KR101032214B1 - 다공성 코팅층을 구비한 전극의 제조방법, 이로부터 형성된 전극 및 이를 구비한 전기화학소자 - Google Patents
다공성 코팅층을 구비한 전극의 제조방법, 이로부터 형성된 전극 및 이를 구비한 전기화학소자 Download PDFInfo
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- KR101032214B1 KR101032214B1 KR1020100061845A KR20100061845A KR101032214B1 KR 101032214 B1 KR101032214 B1 KR 101032214B1 KR 1020100061845 A KR1020100061845 A KR 1020100061845A KR 20100061845 A KR20100061845 A KR 20100061845A KR 101032214 B1 KR101032214 B1 KR 101032214B1
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- electrode
- coating layer
- metal
- electrochemical device
- nonwoven fabric
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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Abstract
본 발명의 전극 외면에 형성된 다공성 부직포 코팅층은 열적 안정성이 뛰어난 무기섬유로 구성되어 전기화학소자가 과열되는 경우에도 양극과 음극 사이의 단락을 억제할 수 있으며, 기공이 고르게 분포되어 있어 전기화학소자의 성능 향상에 기여한다.
Description
도 2는 실시예 2에 따라 전극 위에 형성된 코팅층의 SEM 사진이다.
도 3은 비교예 1에 따라 전극 위에 형성된 코팅층의 SEM 사진이다.
도 4는 비교예 2에 따라 전극 위에 형성된 코팅층의 SEM 사진이다.
Claims (21)
- (S1) 금속 알콕사이드 화합물을 포함하는 졸 용액을 준비하는 단계; 및
(S2) 상기 졸 용액을 집전체의 적어도 일면에 형성된 전극활물질층의 외면에 전기분사하여 무기섬유로 된 다공성 부직포 코팅층을 형성하는 단계를 포함하는 전극의 제조방법. - 제1항에 있어서,
상기 금속 알콕사이드 화합물의 금속은 알칼리 금속, 알칼리 토금속 및 전이 금속으로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상을 포함하는 것을 특징으로 하는 전극의 제조방법. - 제2항에 있어서,
상기 알칼리 금속은 리튬인 것을 특징으로 하는 전극의 제조방법. - 제1항에 있어서,
상기 금속 알콕사이드 화합물은 규소 함유 알콕사이드, 알루미늄 함유 알콕사이드 및 티타늄 함유 알콕사이드로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 혼합물인 것을 특징으로 하는 전극의 제조방법. - 제4항에 있어서,
상기 규소 함유 알콕사이드는 테트라알킬(탄소수가 1 내지 4)오르소실리케이트이고, 알루미늄 함유 알콕사이드는 알루미늄 세크부톡사이드, 알루미늄 이소프로톡사이드, 알루미늄 에톡사이드로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 혼합물이고, 티타늄 함유 알콕사이드는 티타늄 이소프로폭사이드 또는 티타늄 알킬(탄소수가 1 내지 4)알콕사이드인 것을 특징으로 하는 전극의 제조방법. - 제1항에 있어서,
상기 졸 용액은 결합제를 더 포함하는 것을 특징으로 하는 전극의 제조방법. - 제6항에 있어서,
상기 결합제는 폴리비닐리덴 플루오라이드-헥사플루오로프로필렌 (polyvinylidene fluoride-co-hexafluoropropylene), 폴리비닐리덴 플루오라이드-트리클로로에틸렌 (polyvinylidene fluoride-co-trichloroethylene), 폴리메틸메타크릴레이트 (polymethylmethacrylate), 폴리아크릴로니트릴 (polyacrylonitrile), 폴리비닐피롤리돈 (polyvinylpyrrolidone), 폴리비닐아세테이트 (polyvinylacetate), 폴리비닐알콜 (polyvinylalcohol), 에틸렌 비닐 아세테이트 공중합체 (polyethylene-co-vinyl acetate), 폴리에틸렌옥사이드 (polyethylene oxide), 셀룰로오스 아세테이트 (cellulose acetate), 셀룰로오스 아세테이트 부틸레이트 (cellulose acetate butyrate), 셀룰로오스 아세테이트 프로피오네이트 (cellulose acetate propionate), 시아노에틸플루란 (cyanoethylpullulan), 시아노에틸폴리비닐알콜 (cyanoethylpolyvinylalcohol), 시아노에틸셀룰로오스 (cyanoethylcellulose), 시아노에틸수크로오스 (cyanoethylsucrose), 플루란 (pullulan), 카르복실 메틸 셀룰로오스 (carboxyl methyl cellulose) 및 분자량 10,000 g/mol 이하의 저분자 화합물로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 혼합물인 것을 특징으로 하는 전극의 제조방법. - 제6항에 있어서,
상기 (S2) 단계 후에 상기 다공성 부직포 코팅층 내의 유기 성분을 분해시키기 위하여 열처리하는 단계를 더 포함하는 것을 특징으로 하는 전극의 제조방법. - 제1항에 있어서,
상기 전기분사는 전기방사(electrospinning) 또는 전기분무(electrospraying)인 것을 특징으로 하는 전극의 제조방법. - (a) 집전체 및 상기 집전체의 적어도 일면에 형성된 전극활물질층; 및
(b) 상기 전극활물질층의 외면에 형성되어 있으며, 무기섬유로 된 다공성 부직포 코팅층을 구비한 전극. - 제10항에 있어서,
상기 무기섬유는 무기섬유를 구성하는 무기 산화물 중 금속이 알칼리 금속, 알칼리 토금속 및 전이 금속으로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상을 포함하는 것을 특징으로 하는 전극. - 제11항에 있어서,
상기 알칼리 금속은 리튬인 것을 특징으로 하는 전극. - 제10항에 있어서,
상기 무기섬유는 SiO2, Al2O3, BaTiO3 및 TiO2로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 혼합물로 형성된 것을 특징으로 하는 전극. - 제10항에 있어서,
상기 무기섬유는 전기분사에 의해 형성된 것을 특징으로 하는 전극. - 제14항에 있어서,
상기 전기분사는 전기방사(electrospinning) 또는 전기분무(electrospraying)인 것을 특징으로 하는 전극. - 제10항에 있어서,
상기 무기섬유의 평균 직경은 0.001 내지 1000 nm인 것을 특징으로 하는 전극. - 제10항에 있어서,
상기 다공성 부직포 코팅층의 두께는 0.1 내지 100 ㎛인 것을 특징으로 하는 전극. - 제10항에 있어서,
상기 다공성 부직포 코팅층의 평균 기공크기는 0.01 내지 10 ㎛인 것을 특징으로 하는 전극. - 제10항에 있어서,
상기 부직포의 기공도는 1 내지 80 %인 것을 특징으로 하는 전극. - 양극, 및 음극을 포함하는 전기화학소자에 있어서,
상기 양극, 음극 또는 양극과 음극 모두는 제10항 내지 제19항 중 어느 한 항의 전극인 것을 특징으로 하는 전기화학소자. - 제20항에 있어서,
상기 전기화학소자는 리튬 이차전지인 것을 특징으로 하는 전기화학소자.
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JP2012516000A JP5841936B2 (ja) | 2009-06-30 | 2010-06-29 | 多孔性コーティング層を備える電極の製造方法、その方法によって形成された電極、及びそれを備える電気化学素子 |
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PCT/KR2010/004215 WO2011002205A2 (ko) | 2009-06-30 | 2010-06-29 | 다공성 코팅층을 구비한 전극의 제조방법, 이로부터 형성된 전극 및 이를 구비한 전기화학소자 |
US13/229,009 US20120003545A1 (en) | 2009-06-30 | 2011-09-09 | Method for manufacturing electrode having porous coating layer, electrode manufactured therefrom, and electrochemical device comprising the same |
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KR101451899B1 (ko) | 2012-10-05 | 2014-10-21 | 동국대학교 산학협력단 | 리튬이차전지의 스피넬 리튬 티타늄 옥사이드 나노섬유 음극활물질의 제조방법 |
WO2018062851A1 (ko) * | 2016-09-30 | 2018-04-05 | 주식회사 아모그린텍 | 전극 및 이를 이용한 이차전지와 전극의 제조방법 |
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KR101451899B1 (ko) | 2012-10-05 | 2014-10-21 | 동국대학교 산학협력단 | 리튬이차전지의 스피넬 리튬 티타늄 옥사이드 나노섬유 음극활물질의 제조방법 |
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WO2011002205A3 (ko) | 2011-04-21 |
KR20110001951A (ko) | 2011-01-06 |
EP2461395A2 (en) | 2012-06-06 |
CN102473894A (zh) | 2012-05-23 |
JP2012531010A (ja) | 2012-12-06 |
CN102473894B (zh) | 2016-12-28 |
US20120003545A1 (en) | 2012-01-05 |
WO2011002205A2 (ko) | 2011-01-06 |
EP2461395A4 (en) | 2014-07-16 |
US20120244292A1 (en) | 2012-09-27 |
PL2461395T3 (pl) | 2019-05-31 |
EP2461395B1 (en) | 2019-01-23 |
JP5841936B2 (ja) | 2016-01-13 |
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