DE69622412T2 - Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats - Google Patents

Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats

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Publication number
DE69622412T2
DE69622412T2 DE69622412T DE69622412T DE69622412T2 DE 69622412 T2 DE69622412 T2 DE 69622412T2 DE 69622412 T DE69622412 T DE 69622412T DE 69622412 T DE69622412 T DE 69622412T DE 69622412 T2 DE69622412 T2 DE 69622412T2
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DE
Germany
Prior art keywords
producing
adhesive connection
electronic arrangement
complete substrate
complete
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69622412T
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English (en)
Other versions
DE69622412D1 (de
Inventor
B Hogerton
E Carlson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
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Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE69622412D1 publication Critical patent/DE69622412D1/de
Publication of DE69622412T2 publication Critical patent/DE69622412T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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DE69622412T 1995-08-29 1996-08-01 Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats Expired - Fee Related DE69622412T2 (de)

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PCT/US1996/012606 WO1997008749A1 (en) 1995-08-29 1996-08-01 Deformable substrate assembly for adhesively bonded electronic device

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JPH1041694A (ja) * 1996-07-25 1998-02-13 Sharp Corp 半導体素子の基板実装構造及びその実装方法
JP3928753B2 (ja) 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
AU4810197A (en) * 1996-10-08 1998-05-05 Fibercote Industries, Inc. Sheet material for core support
JPH10270496A (ja) 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
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US5714252A (en) 1998-02-03
EP0847594A1 (de) 1998-06-17
CN1194059A (zh) 1998-09-23
EP0847594B1 (de) 2002-07-17
WO1997008749A1 (en) 1997-03-06
JPH11510649A (ja) 1999-09-14
TW349269B (en) 1999-01-01
KR19990044151A (ko) 1999-06-25
DE69622412D1 (de) 2002-08-22

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