KR0166146B1 - 배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법 - Google Patents

배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법 Download PDF

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Publication number
KR0166146B1
KR0166146B1 KR1019950024468A KR19950024468A KR0166146B1 KR 0166146 B1 KR0166146 B1 KR 0166146B1 KR 1019950024468 A KR1019950024468 A KR 1019950024468A KR 19950024468 A KR19950024468 A KR 19950024468A KR 0166146 B1 KR0166146 B1 KR 0166146B1
Authority
KR
South Korea
Prior art keywords
substrate
output side
input side
wiring board
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950024468A
Other languages
English (en)
Korean (ko)
Other versions
KR960008968A (ko
Inventor
야스노브 타구사
시게오 나카브
Original Assignee
쯔지 하루오
샤프 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쯔지 하루오, 샤프 가부시끼가이샤 filed Critical 쯔지 하루오
Publication of KR960008968A publication Critical patent/KR960008968A/ko
Application granted granted Critical
Publication of KR0166146B1 publication Critical patent/KR0166146B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1019950024468A 1994-08-04 1995-08-04 배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법 Expired - Fee Related KR0166146B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-183267 1994-08-04
JP18326794A JP3186925B2 (ja) 1994-08-04 1994-08-04 パネルの実装構造並びに集積回路搭載テープおよびその製造方法

Publications (2)

Publication Number Publication Date
KR960008968A KR960008968A (ko) 1996-03-22
KR0166146B1 true KR0166146B1 (ko) 1999-02-01

Family

ID=16132679

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950024468A Expired - Fee Related KR0166146B1 (ko) 1994-08-04 1995-08-04 배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법

Country Status (5)

Country Link
US (2) US5668700A (https=)
JP (1) JP3186925B2 (https=)
KR (1) KR0166146B1 (https=)
CN (2) CN1080984C (https=)
TW (1) TW275184B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR100339646B1 (ko) * 1998-12-08 2002-06-05 아끼구사 나오유끼 매트릭스 표시 장치 및 그 제조 방법 그리고 열압착 접속용 헤드
KR20230026255A (ko) * 2021-08-17 2023-02-24 주식회사 케이펙스 플랫 플렉시블 인쇄회로

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JP3063831B2 (ja) * 1997-08-11 2000-07-12 日本電気株式会社 表示装置及びその製造方法
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JP3209219B2 (ja) 1999-01-18 2001-09-17 セイコーエプソン株式会社 電気光学装置および電子機器
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KR100381046B1 (ko) * 2000-03-31 2003-04-18 엘지.필립스 엘시디 주식회사 더미부를 가지는 테이프 캐리어 패키지와 이를 이용한 액정표시장치
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JP4742441B2 (ja) * 2001-04-16 2011-08-10 日本電気株式会社 フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法
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KR20230026255A (ko) * 2021-08-17 2023-02-24 주식회사 케이펙스 플랫 플렉시블 인쇄회로

Also Published As

Publication number Publication date
TW275184B (https=) 1996-05-01
CN1118566A (zh) 1996-03-13
US5822191A (en) 1998-10-13
CN1080984C (zh) 2002-03-13
JPH0845986A (ja) 1996-02-16
CN1144287C (zh) 2004-03-31
KR960008968A (ko) 1996-03-22
US5668700A (en) 1997-09-16
CN1310469A (zh) 2001-08-29
JP3186925B2 (ja) 2001-07-11

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