JPH10506755A - エンハンストドリフト領域を備える高電圧横型dmosデバイス - Google Patents

エンハンストドリフト領域を備える高電圧横型dmosデバイス

Info

Publication number
JPH10506755A
JPH10506755A JP8511865A JP51186596A JPH10506755A JP H10506755 A JPH10506755 A JP H10506755A JP 8511865 A JP8511865 A JP 8511865A JP 51186596 A JP51186596 A JP 51186596A JP H10506755 A JPH10506755 A JP H10506755A
Authority
JP
Japan
Prior art keywords
region
transistor
regions
conductivity type
dopant concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8511865A
Other languages
English (en)
Japanese (ja)
Inventor
アール. シン,マイケル
イー. ガーネット,マーティン
シー. モイヤー,ジェイムズ
ジェイ. オルター,マーティン
アール. リフティン,ヘルムート
Original Assignee
マイクレル,インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26978899&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH10506755(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/313,471 external-priority patent/US5447876A/en
Application filed by マイクレル,インコーポレーテッド filed Critical マイクレル,インコーポレーテッド
Publication of JPH10506755A publication Critical patent/JPH10506755A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65Lateral DMOS [LDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/257Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
    • H10W20/484
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/157Impurity concentrations or distributions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/256Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • H10D64/516Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
JP8511865A 1994-09-27 1995-09-25 エンハンストドリフト領域を備える高電圧横型dmosデバイス Pending JPH10506755A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US08/313,471 US5447876A (en) 1993-11-19 1994-09-27 Method of making a diamond shaped gate mesh for cellular MOS transistor array
US313,471 1994-09-27
US384,168 1995-02-06
US08/384,168 US5517046A (en) 1993-11-19 1995-02-06 High voltage lateral DMOS device with enhanced drift region
PCT/US1995/011959 WO1996010267A1 (en) 1994-09-27 1995-09-25 High voltage lateral dmos device with enhanced drift region

Publications (1)

Publication Number Publication Date
JPH10506755A true JPH10506755A (ja) 1998-06-30

Family

ID=26978899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8511865A Pending JPH10506755A (ja) 1994-09-27 1995-09-25 エンハンストドリフト領域を備える高電圧横型dmosデバイス

Country Status (6)

Country Link
US (1) US5517046A (OSRAM)
EP (1) EP0788659B1 (OSRAM)
JP (1) JPH10506755A (OSRAM)
AU (1) AU3593395A (OSRAM)
DE (1) DE69513680T2 (OSRAM)
WO (1) WO1996010267A1 (OSRAM)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303961A (ja) * 2002-04-09 2003-10-24 Sanyo Electric Co Ltd Mos半導体装置
US6638827B2 (en) 2000-04-26 2003-10-28 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing it
JPWO2005029590A1 (ja) * 2003-09-18 2006-11-30 新電元工業株式会社 横型短チャネルdmos及びその製造方法並びに半導体装置
WO2009091840A3 (en) * 2008-01-14 2009-09-24 Volterra Semiconductor Corporation Power transistor with protected channel
JP2009239096A (ja) * 2008-03-27 2009-10-15 Renesas Technology Corp 半導体装置
JP2011508978A (ja) * 2007-12-28 2011-03-17 ヴォルテラ セミコンダクター コーポレイション 二重拡散型ソースmosfet(ldmos)トランジスタの高ドープ領域及びその作製方法
JP2011103376A (ja) * 2009-11-11 2011-05-26 Renesas Electronics Corp 半導体装置及びその製造方法
JP2014209634A (ja) * 2007-03-28 2014-11-06 アドバンスト・アナロジック・テクノロジーズ・インコーポレイテッドAdvanced Analogic Technologies Incorporated 絶縁分離された集積回路装置

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6242787B1 (en) 1995-11-15 2001-06-05 Denso Corporation Semiconductor device and manufacturing method thereof
US6831331B2 (en) 1995-11-15 2004-12-14 Denso Corporation Power MOS transistor for absorbing surge current
US6071768A (en) * 1996-05-17 2000-06-06 Texas Instruments Incorporated Method of making an efficient NPN turn-on in a high voltage DENMOS transistor for ESD protection
SE513283C2 (sv) * 1996-07-26 2000-08-14 Ericsson Telefon Ab L M MOS-transistorstruktur med utsträckt driftregion
US5846866A (en) * 1997-02-07 1998-12-08 National Semiconductor Corporation Drain extension regions in low voltage lateral DMOS devices
EP0880183A3 (en) * 1997-05-23 1999-07-28 Texas Instruments Incorporated LDMOS power device
EP0922302A2 (en) * 1997-05-23 1999-06-16 Koninklijke Philips Electronics N.V. Lateral mos transistor device
JP3387782B2 (ja) 1997-07-14 2003-03-17 松下電器産業株式会社 半導体装置
KR100244282B1 (ko) * 1997-08-25 2000-02-01 김영환 고전압 트랜지스터의 구조 및 제조 방법
US6133077A (en) 1998-01-13 2000-10-17 Lsi Logic Corporation Formation of high-voltage and low-voltage devices on a semiconductor substrate
US6020239A (en) 1998-01-28 2000-02-01 International Business Machines Corporation Pillar transistor incorporating a body contact
US6150200A (en) * 1998-04-03 2000-11-21 Motorola, Inc. Semiconductor device and method of making
US6303961B1 (en) * 1998-04-29 2001-10-16 Aqere Systems Guardian Corp. Complementary semiconductor devices
US6096606A (en) * 1998-05-04 2000-08-01 Motorola, Inc. Method of making a semiconductor device
US6093585A (en) * 1998-05-08 2000-07-25 Lsi Logic Corporation High voltage tolerant thin film transistor
US6252278B1 (en) * 1998-05-18 2001-06-26 Monolithic Power Systems, Inc. Self-aligned lateral DMOS with spacer drift region
JP3443355B2 (ja) * 1999-03-12 2003-09-02 三洋電機株式会社 半導体装置の製造方法
KR100336557B1 (ko) * 1999-09-14 2002-05-11 박종섭 정전방전보호소자 제조방법
US6271552B1 (en) * 1999-10-04 2001-08-07 Xemod, Inc Lateral RF MOS device with improved breakdown voltage
US6784059B1 (en) * 1999-10-29 2004-08-31 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing thereof
US6683349B1 (en) * 1999-10-29 2004-01-27 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing the same
WO2001075979A1 (de) * 2000-03-31 2001-10-11 Ihp Gmbh-Innovations For High Performance Microelectronics Cmos-kompatibler lateraler dmos-transistor und verfahren zur herstellung eines derartigen transistors
EP1158583A1 (en) * 2000-05-23 2001-11-28 STMicroelectronics S.r.l. Low on-resistance LDMOS
JP2002094063A (ja) * 2000-09-11 2002-03-29 Toshiba Corp 半導体装置
JP2002217407A (ja) * 2001-01-16 2002-08-02 Sanyo Electric Co Ltd 半導体装置とその製造方法
JP4030269B2 (ja) * 2001-03-06 2008-01-09 三洋電機株式会社 半導体装置とその製造方法
TW543146B (en) * 2001-03-09 2003-07-21 Fairchild Semiconductor Ultra dense trench-gated power device with the reduced drain-source feedback capacitance and miller charge
US7109558B2 (en) 2001-06-06 2006-09-19 Denso Corporation Power MOS transistor having capability for setting substrate potential independently of source potential
US20060038223A1 (en) * 2001-07-03 2006-02-23 Siliconix Incorporated Trench MOSFET having drain-drift region comprising stack of implanted regions
US7033876B2 (en) * 2001-07-03 2006-04-25 Siliconix Incorporated Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same
US7009247B2 (en) * 2001-07-03 2006-03-07 Siliconix Incorporated Trench MIS device with thick oxide layer in bottom of gate contact trench
US7291884B2 (en) * 2001-07-03 2007-11-06 Siliconix Incorporated Trench MIS device having implanted drain-drift region and thick bottom oxide
US6563142B2 (en) 2001-07-11 2003-05-13 Lumileds Lighting, U.S., Llc Reducing the variation of far-field radiation patterns of flipchip light emitting diodes
US6486034B1 (en) * 2001-07-20 2002-11-26 Taiwan Semiconductor Manufacturing Company Method of forming LDMOS device with double N-layering
US6475870B1 (en) * 2001-07-23 2002-11-05 Taiwan Semiconductor Manufacturing Company P-type LDMOS device with buried layer to solve punch-through problems and process for its manufacture
US6593621B2 (en) * 2001-08-23 2003-07-15 Micrel, Inc. LDMOS field effect transistor with improved ruggedness in narrow curved areas
DE10156468A1 (de) 2001-11-16 2003-05-28 Eupec Gmbh & Co Kg Halbleiterbauelement und Verfahren zum Kontaktieren eines solchen Halbleiterbauelements
US7635621B2 (en) * 2002-11-22 2009-12-22 Micrel, Inc. Lateral double-diffused metal oxide semiconductor (LDMOS) device with an enhanced drift region that has an improved Ron area product
US6833586B2 (en) * 2003-01-02 2004-12-21 Micrel, Inc. LDMOS transistor with high voltage source and drain terminals
KR100493059B1 (ko) * 2003-04-18 2005-06-02 삼성전자주식회사 게이트 캐패시턴스를 감소시킬 수 있는 트랜지스터
US6946706B1 (en) 2003-07-09 2005-09-20 National Semiconductor Corporation LDMOS transistor structure for improving hot carrier reliability
US20050275027A1 (en) * 2003-09-09 2005-12-15 Micrel, Incorporated ESD protection for integrated circuits
JP4800566B2 (ja) * 2003-10-06 2011-10-26 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
CN100376020C (zh) * 2003-12-29 2008-03-19 中芯国际集成电路制造(上海)有限公司 一种制作具有延伸闸极晶体管的方法
US20050280053A1 (en) * 2004-06-22 2005-12-22 Hayes Monty B Semiconductor device with diagonal gate signal distribution runner
US7718448B1 (en) * 2005-05-27 2010-05-18 National Semiconductor Corporation Method of monitoring process misalignment to reduce asymmetric device operation and improve the electrical and hot carrier performance of LDMOS transistor arrays
US7868378B1 (en) * 2005-07-18 2011-01-11 Volterra Semiconductor Corporation Methods and apparatus for LDMOS transistors
US7375408B2 (en) * 2005-10-11 2008-05-20 United Microelectronics Corp. Fabricating method of a high voltage metal oxide semiconductor device
US7956384B2 (en) * 2006-06-23 2011-06-07 Alpha & Omega Semiconductor Ltd. Closed cell configuration to increase channel density for sub-micron planar semiconductor power device
TWI312192B (en) * 2006-09-18 2009-07-11 Promos Technologies Inc Semiconductor device and manufacture method thereof
CN100592533C (zh) * 2007-10-15 2010-02-24 天钰科技股份有限公司 横向扩散金属氧化物晶体管
TWI394277B (zh) * 2007-10-19 2013-04-21 Fitipower Integrated Tech Inc 橫向擴散金屬氧化物電晶體
US8114750B2 (en) * 2008-04-17 2012-02-14 International Business Machines Corporation Lateral diffusion field effect transistor with drain region self-aligned to gate electrode
JP5420854B2 (ja) * 2008-04-28 2014-02-19 パナソニック株式会社 半導体装置およびその製造方法
US7851314B2 (en) * 2008-04-30 2010-12-14 Alpha And Omega Semiconductor Incorporated Short channel lateral MOSFET and method
US7759923B2 (en) * 2008-07-08 2010-07-20 Micrel, Inc. Current sensing in a buck-boost switching regulator using integrally embedded PMOS devices
KR20100064264A (ko) * 2008-12-04 2010-06-14 주식회사 동부하이텍 반도체 소자 및 이의 제조 방법
US8049307B2 (en) * 2009-01-23 2011-11-01 Vanguard International Semiconductor Corporation Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices
JP5525736B2 (ja) * 2009-02-18 2014-06-18 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置及びその製造方法
US9184097B2 (en) * 2009-03-12 2015-11-10 System General Corporation Semiconductor devices and formation methods thereof
JP5985393B2 (ja) * 2009-08-04 2016-09-06 ジーエーエヌ システムズ インコーポレイテッド アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ
US8048765B2 (en) * 2009-08-28 2011-11-01 Broadcom Corporation Method for fabricating a MOS transistor with source/well heterojunction and related structure
US20110062554A1 (en) * 2009-09-17 2011-03-17 Hsing Michael R High voltage floating well in a silicon die
DE102009051745B4 (de) * 2009-11-03 2017-09-21 Austriamicrosystems Ag Hochvolt-Transistor mit Mehrfach-Dielektrikum und Herstellungsverfahren
KR101128694B1 (ko) * 2009-11-17 2012-03-23 매그나칩 반도체 유한회사 반도체 장치
US8362557B2 (en) * 2009-12-02 2013-01-29 Fairchild Semiconductor Corporation Stepped-source LDMOS architecture
US8390078B2 (en) * 2010-06-10 2013-03-05 Taiwan Semiconductor Manufacturing Company, Ltd. Quadrangle MOS transistors
JP5043990B2 (ja) * 2010-06-18 2012-10-10 シャープ株式会社 半導体装置およびその製造方法
US9450074B1 (en) * 2011-07-29 2016-09-20 Maxim Integrated Products, Inc. LDMOS with field plate connected to gate
US9214457B2 (en) 2011-09-20 2015-12-15 Alpha & Omega Semiconductor Incorporated Method of integrating high voltage devices
US8916913B2 (en) * 2012-07-13 2014-12-23 Monolithic Power Systems, Inc. High voltage semiconductor device and the associated method of manufacturing
US20140175526A1 (en) * 2012-12-20 2014-06-26 Macronix International Co., Ltd. Semiconductor device for current control and method thereof
US8981475B2 (en) 2013-06-18 2015-03-17 International Business Machines Corporation Lateral diffusion metal oxide semiconductor (LDMOS)
CN105556647B (zh) * 2013-07-19 2017-06-13 日产自动车株式会社 半导体装置及其制造方法
US9219146B2 (en) * 2013-12-27 2015-12-22 Monolithic Power Systems, Inc. High voltage PMOS and the method for forming thereof
GB201418752D0 (en) * 2014-10-22 2014-12-03 Rolls Royce Plc Lateral field effect transistor device
US9583612B1 (en) * 2016-01-21 2017-02-28 Texas Instruments Incorporated Drift region implant self-aligned to field relief oxide with sidewall dielectric
US20170292047A1 (en) 2016-04-12 2017-10-12 Rextac Llc Hexene-1 Containing Amorphous Polyalphaolefins For Improved Hot Melt Adhesives
TWM547757U (zh) 2017-01-20 2017-08-21 杰力科技股份有限公司 功率晶片及其電晶體結構
KR20190118745A (ko) * 2018-04-11 2019-10-21 주식회사 디비하이텍 3d 채널 영역을 형성하는 반도체 소자 및 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4148047A (en) * 1978-01-16 1979-04-03 Honeywell Inc. Semiconductor apparatus
JPS63262873A (ja) * 1987-04-21 1988-10-31 Fuji Xerox Co Ltd 半導体装置
US4922327A (en) * 1987-12-24 1990-05-01 University Of Toronto Innovations Foundation Semiconductor LDMOS device with upper and lower passages
JPH01207976A (ja) * 1988-02-15 1989-08-21 Nec Corp 半導体装置
US5072267A (en) * 1989-06-28 1991-12-10 Nec Corporation Complementary field effect transistor
JP2545762B2 (ja) * 1990-04-13 1996-10-23 日本電装株式会社 高耐圧misトランジスタおよびこのトランジスタを有する相補型トランジスタの製造方法
US5306652A (en) * 1991-12-30 1994-04-26 Texas Instruments Incorporated Lateral double diffused insulated gate field effect transistor fabrication process
US5412239A (en) * 1993-05-14 1995-05-02 Siliconix Incorporated Contact geometry for improved lateral MOSFET
US5355008A (en) * 1993-11-19 1994-10-11 Micrel, Inc. Diamond shaped gate mesh for cellular MOS transistor array

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6638827B2 (en) 2000-04-26 2003-10-28 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing it
US7087961B2 (en) 2000-04-26 2006-08-08 Sanyo Electric Co., Ltd. Semiconductor device with reduced on-state resistance
JP2003303961A (ja) * 2002-04-09 2003-10-24 Sanyo Electric Co Ltd Mos半導体装置
JPWO2005029590A1 (ja) * 2003-09-18 2006-11-30 新電元工業株式会社 横型短チャネルdmos及びその製造方法並びに半導体装置
JP2014209634A (ja) * 2007-03-28 2014-11-06 アドバンスト・アナロジック・テクノロジーズ・インコーポレイテッドAdvanced Analogic Technologies Incorporated 絶縁分離された集積回路装置
JP2011508978A (ja) * 2007-12-28 2011-03-17 ヴォルテラ セミコンダクター コーポレイション 二重拡散型ソースmosfet(ldmos)トランジスタの高ドープ領域及びその作製方法
WO2009091840A3 (en) * 2008-01-14 2009-09-24 Volterra Semiconductor Corporation Power transistor with protected channel
US8664728B2 (en) 2008-01-14 2014-03-04 Volterra Semiconductor Corporation Power transistor with protected channel
US9224603B2 (en) 2008-01-14 2015-12-29 Volterra Semiconductor LLC Method of fabricating power transistor with protected channel
JP2009239096A (ja) * 2008-03-27 2009-10-15 Renesas Technology Corp 半導体装置
JP2011103376A (ja) * 2009-11-11 2011-05-26 Renesas Electronics Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
US5517046A (en) 1996-05-14
AU3593395A (en) 1996-04-19
DE69513680D1 (de) 2000-01-05
EP0788659A1 (en) 1997-08-13
WO1996010267A1 (en) 1996-04-04
EP0788659A4 (OSRAM) 1997-09-10
DE69513680T2 (de) 2000-05-11
EP0788659B1 (en) 1999-12-01

Similar Documents

Publication Publication Date Title
JPH10506755A (ja) エンハンストドリフト領域を備える高電圧横型dmosデバイス
US5447876A (en) Method of making a diamond shaped gate mesh for cellular MOS transistor array
US7265041B2 (en) Gate layouts for transistors
US5618688A (en) Method of forming a monolithic semiconductor integrated circuit having an N-channel JFET
US4636822A (en) GaAs short channel lightly doped drain MESFET structure and fabrication
KR100967883B1 (ko) 개선된 드레인 접점을 가진 트렌치 dmos 디바이스
US4750024A (en) Offset floating gate EPROM memory cell
JPH07105457B2 (ja) 半導体デバイスの形成方法
US5382536A (en) Method of fabricating lateral DMOS structure
US5187109A (en) Lateral bipolar transistor and method of making the same
JPH0645532A (ja) 自己整合型ウエルタップを有するbicmos装置及びその製造方法
JPH09298301A (ja) Mos技術パワーデバイス
US6300657B1 (en) Self-aligned dynamic threshold CMOS device
JPH03241771A (ja) 高い抵抗性の無定形シリコン抵抗器を含む集積回路を形成する方法
JPH09252115A (ja) Mos技術パワーデバイス
US5703389A (en) Vertical IGFET configuration having low on-resistance and method
EP0172193B1 (en) Programmable read-only memory cell and method of fabrication
US4001048A (en) Method of making metal oxide semiconductor structures using ion implantation
US4764481A (en) Grown side-wall silicided source/drain self-align CMOS fabrication process
EP0337720B1 (en) Method for fabricating a bipolar transistor
JP3099917B2 (ja) 電界効果トランジスタ
US6004855A (en) Process for producing a high performance bipolar structure
JP2919494B2 (ja) 縦型mosfet
US5444292A (en) Integrated thin film approach to achieve high ballast levels for overlay structures
JP3001045B2 (ja) 半導体装置及びその製造方法