KR950025634U - 칩마운터용 부품인식장치 - Google Patents
칩마운터용 부품인식장치Info
- Publication number
- KR950025634U KR950025634U KR2019940002783U KR19940002783U KR950025634U KR 950025634 U KR950025634 U KR 950025634U KR 2019940002783 U KR2019940002783 U KR 2019940002783U KR 19940002783 U KR19940002783 U KR 19940002783U KR 950025634 U KR950025634 U KR 950025634U
- Authority
- KR
- South Korea
- Prior art keywords
- mounter
- chip
- component
- component mounter
- chip mounter
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940002783U KR200149152Y1 (ko) | 1994-02-16 | 1994-02-16 | 칩마운터용 부품인식장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940002783U KR200149152Y1 (ko) | 1994-02-16 | 1994-02-16 | 칩마운터용 부품인식장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950025634U true KR950025634U (ko) | 1995-09-18 |
KR200149152Y1 KR200149152Y1 (ko) | 1999-06-15 |
Family
ID=19377296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940002783U KR200149152Y1 (ko) | 1994-02-16 | 1994-02-16 | 칩마운터용 부품인식장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200149152Y1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101146318B1 (ko) * | 2006-04-06 | 2012-05-21 | 삼성테크윈 주식회사 | 칩마운터의 부품 흡착 인식방법 |
KR20210000043A (ko) * | 2019-06-24 | 2021-01-04 | 삼성전자주식회사 | 콜렛 장치 및 이를 이용한 반도체 장치의 제조 방법 |
-
1994
- 1994-02-16 KR KR2019940002783U patent/KR200149152Y1/ko not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101146318B1 (ko) * | 2006-04-06 | 2012-05-21 | 삼성테크윈 주식회사 | 칩마운터의 부품 흡착 인식방법 |
KR20210000043A (ko) * | 2019-06-24 | 2021-01-04 | 삼성전자주식회사 | 콜렛 장치 및 이를 이용한 반도체 장치의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR200149152Y1 (ko) | 1999-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69529042D1 (de) | Halbleiterschaltung | |
KR970703062A (ko) | 전자 구성 요소용 밀봉 장치(encapsulation for electronic components) | |
DE69511661D1 (de) | Referenzschaltung | |
DE69512730D1 (de) | IC-Fassung | |
DE69518181D1 (de) | Chip-Induktivität | |
KR960015828A (ko) | 반도체 집적 회로 | |
DE69736266D1 (de) | Chip-Bauteil | |
DE69517759D1 (de) | Integrierte Halbleiterschaltung | |
DE69528252D1 (de) | Hackschnitzelsilo | |
KR960015898A (ko) | 반도체 집적회로 | |
DE59508289D1 (de) | Mikroelektronisches Bauelement | |
DE59510269D1 (de) | Leistungs-Halbleiterbauelement | |
DE59508234D1 (de) | Abschaltbares Halbleiterbauelement | |
DE59502827D1 (de) | Integrierte schaltung | |
KR950025634U (ko) | 칩마운터용 부품인식장치 | |
ATA124098A (de) | Bauteil | |
DE59510936D1 (de) | Chip-Induktivität | |
KR980006113U (ko) | 칩 마운터 테이프의 피더 | |
DE69517825D1 (de) | Bauelement | |
DE69522163D1 (de) | Schnittstellenschaltung | |
KR960026295U (ko) | 칩부품 실장구조 | |
DE59505249D1 (de) | Integrierte Schaltungsanordnung | |
KR960015952U (ko) | 칩마운터의 보류장치 | |
KR980005482U (ko) | 반도체 칩 마운터 | |
KR960010163U (ko) | 땜납 설치대 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20080227 Year of fee payment: 10 |
|
EXPY | Expiration of term |