JP3625646B2 - フリップチップ実装方法 - Google Patents

フリップチップ実装方法 Download PDF

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Publication number
JP3625646B2
JP3625646B2 JP09546398A JP9546398A JP3625646B2 JP 3625646 B2 JP3625646 B2 JP 3625646B2 JP 09546398 A JP09546398 A JP 09546398A JP 9546398 A JP9546398 A JP 9546398A JP 3625646 B2 JP3625646 B2 JP 3625646B2
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Japan
Prior art keywords
circuit board
adhesive film
insulating adhesive
chip
mounting method
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Expired - Fee Related
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JP09546398A
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English (en)
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JPH11274224A (ja
Inventor
▲鉱▼司 伊藤
雅典 秋田
俊裕 森
リチャード・エイチ・エステス
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Priority to JP09546398A priority Critical patent/JP3625646B2/ja
Priority to PCT/US1999/006348 priority patent/WO1999049507A1/en
Priority to US09/274,748 priority patent/US6219911B1/en
Publication of JPH11274224A publication Critical patent/JPH11274224A/ja
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Publication of JP3625646B2 publication Critical patent/JP3625646B2/ja
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    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、フリップチップ実装方法、更に詳しくは、絶縁性接着剤フィルムを用いるフリップチップ実装方法に関するものである。
【０００２】
【従来の技術】
従来、フリップチップ実装に関し、各種の方法が公知であるが、その代表例として、絶縁性接着剤フィルムを用いるフリップチップ実装方法が挙げられる。
【０００３】
なお、この実装方法は、他のフリップチップ実装方法に比して、ＩＣチップを回路基板に接合すると同時に、その接合箇所を樹脂封止（アンダーフィル）することができて実装工程の簡略化を図ることができる等の特長を有している。
【０００４】
その為、近時、この実装方法が注目されつつあるが、特開平９−９７８１５号公報においては、その段落［００１８］及び［００２０］の記載等により、ＩＣチップのＡｕバンプを回路基板の電極に直接、接合する実装方法（以下、直接実装という。）が開示されていると共に、その段落［００１４］の記載等により、ＩＣチップのＡｕバンプを回路基板の電極に間接的に接合する実装方法（以下、間接実装という。）が開示されている。
【０００５】
【発明が解決しようとする課題】
しかし、間接実装は、ＩＣチップと回路基板との電気的接合を、両者間に配されている絶縁性接着剤フィルムのスルホールに充填の導電性接着剤層を介して行うものであるから、そのような導電性接着剤層を介在させないで、絶縁性接着剤フィルムに穿設されているスルホールにＩＣチップのＡｕバンプを挿入せしめて回路基板の電極に接触させて接合する直接実装よりも信頼性が低下し導電不良等が発生し易い等の欠点を有している。
【０００６】
その為、直接実装の方が重視されつつあるが、これにおいても、ＩＣチップのＡｕバンプを挿入する為の微小のスルホールを多数穿設した絶縁性接着剤フィルムを用いているので、それの加工が煩わしく汎用性が不十分で実用に供することが困難であった。
【０００７】
本発明は、このような欠点に鑑みて発明されたものであって、ＩＣチップのバンプを、ボールボンディング法により形成される半田バンプやメッキ法により形成されるＡｕバンプ等の従来のバンプに代えて、導電ペーストからなるポリマーバンプに設けることにより、絶縁性接着剤フィルムを突き破って良好に接合することができることを見い出し、それに基づいて本発明を完成したものである。
【０００８】
【課題を解決するための手段】
すなわち、本発明に係るフリップチップ実装方法は、ＩＣチップのバンプを回路基板の電極に直接、接合せしめるに際し、前記ＩＣチップと前記回路基板間に絶縁性接着剤フィルムを介在せしめるフリップチップ実装方法において、前記ＩＣチップのバンプを銀粒子を含有する熱硬化性エポキシ樹脂ペーストからなる導電ペーストをスクリーン印刷し硬化させて前記銀粒子をバンプ表面に析出させた微細な凹凸面を形成したポリマーバンプに構成し、かつ、前記絶縁性接着剤フィルムを予備加熱ツールを用いて前記回路基板に押し付けながら加熱して該回路基板の電極に密着させた後、前記ポリマーバンプで前記絶縁性接着剤フィルムを突き破って該ポリマーバンプを前記電極に接合せしめ、該接合時に前記ポリマーバンプを前記電極に対する接触面積を広げるように変形させて該電極に前記熱硬化性エポキシ樹脂により接着させることを特徴とすることを特徴とするものである。
【０００９】
なお、ポリマーバンプは、スクリーン印刷により形成するのが好ましい。また、接合に先立って、絶縁性接着剤フィルムを回路基板に押し付けながら加熱して回路基板の電極に密着せしめ、その後において接合するのが好ましい。また、回路基板を吸気ステージで吸引保持するのが好ましく、かつ、回路基板は、吸気ステージとの組み合わせにおいては、樹脂フィルム基板が好ましい。また、絶縁性接着剤フィルムは、熱硬化性のものが好ましい。
【００１０】
【発明の実施の形態】
本発明においては、図１において示されているように、ＩＣチップ１のポリマーバンプ２を、回路基板３の電極４に直接、接合（ボンディング）せしめるが、その際、ＩＣチップ１と回路基板３との間に絶縁性接着剤フィルム５を介在させて行う。なお、ＩＣチップ１のポリマーバンプ２は、ＩＣチップ１の電極パッド６上に導電ペーストをスクリーン印刷して形成され、かつ、かかるスクリーン印刷の版材としてはメタルマスクが好適である。
【００１１】
また、導電ペーストは、導電粒子（例えば、銀粒子等）を含有した熱硬化性樹脂ペースト（例えば、エポキシ樹脂ペースト等）を用いることができ、そして、絶縁性接着剤フィルム５は、熱硬化性、熱可塑性、又は、それらの混合物のいずれであってもよいが、好ましくは、熱硬化性のものが用いられる。なお、このフィルム５の形態は、単体フィルムは勿論のこと、ラミネートフィルムであってもよい。
【００１２】
一方、回路基板３は、樹脂フィルム基板が好適であるが、他の基板であってもよく、これを吸気ステージ７で吸引保持するのが好ましい。また、回路基板３を吸気ステージ７で吸引保持した状態において、回路基板３上に絶縁性接着剤フィルム５をセットし、次いで、それを回路基板３に押し付けながら加熱して回路基板３の電極４に密着せしめてから接合するのが好ましい。
【００１３】
なお、回路基板３に絶縁性接着剤フィルム５を押し付けながら加熱（例えば、８０℃に加熱）することは、予備加熱ツールを用いて行われ、その後、ボンデイングツール８で接合を行う。ボンデイングツール８は、ＸＹＺの三軸方向に移動し得ると共に所定角度に回転し得るように装着されており、しかも、ヒータを内蔵（図示されていない）していると共にＩＣチップ１を真空吸引保持することができるように設けられている。
【００１４】
その為、下方の回路基板３の電極４に対してＩＣチップ１のポリマーバンプ２を精密に位置決めさせて加熱圧着、すなわち、接合（ボンディング）することができるが、その際、ＩＣチップ１のポリマーバンプ２で絶縁性接着剤フィルム５を突き破って良好に接合することができる。なお、接合時の加熱温度及び圧力は所定に制御される。
【００１５】
このように、本発明においては、ＩＣチップ１のバンプを、導電ペーストからなるポリマーバンプ２で構成しているが、このポリマーバンプ２は、ボールボンディング法により形成される半田バンプやメッキ法により形成されるＡｕバンプ等の他のバンプとの比較において、絶縁性接着剤フィルム５を突き破ることができる点においては、格別な差異が無いとしても、接合時において回路基板３の電極４との接触面積を広げ得る状態に変形できるといった特性を有している点で著しく異なり、加えて、バンプ表面が接合に適した状態で銀鱗粒子が表面に析出して微細な凹凸面を形成しているといった特性を有していると共に、接合時において樹脂が接着剤の役割をするといった特性を有している点においても著しく異なっている。
【００１６】
その為、絶縁性接着剤フィルム５に、ＩＣチップ１のポリマーバンプ２を挿入する為の微小のスルホールを穿設しなくても、それを突き破って接合することができるから、絶縁性接着剤フィルム５の準備が容易になって汎用性を一段と向上させることができる。また、その際、信頼性が十分な状態に強固に接合することができる。
【００１７】
【実施例】
銀粒子を６０％〜８０％を含有した熱硬化性エポキシ樹脂からなる導電ペーストを用い、スクリーン印刷法によりＩＣチップの電極パッド上にペーストバンプを形成した。なお、電極パッドには、あらかじめ無電解メッキ法によりアルミニウムの上にＮｉ／Ａｕの金属膜を形成した。また、かかる印刷には、マスク厚さ５０μ、マスク穴径９５μのメタルマスクを用いた。
【００１８】
そして、印刷したウエハは、１５０℃のオーブン中で約１時間加熱してバンプを硬化させて底部平均径が１５０μ、平均高さが４０μのバンプが形成されたウエハを得た。バンプは頂上に２０μ程度の比較的平坦な部分があるが、全体として円錐形状をしていた。ウエハをダイシングソーで切断して個々のチップを作成した。チップ１個当りバンプ数は４８個であった。
【００１９】
一方、厚さ１８μの銅箔が張り付けられたポリエステル基材を用いてエッチング法により銅配線パターンを形成し、そして、無電解メッキ法により銅配線上にＮｉ／Ａｕの金属層を形成した。
【００２０】
次いで、熱硬化性エポキシ樹脂からなり、半硬化してフィルム状に形成されたフィルムをＩＣチップより多少大きめの大きさに切り出し、加熱ツールを用いてＣＯＦ基板のボンデイング所定位置に８０℃に加熱して張り付けた。
【００２１】
次いで、ＣＯＦ基板のアライメントマークとＩＣチップのアライメント用のパターンとを上下２眼の顕微鏡を使用して位置合わせし、２４０℃に加熱したボンデイングツールを用い２．５Ｋｇの力をかけてＩＣチップをＣＯＦ基板に押し付けた。２０秒経過後、ボンデイングツールをエアーで５秒冷却した後、ツールを上昇してボンデイングを終了した。
【００２２】
次いで、ボンデイングを終了したＩＣチップのバンプ先端部を観察したところ、バンブ高さ方向に約１／３変形して低くなり、バンプ先端の平坦部が約４０μの径に拡大した。なお、上記回路基板の配線導体パターンの所定位置にＩＣチップが強固に接合されており、かつ、バンプ近傍のフィルム接着剤層には気泡の混在が認められなかった。
【００２３】
【発明の効果】
上述のように、請求項１〜６に記載の発明によると、スルホールを穿設していない絶縁性接着剤フイルムを用いてＩＣチップのバンプを回路基板の電極に直接、接合せしめることができるから、絶縁性接着剤フイルムの準備が容易になって汎用性を一段と向上させることができ、しかも、信頼性が十分な状態に強固に接合することができる。
【図面の簡単な説明】
【図１】絶縁性接着剤フイルムを用いるフリップチップ実装を示す図である。
【符号の説明】
１ ＩＣチップ
２ ポリマーバンプ
３ 回路基板
４ 電極
５ 絶縁性接着フイルム
７ 吸気ステージ
８ ボンデイングツール

Claims (4)

  1. ＩＣチップのバンプを回路基板の電極に直接、接合せしめるに際し、前記ＩＣチップと前記回路基板間に絶縁性接着剤フィルムを介在せしめるフリップチップ実装方法において、前記ＩＣチップのバンプを銀粒子を含有する熱硬化性エポキシ樹脂ペーストからなる導電ペーストをスクリーン印刷し硬化させて前記銀粒子をバンプ表面に析出させた微細な凹凸面を形成したポリマーバンプに構成し、かつ、前記絶縁性接着剤フィルムを予備加熱ツールを用いて前記回路基板に押し付けながら加熱して該回路基板の電極に密着させた後、前記ポリマーバンプで前記絶縁性接着剤フィルムを突き破って該ポリマーバンプを前記電極に接合せしめ、該接合時に前記ポリマーバンプを前記電極に対する接触面積を広げるように変形させて該電極に前記熱硬化性エポキシ樹脂により接着させることを特徴とするフリップチップ実装方法。
  2. 回路基板を吸気ステージで吸引保持することを特徴とする請求項１に記載のフリップチップ実装方法。
  3. 回路基板が樹脂フィルム基板であることを特徴とする請求項１，２又は３に記載のフリップチップ実装方法。
  4. 絶縁性接着剤フィルムが熱硬化性のものであることを特徴とする請求項１，２又は３に記載のフリップチップ実装方法。
JP09546398A 1998-03-23 1998-03-23 フリップチップ実装方法 Expired - Fee Related JP3625646B2 (ja)

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JP09546398A JP3625646B2 (ja) 1998-03-23 1998-03-23 フリップチップ実装方法
PCT/US1999/006348 WO1999049507A1 (en) 1998-03-23 1999-03-17 Flip chip mounting technique
US09/274,748 US6219911B1 (en) 1998-03-23 1999-03-23 Flip chip mounting technique

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