JPH10506755A - エンハンストドリフト領域を備える高電圧横型dmosデバイス - Google Patents
エンハンストドリフト領域を備える高電圧横型dmosデバイスInfo
- Publication number
- JPH10506755A JPH10506755A JP8511865A JP51186596A JPH10506755A JP H10506755 A JPH10506755 A JP H10506755A JP 8511865 A JP8511865 A JP 8511865A JP 51186596 A JP51186596 A JP 51186596A JP H10506755 A JPH10506755 A JP H10506755A
- Authority
- JP
- Japan
- Prior art keywords
- region
- transistor
- regions
- conductivity type
- dopant concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/65—Lateral DMOS [LDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/257—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
-
- H10W20/484—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
- H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/313,471 US5447876A (en) | 1993-11-19 | 1994-09-27 | Method of making a diamond shaped gate mesh for cellular MOS transistor array |
| US313,471 | 1994-09-27 | ||
| US384,168 | 1995-02-06 | ||
| US08/384,168 US5517046A (en) | 1993-11-19 | 1995-02-06 | High voltage lateral DMOS device with enhanced drift region |
| PCT/US1995/011959 WO1996010267A1 (en) | 1994-09-27 | 1995-09-25 | High voltage lateral dmos device with enhanced drift region |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10506755A true JPH10506755A (ja) | 1998-06-30 |
Family
ID=26978899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8511865A Pending JPH10506755A (ja) | 1994-09-27 | 1995-09-25 | エンハンストドリフト領域を備える高電圧横型dmosデバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5517046A (OSRAM) |
| EP (1) | EP0788659B1 (OSRAM) |
| JP (1) | JPH10506755A (OSRAM) |
| AU (1) | AU3593395A (OSRAM) |
| DE (1) | DE69513680T2 (OSRAM) |
| WO (1) | WO1996010267A1 (OSRAM) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003303961A (ja) * | 2002-04-09 | 2003-10-24 | Sanyo Electric Co Ltd | Mos半導体装置 |
| US6638827B2 (en) | 2000-04-26 | 2003-10-28 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing it |
| JPWO2005029590A1 (ja) * | 2003-09-18 | 2006-11-30 | 新電元工業株式会社 | 横型短チャネルdmos及びその製造方法並びに半導体装置 |
| WO2009091840A3 (en) * | 2008-01-14 | 2009-09-24 | Volterra Semiconductor Corporation | Power transistor with protected channel |
| JP2009239096A (ja) * | 2008-03-27 | 2009-10-15 | Renesas Technology Corp | 半導体装置 |
| JP2011508978A (ja) * | 2007-12-28 | 2011-03-17 | ヴォルテラ セミコンダクター コーポレイション | 二重拡散型ソースmosfet(ldmos)トランジスタの高ドープ領域及びその作製方法 |
| JP2011103376A (ja) * | 2009-11-11 | 2011-05-26 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
| JP2014209634A (ja) * | 2007-03-28 | 2014-11-06 | アドバンスト・アナロジック・テクノロジーズ・インコーポレイテッドAdvanced Analogic Technologies Incorporated | 絶縁分離された集積回路装置 |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6242787B1 (en) | 1995-11-15 | 2001-06-05 | Denso Corporation | Semiconductor device and manufacturing method thereof |
| US6831331B2 (en) | 1995-11-15 | 2004-12-14 | Denso Corporation | Power MOS transistor for absorbing surge current |
| US6071768A (en) * | 1996-05-17 | 2000-06-06 | Texas Instruments Incorporated | Method of making an efficient NPN turn-on in a high voltage DENMOS transistor for ESD protection |
| SE513283C2 (sv) * | 1996-07-26 | 2000-08-14 | Ericsson Telefon Ab L M | MOS-transistorstruktur med utsträckt driftregion |
| US5846866A (en) * | 1997-02-07 | 1998-12-08 | National Semiconductor Corporation | Drain extension regions in low voltage lateral DMOS devices |
| EP0880183A3 (en) * | 1997-05-23 | 1999-07-28 | Texas Instruments Incorporated | LDMOS power device |
| EP0922302A2 (en) * | 1997-05-23 | 1999-06-16 | Koninklijke Philips Electronics N.V. | Lateral mos transistor device |
| JP3387782B2 (ja) | 1997-07-14 | 2003-03-17 | 松下電器産業株式会社 | 半導体装置 |
| KR100244282B1 (ko) * | 1997-08-25 | 2000-02-01 | 김영환 | 고전압 트랜지스터의 구조 및 제조 방법 |
| US6133077A (en) | 1998-01-13 | 2000-10-17 | Lsi Logic Corporation | Formation of high-voltage and low-voltage devices on a semiconductor substrate |
| US6020239A (en) | 1998-01-28 | 2000-02-01 | International Business Machines Corporation | Pillar transistor incorporating a body contact |
| US6150200A (en) * | 1998-04-03 | 2000-11-21 | Motorola, Inc. | Semiconductor device and method of making |
| US6303961B1 (en) * | 1998-04-29 | 2001-10-16 | Aqere Systems Guardian Corp. | Complementary semiconductor devices |
| US6096606A (en) * | 1998-05-04 | 2000-08-01 | Motorola, Inc. | Method of making a semiconductor device |
| US6093585A (en) * | 1998-05-08 | 2000-07-25 | Lsi Logic Corporation | High voltage tolerant thin film transistor |
| US6252278B1 (en) * | 1998-05-18 | 2001-06-26 | Monolithic Power Systems, Inc. | Self-aligned lateral DMOS with spacer drift region |
| JP3443355B2 (ja) * | 1999-03-12 | 2003-09-02 | 三洋電機株式会社 | 半導体装置の製造方法 |
| KR100336557B1 (ko) * | 1999-09-14 | 2002-05-11 | 박종섭 | 정전방전보호소자 제조방법 |
| US6271552B1 (en) * | 1999-10-04 | 2001-08-07 | Xemod, Inc | Lateral RF MOS device with improved breakdown voltage |
| US6784059B1 (en) * | 1999-10-29 | 2004-08-31 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing thereof |
| US6683349B1 (en) * | 1999-10-29 | 2004-01-27 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing the same |
| WO2001075979A1 (de) * | 2000-03-31 | 2001-10-11 | Ihp Gmbh-Innovations For High Performance Microelectronics | Cmos-kompatibler lateraler dmos-transistor und verfahren zur herstellung eines derartigen transistors |
| EP1158583A1 (en) * | 2000-05-23 | 2001-11-28 | STMicroelectronics S.r.l. | Low on-resistance LDMOS |
| JP2002094063A (ja) * | 2000-09-11 | 2002-03-29 | Toshiba Corp | 半導体装置 |
| JP2002217407A (ja) * | 2001-01-16 | 2002-08-02 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
| JP4030269B2 (ja) * | 2001-03-06 | 2008-01-09 | 三洋電機株式会社 | 半導体装置とその製造方法 |
| TW543146B (en) * | 2001-03-09 | 2003-07-21 | Fairchild Semiconductor | Ultra dense trench-gated power device with the reduced drain-source feedback capacitance and miller charge |
| US7109558B2 (en) | 2001-06-06 | 2006-09-19 | Denso Corporation | Power MOS transistor having capability for setting substrate potential independently of source potential |
| US20060038223A1 (en) * | 2001-07-03 | 2006-02-23 | Siliconix Incorporated | Trench MOSFET having drain-drift region comprising stack of implanted regions |
| US7033876B2 (en) * | 2001-07-03 | 2006-04-25 | Siliconix Incorporated | Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same |
| US7009247B2 (en) * | 2001-07-03 | 2006-03-07 | Siliconix Incorporated | Trench MIS device with thick oxide layer in bottom of gate contact trench |
| US7291884B2 (en) * | 2001-07-03 | 2007-11-06 | Siliconix Incorporated | Trench MIS device having implanted drain-drift region and thick bottom oxide |
| US6563142B2 (en) | 2001-07-11 | 2003-05-13 | Lumileds Lighting, U.S., Llc | Reducing the variation of far-field radiation patterns of flipchip light emitting diodes |
| US6486034B1 (en) * | 2001-07-20 | 2002-11-26 | Taiwan Semiconductor Manufacturing Company | Method of forming LDMOS device with double N-layering |
| US6475870B1 (en) * | 2001-07-23 | 2002-11-05 | Taiwan Semiconductor Manufacturing Company | P-type LDMOS device with buried layer to solve punch-through problems and process for its manufacture |
| US6593621B2 (en) * | 2001-08-23 | 2003-07-15 | Micrel, Inc. | LDMOS field effect transistor with improved ruggedness in narrow curved areas |
| DE10156468A1 (de) | 2001-11-16 | 2003-05-28 | Eupec Gmbh & Co Kg | Halbleiterbauelement und Verfahren zum Kontaktieren eines solchen Halbleiterbauelements |
| US7635621B2 (en) * | 2002-11-22 | 2009-12-22 | Micrel, Inc. | Lateral double-diffused metal oxide semiconductor (LDMOS) device with an enhanced drift region that has an improved Ron area product |
| US6833586B2 (en) * | 2003-01-02 | 2004-12-21 | Micrel, Inc. | LDMOS transistor with high voltage source and drain terminals |
| KR100493059B1 (ko) * | 2003-04-18 | 2005-06-02 | 삼성전자주식회사 | 게이트 캐패시턴스를 감소시킬 수 있는 트랜지스터 |
| US6946706B1 (en) | 2003-07-09 | 2005-09-20 | National Semiconductor Corporation | LDMOS transistor structure for improving hot carrier reliability |
| US20050275027A1 (en) * | 2003-09-09 | 2005-12-15 | Micrel, Incorporated | ESD protection for integrated circuits |
| JP4800566B2 (ja) * | 2003-10-06 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| CN100376020C (zh) * | 2003-12-29 | 2008-03-19 | 中芯国际集成电路制造(上海)有限公司 | 一种制作具有延伸闸极晶体管的方法 |
| US20050280053A1 (en) * | 2004-06-22 | 2005-12-22 | Hayes Monty B | Semiconductor device with diagonal gate signal distribution runner |
| US7718448B1 (en) * | 2005-05-27 | 2010-05-18 | National Semiconductor Corporation | Method of monitoring process misalignment to reduce asymmetric device operation and improve the electrical and hot carrier performance of LDMOS transistor arrays |
| US7868378B1 (en) * | 2005-07-18 | 2011-01-11 | Volterra Semiconductor Corporation | Methods and apparatus for LDMOS transistors |
| US7375408B2 (en) * | 2005-10-11 | 2008-05-20 | United Microelectronics Corp. | Fabricating method of a high voltage metal oxide semiconductor device |
| US7956384B2 (en) * | 2006-06-23 | 2011-06-07 | Alpha & Omega Semiconductor Ltd. | Closed cell configuration to increase channel density for sub-micron planar semiconductor power device |
| TWI312192B (en) * | 2006-09-18 | 2009-07-11 | Promos Technologies Inc | Semiconductor device and manufacture method thereof |
| CN100592533C (zh) * | 2007-10-15 | 2010-02-24 | 天钰科技股份有限公司 | 横向扩散金属氧化物晶体管 |
| TWI394277B (zh) * | 2007-10-19 | 2013-04-21 | Fitipower Integrated Tech Inc | 橫向擴散金屬氧化物電晶體 |
| US8114750B2 (en) * | 2008-04-17 | 2012-02-14 | International Business Machines Corporation | Lateral diffusion field effect transistor with drain region self-aligned to gate electrode |
| JP5420854B2 (ja) * | 2008-04-28 | 2014-02-19 | パナソニック株式会社 | 半導体装置およびその製造方法 |
| US7851314B2 (en) * | 2008-04-30 | 2010-12-14 | Alpha And Omega Semiconductor Incorporated | Short channel lateral MOSFET and method |
| US7759923B2 (en) * | 2008-07-08 | 2010-07-20 | Micrel, Inc. | Current sensing in a buck-boost switching regulator using integrally embedded PMOS devices |
| KR20100064264A (ko) * | 2008-12-04 | 2010-06-14 | 주식회사 동부하이텍 | 반도체 소자 및 이의 제조 방법 |
| US8049307B2 (en) * | 2009-01-23 | 2011-11-01 | Vanguard International Semiconductor Corporation | Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices |
| JP5525736B2 (ja) * | 2009-02-18 | 2014-06-18 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置及びその製造方法 |
| US9184097B2 (en) * | 2009-03-12 | 2015-11-10 | System General Corporation | Semiconductor devices and formation methods thereof |
| JP5985393B2 (ja) * | 2009-08-04 | 2016-09-06 | ジーエーエヌ システムズ インコーポレイテッド | アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ |
| US8048765B2 (en) * | 2009-08-28 | 2011-11-01 | Broadcom Corporation | Method for fabricating a MOS transistor with source/well heterojunction and related structure |
| US20110062554A1 (en) * | 2009-09-17 | 2011-03-17 | Hsing Michael R | High voltage floating well in a silicon die |
| DE102009051745B4 (de) * | 2009-11-03 | 2017-09-21 | Austriamicrosystems Ag | Hochvolt-Transistor mit Mehrfach-Dielektrikum und Herstellungsverfahren |
| KR101128694B1 (ko) * | 2009-11-17 | 2012-03-23 | 매그나칩 반도체 유한회사 | 반도체 장치 |
| US8362557B2 (en) * | 2009-12-02 | 2013-01-29 | Fairchild Semiconductor Corporation | Stepped-source LDMOS architecture |
| US8390078B2 (en) * | 2010-06-10 | 2013-03-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Quadrangle MOS transistors |
| JP5043990B2 (ja) * | 2010-06-18 | 2012-10-10 | シャープ株式会社 | 半導体装置およびその製造方法 |
| US9450074B1 (en) * | 2011-07-29 | 2016-09-20 | Maxim Integrated Products, Inc. | LDMOS with field plate connected to gate |
| US9214457B2 (en) | 2011-09-20 | 2015-12-15 | Alpha & Omega Semiconductor Incorporated | Method of integrating high voltage devices |
| US8916913B2 (en) * | 2012-07-13 | 2014-12-23 | Monolithic Power Systems, Inc. | High voltage semiconductor device and the associated method of manufacturing |
| US20140175526A1 (en) * | 2012-12-20 | 2014-06-26 | Macronix International Co., Ltd. | Semiconductor device for current control and method thereof |
| US8981475B2 (en) | 2013-06-18 | 2015-03-17 | International Business Machines Corporation | Lateral diffusion metal oxide semiconductor (LDMOS) |
| CN105556647B (zh) * | 2013-07-19 | 2017-06-13 | 日产自动车株式会社 | 半导体装置及其制造方法 |
| US9219146B2 (en) * | 2013-12-27 | 2015-12-22 | Monolithic Power Systems, Inc. | High voltage PMOS and the method for forming thereof |
| GB201418752D0 (en) * | 2014-10-22 | 2014-12-03 | Rolls Royce Plc | Lateral field effect transistor device |
| US9583612B1 (en) * | 2016-01-21 | 2017-02-28 | Texas Instruments Incorporated | Drift region implant self-aligned to field relief oxide with sidewall dielectric |
| US20170292047A1 (en) | 2016-04-12 | 2017-10-12 | Rextac Llc | Hexene-1 Containing Amorphous Polyalphaolefins For Improved Hot Melt Adhesives |
| TWM547757U (zh) | 2017-01-20 | 2017-08-21 | 杰力科技股份有限公司 | 功率晶片及其電晶體結構 |
| KR20190118745A (ko) * | 2018-04-11 | 2019-10-21 | 주식회사 디비하이텍 | 3d 채널 영역을 형성하는 반도체 소자 및 제조방법 |
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| US4148047A (en) * | 1978-01-16 | 1979-04-03 | Honeywell Inc. | Semiconductor apparatus |
| JPS63262873A (ja) * | 1987-04-21 | 1988-10-31 | Fuji Xerox Co Ltd | 半導体装置 |
| US4922327A (en) * | 1987-12-24 | 1990-05-01 | University Of Toronto Innovations Foundation | Semiconductor LDMOS device with upper and lower passages |
| JPH01207976A (ja) * | 1988-02-15 | 1989-08-21 | Nec Corp | 半導体装置 |
| US5072267A (en) * | 1989-06-28 | 1991-12-10 | Nec Corporation | Complementary field effect transistor |
| JP2545762B2 (ja) * | 1990-04-13 | 1996-10-23 | 日本電装株式会社 | 高耐圧misトランジスタおよびこのトランジスタを有する相補型トランジスタの製造方法 |
| US5306652A (en) * | 1991-12-30 | 1994-04-26 | Texas Instruments Incorporated | Lateral double diffused insulated gate field effect transistor fabrication process |
| US5412239A (en) * | 1993-05-14 | 1995-05-02 | Siliconix Incorporated | Contact geometry for improved lateral MOSFET |
| US5355008A (en) * | 1993-11-19 | 1994-10-11 | Micrel, Inc. | Diamond shaped gate mesh for cellular MOS transistor array |
-
1995
- 1995-02-06 US US08/384,168 patent/US5517046A/en not_active Expired - Lifetime
- 1995-09-25 AU AU35933/95A patent/AU3593395A/en not_active Abandoned
- 1995-09-25 DE DE69513680T patent/DE69513680T2/de not_active Expired - Fee Related
- 1995-09-25 WO PCT/US1995/011959 patent/WO1996010267A1/en not_active Ceased
- 1995-09-25 EP EP95933172A patent/EP0788659B1/en not_active Expired - Lifetime
- 1995-09-25 JP JP8511865A patent/JPH10506755A/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6638827B2 (en) | 2000-04-26 | 2003-10-28 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing it |
| US7087961B2 (en) | 2000-04-26 | 2006-08-08 | Sanyo Electric Co., Ltd. | Semiconductor device with reduced on-state resistance |
| JP2003303961A (ja) * | 2002-04-09 | 2003-10-24 | Sanyo Electric Co Ltd | Mos半導体装置 |
| JPWO2005029590A1 (ja) * | 2003-09-18 | 2006-11-30 | 新電元工業株式会社 | 横型短チャネルdmos及びその製造方法並びに半導体装置 |
| JP2014209634A (ja) * | 2007-03-28 | 2014-11-06 | アドバンスト・アナロジック・テクノロジーズ・インコーポレイテッドAdvanced Analogic Technologies Incorporated | 絶縁分離された集積回路装置 |
| JP2011508978A (ja) * | 2007-12-28 | 2011-03-17 | ヴォルテラ セミコンダクター コーポレイション | 二重拡散型ソースmosfet(ldmos)トランジスタの高ドープ領域及びその作製方法 |
| WO2009091840A3 (en) * | 2008-01-14 | 2009-09-24 | Volterra Semiconductor Corporation | Power transistor with protected channel |
| US8664728B2 (en) | 2008-01-14 | 2014-03-04 | Volterra Semiconductor Corporation | Power transistor with protected channel |
| US9224603B2 (en) | 2008-01-14 | 2015-12-29 | Volterra Semiconductor LLC | Method of fabricating power transistor with protected channel |
| JP2009239096A (ja) * | 2008-03-27 | 2009-10-15 | Renesas Technology Corp | 半導体装置 |
| JP2011103376A (ja) * | 2009-11-11 | 2011-05-26 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5517046A (en) | 1996-05-14 |
| AU3593395A (en) | 1996-04-19 |
| DE69513680D1 (de) | 2000-01-05 |
| EP0788659A1 (en) | 1997-08-13 |
| WO1996010267A1 (en) | 1996-04-04 |
| EP0788659A4 (OSRAM) | 1997-09-10 |
| DE69513680T2 (de) | 2000-05-11 |
| EP0788659B1 (en) | 1999-12-01 |
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