JP6358431B2 - 電子部品装置及びその製造方法 - Google Patents

電子部品装置及びその製造方法 Download PDF

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Publication number
JP6358431B2
JP6358431B2 JP2014170410A JP2014170410A JP6358431B2 JP 6358431 B2 JP6358431 B2 JP 6358431B2 JP 2014170410 A JP2014170410 A JP 2014170410A JP 2014170410 A JP2014170410 A JP 2014170410A JP 6358431 B2 JP6358431 B2 JP 6358431B2
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JP
Japan
Prior art keywords
layer
electronic component
wiring board
insulating layer
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014170410A
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English (en)
Japanese (ja)
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JP2016046418A5 (enExample
JP2016046418A (ja
Inventor
経塚　正宏
正宏 経塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014170410A priority Critical patent/JP6358431B2/ja
Priority to US14/833,578 priority patent/US10098228B2/en
Priority to KR1020150119249A priority patent/KR102331611B1/ko
Publication of JP2016046418A publication Critical patent/JP2016046418A/ja
Publication of JP2016046418A5 publication Critical patent/JP2016046418A5/ja
Application granted granted Critical
Publication of JP6358431B2 publication Critical patent/JP6358431B2/ja
Priority to US16/116,156 priority patent/US10383228B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H10W70/095—
    • H10W70/611—
    • H10W70/614—
    • H10W74/114—
    • H10W74/121—
    • H10W90/00—
    • H10W90/401—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H10W70/60—
    • H10W70/635—
    • H10W74/142—
    • H10W74/15—
    • H10W90/701—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
JP2014170410A 2014-08-25 2014-08-25 電子部品装置及びその製造方法 Active JP6358431B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014170410A JP6358431B2 (ja) 2014-08-25 2014-08-25 電子部品装置及びその製造方法
US14/833,578 US10098228B2 (en) 2014-08-25 2015-08-24 Electronic component device and method for manufacturing the same
KR1020150119249A KR102331611B1 (ko) 2014-08-25 2015-08-25 전자 부품 장치 및 그 제조 방법
US16/116,156 US10383228B2 (en) 2014-08-25 2018-08-29 Electronic component device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014170410A JP6358431B2 (ja) 2014-08-25 2014-08-25 電子部品装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2016046418A JP2016046418A (ja) 2016-04-04
JP2016046418A5 JP2016046418A5 (enExample) 2017-05-18
JP6358431B2 true JP6358431B2 (ja) 2018-07-18

Family

ID=55349564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014170410A Active JP6358431B2 (ja) 2014-08-25 2014-08-25 電子部品装置及びその製造方法

Country Status (3)

Country Link
US (2) US10098228B2 (enExample)
JP (1) JP6358431B2 (enExample)
KR (1) KR102331611B1 (enExample)

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JP6444269B2 (ja) * 2015-06-19 2018-12-26 新光電気工業株式会社 電子部品装置及びその製造方法
JP2017041500A (ja) * 2015-08-18 2017-02-23 イビデン株式会社 プリント配線板および半導体パッケージ
CN208227405U (zh) * 2015-10-15 2018-12-11 株式会社村田制作所 树脂基板及部件安装树脂基板
CN108713351B (zh) * 2016-03-11 2021-01-15 本田技研工业株式会社 电子电路基板及超声波接合方法
JP6770331B2 (ja) * 2016-05-02 2020-10-14 ローム株式会社 電子部品およびその製造方法
US10062626B2 (en) * 2016-07-26 2018-08-28 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
JP6726309B2 (ja) * 2017-01-05 2020-07-22 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 高信頼性電子パッケージ構造、回路基板及びデバイス
KR102059478B1 (ko) * 2017-09-15 2019-12-26 스템코 주식회사 회로 기판 및 그 제조 방법
KR102449368B1 (ko) * 2017-10-20 2022-09-30 삼성전기주식회사 다층 인쇄회로기판
US10957672B2 (en) * 2017-11-13 2021-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
KR102467001B1 (ko) * 2017-12-05 2022-11-14 삼성전자주식회사 이미지 센서 모듈용 기판 구조체 및 이를 포함하는 이미지 센서 모듈
WO2019133008A1 (en) 2017-12-30 2019-07-04 Intel Corporation Ultra-thin, hyper-density semiconductor packages
KR102071457B1 (ko) * 2018-03-13 2020-01-30 삼성전자주식회사 팬-아웃 반도체 패키지
JP2020013908A (ja) * 2018-07-18 2020-01-23 住友電工デバイス・イノベーション株式会社 電子部品の実装構造
US11322447B2 (en) 2019-08-16 2022-05-03 Taiwan Semiconductor Manufacturing Company, Ltd. Dual-sided routing in 3D SiP structure
KR102424641B1 (ko) * 2019-08-16 2022-07-25 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 반도체 패키지 및 그 형성 방법
DE102020105134A1 (de) 2019-09-27 2021-04-01 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleiterpackage und herstellungsverfahren
US11355428B2 (en) * 2019-09-27 2022-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package
US12308738B2 (en) * 2019-12-18 2025-05-20 Delta Electronics (Shanghai) Co., Ltd. Power module
KR102746859B1 (ko) * 2020-01-23 2024-12-27 삼성전자주식회사 반도체 패키지 및 그 제조 방법
JP7421357B2 (ja) * 2020-02-05 2024-01-24 新光電気工業株式会社 部品内蔵基板及び部品内蔵基板の製造方法
KR102759371B1 (ko) * 2020-02-18 2025-01-24 삼성전자주식회사 반도체 패키지, 및 이를 가지는 패키지 온 패키지
US20250046690A1 (en) * 2023-08-04 2025-02-06 Avago Technologies International Sales Pte. Limited Hybrid substrates and manufacturing methods thereof

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347722A (ja) 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法
JP3914239B2 (ja) * 2005-03-15 2007-05-16 新光電気工業株式会社 配線基板および配線基板の製造方法
JP4016039B2 (ja) * 2005-06-02 2007-12-05 新光電気工業株式会社 配線基板および配線基板の製造方法
JP2007059821A (ja) * 2005-08-26 2007-03-08 Shinko Electric Ind Co Ltd 配線基板の製造方法
JPWO2007069606A1 (ja) * 2005-12-14 2009-05-21 新光電気工業株式会社 チップ内蔵基板の製造方法
JP4182140B2 (ja) * 2005-12-14 2008-11-19 新光電気工業株式会社 チップ内蔵基板
JP4182144B2 (ja) 2005-12-14 2008-11-19 新光電気工業株式会社 チップ内蔵基板の製造方法
US7830004B2 (en) * 2006-10-27 2010-11-09 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging with base layers comprising alloy 42
JP5326269B2 (ja) * 2006-12-18 2013-10-30 大日本印刷株式会社 電子部品内蔵配線板、及び電子部品内蔵配線板の放熱方法
JP5144222B2 (ja) * 2007-11-14 2013-02-13 新光電気工業株式会社 配線基板及びその製造方法
JP5079646B2 (ja) * 2008-08-26 2012-11-21 新光電気工業株式会社 半導体パッケージ及びその製造方法と半導体装置
JP5269563B2 (ja) 2008-11-28 2013-08-21 新光電気工業株式会社 配線基板とその製造方法
JP2010135418A (ja) * 2008-12-02 2010-06-17 Shinko Electric Ind Co Ltd 配線基板及び電子部品装置
JP5339928B2 (ja) * 2009-01-15 2013-11-13 新光電気工業株式会社 配線基板及びその製造方法
JP5570855B2 (ja) * 2010-03-18 2014-08-13 新光電気工業株式会社 配線基板及びその製造方法並びに半導体装置及びその製造方法
US20130049214A1 (en) * 2011-08-29 2013-02-28 Infineon Technologies Ag Method of processing at least one die and die arrangement
US9013037B2 (en) * 2011-09-14 2015-04-21 Stmicroelectronics Pte Ltd. Semiconductor package with improved pillar bump process and structure
JP5357239B2 (ja) * 2011-12-05 2013-12-04 新光電気工業株式会社 配線基板、半導体装置、及び配線基板の製造方法
WO2013180288A1 (ja) * 2012-05-31 2013-12-05 京セラ株式会社 電子素子搭載用基板および電子装置
JP5903337B2 (ja) * 2012-06-08 2016-04-13 新光電気工業株式会社 半導体パッケージ及びその製造方法
JP6152254B2 (ja) * 2012-09-12 2017-06-21 新光電気工業株式会社 半導体パッケージ、半導体装置及び半導体パッケージの製造方法
US20140239428A1 (en) * 2013-02-28 2014-08-28 Infineon Technologies Ag Chip arrangement and a method for manufacturing a chip arrangement
US20140367854A1 (en) * 2013-06-17 2014-12-18 Broadcom Corporation Interconnect structure for molded ic packages

Also Published As

Publication number Publication date
KR20160024802A (ko) 2016-03-07
US10098228B2 (en) 2018-10-09
US20190029113A1 (en) 2019-01-24
US10383228B2 (en) 2019-08-13
US20160057863A1 (en) 2016-02-25
JP2016046418A (ja) 2016-04-04
KR102331611B1 (ko) 2021-11-30

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