KR960008968A - 배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법 - Google Patents

배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법 Download PDF

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KR960008968A
KR960008968A KR1019950024468A KR19950024468A KR960008968A KR 960008968 A KR960008968 A KR 960008968A KR 1019950024468 A KR1019950024468 A KR 1019950024468A KR 19950024468 A KR19950024468 A KR 19950024468A KR 960008968 A KR960008968 A KR 960008968A
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electrode
panel
manufacturing
integrated circuit
assembly structure
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KR1019950024468A
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KR0166146B1 (ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01049—Indium [In]
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    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01073—Tantalum [Ta]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01079—Gold [Au]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01082—Lead [Pb]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1019950024468A 1994-08-04 1995-08-04 배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법 KR0166146B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18326794A JP3186925B2 (ja) 1994-08-04 1994-08-04 パネルの実装構造並びに集積回路搭載テープおよびその製造方法
JP94-183267 1994-08-04

Publications (2)

Publication Number Publication Date
KR960008968A true KR960008968A (ko) 1996-03-22
KR0166146B1 KR0166146B1 (ko) 1999-02-01

Family

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Application Number Title Priority Date Filing Date
KR1019950024468A KR0166146B1 (ko) 1994-08-04 1995-08-04 배선과 전극을 미세 피치로 접속할 수 있는 패널의 조립구조, 집적회로탑재 테이프 및 그의 제조방법

Country Status (5)

Country Link
US (2) US5668700A (ko)
JP (1) JP3186925B2 (ko)
KR (1) KR0166146B1 (ko)
CN (2) CN1080984C (ko)
TW (1) TW275184B (ko)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205373B2 (ja) * 1992-03-12 2001-09-04 株式会社日立製作所 液晶表示装置
US5893623A (en) * 1993-11-12 1999-04-13 Seiko Epson Corporation Structure and method for mounting semiconductor devices, and liquid crystal display
TW293093B (ko) * 1994-09-08 1996-12-11 Hitachi Ltd
CN1138463C (zh) * 1996-12-13 2004-02-11 松下电器产业株式会社 电子部件及其安装方法和装置
US6938335B2 (en) 1996-12-13 2005-09-06 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
KR100476533B1 (ko) * 1997-07-30 2006-06-19 삼성전자주식회사 탭실장방식의인쇄회로기판구조
KR100476531B1 (ko) * 1997-07-30 2005-11-14 삼성전자주식회사 탭실장방식의인쇄회로기판구조
JP3063831B2 (ja) * 1997-08-11 2000-07-12 日本電気株式会社 表示装置及びその製造方法
US5956234A (en) * 1998-01-20 1999-09-21 Integrated Device Technology, Inc. Method and structure for a surface mountable rigid-flex printed circuit board
EP0942392A3 (en) * 1998-03-13 2000-10-18 Kabushiki Kaisha Toshiba Chip card
JP2000002882A (ja) * 1998-06-16 2000-01-07 Toshiba Electronic Engineering Corp 液晶表示装置及びその製造方法
JP3521757B2 (ja) * 1998-09-08 2004-04-19 株式会社豊田自動織機 半導体モジュール電極構造
US6123551A (en) * 1998-10-06 2000-09-26 Northern Telecom Limited Electronic circuit interconnection method and apparatus
JP2000172193A (ja) 1998-12-08 2000-06-23 Fujitsu Ltd マトリックス表示装置及びその製造方法並びに熱圧着接続用ヘッド
JP3209219B2 (ja) 1999-01-18 2001-09-17 セイコーエプソン株式会社 電気光学装置および電子機器
DE60037630T2 (de) * 1999-03-31 2009-01-08 Seiko Epson Corp. Verbinder mit schmalen abständen, abstandsumsetzer, mikromaschine, piezoelektrisches stellglied, elektrostatisches stellglied, tintenstrahldruckkopf, tintenstrahldrucker, flüssigkristallbauelement und elektronisches gerät
JP2001013883A (ja) * 1999-06-30 2001-01-19 Fujitsu Ltd ドライバｉｃ実装モジュール及びそれを使用した平板型表示装置
EP1085788A3 (en) * 1999-09-14 2003-01-02 Seiko Epson Corporation Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
US6433414B2 (en) * 2000-01-26 2002-08-13 Casio Computer Co., Ltd. Method of manufacturing flexible wiring board
JP2001237280A (ja) * 2000-02-22 2001-08-31 Nec Corp テープキャリア型半導体装置および可撓性フィルム接続基板
TW527513B (en) * 2000-03-06 2003-04-11 Hitachi Ltd Liquid crystal display device and manufacturing method thereof
KR100381046B1 (ko) * 2000-03-31 2003-04-18 엘지.필립스 엘시디 주식회사 더미부를 가지는 테이프 캐리어 패키지와 이를 이용한 액정표시장치
US6677664B2 (en) * 2000-04-25 2004-01-13 Fujitsu Hitachi Plasma Display Limited Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis
JP3485107B2 (ja) * 2000-06-13 2004-01-13 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び、電子機器
JP4535588B2 (ja) * 2000-09-13 2010-09-01 京セラ株式会社 回路基板および電子デバイス
US6700070B1 (en) * 2000-11-03 2004-03-02 Cray Inc. Alignment mark for placement of guide hole
JP3627011B2 (ja) * 2001-02-13 2005-03-09 インターナショナル・ビジネス・マシーンズ・コーポレーション 接合方法
JP3721999B2 (ja) * 2001-03-14 2005-11-30 セイコーエプソン株式会社 液晶装置及び電子機器
JP2002343560A (ja) * 2001-03-16 2002-11-29 Seiko Epson Corp 有機エレクトロルミネッセンス装置、電子機器
JP4742441B2 (ja) * 2001-04-16 2011-08-10 日本電気株式会社 フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法
JP2003149665A (ja) * 2001-11-08 2003-05-21 Hitachi Ltd 液晶表示装置
FR2832588B1 (fr) * 2001-11-20 2004-02-13 Gemplus Card Int Ruban conducteur lamine de raccordement a une interface d'entrees/sorties
KR100462604B1 (ko) * 2002-05-20 2004-12-20 삼성전자주식회사 잉크젯 프린트헤드 및 잉크젯 프린트헤드의ｆｐｃ케이블의 본딩 방법 및 이를 적용한 장치
JP4226368B2 (ja) * 2002-06-07 2009-02-18 シャープ株式会社 配線基板、表示装置、及び配線基板の製造方法
JP4054861B2 (ja) * 2002-08-08 2008-03-05 三菱電機株式会社 表示装置および表示装置の製造方法
TWI286381B (en) * 2002-08-27 2007-09-01 Gigno Technology Co Ltd Multi-chip integrated module
JP4144436B2 (ja) * 2003-06-02 2008-09-03 セイコーエプソン株式会社 電気光学モジュール及び電子機器
KR100637151B1 (ko) * 2004-02-21 2006-10-23 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US20050183884A1 (en) * 2004-02-25 2005-08-25 Arima Display Corporation Flexible printed circuit board
US6972963B1 (en) * 2004-07-02 2005-12-06 Chunghwa Picture Tubes Electronic apparatus having structure for protecting flexible printed circuit and chip thereon
JP2006064939A (ja) * 2004-08-26 2006-03-09 Optrex Corp 表示装置
JP4285484B2 (ja) 2005-01-24 2009-06-24 セイコーエプソン株式会社 電気光学装置、電気光学装置用基板、回路基板、実装構造体及び電子機器
KR100695892B1 (ko) * 2005-01-25 2007-03-19 삼성전자주식회사 굴곡진 프로파일을 갖는 부유 게이트를 구비하는 비휘발성메모리 소자 및 그 형성 방법
JP5128773B2 (ja) * 2006-01-23 2013-01-23 日本電気株式会社 液晶表示装置の製造方法
JP5273330B2 (ja) * 2006-08-04 2013-08-28 株式会社ジャパンディスプレイ 表示装置
KR100821043B1 (ko) * 2006-09-22 2008-04-08 삼성에스디아이 주식회사 연성인쇄회로기판
US7495927B2 (en) * 2007-01-24 2009-02-24 Epson Imaging Devices Corporation Mount structure, electro-optical device, and electronic apparatus
TWI328861B (en) 2007-03-13 2010-08-11 Au Optronics Corp Fabrication methods of thin film transistor substrate
JP5504557B2 (ja) * 2007-09-21 2014-05-28 セイコーエプソン株式会社 電気光学装置及び電気光学装置用実装ケース、並びに電子機器
CN101451013B (zh) 2007-11-29 2011-05-25 比亚迪股份有限公司 一种聚酰亚胺材料及其制备方法
US8017873B2 (en) * 2008-03-03 2011-09-13 Himax Technologies Limited Built-in method of thermal dissipation layer for driver IC substrate and structure thereof
JP4980960B2 (ja) * 2008-03-14 2012-07-18 ラピスセミコンダクタ株式会社 テープ配線基板及び半導体チップパッケージ
US20100067203A1 (en) * 2008-07-08 2010-03-18 T-Ray Science Inc. Apparatus for carrying photoconductive integrated circuits
WO2010016174A1 (ja) * 2008-08-07 2010-02-11 シャープ株式会社 タッチパネル、表示装置及び電子機器
GB2472047B (en) 2009-07-22 2011-08-10 Novalia Ltd Packaging or mounting a component
US9179560B2 (en) * 2010-10-25 2015-11-03 Korea Electric Terminal Co., Ltd. Board block for vehicles
TW201222683A (en) * 2010-11-18 2012-06-01 Siliconware Precision Industries Co Ltd Method of forming semiconductor package
US9508617B2 (en) * 2012-03-02 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Test chip, test board and reliability testing method
JP2013258044A (ja) * 2012-06-12 2013-12-26 Molex Inc コネクタ
KR101954985B1 (ko) * 2012-09-17 2019-03-08 삼성디스플레이 주식회사 디스플레이 장치
US9437616B2 (en) * 2012-11-22 2016-09-06 Sharp Kabushiki Kaisha Display apparatus
CN103885213B (zh) * 2012-12-21 2017-04-12 深圳市比亚迪电子部品件有限公司 一种fog热压头到ic芯片的距离调试方法
GB2525605B (en) 2014-04-28 2018-10-24 Flexenable Ltd Method of bonding flexible printed circuits
CN105572988B (zh) * 2014-11-04 2019-07-16 株式会社日本显示器 显示装置
CN105652492A (zh) * 2015-12-25 2016-06-08 昆山国显光电有限公司 Fog工艺的对位方法和系统
CN108398818B (zh) * 2017-02-06 2021-04-27 精工爱普生株式会社 电光装置以及电子设备
KR102398994B1 (ko) * 2017-12-01 2022-05-20 가부시키가이샤 신가와 실장 장치
KR101989946B1 (ko) * 2017-12-06 2019-06-14 주식회사 엘비루셈 정렬마크를 구비한 ｃｏｆ 패키지용 필름
KR102322539B1 (ko) * 2018-02-07 2021-11-04 삼성전자주식회사 반도체 패키지 및 이를 포함하는 디스플레이 장치
US20210005701A1 (en) * 2018-03-02 2021-01-07 Sharp Kabushiki Kaisha Display device
JP7147412B2 (ja) 2018-09-25 2022-10-05 ブラザー工業株式会社 液体吐出装置及び配線部材
JP7259250B2 (ja) * 2018-10-01 2023-04-18 日本電気株式会社 熱圧着装置および熱圧着方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4048438A (en) * 1974-10-23 1977-09-13 Amp Incorporated Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
CH660551GA3 (ko) * 1982-12-27 1987-05-15
US5089750A (en) * 1986-12-18 1992-02-18 Matsushita Electric Industrial Co., Ltd. Lead connection structure
US4783719A (en) * 1987-01-20 1988-11-08 Hughes Aircraft Company Test connector for electrical devices
US4811081A (en) * 1987-03-23 1989-03-07 Motorola, Inc. Semiconductor die bonding with conductive adhesive
DE3852563T2 (de) * 1987-05-01 1995-05-11 Canon Kk Verfahren zum Anschliessen eines externen Schaltkreises und Verpackungsstruktur.
JPH0291360U (ko) * 1988-12-29 1990-07-19
US5180888A (en) * 1989-08-10 1993-01-19 Casio Computer Co., Ltd. Conductive bonding agent and a conductive connecting method
KR940006185Y1 (ko) * 1990-06-07 1994-09-10 가시오 게이상기 가부시끼가이샤 Ic 모듈
JPH07123133B2 (ja) * 1990-08-13 1995-12-25 株式会社東芝 フィルムキャリア構造
JPH04242721A (ja) * 1991-01-08 1992-08-31 Toshiba Corp 液晶表示装置
US5288950A (en) * 1991-02-15 1994-02-22 Sumitomo Metal Mining Company Limited Flexible wiring board and method of preparing the same
JPH064582A (ja) * 1992-06-24 1994-01-14 Matsushita Electric Ind Co Ltd 中央演算装置
KR960008514B1 (ko) * 1993-07-23 1996-06-26 삼성전자 주식회사 테스트 소켓 및 그를 이용한 노운 굳 다이 제조방법

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US5668700A (en) 1997-09-16
CN1080984C (zh) 2002-03-13
US5822191A (en) 1998-10-13
TW275184B (ko) 1996-05-01
CN1144287C (zh) 2004-03-31

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