JP7087205B2 - 半導体用パッケージングガラス基板、半導体用パッケージング基板及び半導体装置 - Google Patents
半導体用パッケージングガラス基板、半導体用パッケージング基板及び半導体装置 Download PDFInfo
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- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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Description
韓国公開特許公報第10-2016-0114710号、
韓国登録特許公報第10-1468680号などがある。
1)準備ステップ(ガラス欠陥形成過程):平坦な第1面及び第2面を有するガラス基板21aを準備し、コアビアの形成のために予め定められた位置のガラス表面に欠陥(溝、21b)を形成した。このとき、前記欠陥は、1cm2当たり225個又は1024個が形成されるようにした。前記ガラスとしては、ホウケイ酸ガラスを適用した。前記欠陥(溝)の形成には、機械的なエッチング及びレーザー照射方式が適用された。
超音波出力80%に条件を変更したことを除いては、前記実施例1と同一にして基板を製造した。
エッチングは、1.1Mのフッ酸(HF)、1.1Mの硝酸(HNO3)及び脱イオン水で充填されたエッチングバス内に前記ガラス基板を位置させ、80Hz、100%出力でエッチングしたことを除いては、前記実施例1と同一にして基板を製造した。
エッチング時の超音波出力80%に条件を変更したことを除いては、前記実施例3と同一にして基板を製造した。
前記応力は、複屈折2次元評価装置を適用して分析した。複屈折の2次元分布評価装置としては、NPM社(Nippon Pulse Korea Co.,LTD)のWPA-200装置を適用した。
3-1)コア層製造ステップ:ガラス基板上に電気伝導性層21dを形成した。前記電気伝導性層としては、銅金属を含む金属層が適用された。チタンを含有するスパッタ層を形成し、銅めっきを進めた。
30:半導体素子部 32:第1半導体素子
34:第2半導体素子 36:第3半導体素子
20:パッケージング基板 22:コア層
223:コア絶縁層 21、21a:ガラス基板
213:第1面 214:第2面
215:半導体パッケージング基板
23:コアビア 233:第1開口部
234:第2開口部 235:最小内径部
24:コア分配層 241:コア分配パターン
241a:第1面分配パターン 241b:コアビア分配パターン
241c:第2面分配パターン 26:上部層
25:上部分配層 251:上部分配パターン
252:ブラインドビア 253:上部絶縁層
27:上面接続層 271:上面接続電極
272:上面連結パターン 29:下部層
291:下部分配層 291a:下部分配パターン
291b:下部絶縁層 292:下面接続層
292a:下面接続電極 292b:下面連結パターン
50:連結部 51:素子連結部
52:ボード連結部 60:カバー層
21b:ガラス欠陥 21c:シード層、プライマー層
21d:コア分配層 21e:コア分配層のエッチング層
23a:絶縁層 23b:絶縁層のエッチング層
23c:電気伝導性層 23d:電気伝導性層のエッチング層
23e:絶縁層 23f:絶縁層のエッチング層
23g:電気伝導性層 23h:電気伝導性層のエッチング層
Claims (10)
- 互いに向かい合う第1面及び第2面を有するガラス基板;及び
前記ガラス基板を厚さ方向に貫通する多数のコアビア;
を含み、
無地ラインは、前記ガラス基板の第1面上で前記コアビアが形成されていない場所をつなぐ直線で、
ビアラインは、前記ガラス基板の第1面上で前記コアビアが形成された場所をつなぐ直線で、
応力差値(P)は、下記の式(1)による値で、
前記応力差値(P)が1.5MPa以下である、半導体用パッケージングガラス基板;
式(1):P=Vp-Np
式(1)において、
Pは、同一のガラス基板で測定した応力差値で、
Vpは、ビアラインで測定した応力の最大値と最小値との差で、
Npは、無地ラインで測定した応力の最大値と最小値との差である。 - 前記Vp値は2.5MPa以下である、請求項1に記載の半導体用パッケージングガラス基板。
- 前記Np値は1.0MPa以下である、請求項1に記載の半導体用パッケージングガラス基板。
- 前記コアビアは、前記ガラス基板の単位面積(1cm×1cm)を基準にして100個~3000個が位置する、請求項1に記載の半導体用パッケージングガラス基板。
- 互いに向かい合う第1面及び第2面を有するガラス基板;及び
前記ガラス基板を厚さ方向に貫通する多数のコアビア;
を含み、
無地ラインは、前記ガラス基板の第1面上で前記コアビアが形成されていない場所をつなぐ直線で、
ビアラインは、前記ガラス基板の第1面上で前記コアビアが形成された場所をつなぐ直線で、
対象ラインは、無地ライン又はビアラインで、
応力差比率(K)は、下記の式(2)による値で、
前記応力差比率(K)が6以下である、半導体用パッケージングガラス基板;
式(2):K=Lp/La
式(2)において、
前記Kは、同一のガラス基板の同一の面で測定した応力差比率で、
前記Lpは、対象ラインに対して測定した応力の最大値と最小値との差で、
前記Laは、前記対象ラインで測定した応力の平均値である。 - 前記対象ラインは無地ラインで、
前記応力差比率(K)は2以下である、請求項5に記載の半導体用パッケージングガラス基板。 - 前記対象ラインはビアラインで、
前記応力差比率(K)は6以下である、請求項5に記載の半導体用パッケージングガラス基板。 - 前記コアビアは、前記ガラス基板の単位面積(1cm×1cm)を基準にして100個~3000個が位置する、請求項5に記載の半導体用パッケージングガラス基板。
- 請求項1又は5による半導体パッケージング用ガラス基板を含み、
前記コアビアの表面上に位置するコア層をさらに含み、
前記コア層は、電気伝導性層形成のシードになるコアシード層又は電気伝導性層であるコア分配層を含む、半導体パッケージング基板。 - 1以上の半導体素子を含む半導体素子部;
前記半導体素子部と電気的に連結されるパッケージング基板;及び
前記パッケージング基板と電気的に連結され、前記半導体素子に外部の電気的信号を伝達し、前記半導体素子を互いに連結するマザーボード;を含み、前記パッケージング基板は請求項9によるパッケージング基板である、半導体装置。
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CN114678344A (zh) | 2022-06-28 |
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CN113383413A (zh) | 2021-09-10 |
JP2022123003A (ja) | 2022-08-23 |
KR20210071074A (ko) | 2021-06-15 |
KR102314986B1 (ko) | 2021-10-19 |
JP2022517062A (ja) | 2022-03-04 |
KR102515304B1 (ko) | 2023-03-29 |
EP3910667A1 (en) | 2021-11-17 |
WO2020204473A1 (ko) | 2020-10-08 |
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KR20210130241A (ko) | 2021-10-29 |
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