processing unit and the heat treatment unit is the main transport mechanism. As
    While transferring the substrate between the first main transport mechanism and the second main transport mechanism of the same level,
    The first main transport mechanism of at least one of the layers is configured to be extendable / descendable / liftable over a plurality of layers including the layer in the coating processing block, and the substrate can be moved between the plurality of second main transport mechanisms. A substrate processing apparatus capable of delivery.
  15. The substrate processing apparatus according to claim 14, wherein
    The second main transport mechanism in at least one of the layers is configured to be extendable / descendable / liftable over a plurality of layers including the layer in the development processing block, so that the substrate can be moved between the plurality of first main transport mechanisms. A substrate processing apparatus capable of delivery.
  16. The substrate processing apparatus according to claim 10, wherein
    Processing blocks capable of transporting substrates between different layers are a coating processing block and a development processing block provided adjacent to this coating processing block,
    The coating processing block includes a coating processing unit and a heat treatment unit for forming a resist film on a substrate as the processing unit, and a first main transport mechanism for transporting the substrate to the coating processing unit and the heat treatment unit. As a main transport mechanism,
    The development processing block includes a development processing unit and a heat treatment unit for developing a substrate as the processing unit, and a second main transport mechanism for transporting the substrate to the development processing unit and the heat treatment unit is the main transport mechanism. As
    While transferring the substrate between the first main transport mechanism and the second main transport mechanism of the same level,
    The second main transport mechanism in at least one of the layers is configured to be extendable / descendable / liftable over a plurality of layers including the layer in the development processing block, so that the substrate can be moved between the plurality of first main transport mechanisms. A substrate processing apparatus capable of delivery.
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US12/324,802 US9184071B2 (en) 2007-11-30 2008-11-26 Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units
US14/863,375 US9687874B2 (en) 2007-11-30 2015-09-23 Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units

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