JP5748914B2 - ダイシング装置及びダイシング方法 - Google Patents
ダイシング装置及びダイシング方法 Download PDFInfo
- Publication number
- JP5748914B2 JP5748914B2 JP2014521434A JP2014521434A JP5748914B2 JP 5748914 B2 JP5748914 B2 JP 5748914B2 JP 2014521434 A JP2014521434 A JP 2014521434A JP 2014521434 A JP2014521434 A JP 2014521434A JP 5748914 B2 JP5748914 B2 JP 5748914B2
- Authority
- JP
- Japan
- Prior art keywords
- blade
- dicing
- diamond
- workpiece
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 88
- 238000005520 cutting process Methods 0.000 claims description 466
- 239000010432 diamond Substances 0.000 claims description 405
- 229910003460 diamond Inorganic materials 0.000 claims description 377
- 239000006061 abrasive grain Substances 0.000 claims description 170
- 239000010419 fine particle Substances 0.000 claims description 118
- 230000002093 peripheral effect Effects 0.000 claims description 90
- 239000002245 particle Substances 0.000 claims description 78
- 238000005245 sintering Methods 0.000 claims description 59
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 description 174
- 238000012545 processing Methods 0.000 description 96
- 239000007788 liquid Substances 0.000 description 49
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 44
- 238000003754 machining Methods 0.000 description 35
- 230000008569 process Effects 0.000 description 34
- 239000013078 crystal Substances 0.000 description 32
- 238000002474 experimental method Methods 0.000 description 31
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- 235000019589 hardness Nutrition 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 25
- 229910052759 nickel Inorganic materials 0.000 description 22
- 230000035882 stress Effects 0.000 description 20
- 239000011230 binding agent Substances 0.000 description 17
- 229910010271 silicon carbide Inorganic materials 0.000 description 17
- 230000001965 increasing effect Effects 0.000 description 16
- 238000000227 grinding Methods 0.000 description 15
- 238000005498 polishing Methods 0.000 description 14
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052594 sapphire Inorganic materials 0.000 description 12
- 239000010980 sapphire Substances 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 230000008859 change Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
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- 238000009826 distribution Methods 0.000 description 10
- 238000005323 electroforming Methods 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- 239000000835 fiber Substances 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 8
- 229910017052 cobalt Inorganic materials 0.000 description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 7
- 238000005461 lubrication Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
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- 238000004070 electrodeposition Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 208000035874 Excoriation Diseases 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014521434A JP5748914B2 (ja) | 2012-06-15 | 2013-06-14 | ダイシング装置及びダイシング方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012136060 | 2012-06-15 | ||
| JP2012136060 | 2012-06-15 | ||
| JP2014521434A JP5748914B2 (ja) | 2012-06-15 | 2013-06-14 | ダイシング装置及びダイシング方法 |
| PCT/JP2013/066501 WO2013187510A1 (ja) | 2012-06-15 | 2013-06-14 | ダイシング装置及びダイシング方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015096460A Division JP5888827B2 (ja) | 2012-06-15 | 2015-05-11 | ダイシング装置及びダイシング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP5748914B2 true JP5748914B2 (ja) | 2015-07-15 |
| JPWO2013187510A1 JPWO2013187510A1 (ja) | 2016-02-08 |
Family
ID=49758328
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014521434A Expired - Fee Related JP5748914B2 (ja) | 2012-06-15 | 2013-06-14 | ダイシング装置及びダイシング方法 |
| JP2015096460A Active JP5888827B2 (ja) | 2012-06-15 | 2015-05-11 | ダイシング装置及びダイシング方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015096460A Active JP5888827B2 (ja) | 2012-06-15 | 2015-05-11 | ダイシング装置及びダイシング方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20150099428A1 (zh) |
| EP (1) | EP2879164B1 (zh) |
| JP (2) | JP5748914B2 (zh) |
| KR (2) | KR102022754B1 (zh) |
| CN (1) | CN104364884B (zh) |
| WO (1) | WO2013187510A1 (zh) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6077799B2 (ja) * | 2012-08-31 | 2017-02-08 | 三星ダイヤモンド工業株式会社 | カッターホイール並びにその製造方法 |
| JP6287774B2 (ja) * | 2014-11-19 | 2018-03-07 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
| JP6600267B2 (ja) * | 2016-03-15 | 2019-10-30 | 株式会社ディスコ | 被加工物の切削方法 |
| WO2017183222A1 (ja) * | 2016-04-21 | 2017-10-26 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP6963754B2 (ja) * | 2016-10-05 | 2021-11-10 | 日本電気硝子株式会社 | ガラス樹脂積層体の製造方法及びガラス樹脂積層体 |
| KR102313832B1 (ko) * | 2018-03-16 | 2021-10-15 | 아다만도 나미키 세이미츠 호오세키 가부시키가이샤 | 다이아몬드 결정의 연마 방법과 다이아몬드 결정 |
| JP7009306B2 (ja) * | 2018-05-21 | 2022-01-25 | 株式会社ディスコ | 切削装置 |
| CN113692332B (zh) * | 2019-07-31 | 2024-06-11 | 马尼株式会社 | 牙科用金刚砂车针 |
| JP2021040097A (ja) * | 2019-09-05 | 2021-03-11 | 株式会社ディスコ | 被加工物の切削方法 |
| CN112318337A (zh) * | 2019-12-20 | 2021-02-05 | 沈阳和研科技有限公司 | 一种砂轮划片机切割有翘曲变形玻璃的方法 |
| US11348798B2 (en) * | 2020-02-07 | 2022-05-31 | Akoustis, Inc. | Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices |
| JP7394712B2 (ja) * | 2020-06-24 | 2023-12-08 | Ｔｏｗａ株式会社 | 切断装置及び切断品の製造方法 |
| TWI832179B (zh) * | 2022-03-22 | 2024-02-11 | 盛新材料科技股份有限公司 | 晶圓定位治具及使用其的晶圓加工方法 |
| CN117300844B (zh) * | 2023-11-28 | 2024-02-02 | 中铁工程装备集团(天津)有限公司 | 一种具有圆跳动检测功能的磨削设备 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3156077A (en) * | 1963-02-06 | 1964-11-10 | Continental Machines | Diamond edge saw blade |
| US3371452A (en) * | 1965-02-08 | 1968-03-05 | Christensen Diamond Prod Co | Diamond saw or milling blades |
| US3574580A (en) * | 1968-11-08 | 1971-04-13 | Atomic Energy Commission | Process for producing sintered diamond compact and products |
| US3912500A (en) * | 1972-12-27 | 1975-10-14 | Leonid Fedorovich Vereschagin | Process for producing diamond-metallic materials |
| US4151686A (en) * | 1978-01-09 | 1979-05-01 | General Electric Company | Silicon carbide and silicon bonded polycrystalline diamond body and method of making it |
| US4180048A (en) * | 1978-06-12 | 1979-12-25 | Regan Barrie F | Cutting wheel |
| WO1986001433A1 (en) * | 1984-08-24 | 1986-03-13 | The Australian National University | Diamond compacts and process for making same |
| JPS61104045A (ja) | 1984-10-26 | 1986-05-22 | Sumitomo Electric Ind Ltd | 工具用ダイヤモンド焼結体 |
| DE3583567D1 (de) * | 1984-09-08 | 1991-08-29 | Sumitomo Electric Industries | Gesinterter werkzeugkoerper aus diamant und verfahren zu seiner herstellung. |
| US5010043A (en) * | 1987-03-23 | 1991-04-23 | The Australian National University | Production of diamond compacts consisting essentially of diamond crystals bonded by silicon carbide |
| JPH05144937A (ja) * | 1991-11-18 | 1993-06-11 | Fujitsu Miyagi Electron:Kk | ダイシングブレード |
| JPH06151586A (ja) * | 1992-11-12 | 1994-05-31 | Sony Corp | ダイシング方法および装置 |
| JP3209818B2 (ja) * | 1993-03-08 | 2001-09-17 | 株式会社東京精密 | ダイシング装置の切削刃取付構造 |
| JPH07276137A (ja) | 1994-03-31 | 1995-10-24 | Osaka Diamond Ind Co Ltd | 切削・研削用工具 |
| US5479911A (en) * | 1994-05-13 | 1996-01-02 | Kulicke And Soffa Investments Inc | Diamond impregnated resinoid cutting blade |
| US5888129A (en) * | 1996-05-15 | 1999-03-30 | Neff; Charles E. | Grinding wheel |
| JP3610716B2 (ja) * | 1997-01-23 | 2005-01-19 | トヨタ自動車株式会社 | 鋳物のシール面の加工方法 |
| US20040112359A1 (en) * | 1997-04-04 | 2004-06-17 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| WO1999003641A1 (fr) * | 1997-07-16 | 1999-01-28 | The Ishizuka Research Institute, Ltd. | Materiau composite stratifie contenant du diamant et procede de fabrication de ce materiau |
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- 2013-06-14 KR KR1020167003252A patent/KR102022754B1/ko active IP Right Grant
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- 2013-06-14 WO PCT/JP2013/066501 patent/WO2013187510A1/ja active Application Filing
- 2013-06-14 KR KR20147034629A patent/KR20150004931A/ko active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5888827B2 (ja) | 2016-03-22 |
| EP2879164A4 (en) | 2015-11-25 |
| CN104364884A (zh) | 2015-02-18 |
| KR20160021904A (ko) | 2016-02-26 |
| JPWO2013187510A1 (ja) | 2016-02-08 |
| KR102022754B1 (ko) | 2019-09-18 |
| EP2879164B1 (en) | 2017-09-13 |
| KR20150004931A (ko) | 2015-01-13 |
| WO2013187510A1 (ja) | 2013-12-19 |
| JP2015164215A (ja) | 2015-09-10 |
| EP2879164A1 (en) | 2015-06-03 |
| US20150099428A1 (en) | 2015-04-09 |
| CN104364884B (zh) | 2017-06-23 |
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