KR960026295U - 칩부품 실장구조 - Google Patents
칩부품 실장구조Info
- Publication number
- KR960026295U KR960026295U KR2019940033894U KR19940033894U KR960026295U KR 960026295 U KR960026295 U KR 960026295U KR 2019940033894 U KR2019940033894 U KR 2019940033894U KR 19940033894 U KR19940033894 U KR 19940033894U KR 960026295 U KR960026295 U KR 960026295U
- Authority
- KR
- South Korea
- Prior art keywords
- mounting structure
- component mounting
- chip component
- chip
- mounting
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940033894U KR960026295U (ko) | 1994-12-13 | 1994-12-13 | 칩부품 실장구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940033894U KR960026295U (ko) | 1994-12-13 | 1994-12-13 | 칩부품 실장구조 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960026295U true KR960026295U (ko) | 1996-07-22 |
Family
ID=60852997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940033894U KR960026295U (ko) | 1994-12-13 | 1994-12-13 | 칩부품 실장구조 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960026295U (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11257719B2 (en) | 2018-06-27 | 2022-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods for improving interlayer dielectric layer topography |
-
1994
- 1994-12-13 KR KR2019940033894U patent/KR960026295U/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11257719B2 (en) | 2018-06-27 | 2022-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods for improving interlayer dielectric layer topography |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |