KR100549475B1 - 반도체 집적 회로 장치 및 반도체 집적 회로 장치의 제조방법 - Google Patents
반도체 집적 회로 장치 및 반도체 집적 회로 장치의 제조방법 Download PDFInfo
- Publication number
- KR100549475B1 KR100549475B1 KR1020010010113A KR20010010113A KR100549475B1 KR 100549475 B1 KR100549475 B1 KR 100549475B1 KR 1020010010113 A KR1020010010113 A KR 1020010010113A KR 20010010113 A KR20010010113 A KR 20010010113A KR 100549475 B1 KR100549475 B1 KR 100549475B1
- Authority
- KR
- South Korea
- Prior art keywords
- gate electrode
- field effect
- insulating film
- effect transistor
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0416—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/18—Bit line organisation; Bit line lay-out
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/6891—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-052436 | 2000-02-28 | ||
| JP2000052436A JP4068781B2 (ja) | 2000-02-28 | 2000-02-28 | 半導体集積回路装置および半導体集積回路装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010085679A KR20010085679A (ko) | 2001-09-07 |
| KR100549475B1 true KR100549475B1 (ko) | 2006-02-08 |
Family
ID=18573949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020010010113A Expired - Fee Related KR100549475B1 (ko) | 2000-02-28 | 2001-02-27 | 반도체 집적 회로 장치 및 반도체 집적 회로 장치의 제조방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6420754B2 (https=) |
| JP (1) | JP4068781B2 (https=) |
| KR (1) | KR100549475B1 (https=) |
| TW (1) | TW473988B (https=) |
Families Citing this family (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1174229A (ja) * | 1997-08-29 | 1999-03-16 | Toshiba Microelectron Corp | 半導体装置 |
| JP2002015565A (ja) * | 2000-06-29 | 2002-01-18 | Mitsubishi Electric Corp | 半導体記憶装置 |
| US8421143B2 (en) | 2000-09-26 | 2013-04-16 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device having element isolating region of trench type |
| JP2002176114A (ja) * | 2000-09-26 | 2002-06-21 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2003031701A (ja) * | 2001-07-13 | 2003-01-31 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置およびその製造方法 |
| US20030030123A1 (en) * | 2001-08-10 | 2003-02-13 | Masayuki Ichige | Semiconductor memory device equipped with memory transistor and peripheral transistor and method of manufacturing the same |
| US6894341B2 (en) * | 2001-12-25 | 2005-05-17 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method |
| JP4225728B2 (ja) * | 2002-01-08 | 2009-02-18 | 株式会社ルネサステクノロジ | 不揮発性半導体記憶装置の製造方法 |
| TWI252565B (en) * | 2002-06-24 | 2006-04-01 | Hitachi Ltd | Semiconductor device and manufacturing method thereof |
| JP4049641B2 (ja) * | 2002-09-06 | 2008-02-20 | 株式会社ルネサステクノロジ | 不揮発性半導体記憶装置 |
| JP4219141B2 (ja) * | 2002-09-13 | 2009-02-04 | 株式会社ルネサステクノロジ | 薄膜磁性体記憶装置 |
| JP2004153003A (ja) * | 2002-10-30 | 2004-05-27 | Sanyo Electric Co Ltd | 不揮発性半導体記憶装置 |
| US6936898B2 (en) * | 2002-12-31 | 2005-08-30 | Transmeta Corporation | Diagonal deep well region for routing body-bias voltage for MOSFETS in surface well regions |
| KR100487950B1 (ko) | 2003-02-03 | 2005-05-06 | 삼성전자주식회사 | 활성영역과 중첩되는 게이트 전극 상에 배치된 콘택홀을갖는 반도체 소자 |
| US6699757B1 (en) * | 2003-03-26 | 2004-03-02 | Macronix International Co., Ltd. | Method for manufacturing embedded non-volatile memory with sacrificial layers |
| US20040188777A1 (en) * | 2003-03-31 | 2004-09-30 | Macronix International Co., Ltd. | Mixed signal embedded mask ROM with virtual ground array and method for manufacturing same |
| JP2005026380A (ja) * | 2003-06-30 | 2005-01-27 | Toshiba Corp | 不揮発性メモリを含む半導体装置及びその製造方法 |
| KR100517560B1 (ko) * | 2003-07-14 | 2005-09-28 | 삼성전자주식회사 | 선택트랜지스터를 갖는 이이피롬 소자 및 그 제조방법 |
| JP3920827B2 (ja) * | 2003-09-08 | 2007-05-30 | 三洋電機株式会社 | 半導体記憶装置 |
| US7174528B1 (en) | 2003-10-10 | 2007-02-06 | Transmeta Corporation | Method and apparatus for optimizing body bias connections in CMOS circuits using a deep n-well grid structure |
| JP4377676B2 (ja) * | 2003-12-24 | 2009-12-02 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US7645673B1 (en) * | 2004-02-03 | 2010-01-12 | Michael Pelham | Method for generating a deep N-well pattern for an integrated circuit design |
| US7388260B1 (en) | 2004-03-31 | 2008-06-17 | Transmeta Corporation | Structure for spanning gap in body-bias voltage routing structure |
| JP2006041354A (ja) * | 2004-07-29 | 2006-02-09 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| JP4880894B2 (ja) * | 2004-11-17 | 2012-02-22 | シャープ株式会社 | 半導体記憶装置の構造及びその製造方法 |
| JP2006164998A (ja) * | 2004-12-02 | 2006-06-22 | Renesas Technology Corp | 半導体装置およびその製造方法 |
| JP2005260253A (ja) * | 2005-04-04 | 2005-09-22 | Renesas Technology Corp | 半導体集積回路装置およびその製造方法 |
| US7247907B2 (en) * | 2005-05-20 | 2007-07-24 | Silicon Storage Technology, Inc. | Bidirectional split gate NAND flash memory structure and array, method of programming, erasing and reading thereof, and method of manufacturing |
| WO2006129342A1 (ja) * | 2005-05-30 | 2006-12-07 | Spansion Llc | 半導体装置およびその製造方法 |
| JP2006351789A (ja) * | 2005-06-15 | 2006-12-28 | Toshiba Corp | 半導体集積回路装置 |
| KR100618903B1 (ko) * | 2005-06-18 | 2006-09-01 | 삼성전자주식회사 | 독립된 전원 장치를 구비하는 반도체 집적 회로와 반도체집적 회로를 구비하는 반도체 시스템 및 반도체 집적 회로형성 방법 |
| JP2007027666A (ja) * | 2005-07-21 | 2007-02-01 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US7305647B1 (en) | 2005-07-28 | 2007-12-04 | Transmeta Corporation | Using standard pattern tiles and custom pattern tiles to generate a semiconductor design layout having a deep well structure for routing body-bias voltage |
| JP4810392B2 (ja) | 2005-11-15 | 2011-11-09 | 株式会社東芝 | 不揮発性半導体記憶装置およびその製造方法 |
| KR100672717B1 (ko) * | 2005-12-28 | 2007-01-24 | 동부일렉트로닉스 주식회사 | 비휘발성 메모리 장치의 제조방법 |
| JP4521366B2 (ja) * | 2006-02-22 | 2010-08-11 | 株式会社東芝 | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法 |
| US7547944B2 (en) * | 2006-03-30 | 2009-06-16 | Catalyst Semiconductor, Inc. | Scalable electrically eraseable and programmable memory (EEPROM) cell array |
| US20090003074A1 (en) * | 2006-03-30 | 2009-01-01 | Catalyst Semiconductor, Inc. | Scalable Electrically Eraseable And Programmable Memory (EEPROM) Cell Array |
| JP4901325B2 (ja) | 2006-06-22 | 2012-03-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US8139408B2 (en) * | 2006-09-05 | 2012-03-20 | Semiconductor Components Industries, L.L.C. | Scalable electrically eraseable and programmable memory |
| US7528436B2 (en) * | 2006-09-05 | 2009-05-05 | Catalyst Semiconductor, Inc. | Scalable electrically eraseable and programmable memory |
| US8750041B2 (en) | 2006-09-05 | 2014-06-10 | Semiconductor Components Industries, Llc | Scalable electrically erasable and programmable memory |
| JP2008159614A (ja) * | 2006-12-20 | 2008-07-10 | Toshiba Corp | 不揮発性半導体メモリ |
| KR100854861B1 (ko) * | 2006-12-27 | 2008-08-28 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자 및 그 제조 방법 |
| US7876547B2 (en) * | 2007-05-30 | 2011-01-25 | International Business Machines Corporation | Vertical parallel plate capacitor structures |
| US7698678B2 (en) * | 2007-05-30 | 2010-04-13 | International Business Machines Corporation | Methodology for automated design of vertical parallel plate capacitors |
| TW200901449A (en) * | 2007-06-21 | 2009-01-01 | Nanya Technology Corp | Flash memory structure and method of making the same |
| TWI340435B (en) * | 2007-07-11 | 2011-04-11 | Nanya Technology Corp | Dynamic random access memory with electrostatic discharge structure and method for manufacturing the same |
| US20090102016A1 (en) * | 2007-10-22 | 2009-04-23 | International Business Machines Corporation | Design structure incorporating vertical parallel plate capacitor structures |
| JP2008066744A (ja) * | 2007-11-05 | 2008-03-21 | Fujitsu Ltd | 半導体記憶装置 |
| US8536628B2 (en) | 2007-11-29 | 2013-09-17 | Micron Technology, Inc. | Integrated circuit having memory cell array including barriers, and method of manufacturing same |
| JP2009272564A (ja) * | 2008-05-09 | 2009-11-19 | Toshiba Corp | 半導体装置及び半導体装置の製造方法 |
| JP4764461B2 (ja) | 2008-09-17 | 2011-09-07 | 株式会社東芝 | 半導体装置 |
| GB2476236A (en) * | 2009-12-15 | 2011-06-22 | Cambridge Silicon Radio Ltd | On-Gate contacts |
| IT1400967B1 (it) * | 2010-06-15 | 2013-07-05 | St Microelectronics Srl | Dispositivo di memoria non volatile con circuito di riconnessione |
| IT1400968B1 (it) | 2010-06-15 | 2013-07-05 | St Microelectronics Srl | Dispositivo di memoria non-volatile con scarica controllata |
| US9070784B2 (en) | 2011-07-22 | 2015-06-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal gate structure of a CMOS semiconductor device and method of forming the same |
| US8536639B2 (en) * | 2011-10-20 | 2013-09-17 | Peking University | I-shape floating gate for flash memory device and fabricating the same |
| US8685817B1 (en) | 2012-11-19 | 2014-04-01 | International Business Machines Corporation | Metal gate structures for CMOS transistor devices having reduced parasitic capacitance |
| JP2014103204A (ja) | 2012-11-19 | 2014-06-05 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
| JP6215645B2 (ja) * | 2012-11-28 | 2017-10-18 | ルネサスエレクトロニクス株式会社 | 半導体集積回路 |
| JP2015060895A (ja) * | 2013-09-17 | 2015-03-30 | 株式会社東芝 | 半導体装置 |
| US9658278B2 (en) * | 2014-01-24 | 2017-05-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for high voltage device crystal defect detection |
| US9299697B2 (en) * | 2014-05-15 | 2016-03-29 | Texas Instruments Incorporated | High breakdown voltage microelectronic device isolation structure with improved reliability |
| US10147784B2 (en) | 2014-05-15 | 2018-12-04 | Texas Instruments Incorporated | High voltage galvanic isolation device |
| US9698147B2 (en) | 2015-02-25 | 2017-07-04 | Sii Semiconductor Corporation | Semiconductor integrated circuit device having low and high withstanding-voltage MOS transistors |
| US10062763B2 (en) * | 2015-05-27 | 2018-08-28 | Qualcomm Incorporated | Method and apparatus for selectively forming nitride caps on metal gate |
| US10217794B2 (en) * | 2017-05-24 | 2019-02-26 | Globalfoundries Singapore Pte. Ltd. | Integrated circuits with vertical capacitors and methods for producing the same |
| US11222945B2 (en) | 2017-12-29 | 2022-01-11 | Texas Instruments Incorporated | High voltage isolation structure and method |
| US12206001B2 (en) | 2019-07-30 | 2025-01-21 | Qualcomm Incorporated | FinFET semiconductor device |
| US11409684B2 (en) | 2020-07-31 | 2022-08-09 | Alibaba Group Holding Limited | Processing accelerator architectures |
| US11625341B2 (en) | 2020-08-11 | 2023-04-11 | Alibaba Group Holding Limited | Narrow DRAM channel systems and methods |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1196997B (it) | 1986-07-25 | 1988-11-25 | Sgs Microelettronica Spa | Processo per realizzare strutture includenti celle di memoria non volatili e2prom con strati di silicio autoallineate transistori associati |
| JP2615876B2 (ja) | 1988-07-13 | 1997-06-04 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP3532625B2 (ja) * | 1994-10-06 | 2004-05-31 | 東芝マイクロエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JPH08298314A (ja) | 1995-04-27 | 1996-11-12 | Nec Yamaguchi Ltd | 不揮発性半導体記憶装置及びその製造方法 |
| JPH08306889A (ja) | 1995-05-08 | 1996-11-22 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
| JPH09270461A (ja) * | 1996-03-29 | 1997-10-14 | Mitsubishi Electric Corp | 半導体装置 |
| US6054734A (en) * | 1996-07-26 | 2000-04-25 | Sony Corporation | Non-volatile memory cell having dual gate electrodes |
| JP3519583B2 (ja) * | 1997-09-19 | 2004-04-19 | 株式会社東芝 | 不揮発性半導体記憶装置およびその製造方法 |
| KR100268424B1 (ko) * | 1998-08-07 | 2000-10-16 | 윤종용 | 반도체 장치의 배선 형성 방법 |
-
2000
- 2000-02-28 JP JP2000052436A patent/JP4068781B2/ja not_active Expired - Fee Related
- 2000-11-15 TW TW089124195A patent/TW473988B/zh not_active IP Right Cessation
-
2001
- 2001-02-26 US US09/791,832 patent/US6420754B2/en not_active Expired - Lifetime
- 2001-02-27 KR KR1020010010113A patent/KR100549475B1/ko not_active Expired - Fee Related
- 2001-03-20 US US09/811,598 patent/US6423584B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP4068781B2 (ja) | 2008-03-26 |
| US6423584B2 (en) | 2002-07-23 |
| TW473988B (en) | 2002-01-21 |
| US20010024859A1 (en) | 2001-09-27 |
| US6420754B2 (en) | 2002-07-16 |
| KR20010085679A (ko) | 2001-09-07 |
| JP2001244424A (ja) | 2001-09-07 |
| US20010020718A1 (en) | 2001-09-13 |
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