KR100849934B1 - 랜덤 주기 칩 이송장치 - Google Patents
랜덤 주기 칩 이송장치 Download PDFInfo
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- KR100849934B1 KR100849934B1 KR1020057014451A KR20057014451A KR100849934B1 KR 100849934 B1 KR100849934 B1 KR 100849934B1 KR 1020057014451 A KR1020057014451 A KR 1020057014451A KR 20057014451 A KR20057014451 A KR 20057014451A KR 100849934 B1 KR100849934 B1 KR 100849934B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
- B65G47/846—Star-shaped wheels or wheels equipped with article-engaging elements
- B65G47/848—Star-shaped wheels or wheels equipped with article-engaging elements the article-engaging elements being suction or magnetic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G29/00—Rotary conveyors, e.g. rotating discs, arms, star-wheels or cones
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1914—Cards, e.g. telephone, credit and identity cards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Specific Conveyance Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
Description
Claims (8)
- 칩을 탑재하여 운송하는 제1운송체;워크를 탑재하여 운송하는 제2운송체;상기 제1운송체로부터 칩을 수령하여 상기 제2운송체에 탑재되어 운송되는 워크 상에 상기 칩을 이송하는 복수의 엔드-이펙터;각각이 상기 엔드-이펙터 하나를 구비하고, 하나의 공통축 주위를 독립적으로 회전할 수 있는 복수의 동축 회전체;상기 동축 회전체의 회전속도 주기를 독립적이고 랜덤하게 변경하도록 각각이 각각의 동축 회전체를 구동하는 서보구동부; 를 포함하여 구성되며,상기 엔드-이펙터는 각각 상기 동축 회전체에 일체로 장착되고, 상기 공통축 주위로 공통 원을 형성하면서 분배되며,상기 엔드-이펙터는 상기 서보구동부의 작동에 따라, 엔드-이펙터간의 순서를 유지하면서 순차적으로 이동하고, 상기 제1운송체로부터 칩을 수령하며, 상기 수령한 칩을 상기 제2운송체의 워크 상에 이송하며, 상기 수령 및 이송운동을 포함하여 주기운동 동안 회전속도가 독립적으로 변경되는 것을 특징으로 하는 칩 이송장치.
- 제 1 항에 있어서,상기 엔드-이펙터는 상기 제1운송체의 운동과 동기되어 상기 제1운송체와의 상대속도가 실질적으로 제로인 상태로 상기 제1운송체로부터 상기 칩을 수령하고, 상기 제2운송체의 운동과 동기되어 상기 제2운송체와의 상대속도가 실질적으로 제로인 상태로 상기 제2운송체의 상기 워크 상에 상기 수령한 칩을 이송함을 특징으로 하는 칩 이송장치.
- 제 2 항에 있어서,상기 동축 회전체는 동축으로 이웃한 베어링의 외측 레이스에 고정되는 내측 레이스와, 동축으로 이웃한 다른 베어링의 내측 레이스에 고정되는 외측 레이스를 갖는, 축방향으로 순서대로 정렬된 동축 베어링을 더 포함하며;상기 베어링의 상기 내측 레이스의 일단면쪽에서 다른 베어링의 외측 레이스에 고정되고 상기 베어링의 상기 외측 레이스는 타단면쪽에서 다른 베어링의 내측 레이스에 고정되며;상기 각각의 엔드-이펙터는 관련 베어링의 내측 레이스에 일체로 고정되고, 상기 관련 베어링의 외측 레이스는 상기 서보구동부의 회전 구동력에 의하여 구동됨을 특징으로 하는 칩 이송장치.
- 제 2 항에 있어서,상기 각 동축 회전체는 관련 서보구동부의 작동에 의하여 주기 속도 변경 및 위상 제어가 개별적이고 독립적으로 이루어지도록 구성됨을 특징으로 하는 칩 이송장치.
- 제 4 항에 있어서,상기 제1운송체에 탑재된 상기 칩의 속도 및/또는 상기 제2운송체에 탑재된 상기 워크의 속도를 계측하는 측정장치를 더 포함하며;상기 서보구동부가 상기 측정장치의 계측결과에 의거하여 작동됨을 특징으로 하는 칩 이송장치.
- 제 4 항에 있어서,상기 제1운송체와 상기 제2운송체의 속도가 다르더라도, 상기 엔드-이펙터가 상기 제1운송체의 운동과 동기되어 상기 제1운송체와의 상대속도가 실질적으로 제로인 상태로 상기 제1운송체로부터 상기 칩을 수령하고, 상기 제2운송체의 운동과 동기되어 상기 제2운송체와의 상대속도가 실질적으로 제로인 상태로 상기 제2운송체의 상기 워크의 소정 위치 상에 상기 수령한 칩을 이송하는 것을 특징으로 하는 칩 이송장치.
- 제 6 항에 있어서,상기 제1운송체 및 상기 제2운송체 각각은 회전실린더 혹은 컨베이어 벨트임을 특징으로 하는 칩 이송장치.
- 제 2 항에 있어서,상기 칩은 전자부품이고, 상기 워크는 시트 형태의 IC카드 부품이거나 RF태그 부품인 것을 특징으로 하는 칩 이송장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2003-00031165 | 2003-02-07 | ||
JP2003031165A JP3739752B2 (ja) | 2003-02-07 | 2003-02-07 | ランダム周期変速可能な小片移載装置 |
Publications (2)
Publication Number | Publication Date |
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KR20050100659A KR20050100659A (ko) | 2005-10-19 |
KR100849934B1 true KR100849934B1 (ko) | 2008-08-04 |
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ID=32820878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020057014451A KR100849934B1 (ko) | 2003-02-07 | 2004-02-05 | 랜덤 주기 칩 이송장치 |
Country Status (8)
Country | Link |
---|---|
US (2) | US7278203B2 (ko) |
EP (1) | EP1595278B1 (ko) |
JP (1) | JP3739752B2 (ko) |
KR (1) | KR100849934B1 (ko) |
CN (1) | CN100349256C (ko) |
DE (1) | DE602004010071T2 (ko) |
TW (1) | TWI322647B (ko) |
WO (1) | WO2004070797A1 (ko) |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10320843B3 (de) * | 2003-05-08 | 2005-01-13 | Mühlbauer Ag | Vorrichtung zum Verbinden von Mikrochipmodulen mit Antennen |
JP4742526B2 (ja) * | 2003-12-26 | 2011-08-10 | シンフォニアテクノロジー株式会社 | Icチップ実装体の製造方法及び製造装置 |
WO2005069205A1 (ja) * | 2004-01-15 | 2005-07-28 | Hitachi Chemical Co., Ltd. | 電子装置の製造方法 |
US7384496B2 (en) * | 2004-02-23 | 2008-06-10 | Checkpoint Systems, Inc. | Security tag system for fabricating a tag including an integrated surface processing system |
TWI288885B (en) * | 2004-06-24 | 2007-10-21 | Checkpoint Systems Inc | Die attach area cut-on-fly method and apparatus |
JP4734857B2 (ja) * | 2004-06-25 | 2011-07-27 | シンフォニアテクノロジー株式会社 | Icチップ実装体の製造装置 |
JP4692718B2 (ja) * | 2004-12-07 | 2011-06-01 | シンフォニアテクノロジー株式会社 | Icチップ実装体の製造装置 |
US7500307B2 (en) | 2004-09-22 | 2009-03-10 | Avery Dennison Corporation | High-speed RFID circuit placement method |
JP4691217B2 (ja) * | 2004-09-22 | 2011-06-01 | 株式会社 ハリーズ | 搬送装置 |
EP1801046B1 (en) * | 2004-09-22 | 2010-03-31 | Hallys Corporation | Transfer apparatus |
DE102004056238B3 (de) * | 2004-11-22 | 2006-03-30 | Arccure Technologies Gmbh | Verfahren und Anordnung zur Herstellung von RFID-Tags |
WO2006059731A1 (ja) * | 2004-12-03 | 2006-06-08 | Hallys Corporation | 電子部品の製造方法、及び電子部品の製造装置 |
CN101073296B (zh) * | 2004-12-03 | 2011-07-06 | 哈里斯股份有限公司 | 内插器接合装置 |
ATE488985T1 (de) * | 2004-12-03 | 2010-12-15 | Hallys Corp | Zwischenglied-bondierungseinrichtung |
WO2006067207A1 (en) * | 2004-12-23 | 2006-06-29 | Crown Packaging Technology, Inc. | Multi-stage process handling equipment |
EP1694107A1 (de) * | 2005-02-17 | 2006-08-23 | KLARER, Christoph | Vorrichtung und Verfahren zur Aufnahme und Übergabe eines elektronischen Bauteils |
DE102005016930A1 (de) * | 2005-03-09 | 2006-09-21 | Mühlbauer Ag | Verfahren zum elektrischen und mechanischem Verbinden von Chipanschlussflächen mit Antennenanschlussflächen und Transponder |
EP1876877B1 (en) * | 2005-04-06 | 2010-08-25 | Hallys Corporation | Electronic component manufacturing apparatus |
US20090166431A1 (en) * | 2005-04-18 | 2009-07-02 | Hallys Corporation | Electronic component and manufacturing method thereof |
TW200707599A (en) * | 2005-04-18 | 2007-02-16 | Hitachi Chemical Co Ltd | Method of producing electronic apparatus |
US7623034B2 (en) * | 2005-04-25 | 2009-11-24 | Avery Dennison Corporation | High-speed RFID circuit placement method and device |
DE102005026127B4 (de) * | 2005-06-07 | 2007-02-08 | Koenig & Bauer Ag | Druckmaschine und ein Verfahren zur Herstellung eines Druckerzeugnisses |
CN101209007A (zh) * | 2005-06-27 | 2008-06-25 | 松下电器产业株式会社 | 贴装条件确定方法 |
JP2007072853A (ja) * | 2005-09-08 | 2007-03-22 | Renesas Technology Corp | 電子装置の製造方法 |
US7569932B2 (en) * | 2005-11-18 | 2009-08-04 | Checkpoint Systems, Inc. | Rotary chip attach |
US7555826B2 (en) | 2005-12-22 | 2009-07-07 | Avery Dennison Corporation | Method of manufacturing RFID devices |
DE102006014437B4 (de) * | 2006-03-27 | 2010-03-11 | Mühlbauer Ag | Verfahren und Vorrichtung zur Herstellung von RFID-Smart-Labels oder Smart-Label-Inlays |
US7828217B2 (en) * | 2006-03-27 | 2010-11-09 | Muhlbauer Ag | Method and device for producing RFID smart labels or smart label inlays |
DE102006028760B3 (de) * | 2006-06-23 | 2007-11-29 | Mühlbauer Ag | Sortiereinrichtung sowie Verfahren zum Sortieren von RFID-Etiketten |
US20080003092A1 (en) * | 2006-06-30 | 2008-01-03 | Petar Baclija | Rotary union connection |
JP4829033B2 (ja) * | 2006-08-09 | 2011-11-30 | 株式会社小森コーポレーション | 情報記録媒体供給装置 |
WO2008044655A1 (fr) * | 2006-10-06 | 2008-04-17 | Hallys Corporation | Unité d'expanseur et équipement pour fabriquer un composant électronique comprenant cette unité d'expanseur |
US7823269B2 (en) * | 2006-10-17 | 2010-11-02 | Tagsys Sas | Method for manufacturing an auxiliary antenna |
JP2009111312A (ja) * | 2007-11-01 | 2009-05-21 | Trinc:Kk | チップマウンター |
JP5234929B2 (ja) * | 2008-06-06 | 2013-07-10 | 株式会社 ハリーズ | 移載装置 |
FR2933681B1 (fr) * | 2008-07-10 | 2011-04-29 | Thomas Cocirta | Dispositif de deplacement et positionnement des containers par chariots independants et re-circulants |
KR101017673B1 (ko) * | 2008-07-18 | 2011-02-25 | 주식회사 에이스테크놀로지 | 헤드셋용 내장형 안테나 |
DE102010008619A1 (de) * | 2009-02-20 | 2010-08-26 | Amb Apparate + Maschinenbau Gmbh | Vorrichtung zum Vereinzeln von scheibenförmigen Elementen |
US8100253B2 (en) * | 2009-06-30 | 2012-01-24 | The Procter & Gamble Company | Methods and apparatuses for transferring discrete articles between carriers |
FR2948012B1 (fr) * | 2009-07-16 | 2011-09-02 | Teknimed | Implant articulaire comprenant au moins deux cavites |
JP5672067B2 (ja) * | 2010-03-09 | 2015-02-18 | 株式会社リコー | 可逆性感熱記録媒体の製造方法及び製造装置、並びに可逆性感熱記録媒体 |
US8701271B2 (en) * | 2010-04-14 | 2014-04-22 | Avery Dennison Corporation | Method of assembly of articles |
TWI402931B (zh) * | 2010-08-16 | 2013-07-21 | Mpi Corp | Grain conveyor |
KR20120096727A (ko) * | 2011-02-23 | 2012-08-31 | 삼성테크윈 주식회사 | 베어 다이를 픽업 및 실장하기 위한 장치 및 방법 |
US10574016B2 (en) * | 2011-03-13 | 2020-02-25 | Norman R BYRNE | Process for forming end product with initial and simultaneous formation of subcomponents from separate work pieces |
US9105760B2 (en) | 2011-11-07 | 2015-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pick-and-place tool for packaging process |
US9061832B2 (en) * | 2011-11-21 | 2015-06-23 | R.A. Jones & Co. | Pouch transfer apparatus and methods |
WO2013083193A1 (en) * | 2011-12-07 | 2013-06-13 | Ismeca Semiconductor Holding Sa | A component handling assembly |
JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
JP2013137285A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
EP2610189B1 (de) * | 2011-12-30 | 2015-06-17 | Krones AG | Vorrichtung und Verfahren zum Transferieren von Behälter-Ausstattungen |
US8720666B2 (en) | 2012-04-16 | 2014-05-13 | The Procter & Gamble Company | Apparatuses for transferring discrete articles |
US8833542B2 (en) | 2012-04-16 | 2014-09-16 | The Procter & Gamble Company | Fluid systems and methods for transferring discrete articles |
US8820513B2 (en) | 2012-04-16 | 2014-09-02 | The Procter & Gamble Company | Methods for transferring discrete articles |
US8607959B2 (en) | 2012-04-16 | 2013-12-17 | The Procter & Gamble Company | Rotational assemblies and methods for transferring discrete articles |
CN103544519B (zh) * | 2012-07-13 | 2016-05-11 | 东莞市锐祥智能卡科技有限公司 | 双界面卡片自动理线与铣槽的方法及其装置 |
WO2014040061A1 (en) * | 2012-09-10 | 2014-03-13 | Ortho Transmission, Llc | Transcutaneous implant for skeletal attachment of external prosthetic devices |
JP2014075531A (ja) * | 2012-10-05 | 2014-04-24 | Samsung Techwin Co Ltd | 部品実装装置 |
CN104736112A (zh) | 2012-10-23 | 2015-06-24 | 宝洁公司 | 用于将离散制品传送到纤维网上的方法 |
TWI474432B (zh) * | 2012-11-15 | 2015-02-21 | Lextar Electronics Corp | 晶粒定位裝置、具有晶粒定位裝置的晶粒定位系統與發光二極體顯示板的晶粒定位方法 |
TR201808597T4 (en) * | 2012-11-23 | 2018-07-23 | Transf Engineering Inc | COMPUTERIZED DIGITAL INSPECTION ASSEMBLY OR PROCESSING COMPONENTS |
CN103182577B (zh) * | 2013-01-21 | 2015-06-03 | 广州市明森机电设备有限公司 | 一种双界面卡的芯片焊接方法及其设备 |
US9181036B2 (en) * | 2013-02-27 | 2015-11-10 | Graham Packaging Company, L.P. | Automatic rotary transfer apparatus and method |
US9763370B2 (en) * | 2013-03-15 | 2017-09-12 | National Technology & Engineering Solutions Of Sandia, Llc | Apparatus for assembly of microelectronic devices |
CN103241403A (zh) * | 2013-05-24 | 2013-08-14 | 无锡市崇安区科技创业服务中心 | 一种led自动编带设备 |
JP5844774B2 (ja) * | 2013-06-06 | 2016-01-20 | アイダエンジニアリング株式会社 | サーボトランスファフィーダ及びサーボトランスファフィーダの制御方法 |
US9463942B2 (en) | 2013-09-24 | 2016-10-11 | The Procter & Gamble Company | Apparatus for positioning an advancing web |
US10589973B2 (en) | 2013-10-25 | 2020-03-17 | Ats Automation Tooling Systems Inc. | Flexible feeding and closing machine for hinged caps |
DE102014104230A1 (de) * | 2014-03-26 | 2015-10-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauteil und Verfahren zur Herstellung eines strahlungsemittierenden Bauteils |
CN104148833B (zh) * | 2014-08-01 | 2015-09-30 | 广州市明森机电设备有限公司 | 一种双界面智能卡芯片焊接方法和焊接设备 |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
US9511951B1 (en) | 2015-06-23 | 2016-12-06 | The Procter & Gamble Company | Methods for transferring discrete articles |
US9511952B1 (en) | 2015-06-23 | 2016-12-06 | The Procter & Gamble Company | Methods for transferring discrete articles |
GB2549250B (en) * | 2016-02-15 | 2021-06-30 | Pragmatic Printing Ltd | Apparatus and method for manufacturing plurality of electronic circuits |
JP6312270B2 (ja) * | 2016-03-25 | 2018-04-18 | 株式会社写真化学 | デバイスチップを用いた電子デバイスの製造方法およびその製造装置 |
DE102016115186A1 (de) * | 2016-08-16 | 2018-02-22 | Osram Opto Semiconductors Gmbh | Verfahren zum Montieren von Halbleiterchips und Vorrichtung zum Übertragen von Halbleiterchips |
CN107887295B (zh) * | 2016-09-30 | 2019-07-23 | 上海微电子装备(集团)股份有限公司 | 一种芯片键合装置及键合方法 |
US10141215B2 (en) | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
US10471545B2 (en) | 2016-11-23 | 2019-11-12 | Rohinni, LLC | Top-side laser for direct transfer of semiconductor devices |
CN106783717A (zh) * | 2016-12-23 | 2017-05-31 | 合肥矽迈微电子科技有限公司 | 芯片倒装贴片设备及方法 |
US10062588B2 (en) | 2017-01-18 | 2018-08-28 | Rohinni, LLC | Flexible support substrate for transfer of semiconductor devices |
GB2563600B (en) | 2017-06-19 | 2022-05-11 | Pragmatic Printing Ltd | Apparatus and method for manufacturing plurality of electronic circuits |
DE102017124582A1 (de) * | 2017-10-20 | 2019-04-25 | Asm Assembly Systems Gmbh & Co. Kg | Ergänzungswerkzeug für Chip-Transfervorrichtung mit Entnahmewerkzeug und Wendewerkzeug |
CN108323150A (zh) * | 2017-12-29 | 2018-07-24 | 重庆市中光电显示技术有限公司 | Fpc供料机 |
TWI646618B (zh) | 2018-01-09 | 2019-01-01 | 宏碁股份有限公司 | 微元件轉移設備和相關方法 |
CN108454998B (zh) * | 2018-03-20 | 2023-06-23 | 湖州市湖芯物联网科技有限公司 | 一种rfid标签连续式生产系统及工艺 |
US10410905B1 (en) | 2018-05-12 | 2019-09-10 | Rohinni, LLC | Method and apparatus for direct transfer of multiple semiconductor devices |
US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
IT201800009341A1 (it) * | 2018-10-11 | 2020-04-11 | Kern Italia Srl | Macchina applicatrice di tessere su supporti cartacei e simili. |
DE102018009475A1 (de) * | 2018-12-03 | 2020-06-04 | Giesecke+Devrient Currency Technology Gmbh | Aufbringung und Befestigung von Einzelelementen auf einer Substratbahn |
TWI686895B (zh) * | 2019-04-19 | 2020-03-01 | 台灣愛司帝科技股份有限公司 | 晶片移轉機台 |
CN110012657A (zh) * | 2019-05-15 | 2019-07-12 | 深圳市兴华炜科技有限公司 | 高速贴片的转移方法及相关产品 |
CN111115244B (zh) * | 2020-01-13 | 2021-08-27 | 山东大学 | 一种自动抓取传送带上样品的装置及其方法 |
DE102020001439B3 (de) * | 2020-02-21 | 2021-06-10 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
CN111313039B (zh) * | 2020-03-30 | 2024-06-04 | 江苏氢导智能装备有限公司 | 贴合设备 |
AR118939A1 (es) * | 2020-05-15 | 2021-11-10 | Marisa Rosana Lattanzi | Máquina combinada para elaborar separadores laminares de productos que se contienen en cajas y cajones |
US20220059406A1 (en) * | 2020-08-21 | 2022-02-24 | Advanced Semiconductor Engineering, Inc. | Method for manufacturing semiconductor package |
CN113369874B (zh) * | 2021-07-23 | 2023-04-21 | 明基生物技术(上海)有限公司 | 一种透析器装盖机 |
CN114194452B (zh) * | 2022-02-17 | 2022-04-26 | 四川永星电子有限公司 | 一种射频片式负载带s参数的自动检测机构 |
CN116117475B (zh) * | 2023-01-31 | 2024-01-23 | 东台市凯润精密机械股份有限公司 | 一种云服务器机柜构件压铆移动输送装置 |
CN116631929B (zh) * | 2023-07-24 | 2024-01-05 | 广东工业大学 | 一种基于摆臂固晶机的芯片转移方法、系统、设备和介质 |
Family Cites Families (116)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3946961A (en) | 1970-03-25 | 1976-03-30 | Steiner American Corporation | Automatic towel winding machine |
US3946931A (en) * | 1974-11-27 | 1976-03-30 | Western Electric Company, Inc. | Methods of and apparatus for bonding an article to a substrate |
IT1188972B (it) * | 1980-12-12 | 1988-01-28 | Gd Spa | Dispositivo di trasferimento per articoli a forma di barretta |
IT1159182B (it) * | 1982-06-23 | 1987-02-25 | Sasib Spa | Dispositivo trasferitore sequenzia le autocompensato in veloicita per convertire in rango trasversale una fila assialmente corrente di oggetti astiformi |
US4548668A (en) * | 1983-01-10 | 1985-10-22 | Continental Can Company, Inc. | Combination machine for assembling container components |
CA1217572A (en) | 1983-05-02 | 1987-02-03 | Kenichi Saito | Mounting apparatus for chip type electronic parts |
US4558397A (en) | 1983-12-19 | 1985-12-10 | Amp Incorporated | Interposer connector for surface mounting a ceramic chip carrier to a printed circuit board |
US4915565A (en) | 1984-03-22 | 1990-04-10 | Sgs-Thomson Microelectronics, Inc. | Manipulation and handling of integrated circuit dice |
US4656478A (en) | 1984-07-30 | 1987-04-07 | Asulab S.A. | Passive transponder for locating avalanche victims |
US4767487A (en) * | 1985-10-18 | 1988-08-30 | Kimberly-Clark Corporation | Method for repositioning discrete articles |
SE462333B (sv) * | 1987-01-23 | 1990-06-11 | Moelnlycke Ab | Anordning foer att oeverfoera artiklar fraan en foersta till en andra transportbana |
US4746618A (en) | 1987-08-31 | 1988-05-24 | Energy Conversion Devices, Inc. | Method of continuously forming an array of photovoltaic cells electrically connected in series |
JPH07109957B2 (ja) * | 1988-06-21 | 1995-11-22 | 松下電器産業株式会社 | 電子部品装着方法 |
JPH0821790B2 (ja) * | 1990-02-15 | 1996-03-04 | 松下電器産業株式会社 | ロータリーヘッド式電子部品実装装置 |
US5078375A (en) | 1990-12-06 | 1992-01-07 | Tamarack Products, Inc. | Method of superposing webs |
DE4117296C2 (de) | 1991-05-27 | 2002-11-21 | Winkler & Duennebier Ag | Vorrichtung zum Überführen von Gegenständen |
TW199259B (ko) * | 1991-09-26 | 1993-02-01 | Nippon Tobacco Sangyo Kk | |
JPH0590790A (ja) * | 1991-09-26 | 1993-04-09 | Japan Tobacco Inc | ワーク実装機 |
US5311763A (en) * | 1992-02-27 | 1994-05-17 | Conner Peripherals, Inc. | Method and apparatus for measuring bearing friction |
US5235736A (en) | 1992-06-15 | 1993-08-17 | Motorola, Inc. | Self-fixturing method for assembling an antenna/receiver combination |
GB9219657D0 (en) | 1992-09-17 | 1992-10-28 | Unilever Plc | Tagged articles |
US5660787A (en) | 1992-10-09 | 1997-08-26 | Illinois Tool Works Inc. | Method for producing oriented plastic strap |
US5479694A (en) | 1993-04-13 | 1996-01-02 | Micron Technology, Inc. | Method for mounting integrated circuits onto printed circuit boards and testing |
US5564888A (en) | 1993-09-27 | 1996-10-15 | Doan; Carl V. | Pick and place machine |
DE4336501A1 (de) | 1993-10-26 | 1995-04-27 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten mit elektronischen Modulen |
FR2716555B1 (fr) | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5751256A (en) | 1994-03-04 | 1998-05-12 | Flexcon Company Inc. | Resonant tag labels and method of making same |
DE4408537A1 (de) * | 1994-03-14 | 1995-09-21 | Leybold Ag | Vorrichtung für den Transport von Substraten |
US5528222A (en) | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US5682143A (en) | 1994-09-09 | 1997-10-28 | International Business Machines Corporation | Radio frequency identification tag |
US6496382B1 (en) | 1995-05-19 | 2002-12-17 | Kasten Chase Applied Research Limited | Radio frequency identification tag |
JP2708016B2 (ja) * | 1995-06-14 | 1998-02-04 | 松下電器産業株式会社 | 電子部品自動実装装置 |
US6252508B1 (en) | 1995-10-11 | 2001-06-26 | Motorola, Inc. | Radio frequency identification tag arranged for magnetically storing tag state information |
CA2171526C (en) | 1995-10-13 | 1997-11-18 | Glen E. Mavity | Combination article security target and printed label and method and apparatus for making and applying same |
DE19540148C1 (de) | 1995-10-27 | 1997-04-24 | Windmoeller & Hoelscher | Vorrichtung zum Abtrennen von Zetteln von einer kontinuierlich geförderten Zettelbahn |
JPH09130084A (ja) * | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
US5700536A (en) | 1996-02-07 | 1997-12-23 | Tamarack Products, Inc. | Integrated label, method and apparatus |
KR100485002B1 (ko) * | 1996-02-16 | 2005-08-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 작업물폴리싱장치및방법 |
US6145901A (en) | 1996-03-11 | 2000-11-14 | Rich; Donald S. | Pick and place head construction |
US6215401B1 (en) | 1996-03-25 | 2001-04-10 | Intermec Ip Corp. | Non-laminated coating for radio frequency transponder (RF tag) |
US5826328A (en) | 1996-03-25 | 1998-10-27 | International Business Machines | Method of making a thin radio frequency transponder |
AU2546597A (en) | 1996-04-10 | 1997-10-29 | Sentry Technology Corporation | Electronic article surveillance system |
US6350342B1 (en) | 1996-09-09 | 2002-02-26 | Tamarack Products Inc. | Method of making integrated label products |
JPH10224099A (ja) | 1997-02-04 | 1998-08-21 | Fuji Mach Mfg Co Ltd | 回路部品装着方法および回路部品装着システム |
US5972152A (en) | 1997-05-16 | 1999-10-26 | Micron Communications, Inc. | Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier |
JP3646472B2 (ja) | 1997-05-19 | 2005-05-11 | 株式会社日立製作所 | 非接触型icカードおよび送受信回路 |
US6081243A (en) | 1997-09-09 | 2000-06-27 | Micron Technology, Inc. | Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices |
WO1999013444A1 (en) | 1997-09-11 | 1999-03-18 | Precision Dynamics Corporation | Laminated radio frequency identification device |
US6164551A (en) | 1997-10-29 | 2000-12-26 | Meto International Gmbh | Radio frequency identification transponder having non-encapsulated IC chip |
US6290507B1 (en) | 1997-10-30 | 2001-09-18 | Intercon Systems, Inc. | Interposer assembly |
JP3339390B2 (ja) | 1997-11-12 | 2002-10-28 | 株式会社村田製作所 | 電子部品の搬送装置 |
US6019865A (en) | 1998-01-21 | 2000-02-01 | Moore U.S.A. Inc. | Method of forming labels containing transponders |
US6094138A (en) | 1998-02-27 | 2000-07-25 | Motorola, Inc. | Integrated circuit assembly and method of assembly |
FR2775810B1 (fr) | 1998-03-09 | 2000-04-28 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
JP3625646B2 (ja) | 1998-03-23 | 2005-03-02 | 東レエンジニアリング株式会社 | フリップチップ実装方法 |
US6299456B1 (en) | 1998-04-10 | 2001-10-09 | Micron Technology, Inc. | Interposer with contact structures for electrical testing |
US6501157B1 (en) | 1998-04-15 | 2002-12-31 | Micron Technology, Inc. | Substrate for accepting wire bonded or flip-chip components |
US5966903A (en) | 1998-05-27 | 1999-10-19 | Lucent Technologies Inc. | High speed flip-chip dispensing |
US6018299A (en) | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
US6107920A (en) | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6091332A (en) | 1998-06-09 | 2000-07-18 | Motorola, Inc. | Radio frequency identification tag having printed circuit interconnections |
US6246327B1 (en) | 1998-06-09 | 2001-06-12 | Motorola, Inc. | Radio frequency identification tag circuit chip having printed interconnection pads |
US6525410B1 (en) | 1998-07-24 | 2003-02-25 | Texas Instruments Incorporated | Integrated circuit wireless tagging |
DE19840210A1 (de) | 1998-09-03 | 2000-03-09 | Fraunhofer Ges Forschung | Verfahren zur Handhabung einer Mehrzahl von Schaltungschips |
US6147605A (en) | 1998-09-11 | 2000-11-14 | Motorola, Inc. | Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag |
US6189208B1 (en) | 1998-09-11 | 2001-02-20 | Polymer Flip Chip Corp. | Flip chip mounting technique |
DE69938929D1 (de) | 1998-09-11 | 2008-07-31 | Motorola Inc | Rfid-etikettenvorrichtung und verfahren |
US6100804A (en) | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
US6262692B1 (en) | 1999-01-13 | 2001-07-17 | Brady Worldwide, Inc. | Laminate RFID label and method of manufacture |
TW490564B (en) | 1999-02-01 | 2002-06-11 | Mirae Corp | A carrier handling apparatus for module IC handler, and method thereof |
ATE300748T1 (de) | 1999-02-09 | 2005-08-15 | Magnus Granhed | Eingekapselte antenne in passivem transponder |
US6410415B1 (en) | 1999-03-23 | 2002-06-25 | Polymer Flip Chip Corporation | Flip chip mounting technique |
US6891110B1 (en) | 1999-03-24 | 2005-05-10 | Motorola, Inc. | Circuit chip connector and method of connecting a circuit chip |
JP4255162B2 (ja) * | 1999-04-01 | 2009-04-15 | 富士機械製造株式会社 | 電気部品の装着方法および電気部品装着システム |
US6280544B1 (en) | 1999-04-21 | 2001-08-28 | Intermec Ip Corp. | RF tag application system |
FR2793054B1 (fr) | 1999-04-29 | 2001-06-29 | Schlumberger Systems & Service | Procede de fabrication de cartes sans contact par laminage et carte sans contact fabriquee selon un tel procede |
FR2795201B1 (fr) | 1999-06-15 | 2001-08-31 | Gemplus Card Int | Dispositif et procede de fabrication de dispositifs electroniques comportant au moins une puce fixee sur un support |
JP3928682B2 (ja) | 1999-06-22 | 2007-06-13 | オムロン株式会社 | 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置 |
US6140146A (en) | 1999-08-03 | 2000-10-31 | Intermec Ip Corp. | Automated RFID transponder manufacturing on flexible tape substrates |
US6492717B1 (en) | 1999-08-03 | 2002-12-10 | Motorola, Inc. | Smart card module and method of assembling the same |
US6243014B1 (en) | 1999-08-27 | 2001-06-05 | Micron Technology, Inc. | Electrical apparatuses, termite sensing apparatuses, and methods of forming electrical apparatuses |
US6313748B1 (en) | 1999-08-27 | 2001-11-06 | Micron Technology, Inc. | Electrical apparatuses, termite sensing apparatuses, methods of forming electrical apparatuses, and methods of sensing termites |
DE60024375T2 (de) * | 1999-09-03 | 2006-06-14 | Matsushita Electric Ind Co Ltd | Bauteilen-bestückungsverfahren und Einrichtung |
US6147662A (en) | 1999-09-10 | 2000-11-14 | Moore North America, Inc. | Radio frequency identification tags and labels |
US6394346B1 (en) | 1999-10-07 | 2002-05-28 | Cubic Corporation | Contactless smart card high production encoding machine |
US6259408B1 (en) | 1999-11-19 | 2001-07-10 | Intermec Ip Corp. | RFID transponders with paste antennas and flip-chip attachment |
FR2801707B1 (fr) | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
CN1178828C (zh) * | 1999-12-16 | 2004-12-08 | 株式会社瑞光 | 传送方法和传送设备 |
US6320556B1 (en) | 2000-01-19 | 2001-11-20 | Moore North America, Inc. | RFID foil or film antennas |
US6634091B1 (en) | 2000-02-15 | 2003-10-21 | Samsung Techwin Co., Ltd. | Part mounter |
US20010046126A1 (en) | 2000-02-18 | 2001-11-29 | Colello Gary M. | Flip-chip RF-ID tag |
US6451154B1 (en) | 2000-02-18 | 2002-09-17 | Moore North America, Inc. | RFID manufacturing concepts |
WO2001062517A1 (fr) | 2000-02-22 | 2001-08-30 | Toray Engineering Company,Limited | Carte d'identification sans contact ou analogue et procede de fabrication correspondant |
JP3830125B2 (ja) | 2000-03-14 | 2006-10-04 | 株式会社東芝 | 半導体装置の製造方法及び半導体装置 |
TW569424B (en) | 2000-03-17 | 2004-01-01 | Matsushita Electric Ind Co Ltd | Module with embedded electric elements and the manufacturing method thereof |
DE10017431C2 (de) | 2000-04-07 | 2002-05-23 | Melzer Maschinenbau Gmbh | Verfahren und Vorrichtung zum Herstellen von Datenträgern mit integriertem Transponder |
US6369711B1 (en) | 2000-06-09 | 2002-04-09 | Intermec Ip Corp | Profile corrected label with RFID transponder and method for making same |
US6384727B1 (en) | 2000-08-02 | 2002-05-07 | Motorola, Inc. | Capacitively powered radio frequency identification device |
WO2002013135A2 (en) | 2000-08-04 | 2002-02-14 | Hei, Inc. | Structures and assembly methods for radio-frequency-identification modules |
US6424263B1 (en) | 2000-12-01 | 2002-07-23 | Microchip Technology Incorporated | Radio frequency identification tag on a single layer substrate |
DE10063313A1 (de) * | 2000-12-19 | 2002-06-27 | Atlantic Zeiser Gmbh | Verfahren zum Bearbeiten, insbesondere Lesen, Programmieren od.dgl., kartenförmiger Informationsträger |
KR100392229B1 (ko) * | 2001-01-09 | 2003-07-22 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 인덱스헤드 |
US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
US7057511B2 (en) | 2001-02-12 | 2006-06-06 | Symbol Technologies, Inc. | Method, system, and apparatus for communicating with a RFID tag population |
DE10120269C1 (de) | 2001-04-25 | 2002-07-25 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders |
FI112550B (fi) | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
FR2826154B1 (fr) | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
DE10136359C2 (de) * | 2001-07-26 | 2003-06-12 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders |
US20030036249A1 (en) | 2001-08-06 | 2003-02-20 | Bauer Donald G. | Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices |
US6549176B2 (en) | 2001-08-15 | 2003-04-15 | Moore North America, Inc. | RFID tag having integral electrical bridge and method of assembling the same |
DE10141703A1 (de) * | 2001-08-25 | 2003-03-06 | Hauni Maschinenbau Ag | Übertragungsvorrichtung und Verfahren zum Übertragen von Artikeln der tabakverarbeitenden Industrie |
GB2379335B (en) | 2001-08-29 | 2005-09-07 | Sunonwealth Electr Mach Ind Co | Supporting structure for a rotor |
US20040088855A1 (en) * | 2002-11-11 | 2004-05-13 | Salman Akram | Interposers for chip-scale packages, chip-scale packages including the interposers, test apparatus for effecting wafer-level testing of the chip-scale packages, and methods |
US7242996B2 (en) * | 2003-03-25 | 2007-07-10 | Id Solutions, Inc. | Attachment of RFID modules to antennas |
JP4403789B2 (ja) * | 2003-05-27 | 2010-01-27 | トヨタ自動車株式会社 | 多段変速機 |
US7061769B1 (en) | 2005-03-11 | 2006-06-13 | Jung-Che Chang | USB/OTG-interface storage card |
-
2003
- 2003-02-07 JP JP2003031165A patent/JP3739752B2/ja not_active Expired - Fee Related
- 2003-10-02 US US10/677,180 patent/US7278203B2/en active Active
-
2004
- 2004-02-05 CN CNB2004800036830A patent/CN100349256C/zh not_active Expired - Lifetime
- 2004-02-05 KR KR1020057014451A patent/KR100849934B1/ko active IP Right Grant
- 2004-02-05 DE DE602004010071T patent/DE602004010071T2/de not_active Expired - Lifetime
- 2004-02-05 WO PCT/JP2004/001231 patent/WO2004070797A1/en active IP Right Grant
- 2004-02-05 EP EP04708503A patent/EP1595278B1/en not_active Expired - Lifetime
- 2004-02-05 TW TW093102693A patent/TWI322647B/zh not_active IP Right Cessation
-
2007
- 2007-09-04 US US11/849,806 patent/US7643904B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20050100659A (ko) | 2005-10-19 |
EP1595278A1 (en) | 2005-11-16 |
TWI322647B (en) | 2010-03-21 |
CN100349256C (zh) | 2007-11-14 |
US20040154161A1 (en) | 2004-08-12 |
WO2004070797A1 (en) | 2004-08-19 |
DE602004010071T2 (de) | 2008-09-11 |
US20080005895A1 (en) | 2008-01-10 |
JP2004265920A (ja) | 2004-09-24 |
CN1748286A (zh) | 2006-03-15 |
EP1595278B1 (en) | 2007-11-14 |
DE602004010071D1 (de) | 2007-12-27 |
TW200421951A (en) | 2004-10-16 |
US7643904B2 (en) | 2010-01-05 |
JP3739752B2 (ja) | 2006-01-25 |
US7278203B2 (en) | 2007-10-09 |
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