DE29609571U1 - Kühlkörperbefestigungsanordnung - Google Patents

Kühlkörperbefestigungsanordnung

Info

Publication number
DE29609571U1
DE29609571U1 DE29609571U DE29609571U DE29609571U1 DE 29609571 U1 DE29609571 U1 DE 29609571U1 DE 29609571 U DE29609571 U DE 29609571U DE 29609571 U DE29609571 U DE 29609571U DE 29609571 U1 DE29609571 U1 DE 29609571U1
Authority
DE
Germany
Prior art keywords
mounting assembly
heatsink mounting
heatsink
assembly
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29609571U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIN ANDY CHUNG-HO TAIPEH TW
Original Assignee
LIN ANDY CHUNG-HO TAIPEH TW
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US08/646,013 priority Critical patent/US5708564A/en
Application filed by LIN ANDY CHUNG-HO TAIPEH TW filed Critical LIN ANDY CHUNG-HO TAIPEH TW
Priority to DE29609571U priority patent/DE29609571U1/de
Publication of DE29609571U1 publication Critical patent/DE29609571U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE29609571U 1996-05-07 1996-05-29 Kühlkörperbefestigungsanordnung Expired - Lifetime DE29609571U1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US08/646,013 US5708564A (en) 1996-05-07 1996-05-07 Heat sink mounting structure
DE29609571U DE29609571U1 (de) 1996-05-07 1996-05-29 Kühlkörperbefestigungsanordnung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/646,013 US5708564A (en) 1996-05-07 1996-05-07 Heat sink mounting structure
DE29609571U DE29609571U1 (de) 1996-05-07 1996-05-29 Kühlkörperbefestigungsanordnung

Publications (1)

Publication Number Publication Date
DE29609571U1 true DE29609571U1 (de) 1996-08-22

Family

ID=26059027

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29609571U Expired - Lifetime DE29609571U1 (de) 1996-05-07 1996-05-29 Kühlkörperbefestigungsanordnung

Country Status (2)

Country Link
US (1) US5708564A (de)
DE (1) DE29609571U1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2322962B (en) * 1997-03-03 2001-10-10 Motor One Electronics Inc Heat dissipating fan/integrated circuit assemblies
US5825622A (en) * 1997-05-17 1998-10-20 Chip Coolers, Inc. Heat sink assembly with adjustable mounting clip
US5870288A (en) * 1997-10-17 1999-02-09 Hoya Tech Co., Ltd. Fixing latch member for heat radiating board of central process unit
TW359383U (en) * 1997-12-19 1999-05-21 Hon Hai Prec Ind Co Ltd Protection cover for heat transfer dielectrics
US6014315A (en) * 1998-09-08 2000-01-11 Chip Coolers, Inc. Heat sink assembly with multiple pressure capability
US5945736A (en) * 1998-09-28 1999-08-31 Chip Coolers, Inc. Heat sink assembly with snap-in cover plate having multiple pressure capability
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6160704A (en) * 1998-12-17 2000-12-12 Intelligent Motion Systems Integral heat-sink and motor assembly for printed circuit boards
US6075699A (en) * 1999-01-29 2000-06-13 Chip Coolers, Inc. Heat sink assembly with snap-in legs
US6201697B1 (en) 1999-02-16 2001-03-13 Chip Coolers, Inc. Heat sink assembly with cam lock
US6219248B1 (en) * 1999-04-23 2001-04-17 Lucent Technologies, Inc. Heat sink alignment apparatus and method
US6219238B1 (en) 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
AU713440B3 (en) * 1999-05-25 1999-12-02 First International Computer, Inc. A support structure for a central processing unit
US6252774B1 (en) 2000-03-28 2001-06-26 Chip Coolers, Inc. Multi-device heat sink assembly
DE20003031U1 (de) * 2000-02-18 2001-05-10 Ekl Ag Vorrichtung zur Befestigung von Kühlelementen
US6236569B1 (en) * 2000-05-31 2001-05-22 Intel Corporation Attaching heat sinks to integrated circuits
US6293331B1 (en) 2000-08-11 2001-09-25 Tyco Electronics Logistics Ag Vibration and shock resistant heat sink assembly
US6336499B1 (en) * 2001-05-31 2002-01-08 Hong Tsai Liu CPU heat sink mounting structure
US6386274B1 (en) * 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6944023B2 (en) * 2002-11-15 2005-09-13 Celestica International Inc. System and method for mounting a heat sink
JP4157871B2 (ja) * 2002-12-27 2008-10-01 富士通株式会社 電子部品の放熱装置
WO2005045654A2 (en) * 2003-11-07 2005-05-19 Asetek A/S Cooling system for a computer system
EP1886208A1 (de) 2005-05-06 2008-02-13 Asetek A/S Kühlsystem für ein computersystem
US7362578B2 (en) * 2005-08-16 2008-04-22 Tyco Electronics Corporation Heat sink fastening system
US8169789B1 (en) * 2007-04-10 2012-05-01 Nvidia Corporation Graphics processing unit stiffening frame
US9927181B2 (en) 2009-12-15 2018-03-27 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
CN102938997A (zh) * 2011-08-16 2013-02-20 鸿富锦精密工业（深圳）有限公司 散热装置
US9736966B1 (en) * 2016-02-10 2017-08-15 International Business Machines Corporation Heat sink with integrated threaded lid

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4607685A (en) * 1984-07-06 1986-08-26 Burroughs Corporation Heat sink for integrated circuit package
US4745456A (en) * 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
JP2902531B2 (ja) * 1992-12-25 1999-06-07 富士通株式会社 半導体装置の放熱装置
US5353193A (en) * 1993-02-26 1994-10-04 Lsi Logic Corporation High power dissipating packages with matched heatspreader heatsink assemblies
US5397919A (en) * 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5392193A (en) * 1994-05-31 1995-02-21 Motorola, Inc. Transistor mounting device
US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5596485A (en) * 1995-03-16 1997-01-21 Amkor Electronics, Inc. Plastic packaged integrated circuit with heat spreader
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks

Also Published As

Publication number Publication date
US5708564A (en) 1998-01-13

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19961002

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 19991203

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20020802

R158 Lapse of ip right after 8 years

Effective date: 20041201