JP5841936B2 - 多孔性コーティング層を備える電極の製造方法、その方法によって形成された電極、及びそれを備える電気化学素子 - Google Patents
多孔性コーティング層を備える電極の製造方法、その方法によって形成された電極、及びそれを備える電気化学素子 Download PDFInfo
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- JP5841936B2 JP5841936B2 JP2012516000A JP2012516000A JP5841936B2 JP 5841936 B2 JP5841936 B2 JP 5841936B2 JP 2012516000 A JP2012516000 A JP 2012516000A JP 2012516000 A JP2012516000 A JP 2012516000A JP 5841936 B2 JP5841936 B2 JP 5841936B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1212—Zeolites, glasses
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
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Description
(S1)金属アルコキシド化合物を含むゾル溶液を用意する段階と、
(S2)前記ゾル溶液を集電体の少なくとも一面に形成された電極活物質層の外面に電気噴射し、無機繊維からなる多孔性不織布コーティング層を形成する段階と、を含む。
(a)集電体及び前記集電体の少なくとも一面に形成された電極活物質層と、
(b)前記電極活物質層の外面に形成され、無機繊維からなった多孔性不織布コーティング層と、を備える。
(a)集電体、及び前記集電体の少なくとも一面に形成された電極活物質層と、
(b)前記電極活物質層の外面に形成され、無機繊維からなった多孔性不織布コーティング層と、を備える。
アルミニウムトリ‐sec‐ブトキシド5gをエタノール18.98mlと水0.22mlに混合し、60℃で3時間撹拌して熟成させた後、常温に冷却させてゾル溶液を用意した。次いで、製造したゾル溶液をシリンジポンプを用いて流量100uL/minで内径0.5mmの管を通じて移送した後、10kVを印加して電極(集電体の外面に正極活物質層が形成された電極)上に電気噴霧してコーティング層を形成した。
バリウムアセテート5.1gを酢酸12mlに溶解させた後、2時間撹拌した。撹拌を続きながら、5.9mLのチタンイソプロポキシドを徐々に添加し、5時間撹拌してゾル溶液を用意した。次いで、製造したゾル溶液をシリンジポンプを用いて流量100uL/minで内径0.5mmの管を通じて移送した後、10kVを印加して電極(集電体の外面に正極活物質層が形成された電極)上に電気噴霧してコーティング層を形成した。
アルミニウムトリ‐sec‐ブトキシド、エタノール、及び水を1:16:0.6のモル比で混合し、60℃で1時間撹拌して熟成させた後、常温に冷却させてゾル溶液を用意した。次いで、ゾル溶液、メタノール及び水を1:0.2:0.003の重量比で混合し、これに酢酸を3体積%添加して常温で30分間撹拌した。その後、5重量%のポリビニルアルコール水溶液をさらに添加して常温で2時間撹拌し、電気紡糸のためのゾル溶液を用意した。
バリウムアセテート1.275gを酢酸3mLに溶解させた後、2時間撹拌した。撹拌を続きながら1.475mLのチタンイソプロポキシドを徐々に添加し、ポリビニルピロリドンをエタノールに10重量%の濃度で溶解させた溶液をさらに添加した後、常温で2時間撹拌して電気紡糸のためのゾル溶液を用意した。
アラミドをジメチルアセトアミドに溶解させて高分子溶液を製造した後、約500nmの平均直径を有するAl2O3無機酸化物粒子を高分子:無機酸化物の重量比が8:2になるように添加し、ミキサーを用いて6時間分散させた。
アラミドをジメチルアセトアミドに溶解させて高分子溶液を製造した後、約50nmの平均直径を有するAl2O3無機酸化物粒子を高分子:無機酸化物の重量比が2:1になるように添加し、ミキサーを用いて6時間分散させた。
Claims (9)
- リチウム二次電池用電極の製造方法であって、
(S1)金属アルコキシド化合物を含むゾル溶液を用意する段階と、
(S2)前記ゾル溶液を集電体の少なくとも一面に形成された電極活物質層の外面に直接電気噴射し、無機繊維からなる多孔性不織布コーティング層を形成する段階とを含んでなり、
前記多孔性不織布コーティング層がセパレータ層である、リチウム二次電池用電極の製造方法。 - 前記金属アルコキシド化合物の金属が、アルカリ金属、アルカリ土類金属、及び遷移金属からなる群より選択される一種又は二種以上のものを含むことを特徴とする、請求項1に記載の電極の製造方法。
- 前記アルカリ金属がリチウムであることを特徴とする、請求項2に記載の電極の製造方法。
- 前記金属アルコキシド化合物が、珪素含有アルコキシド、アルミニウム含有アルコキシド、及びチタン含有アルコキシドからなる群より選択される一種又は二種以上の混合物であることを特徴とする、請求項1に記載の電極の製造方法。
- 前記珪素含有アルコキシドが、テトラアルキルオルトシリケート(炭素数1ないし4)であり、
前記アルミニウム含有アルコキシドが、アルミニウムセクブトキシド、アルミニウムイソプロポキシド、アルミニウムエトキシドからなる群より選択される一種又は二種以上の混合物であり、
前記チタン含有アルコキシドが、チタンイソプロポキシドまたはチタンアルキルアルコキシド(炭素数1ないし4)であることを特徴とする、請求項4に記載の電極の製造方法。 - 前記ゾル溶液が結合剤をさらに含むことを特徴とする、請求項1〜5の何れか一項に記載の電極の製造方法。
- 前記結合剤が、ポリフッ化ビニリデン‐ヘキサフルオロプロピレン、ポリフッ化ビニリデン‐トリクロロエチレン、ポリメチルメタクリレート、ポリアクリロニトリル、ポリビニルピロリドン、ポリビニルアセテート、ポリビニルアルコール、エチレンビニルアセテート共重合体、ポリエチレンオキサイド、セルロースアセテート、セルロースアセテートブチレート、セルロースアセテートプロピオネート、シアノエチルプルラン、シアノエチルポリビニルアルコール、シアノエチルセルロース、シアノエチルスクロース、プルラン、カルボキシルメチルセルロース、及び分子量10,000g/mol以下の低分子化合物からなる群より選択される一種又は二種以上の混合物であることを特徴とする、請求項6に記載の電極の製造方法。
- 前記(S2)段階後に、前記多孔性不織布コーティング層内の有機成分を分解させるために熱処理する段階をさらに含むことを特徴とする、請求項6に記載の電極の製造方法。
- 前記電気噴射が、電気紡糸または電気噴霧であることを特徴とする、請求項1〜8の何れか一項に記載の電極の製造方法。
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KR1020100061845A KR101032214B1 (ko) | 2009-06-30 | 2010-06-29 | 다공성 코팅층을 구비한 전극의 제조방법, 이로부터 형성된 전극 및 이를 구비한 전기화학소자 |
KR10-2010-0061845 | 2010-06-29 | ||
PCT/KR2010/004215 WO2011002205A2 (ko) | 2009-06-30 | 2010-06-29 | 다공성 코팅층을 구비한 전극의 제조방법, 이로부터 형성된 전극 및 이를 구비한 전기화학소자 |
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CN102473894A (zh) | 2012-05-23 |
JP2012531010A (ja) | 2012-12-06 |
CN102473894B (zh) | 2016-12-28 |
US20120003545A1 (en) | 2012-01-05 |
KR101032214B1 (ko) | 2011-05-02 |
WO2011002205A2 (ko) | 2011-01-06 |
EP2461395A4 (en) | 2014-07-16 |
US20120244292A1 (en) | 2012-09-27 |
PL2461395T3 (pl) | 2019-05-31 |
EP2461395B1 (en) | 2019-01-23 |
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