JP4577886B2 - 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム - Google Patents

基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム Download PDF

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JP4577886B2
JP4577886B2 JP2005013481A JP2005013481A JP4577886B2 JP 4577886 B2 JP4577886 B2 JP 4577886B2 JP 2005013481 A JP2005013481 A JP 2005013481A JP 2005013481 A JP2005013481 A JP 2005013481A JP 4577886 B2 JP4577886 B2 JP 4577886B2
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Japan
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module
substrate
processed
transfer
failure
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JP2005013481A
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Japanese (ja)
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JP2006203003A5 (enExample
JP2006203003A (ja
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知広 金子
圭孝 原
亮 宮田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005013481A priority Critical patent/JP4577886B2/ja
Priority to TW094145035A priority patent/TWI287250B/zh
Priority to KR1020077018932A priority patent/KR100905508B1/ko
Priority to PCT/JP2006/300576 priority patent/WO2006077843A1/ja
Priority to CNB2006800026096A priority patent/CN100555595C/zh
Priority to US11/813,925 priority patent/US8393845B2/en
Publication of JP2006203003A publication Critical patent/JP2006203003A/ja
Publication of JP2006203003A5 publication Critical patent/JP2006203003A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2005013481A 2005-01-21 2005-01-21 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム Expired - Lifetime JP4577886B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005013481A JP4577886B2 (ja) 2005-01-21 2005-01-21 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
TW094145035A TWI287250B (en) 2005-01-21 2005-12-19 Substrate transfer and processing apparatus, obstacle measure method in substrate transfer and processing apparatus and program for an obstacle measure in the substrate transfer and processing apparatus
PCT/JP2006/300576 WO2006077843A1 (ja) 2005-01-21 2006-01-18 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
CNB2006800026096A CN100555595C (zh) 2005-01-21 2006-01-18 基板搬送处理装置和基板搬送处理装置的故障对策方法
KR1020077018932A KR100905508B1 (ko) 2005-01-21 2006-01-18 기판 반송 처리 장치 및 기판 반송 처리 장치에 있어서의 장해 대책 방법 및 기판 반송 처리 장치에 있어서의 장해 대책용 프로그램을 수록한 기록매체
US11/813,925 US8393845B2 (en) 2005-01-21 2006-01-18 Substrate convey processing device, trouble countermeasure method in substrate convey processing device, and trouble countermeasures program in substrate convey processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005013481A JP4577886B2 (ja) 2005-01-21 2005-01-21 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム

Publications (3)

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JP2006203003A JP2006203003A (ja) 2006-08-03
JP2006203003A5 JP2006203003A5 (enExample) 2006-12-21
JP4577886B2 true JP4577886B2 (ja) 2010-11-10

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Country Status (6)

Country Link
US (1) US8393845B2 (enExample)
JP (1) JP4577886B2 (enExample)
KR (1) KR100905508B1 (enExample)
CN (1) CN100555595C (enExample)
TW (1) TWI287250B (enExample)
WO (1) WO2006077843A1 (enExample)

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JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
JP4388563B2 (ja) 2007-03-27 2009-12-24 東京エレクトロン株式会社 基板の処理方法、基板処理装置及びコンピュータ読み取り可能な記憶媒体
DE102007025339A1 (de) * 2007-05-31 2008-12-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP4986784B2 (ja) * 2007-09-18 2012-07-25 東京エレクトロン株式会社 処理システムの制御装置、処理システムの制御方法および制御プログラムを記憶した記憶媒体
JP4770938B2 (ja) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 基板処理装置
JP4761326B2 (ja) * 2010-01-15 2011-08-31 シャープ株式会社 薄膜形成装置システムおよび薄膜形成方法
JP5246184B2 (ja) 2010-02-24 2013-07-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5168300B2 (ja) * 2010-02-24 2013-03-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5338757B2 (ja) * 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5473857B2 (ja) * 2010-10-14 2014-04-16 東京エレクトロン株式会社 搬送装置および処理システム
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP6013792B2 (ja) * 2012-06-12 2016-10-25 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
JP5928283B2 (ja) * 2012-09-28 2016-06-01 東京エレクトロン株式会社 基板処理装置、基板搬送方法及び記憶媒体
JP6049394B2 (ja) * 2012-10-22 2016-12-21 東京エレクトロン株式会社 基板処理システム及び基板の搬送制御方法
JP6860365B2 (ja) * 2017-01-31 2021-04-14 キヤノン株式会社 基板処理装置、基板処理システム、基板処理方法、物品製造方法、およびプログラム
JP7109287B2 (ja) * 2018-07-09 2022-07-29 東京エレクトロン株式会社 基板処理システム、基板処理方法、および制御プログラム
CN113851403A (zh) * 2021-08-30 2021-12-28 北京北方华创微电子装备有限公司 物料调度方法和半导体设备
CN116643544A (zh) * 2023-05-31 2023-08-25 西安奕斯伟材料科技股份有限公司 半导体物料搬送的控制方法、装置、设备、介质及产品

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Also Published As

Publication number Publication date
WO2006077843A1 (ja) 2006-07-27
CN101107701A (zh) 2008-01-16
JP2006203003A (ja) 2006-08-03
CN100555595C (zh) 2009-10-28
KR100905508B1 (ko) 2009-07-01
KR20070094862A (ko) 2007-09-21
US20090016860A1 (en) 2009-01-15
TWI287250B (en) 2007-09-21
US8393845B2 (en) 2013-03-12
TW200629365A (en) 2006-08-16

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