JP6194002B2 - 大量転写ツール - Google Patents
大量転写ツール Download PDFInfo
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- JP6194002B2 JP6194002B2 JP2015531125A JP2015531125A JP6194002B2 JP 6194002 B2 JP6194002 B2 JP 6194002B2 JP 2015531125 A JP2015531125 A JP 2015531125A JP 2015531125 A JP2015531125 A JP 2015531125A JP 6194002 B2 JP6194002 B2 JP 6194002B2
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- carrier substrate
- transfer head
- substrate holder
- substrate
- mass transfer
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
- B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0085—Gripping heads and other end effectors with means for applying an electrostatic force on the object to be gripped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
Description
Claims (19)
- 大量転写ツールであって、
関節転写ヘッドアセンブリであって、
取付面と、
電気的コンタクトを有する静電電圧源接続部と、
静電転写ヘッドアレイを支持する基板であって、前記基板は、前記取付面に着脱自在に取り付け可能であり、前記取付面に取り付けられるとき、前記電気的コンタクトに電気的に接続される、基板と、
を含む、関節転写ヘッドアセンブリと、
キャリア基板ホルダと、
前記関節転写ヘッドアセンブリと前記キャリア基板ホルダとの間の空間的関係を調整するためのアクチュエータアセンブリと、
を備える、大量転写ツール。 - 前記取付面は、前記基板に吸引力を印加するために真空源に結合された真空ポートを含む、請求項1に記載の大量転写ツール。
- 前記静電電圧源接続部は、前記電気的コンタクトを有する弾性導体を含み、前記弾性導体は前記基板を押圧する、請求項1に記載の大量転写ツール。
- 前記アクチュエータアセンブリは、少なくとも自由度6での前記空間的関係を調整する、請求項1に記載の大量転写ツール。
- 前記アクチュエータアセンブリは、前記関節転写ヘッドアセンブリに結合されて少なくとも自由度4で関節転写ヘッドアセンブリの位置を調整する第1のアクチュエータサブアセンブリと、前記キャリア基板ホルダに結合され少なくとも自由度2でキャリア基板ホルダ位置を調整する第2のアクチュエータサブアセンブリと、を含む、請求項4に記載の大量転写ツール。
- 前記アクチュエータアセンブリは、前記関節転写ヘッドアセンブリに結合されて前記静電転写ヘッドアレイの接触面に直交する方向に前記関節転写ヘッドアセンブリの動きを制約する第1のフレクシャを含み、前記第1のフレクシャは第1の屈曲面を含む、請求項5に記載の大量転写ツール。
- 前記アクチュエータアセンブリは、前記関節転写ヘッドアセンブリに結合された第2のフレクシャを更に含み、前記第2のフレクシャは前記第1の屈曲面に実質的に平行に向き付けられた第2の屈曲面を含む、請求項6に記載の大量転写ツール。
- 前記関節転写ヘッドアセンブリの前記取付面に対して固定され、前記キャリア基板ホルダ上のキャリア基板の位置を検出する第1の位置センサを更に備える、請求項5に記載の大量転写ツール。
- 前記キャリア基板ホルダに対して固定され、前記関節転写ヘッドアセンブリの位置を検出する第2の位置センサを更に備える、請求項8に記載の大量転写ツール。
- 前記第1の位置センサと前記第2の位置センサは、共にスペクトル干渉レーザ変位計を含む、請求項9に記載の大量転写ツール。
- 前記アクチュエータアセンブリに結合されて前記第1の屈曲面の撓みを検出する第3の位置センサを更に備える、請求項6に記載の大量転写ツール。
- 前記キャリア基板ホルダに結合されて前記キャリア基板ホルダに印加される力を測定する力計を更に備える、請求項1に記載の大量転写ツール。
- 転写先基板ホルダを更に備える、請求項1に記載の大量転写ツール。
- 前記基板を加熱するヒータを更に備える、請求項1に記載の大量転写ツール。
- 前記キャリア基板ホルダに結合されて前記キャリア基板ホルダを加熱するヒータを更に備える、請求項1に記載の大量転写ツール。
- 前記転写先基板ホルダに結合されて前記転写先基板ホルダを加熱するヒータを更に備える、請求項13に記載の大量転写ツール。
- 前記関節転写ヘッドアセンブリに対して固定されて、第1の撮像面を有する第1の撮像装置と、
前記キャリア基板ホルダに対して固定されて、第2の撮像面を有する第2の撮像装置と、
前記第1の撮像面と前記第2の撮像面との間に位置する基準マークと、
を更に備える、請求項1に記載の大量転写ツール。 - 前記基準マークは、透明板の一部であり、非対称のパターンを含む、請求項17に記載の大量転写ツール。
- 前記第1の撮像装置及び前記第2の撮像装置は共にカメラを含む、請求項17に記載の大量転写ツール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/607,031 US9162880B2 (en) | 2012-09-07 | 2012-09-07 | Mass transfer tool |
US13/607,031 | 2012-09-07 | ||
PCT/US2013/056912 WO2014039335A1 (en) | 2012-09-07 | 2013-08-27 | Mass transfer tool |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015529400A JP2015529400A (ja) | 2015-10-05 |
JP6194002B2 true JP6194002B2 (ja) | 2017-09-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015531125A Active JP6194002B2 (ja) | 2012-09-07 | 2013-08-27 | 大量転写ツール |
Country Status (7)
Country | Link |
---|---|
US (3) | US9162880B2 (ja) |
JP (1) | JP6194002B2 (ja) |
KR (1) | KR101684815B1 (ja) |
CN (1) | CN104781922B (ja) |
DE (1) | DE112013004389B4 (ja) |
TW (1) | TWI574902B (ja) |
WO (1) | WO2014039335A1 (ja) |
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US20170015006A1 (en) | 2017-01-19 |
US9511498B2 (en) | 2016-12-06 |
KR20150052288A (ko) | 2015-05-13 |
US20140071580A1 (en) | 2014-03-13 |
US20160001450A1 (en) | 2016-01-07 |
TW201418129A (zh) | 2014-05-16 |
CN104781922A (zh) | 2015-07-15 |
TWI574902B (zh) | 2017-03-21 |
CN104781922B (zh) | 2017-04-26 |
US9162880B2 (en) | 2015-10-20 |
KR101684815B1 (ko) | 2016-12-08 |
DE112013004389B4 (de) | 2021-09-16 |
WO2014039335A1 (en) | 2014-03-13 |
DE112013004389T5 (de) | 2015-06-03 |
US10183401B2 (en) | 2019-01-22 |
JP2015529400A (ja) | 2015-10-05 |
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