DE69513680D1 - Laterale hochspannungs-dmos-anordnung mit höherer driftzone - Google Patents
Laterale hochspannungs-dmos-anordnung mit höherer driftzoneInfo
- Publication number
- DE69513680D1 DE69513680D1 DE69513680T DE69513680T DE69513680D1 DE 69513680 D1 DE69513680 D1 DE 69513680D1 DE 69513680 T DE69513680 T DE 69513680T DE 69513680 T DE69513680 T DE 69513680T DE 69513680 D1 DE69513680 D1 DE 69513680D1
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- high voltage
- drift zone
- lateral high
- voltage dmos
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/313,471 US5447876A (en) | 1993-11-19 | 1994-09-27 | Method of making a diamond shaped gate mesh for cellular MOS transistor array |
US08/384,168 US5517046A (en) | 1993-11-19 | 1995-02-06 | High voltage lateral DMOS device with enhanced drift region |
PCT/US1995/011959 WO1996010267A1 (en) | 1994-09-27 | 1995-09-25 | High voltage lateral dmos device with enhanced drift region |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69513680D1 true DE69513680D1 (de) | 2000-01-05 |
DE69513680T2 DE69513680T2 (de) | 2000-05-11 |
Family
ID=26978899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69513680T Expired - Fee Related DE69513680T2 (de) | 1994-09-27 | 1995-09-25 | Laterale hochspannungs-dmos-anordnung mit höherer driftzone |
Country Status (6)
Country | Link |
---|---|
US (1) | US5517046A (de) |
EP (1) | EP0788659B1 (de) |
JP (1) | JPH10506755A (de) |
AU (1) | AU3593395A (de) |
DE (1) | DE69513680T2 (de) |
WO (1) | WO1996010267A1 (de) |
Families Citing this family (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6831331B2 (en) | 1995-11-15 | 2004-12-14 | Denso Corporation | Power MOS transistor for absorbing surge current |
US6242787B1 (en) | 1995-11-15 | 2001-06-05 | Denso Corporation | Semiconductor device and manufacturing method thereof |
US6071768A (en) * | 1996-05-17 | 2000-06-06 | Texas Instruments Incorporated | Method of making an efficient NPN turn-on in a high voltage DENMOS transistor for ESD protection |
SE513283C2 (sv) * | 1996-07-26 | 2000-08-14 | Ericsson Telefon Ab L M | MOS-transistorstruktur med utsträckt driftregion |
US5846866A (en) * | 1997-02-07 | 1998-12-08 | National Semiconductor Corporation | Drain extension regions in low voltage lateral DMOS devices |
EP0880183A3 (de) * | 1997-05-23 | 1999-07-28 | Texas Instruments Incorporated | LDMOS-Leistungsanordnung |
EP0922302A2 (de) * | 1997-05-23 | 1999-06-16 | Koninklijke Philips Electronics N.V. | Laterale mos transistoranordnung |
KR100244282B1 (ko) * | 1997-08-25 | 2000-02-01 | 김영환 | 고전압 트랜지스터의 구조 및 제조 방법 |
US6133077A (en) * | 1998-01-13 | 2000-10-17 | Lsi Logic Corporation | Formation of high-voltage and low-voltage devices on a semiconductor substrate |
US6020239A (en) * | 1998-01-28 | 2000-02-01 | International Business Machines Corporation | Pillar transistor incorporating a body contact |
US6150200A (en) * | 1998-04-03 | 2000-11-21 | Motorola, Inc. | Semiconductor device and method of making |
US6303961B1 (en) * | 1998-04-29 | 2001-10-16 | Aqere Systems Guardian Corp. | Complementary semiconductor devices |
US6096606A (en) * | 1998-05-04 | 2000-08-01 | Motorola, Inc. | Method of making a semiconductor device |
US6093585A (en) * | 1998-05-08 | 2000-07-25 | Lsi Logic Corporation | High voltage tolerant thin film transistor |
US6252278B1 (en) * | 1998-05-18 | 2001-06-26 | Monolithic Power Systems, Inc. | Self-aligned lateral DMOS with spacer drift region |
JP3443355B2 (ja) * | 1999-03-12 | 2003-09-02 | 三洋電機株式会社 | 半導体装置の製造方法 |
KR100336557B1 (ko) * | 1999-09-14 | 2002-05-11 | 박종섭 | 정전방전보호소자 제조방법 |
US6271552B1 (en) * | 1999-10-04 | 2001-08-07 | Xemod, Inc | Lateral RF MOS device with improved breakdown voltage |
US6784059B1 (en) * | 1999-10-29 | 2004-08-31 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing thereof |
US6683349B1 (en) * | 1999-10-29 | 2004-01-27 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing the same |
ATE514192T1 (de) * | 2000-03-31 | 2011-07-15 | Ihp Gmbh | Cmos-kompatibler lateraler dmos-transistor |
TW512533B (en) | 2000-04-26 | 2002-12-01 | Sanyo Electric Co | Semiconductor device and its manufacturing process |
EP1158583A1 (de) * | 2000-05-23 | 2001-11-28 | STMicroelectronics S.r.l. | LDMOS mit niedrigem Anschaltwiderstand |
JP2002094063A (ja) * | 2000-09-11 | 2002-03-29 | Toshiba Corp | 半導体装置 |
JP2002217407A (ja) * | 2001-01-16 | 2002-08-02 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
JP4030269B2 (ja) * | 2001-03-06 | 2008-01-09 | 三洋電機株式会社 | 半導体装置とその製造方法 |
US6683346B2 (en) * | 2001-03-09 | 2004-01-27 | Fairchild Semiconductor Corporation | Ultra dense trench-gated power-device with the reduced drain-source feedback capacitance and Miller charge |
US7109558B2 (en) | 2001-06-06 | 2006-09-19 | Denso Corporation | Power MOS transistor having capability for setting substrate potential independently of source potential |
US7291884B2 (en) * | 2001-07-03 | 2007-11-06 | Siliconix Incorporated | Trench MIS device having implanted drain-drift region and thick bottom oxide |
US7033876B2 (en) * | 2001-07-03 | 2006-04-25 | Siliconix Incorporated | Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same |
US20060038223A1 (en) * | 2001-07-03 | 2006-02-23 | Siliconix Incorporated | Trench MOSFET having drain-drift region comprising stack of implanted regions |
US7009247B2 (en) * | 2001-07-03 | 2006-03-07 | Siliconix Incorporated | Trench MIS device with thick oxide layer in bottom of gate contact trench |
US6563142B2 (en) | 2001-07-11 | 2003-05-13 | Lumileds Lighting, U.S., Llc | Reducing the variation of far-field radiation patterns of flipchip light emitting diodes |
US6486034B1 (en) * | 2001-07-20 | 2002-11-26 | Taiwan Semiconductor Manufacturing Company | Method of forming LDMOS device with double N-layering |
US6475870B1 (en) | 2001-07-23 | 2002-11-05 | Taiwan Semiconductor Manufacturing Company | P-type LDMOS device with buried layer to solve punch-through problems and process for its manufacture |
US6593621B2 (en) * | 2001-08-23 | 2003-07-15 | Micrel, Inc. | LDMOS field effect transistor with improved ruggedness in narrow curved areas |
DE10156468A1 (de) * | 2001-11-16 | 2003-05-28 | Eupec Gmbh & Co Kg | Halbleiterbauelement und Verfahren zum Kontaktieren eines solchen Halbleiterbauelements |
JP2003303961A (ja) * | 2002-04-09 | 2003-10-24 | Sanyo Electric Co Ltd | Mos半導体装置 |
US7635621B2 (en) * | 2002-11-22 | 2009-12-22 | Micrel, Inc. | Lateral double-diffused metal oxide semiconductor (LDMOS) device with an enhanced drift region that has an improved Ron area product |
US6833586B2 (en) * | 2003-01-02 | 2004-12-21 | Micrel, Inc. | LDMOS transistor with high voltage source and drain terminals |
KR100493059B1 (ko) * | 2003-04-18 | 2005-06-02 | 삼성전자주식회사 | 게이트 캐패시턴스를 감소시킬 수 있는 트랜지스터 |
US6946706B1 (en) | 2003-07-09 | 2005-09-20 | National Semiconductor Corporation | LDMOS transistor structure for improving hot carrier reliability |
US20050275027A1 (en) * | 2003-09-09 | 2005-12-15 | Micrel, Incorporated | ESD protection for integrated circuits |
WO2005029590A1 (ja) * | 2003-09-18 | 2005-03-31 | Shindengen Electric Manufacturing Co., Ltd. | 横型短チャネルdmos及びその製造方法並びに半導体装置 |
JP4800566B2 (ja) * | 2003-10-06 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
CN100376020C (zh) * | 2003-12-29 | 2008-03-19 | 中芯国际集成电路制造(上海)有限公司 | 一种制作具有延伸闸极晶体管的方法 |
US20050280053A1 (en) * | 2004-06-22 | 2005-12-22 | Hayes Monty B | Semiconductor device with diagonal gate signal distribution runner |
US7718448B1 (en) * | 2005-05-27 | 2010-05-18 | National Semiconductor Corporation | Method of monitoring process misalignment to reduce asymmetric device operation and improve the electrical and hot carrier performance of LDMOS transistor arrays |
US7868378B1 (en) * | 2005-07-18 | 2011-01-11 | Volterra Semiconductor Corporation | Methods and apparatus for LDMOS transistors |
US7375408B2 (en) * | 2005-10-11 | 2008-05-20 | United Microelectronics Corp. | Fabricating method of a high voltage metal oxide semiconductor device |
US7956384B2 (en) * | 2006-06-23 | 2011-06-07 | Alpha & Omega Semiconductor Ltd. | Closed cell configuration to increase channel density for sub-micron planar semiconductor power device |
TWI312192B (en) * | 2006-09-18 | 2009-07-11 | Promos Technologies Inc | Semiconductor device and manufacture method thereof |
US7737526B2 (en) * | 2007-03-28 | 2010-06-15 | Advanced Analogic Technologies, Inc. | Isolated trench MOSFET in epi-less semiconductor sustrate |
CN100592533C (zh) * | 2007-10-15 | 2010-02-24 | 天钰科技股份有限公司 | 横向扩散金属氧化物晶体管 |
TWI394277B (zh) * | 2007-10-19 | 2013-04-21 | Fitipower Integrated Tech Inc | 橫向擴散金屬氧化物電晶體 |
US7999318B2 (en) * | 2007-12-28 | 2011-08-16 | Volterra Semiconductor Corporation | Heavily doped region in double-diffused source MOSFET (LDMOS) transistor and a method of fabricating the same |
CN101933147B (zh) | 2008-01-14 | 2012-07-04 | 沃特拉半导体公司 | 具保护沟道的功率晶体管及其制造方法 |
JP2009239096A (ja) * | 2008-03-27 | 2009-10-15 | Renesas Technology Corp | 半導体装置 |
US8114750B2 (en) * | 2008-04-17 | 2012-02-14 | International Business Machines Corporation | Lateral diffusion field effect transistor with drain region self-aligned to gate electrode |
JP5420854B2 (ja) * | 2008-04-28 | 2014-02-19 | パナソニック株式会社 | 半導体装置およびその製造方法 |
US7851314B2 (en) * | 2008-04-30 | 2010-12-14 | Alpha And Omega Semiconductor Incorporated | Short channel lateral MOSFET and method |
US7759923B2 (en) * | 2008-07-08 | 2010-07-20 | Micrel, Inc. | Current sensing in a buck-boost switching regulator using integrally embedded PMOS devices |
KR20100064264A (ko) * | 2008-12-04 | 2010-06-14 | 주식회사 동부하이텍 | 반도체 소자 및 이의 제조 방법 |
US8049307B2 (en) * | 2009-01-23 | 2011-11-01 | Vanguard International Semiconductor Corporation | Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices |
JP5525736B2 (ja) * | 2009-02-18 | 2014-06-18 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置及びその製造方法 |
US9184097B2 (en) * | 2009-03-12 | 2015-11-10 | System General Corporation | Semiconductor devices and formation methods thereof |
CA2769940C (en) * | 2009-08-04 | 2016-04-26 | Gan Systems Inc. | Island matrixed gallium nitride microwave and power switching transistors |
US8048765B2 (en) * | 2009-08-28 | 2011-11-01 | Broadcom Corporation | Method for fabricating a MOS transistor with source/well heterojunction and related structure |
US20110062554A1 (en) * | 2009-09-17 | 2011-03-17 | Hsing Michael R | High voltage floating well in a silicon die |
DE102009051745B4 (de) | 2009-11-03 | 2017-09-21 | Austriamicrosystems Ag | Hochvolt-Transistor mit Mehrfach-Dielektrikum und Herstellungsverfahren |
JP5784269B2 (ja) * | 2009-11-11 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
KR101128694B1 (ko) * | 2009-11-17 | 2012-03-23 | 매그나칩 반도체 유한회사 | 반도체 장치 |
US8362557B2 (en) * | 2009-12-02 | 2013-01-29 | Fairchild Semiconductor Corporation | Stepped-source LDMOS architecture |
US8390078B2 (en) * | 2010-06-10 | 2013-03-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Quadrangle MOS transistors |
JP5043990B2 (ja) * | 2010-06-18 | 2012-10-10 | シャープ株式会社 | 半導体装置およびその製造方法 |
US9450074B1 (en) * | 2011-07-29 | 2016-09-20 | Maxim Integrated Products, Inc. | LDMOS with field plate connected to gate |
US9214457B2 (en) | 2011-09-20 | 2015-12-15 | Alpha & Omega Semiconductor Incorporated | Method of integrating high voltage devices |
US8916913B2 (en) * | 2012-07-13 | 2014-12-23 | Monolithic Power Systems, Inc. | High voltage semiconductor device and the associated method of manufacturing |
US20140175526A1 (en) * | 2012-12-20 | 2014-06-26 | Macronix International Co., Ltd. | Semiconductor device for current control and method thereof |
US8981475B2 (en) | 2013-06-18 | 2015-03-17 | International Business Machines Corporation | Lateral diffusion metal oxide semiconductor (LDMOS) |
WO2015008550A1 (ja) * | 2013-07-19 | 2015-01-22 | 日産自動車株式会社 | 半導体装置及びその製造方法 |
US9219146B2 (en) * | 2013-12-27 | 2015-12-22 | Monolithic Power Systems, Inc. | High voltage PMOS and the method for forming thereof |
GB201418752D0 (en) * | 2014-10-22 | 2014-12-03 | Rolls Royce Plc | Lateral field effect transistor device |
US9583612B1 (en) * | 2016-01-21 | 2017-02-28 | Texas Instruments Incorporated | Drift region implant self-aligned to field relief oxide with sidewall dielectric |
US20170292047A1 (en) | 2016-04-12 | 2017-10-12 | Rextac Llc | Hexene-1 Containing Amorphous Polyalphaolefins For Improved Hot Melt Adhesives |
TWM547757U (zh) | 2017-01-20 | 2017-08-21 | 杰力科技股份有限公司 | 功率晶片及其電晶體結構 |
KR20190118745A (ko) * | 2018-04-11 | 2019-10-21 | 주식회사 디비하이텍 | 3d 채널 영역을 형성하는 반도체 소자 및 제조방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4148047A (en) * | 1978-01-16 | 1979-04-03 | Honeywell Inc. | Semiconductor apparatus |
JPS63262873A (ja) * | 1987-04-21 | 1988-10-31 | Fuji Xerox Co Ltd | 半導体装置 |
US4922327A (en) * | 1987-12-24 | 1990-05-01 | University Of Toronto Innovations Foundation | Semiconductor LDMOS device with upper and lower passages |
JPH01207976A (ja) * | 1988-02-15 | 1989-08-21 | Nec Corp | 半導体装置 |
US5072267A (en) * | 1989-06-28 | 1991-12-10 | Nec Corporation | Complementary field effect transistor |
JP2545762B2 (ja) * | 1990-04-13 | 1996-10-23 | 日本電装株式会社 | 高耐圧misトランジスタおよびこのトランジスタを有する相補型トランジスタの製造方法 |
US5306652A (en) * | 1991-12-30 | 1994-04-26 | Texas Instruments Incorporated | Lateral double diffused insulated gate field effect transistor fabrication process |
US5412239A (en) * | 1993-05-14 | 1995-05-02 | Siliconix Incorporated | Contact geometry for improved lateral MOSFET |
US5355008A (en) * | 1993-11-19 | 1994-10-11 | Micrel, Inc. | Diamond shaped gate mesh for cellular MOS transistor array |
-
1995
- 1995-02-06 US US08/384,168 patent/US5517046A/en not_active Expired - Lifetime
- 1995-09-25 JP JP8511865A patent/JPH10506755A/ja active Pending
- 1995-09-25 AU AU35933/95A patent/AU3593395A/en not_active Abandoned
- 1995-09-25 WO PCT/US1995/011959 patent/WO1996010267A1/en active IP Right Grant
- 1995-09-25 DE DE69513680T patent/DE69513680T2/de not_active Expired - Fee Related
- 1995-09-25 EP EP95933172A patent/EP0788659B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0788659B1 (de) | 1999-12-01 |
US5517046A (en) | 1996-05-14 |
WO1996010267A1 (en) | 1996-04-04 |
AU3593395A (en) | 1996-04-19 |
EP0788659A4 (de) | 1997-09-10 |
EP0788659A1 (de) | 1997-08-13 |
DE69513680T2 (de) | 2000-05-11 |
JPH10506755A (ja) | 1998-06-30 |
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