US20150099428A1 - Dicing Device and Dicing Method - Google Patents

Dicing Device and Dicing Method Download PDF

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Publication number
US20150099428A1
US20150099428A1 US14/569,061 US201414569061A US2015099428A1 US 20150099428 A1 US20150099428 A1 US 20150099428A1 US 201414569061 A US201414569061 A US 201414569061A US 2015099428 A1 US2015099428 A1 US 2015099428A1
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Prior art keywords
blade
workpiece
diamond
dicing
abrasive grains
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US14/569,061
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English (en)
Inventor
Takashi Fujita
Junji Watanabe
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Assigned to TOKYO SEIMITSU CO., LTD. reassignment TOKYO SEIMITSU CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJITA, TAKASHI
Publication of US20150099428A1 publication Critical patent/US20150099428A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to a dicing device and a dicing method which are employed when cutting process such as cutting and grooving is performed on a workpiece such as a wafer having a semiconductor device or electronic parts formed thereon.
  • a dicing device which divides a workpiece such as a wafer having semiconductor devices or electronic parts formed thereon into individual chips includes, at least, a dicing blade which is rotated at high speed by a spindle, a worktable which mounts a workpiece thereon, and moving shafts of X, Y, Z and ⁇ for changing relative positions of the worktable to the blade, and performs cutting process such as cutting and grooving on the workpiece by the operation of each of these moving shafts.
  • Patent Literature 1 Japanese Patent Application Laid-Open No. 2005-129741
  • Patent Literature 2 Japanese Patent Application Laid-Open No. 2010-234597
  • Patent Literature 1 an electroformed blade is described in which diamond abrasive grains are stuck to the end face of a metallic base material (aluminum flange) with an electroforming method using an electroplating technique, and an alloy of soft metal such as nickel, copper or the like is used as a bonding material.
  • a diamond blade which is formed of a substrate formed of a plurality of diamond layers, by sequentially stacking different diamond layers that have different hardnesses from one another with a chemical vapor deposition (CVD) method.
  • CVD chemical vapor deposition
  • the workpiece is subjected to cutting process by a dicing blade having an edge thickness larger than the thickness of the workpiece, the workpiece is occasionally broken before being cut.
  • the workpiece having a thickness of, for instance, approximately 50 ⁇ m is subjected to grooving process of forming a groove having a depth of approximately 30 ⁇ m, the width of the groove naturally needs to be set at 30 ⁇ m or less, and the edge thickness of the dicing blade needs to be controlled to 30 ⁇ m or less, accordingly.
  • a brittle material it is difficult to avoid the occurrence of cracking which causes breaking.
  • Materials having ductility such as copper, aluminum, an organic film and a resin are not broken, but have properties of easily forming a burr, so that it is difficult to avoid the occurrence of the burr of the materials.
  • an electroformed blade described in Patent Literature 1 shows the state in which diamond abrasive grains 92 are scattered in a bonding material (metal bond) 94 , and the diamond abrasive grains 92 each having a sharp tip part project on the surface, as is shown in FIG. 21 .
  • the position of projections and the amount of projections of the diamond abrasive grains 92 are both random, and it is theoretically difficult to control the projections of the abrasive grains with high precision. For this reason, the cut depth in one work unit cannot be controlled with high precision.
  • the reason why such a problem occurs is a surface morphology of the electroformed blade.
  • the diamond abrasive grains 92 are bonded by a bonding material 94 in the electroformed blade, but as for the surface morphology, the diamond abrasive grains 92 exist in a form of being scattered in the bonding material 94 .
  • the electroformed blade shows the state in which a reference plane 98 which is an overall average height position exists in the vicinity of the surface of the bonding material 94 , and the diamond abrasive grains 92 project from the reference plane 98 .
  • the electroformed blade in particular, as there is a term of a spontaneous edge generation, the electroformed blade functions in a mode in which the diamond abrasive grains 92 which have been worn on the way of the cutting process fall off as it is, and new diamond abrasive grains 92 that exist under the diamond abrasive grains having fallen off subsequently work.
  • the diamond abrasive grains 92 if such falling off of the diamond abrasive grains 92 is accepted, the diamond abrasive grains 92 having fallen off enter between the blade and the workpiece, and consequently promote a crack. In the process by a blade where falling-off of the diamond is assumed, it is theoretically impossible to prevent the occurrence of the crack.
  • a substrate on which a uniform and thin plating film is formed is manufactured in the plating by an electrodeposition method, and the plating film is removed from the substrate to be formed into a blade.
  • the plating film is removed from the substrate to be formed into a blade.
  • the electroformed blade has poor thermal conductance, has a tendency of easily accumulating heat in itself due to heat generation caused by frictional resistance with the side face of a groove, when performing cutting process, and also has a possibility of causing the warpage of itself.
  • the thermal conductivity of nickel is only approximately 92 W/m ⁇ K, as is shown in Table 1.
  • the thermal conductivity of the copper is only approximately 398 W/m ⁇ K.
  • the thermal conductivity of the diamond is 2,100 W/m ⁇ K, and has extremely higher thermal conductivity than those of nickel and copper.
  • the above described diamond blade is formed with the CVD method, and accordingly is formed into a blade which is formed of an extremely dense film. But as a result, the surface of the diamond blade becomes almost planate, and a recessed shape for arbitrarily giving a cut or a pocket for removing swarf cannot be formed in the surface. In addition, even if fine convexoconcaves are consequently formed, the size of the grain boundary cannot be arbitrarily set before the film is formed. Accordingly, a pitch and the like of the convexoconcaves cannot be arbitrarily designed.
  • the thickness distribution of the edge of the blade is determined by the thickness distribution of the formed film.
  • the waviness cannot be removed.
  • the reference surface of the blade it is theoretically difficult to fit and mount the reference surface of the blade to and on the reference surface of a highly-precise spindle flange having no run-out, and to enhance the run-out accuracy.
  • the outer circumferential part (tip part) of the blade is preferably as thin as possible, but a portion which abuts on the flange needs to have such a degree of thickness as not to cause the warpage, in order to keep a flat surface that becomes a highly-precise reference.
  • a method using film formation cannot be substantially applicable because the blade cannot be substantially manufactured as the integrated object by the method.
  • the joined material is deformed due to the thermal stress, and results in disturbing of the circularity and the flatness.
  • the joined material cannot achieve a process of a ductile mode as in the present invention, which will be described later.
  • a grinding or cutting process the case is referred to as a process of a ductile mode, where the workpiece is worked in the state in which spiral and streamlined chips are generated.
  • a structure in which high-hardness diamond chips are embedded in the outer circumference of the blade resists securing the flatness of the whole blade due to a bimetal effect, because the diamond portion and the substrate portion have different thermal expansions and thermal conductivities. Besides, results in an aggravation of the flatness also due to the thermal stress, because when the chips are arranged in a circumferential shape, the temperature distribution does not become axisymmetrical and ordered.
  • a thin blade which is 0.1 mm or less needs to be used, and the groove needs to be formed in an extremely local region or the cutting width needs to be limited.
  • a thin blade cannot be formed with the structure in which the diamond chips and the base material are bonded to each other. It is difficult to secure the continuous flatness of the diamond chip portion and the other base material portion.
  • the diamond chip portion has extremely high hardness, but the base material portion occasionally absorbs an impact which the diamond chip receives, due to an elastic effect of the metal portion of the base material.
  • the process is performed in the ductile mode, it is necessary to continuously form an extremely fine cut.
  • the base material has absorbed such an impact, the process of the ductile mode under the extremely fine cut cannot be performed.
  • the blade embedded with the diamond chip has a problem, in consideration of the points of the thermal conduction, the flatness of the shape, the continuity of the flat surface and a property of exerting a locally effective shearing force on the workpiece without absorbing the impact caused by the process.
  • a compressive stress is formed in the film formed of the diamond layers which have been film-formed with the CVD method, and accordingly a degree of exerted stress varies as the film is deposited. Because of this, when the film is removed and is formed into the blade in the final stage, a degree of exerted compressive stress is different between both left and right surfaces, and as a result, the blade is warped. Even though such a warpage of the blade is intended to be corrected, there is no means to correct the warpage, and there is a concern that a yield is aggravated by the stress in the film.
  • the dicing device performs the process while forming a fine cut in a material such as a brittle material, and in some cases, a ductile material, and also removing swarf, even if a uniform sharp cutting tool such as a sharp knife is formed without convexoconcaves on the outer circumferential part, it is impossible for such cutting tool to perform a substantial cutting process without having the fine convexoconcaves on the outer circumferential part.
  • a relative velocity is set at zero so that the blade does not slide on the workpiece.
  • the blade needs to be freely rotated in order to exert a vertical stress on the material, and a blade structure has a form of pressing a bearing or a bearing portion in the blade vertically in a downward direction.
  • a blade holding portion for sliding the blade along the workpiece, and a blade portion which rotates while coming in contact with the workpiece must not be completely fixed.
  • the blade is not connected directly to the motor without having freeplay.
  • the present application is not proposed for the scribing process, and accordingly has a structure in which the motor and the blade are connected directly to each other. A relationship of the shaft and the bearing does not exist, and the motor and the blade are incorporated in a coaxial structure by fitting with high precision.
  • the face mating between the end face of the blade and the end face of the flange which is connected directly to the motor becomes important.
  • a reference plane becomes necessary for being mated with the end face of the flange.
  • a material in which a ductile material and a brittle material are mixed such as a Cu/Low-k material (material in which copper material and material having low dielectric constant are mixed).
  • the workpiece such as the brittle material like the Low-k material needs to be worked in a deformation region of the material so that the brittle fracture does not occur therein.
  • Cu is a ductile material, and accordingly is not broken.
  • a mustache-like bun is formed in the upper part in many cases.
  • the present invention is designed with respect to such circumstances and aims to provide a dicing device and a dicing method which do not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision.
  • a dicing device which performs cutting process on a workpiece, includes: a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains 80 vol % (hereinafter referred to simply as “%”) or more of the diamond abrasive grains; a rotating mechanism configured to rotate the dicing blade; and a movement mechanism configured to move the workpiece relatively to the dicing blade while the dicing blade forms a constant cut depth on the workpiece.
  • % vol %
  • the dicing blade forms a cut on the workpiece while rotating in a down-cutting direction.
  • the down-cutting direction means a rotating direction in which the cutting edge of the dicing blade cut into the surface of the workpiece when the workpiece is moved relatively to the dicing blade.
  • cutting edges which are formed of recessed parts formed on the surface of the diamond sintered body are continuously provided on an outer circumferential part of the dicing blade along a circumferential direction.
  • the dicing blade is formed of the diamond sintered body, and accordingly is completely different from a conventional material formed by diamond electrodeposition, which is electrodeposited using a bonding material softer than diamond.
  • the bonding material retreats compared to the diamond. Accordingly, the diamond projects, and as a result, the projection of the diamond abrasive grains from an average level line has been large. As a result, the cut depth becomes excessive in the abrasive grain portion at which an amount of projection is large, and results in excess of the critical cut depth inherent to the material and causing a crack.
  • the diamond blade is formed mostly of diamond, and the portion of the recess surrounded by the diamond becomes a cutting edge. Because of this, the abrasive grains of which the peripheries retreat and which project are not formed. As a result, the excessive cut depth is not formed, and the recessed part functions as a cutting edge.
  • the reference surface is a flat surface and is a face of diamond, and the recessed portions exist in places on the face of diamond. Accordingly, basically, the recessed portions perform processes as the cutting edge.
  • the diamond abrasive grains dominantly exist in the whole, and sintering aids which are scattered and left exist between the diamond abrasive grains.
  • the cutting edge which is formed in the blade becomes a recessed cutting edge that is formed among the diamond abrasive grains.
  • the empty portion functions as the cutting edge. If the content decreases, the form in which the recessed portion is formed in the outer edge made of the diamond abrasive grains is not obtained, but the convexoconcave portion becomes almost flat or salients become dominant so as to form relatively projecting portions. Consequently, the projecting portions do not become such a cutting edge as to form stable cut depth of a fixed amount or less on the workpiece without causing a fatal crack in the workpiece.
  • the blade according to the present invention is formed of a sintered diamond, which becomes a great feature of the blade according to the present application.
  • the sintered diamond is manufactured by the steps of spreading diamonds having a uniformized particle size, adding a trace amount of sintering aids thereto and subjecting them to a high temperature and a high pressure.
  • the sintering aids diffuse into the diamond abrasive grains, and as a result, the diamonds are strongly combined with one another.
  • the method of fixing the diamond abrasive grains is a method of fixing the scattered diamonds with a surrounding metal.
  • the sintering aids diffuse into the diamonds and thereby strongly combine the diamond particles to each other.
  • the blade can utilize the characteristics of the diamond by bonding the diamond particles to each other. As the content of the diamond increases, the blade can utilize the physical properties almost close to those of the diamond, in the rigidity, the hardness and the thermal conduction of the diamond. This is because the diamonds are bonded to each other.
  • the blade is manufactured by being fired under a high temperature and a high pressure compared to other manufacturing methods such as the electroformed blade, and thereby the diamonds are combined with each other.
  • COMPAX DIAMOND (trademark) made by General Electric Company corresponds to this sintered diamond.
  • COMPAX DIAMOND fine particles formed of single crystals are bonded to each other by the sintering aids.
  • a natural diamond, an artificial diamond and the like naturally have a large content of diamond, and exist as a strong diamond.
  • Such a single crystal diamond tends to easily cause cracking along a cleavage plane, when falling off.
  • the whole blade is formed of the single crystal diamond, for instance, if there is the cleavage plane in a certain direction, the blade occasionally is broken into two pieces in the cleavage plane, even though having been molded into a discoid shape. Even when the diamond is worn as the progression of the process, there is also a problem that the wear occurs dependently on a face orientation along the cleavage plane.
  • a member such as DLC (diamond like carbon) which has been manufactured by being vapor-phase grown by the CVD is also manufactured as a polycrystal body, but the size of the grain boundary cannot be controlled with high precision. Because of this, it cannot be set how uniformly the diamond should be worn when the diamond is worn from the crystal grain boundary, and thus, the unit of the crystal or grain boundary cannot be strictly controlled, by which the crystals wear and fall off due to the process. Therefore, such phenomena can occur in some cases that the member is largely fractured, and an excessive stress is applied to a part of defect and the diamond is largely broken.
  • DLC diamond like carbon
  • PCD Polycrystalline Diamond
  • the fine particles of the diamond themselves are single crystal bodies, and are complete crystal bodies having extremely high hardness.
  • the single crystals are bonded to each other by the sintering aids which are mixed for combining the single crystals with each other.
  • the orientations of bonded portions are not completely aligned, and accordingly the crystals do not form the single crystal as a whole, but show a form in which the crystals are bonded as the polycrystal body. Because of this, the crystal orientation dependency does not exist also in the wearing process, and the PCD has a fixed large strength in any direction.
  • the structure is polycrystal, but the PCD is a polycrystal body in such a state that fine single crystals having a uniform size are densely agglomerated.
  • the PCD can keep an initial state with high precision, in the point of controlling the state of a cutting edge in the outer circumference and a pitch unit of the cutting edge in the outer circumference, in the wearing process in the work.
  • single crystals fall off by a mechanism that the bonding is cut from the grain boundary portion because the portion in which the single crystal and the single crystal are bonded to each other has relatively weak hardness and strength, rather than a mechanism that the single crystals themselves are broken.
  • the single crystal is worn along the crystal grain boundary existing between the single crystals, and accordingly when the cutting edges are formed, the cutting edges are formed naturally at evenly set intervals.
  • formed convexoconcaves all become the cutting edge.
  • the cutting edges of the convexoconcaves due to the grain boundaries among the particles also exist among the cutting edges due to the natural convexoconcaves existing at even intervals. All of these cutting edges are formed of the diamond, and accordingly exist as cutting edges.
  • the blade according to the present invention has a structure by the PCD and has a discoid shape; and particularly shows the effect due to the combination.
  • the cutting edge is not always on the working point during the process, but contributes to the process only by an arc of an extremely local portion while rotating. Accordingly, the machining and the cooling are repeated, and thereby the tip part is not excessively overheated.
  • the diamond does not cause a thermochemical reaction, and stably contributes to the process.
  • the formation of the cutting edge at even intervals becomes an indispensable factor for ductile mode dicing that is the subject of the present invention, which will be described later.
  • a cut depth that one cutting edge forms on the material becomes important, as will be described later, and in addition, “interval between cutting edges in outer circumferential part of blade” becomes an essential factor associated with the cut depth which one cutting edge forms on the workpiece.
  • a relationship between the critical cut depth which one edge forms on the workpiece and the interval between the cutting edges will be described later, but in order to specify the critical cutting depth of one edge, it becomes indispensable to stably set the interval between the cutting edges.
  • the PCD becomes suitable in which the single crystal abrasive grains having a uniform particle size are bonded to each other by sintering.
  • the content of the abrasive grains is small. Also in Japanese Patent Application Laid-Open No. 2010-005778 and the like, the content of the diamond abrasive grains occupying in the abrasive grain layer is approximately 10%. Therefore, the content of the abrasive grains is scarcely set so as to exceed 70%. Because of this, each of the abrasive grains sparsely exists.
  • the abrasive grains are uniformly arranged to some extent, but in order to secure sufficient projection of one abrasive grain, the interval between the abrasive grains is also large.
  • a dicing blade for cutting a rare-earth magnet is described, and is formed of a composite sintered body of diamond and/or CBN (Cubic Boron Nitride).
  • the content of the diamond or the CBN is determined to be 1 to 70 vol %, and is determined more preferably to be 5 to 50%.
  • the patent describes that when the content of the diamond exceeds 70%, the dicing blade becomes weak to the impact and is easily broken, though having no problem in warpage and bending.
  • Japanese Patent No. 4714453 also discloses a tool for performing a cutting or grooving process on a composite material of ceramics, metal, glass and the like.
  • the patent describes that the tool which is manufactured by firing the diamond contains 3.5 to 60 vol % of the abrasive grains in the fired body.
  • the patent describes that a technical subject here is that the bonding material has a high power of holding the abrasive grains even though having high elasticity and high hardness, and that if the blade has the described structured, a sufficient projection of the abrasive grains can be always kept. It is described that the blade can perform a high-speed work while effectively keeping spontaneous edge generation, by sufficiently assuring “projection of abrasive grains”.
  • the electroformed blade and the blade of the diamond sintered body do not spread gaps of the abrasive grains all over.
  • the critical cut depth which one cutting edge forms on the workpiece becomes important and will be described later by expressions, in order that the workpiece is machined in the ductile mode, and the interval between the cutting edges becomes important, in order that the cut depth is kept at a fixed value or less.
  • the blade according to the present application does not form cutting edges due to the abrasive grains which are large, are isolated and project, but forms cutting edges at even intervals by spreading the diamonds and using the recessed portions among the spread diamonds.
  • FIGS. 22A and 22B schematically show a state of the interval between abrasive grains, according to the content of diamond abrasive grains.
  • the content of the diamond abrasive grains needs to be at least 70% or more at the lowest, in order to spread the diamond grains.
  • a part of the diamonds must be removed.
  • the diamond abrasive grains When the diamond abrasive grains are sintered so that the content becomes 80% or more, the diamond abrasive grains can form a state in which the diamonds are spread so as not to form gaps among the diamonds at least spatially as is shown in FIG. 22A . After that, the blade having the cutting edges at even intervals can be naturally formed by roughening the surface while removing the abrasive grains themselves, in the above state. In addition, all of thus formed convexoconcaves function as the cutting edge.
  • the blade in order to form the cutting edges at even intervals, the blade needs to be formed from a material which is formed by spreading abrasive grains with high density and then firing the grains under a high temperature and a high pressure.
  • the content of the diamond abrasive grains is 70% or less, as is shown in FIG. 22B , it becomes difficult to arbitrarily form cutting edges at even intervals. This is because when the content is 70% or less, a portion in which the diamond abrasive grains are rich and a portion in which the diamond abrasive grains are sparse are inevitably formed, and because in the portion in which the diamond abrasive grains are sparse, the interval between the cutting edges has a possibility of increasing due to the existence of the isolated abrasive grain.
  • the content of the diamond abrasive grains is preferably set at 70% or less.
  • the content of the diamond is preferably 70% or more at the minimum, and ideally desirably is 80% or more, in order to make the recessed portion between the abrasive grains function as the cutting edge, and keep the interval between the cutting edges at a constant interval.
  • the blade in this case is not a blade for simply cutting a material with a sharp edge such as a cutter.
  • the blade is not a blade which has the tip manufactured into the sharp edge and cuts a material according to a principle as in scissors.
  • the blade needs to remove the workpiece while shaving, and to enter a groove.
  • the blade needs to continuously perform operations of putting the next edge into the material while discharging swarf. Therefore, the tip may not simply be sharp, but needs a fine cutting edge.
  • the cutting edge portions are formed at constant intervals not only by the grain boundary portions but also by the natural roughness of the outer circumferential portion.
  • Such an interval between the cutting edges will be shown later by an example in which the cutting edge has a specific interval, but it occasionally occurs that the particle size of the diamond and a size of the interval between the cutting edges become completely different.
  • the concept for the cutting edge becomes different from that in the usual electroformed blade.
  • the diamonds are embedded and exist in the bonding material, and accordingly the individual diamonds independently exist. Therefore, the size of the cutting edge becomes equal to the particle size of the diamond.
  • one diamond forms one cutting edge.
  • the unit of the spontaneous edge generation is each of the diamonds, and in other words, corresponds to each of the cutting edges.
  • the unit of the cutting edge is not different from the unit of the spontaneous edge generation.
  • the unit of the spontaneous edge generation occurs due to the falling off of the abrasive grains themselves, the unit of the spontaneous edge generation is also being larger, and the life becomes extremely shorter.
  • small diamonds are bonded to each other.
  • Cutting edges larger than the diamond particles are formed in the outer circumferential part of the blade of the sintered diamond which is formed of diamonds bonded to each other.
  • the particle size of the diamond which is each of the abrasive grains constituting the sintered body is as extremely small as approximately 1 ⁇ , in comparison with the unit of the cutting edge.
  • each of the diamonds falls off along with the work, but it does not occur that the whole cutting edge falls off.
  • the abrasive grain which forms one cutting edge does not fall off as in the electroformed blade, but a part of the diamonds in the portion in which the diamonds are bonded to each other become chipped and fall off.
  • the diamond in the case of the present invention, in the process in which the spontaneous edge generation occurs, the diamond exfoliates and falls off due to wearing in a region smaller than the size of the cutting edge, and the size of the cutting edge itself does not largely change.
  • the dicing proceeds while the diamond extremely finely and partially exfoliates and falls off, in one cutting edge.
  • the size of the cutting edge itself does not change, and on the other hand, the sharpness of the whole cutting edge is not aggravated by the wearing.
  • the maximum cut depth per one cutting edge is kept within a fixed value while the blade is finely, partially and spontaneously generated. As a result, it becomes possible to continue the process in the ductile mode while keeping the stable sharpness.
  • the portion in which the diamond has been chipped becomes a small recess
  • the recessed portion also exists as a fine cutting edge which exists in a large cutting edge that is a region surrounded by other diamond abrasive grains, and constitutes fine roughness which functions as a trigger of entering the workpiece.
  • the way of thinking for the spontaneous edge generation in this structure is completely different from that in the conventional structure, in the point that the portion from which the diamond has chipped becomes the next cutting edge in the state.
  • intervals between the cutting edges and a critical cut depth to be cut by one cutting edge require that a fixed cut of the blade is set for a blade having the cutting edges on the outer circumference, as a set condition for dicing, and the blade is fed to the workpiece at a feeding speed corresponding to the setting of the cut. Therefore, the device is a prerequisite, which operates the blade at a constant feeding speed so that the blade keeps a constant cut along the surface shape.
  • the workpiece is a flat surface, it is necessary to set a fixed cut in parallel to the surface of the workpiece to be machined, and relatively feed the blade.
  • each cutting edge on the outer peripheral end part runs idle after having performed a removing process of the workpiece at the working point, and the blade is naturally cooled.
  • a portion which comes in contact with the workpiece is, in particular, only a part of the blade, and accordingly most of the cutting edges run idle and are cooled.
  • the cutting edge continues contacting the workpiece, the cutting edge portion is heated by friction, and there is the case where the cutting edge is thermochemically worn, even when the cutting edge is formed of the diamond.
  • the discoid-shaped blade is set so as to stand on the surface of the workpiece and cuts the workpiece, and thereby the diamond can be greatly avoided from being worn due to thermal influence.
  • the diamond sintered body is a substance formed of the diamond abrasive grains which have been sintered with the use of a sintering aid formed from a soft metal.
  • the blade becomes electroconductive.
  • the blade is not electroconductive, it is difficult to accurately estimate the outer diameter of the outer peripheral end part of the blade, and it is difficult to accurately estimate the position of the tip of the blade with respect to the workpiece, in consideration of a mounting error caused by being mounted on a spindle.
  • an electroconductive blade is used as the blade, and also is designed so as to be brought into conduction with a chuck plate for chucking a planate substrate which becomes reference, and then is brought into conduction with the chuck plate when the electroconductive blade has been brought into contact with the chuck plate. Thereby, a relative height of the blade to the chuck plate can be found.
  • the above described recessed parts are preferably each formed of a recessed part which is formed by subjecting the above described diamond sintered body to abrasion treatment or dressing treatment.
  • the average particle size of the above described diamond abrasive grains is 25 ⁇ m or less.
  • Japanese Patent No. 3308246 describes a diamond blade for cutting a rare-earth magnet, but describes that the content of the diamond is desirably 1 to 70 vol % and the average particle size of the diamond is desirably 1 to 100 ⁇ m. In addition, the patent describes in Example 1 that the average particle size of the diamond is 150 ⁇ m. The blade is directed at decreasing bending and warpage and enhancing the wear resistance of a cored bar.
  • the average particle size of the diamond is 10 to 100 ⁇ m but the average particle size is more desirably 40 to 100 ⁇ m.
  • Japanese Patent Application Laid-Open No. 2003-326466 describes a blade for dicing ceramics, glass, a resin and metal, and describes that the average particle size is preferably 0.1 ⁇ m to 300 ⁇ m.
  • the conventional blades are described to be suitable when the particle size of the diamond is a comparatively large size.
  • the average particle size of the diamond abrasive grains is 25 ⁇ m or less in association with the content of the diamond.
  • the ratio of an area is remarkably reduced in which the diamonds are brought into contact with each other, and accordingly though a part of the diamonds are combined by being sintered, most of the diamonds are not combined because of absence of the sintering aid to form spaces.
  • the blade needs to have such a distance in the thickness direction that two to three fine particles exist in the thickness direction at the minimum, otherwise the blade itself cannot be formed into a strong blade in which each of the abrasive grains are combined with each other.
  • the thickness direction needs to be 50 ⁇ m or more at the minimum.
  • the maximum cut depth to which one edge cuts down is larger than a Dc value of 0.1 ⁇ m, for instance, in SiC, from the linearity of the existing cutting edge.
  • the particle size of the diamond it is desirable to control the particle size of the diamond to 25 ⁇ m or less.
  • the fine particle diamond down to approximately 0.3 to 0.5 ⁇ m has been examined under present conditions, but the circumstance is unclear for the ultrafine particle diamond having particle sizes below the sizes.
  • the outer circumferential part of the dicing blade is formed so as to be thinner than the inside portion of the outer circumferential part, and it is more preferable that the thickness of the outer circumferential part of the dicing blade is 50 ⁇ m or less.
  • the outer circumferential part of the dicing blade means a width of a portion which enters the workpiece.
  • the portion which cuts into the workpiece occasionally breaks the workpiece, when the width of the blade is larger than the thickness of the workpiece. This phenomenon is described in detail later.
  • the rotating mechanism has a flange surface which is made from a metal and is vertical to a rotation axis around which the dicing blade is rotated, and the dicing blade has a reference plane portion in one side surface, and is fixed to the rotation axis in a state in which the reference plane portion is made to abut on the flange surface.
  • the reference plane portion of the dicing blade is formed into an annular shape which regards the rotation axis as the center.
  • a dicing device which performs cutting process on a workpiece, includes: a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains 80 vol % or more of the diamond abrasive grains; a rotating mechanism that rotates the dicing blade; and a movement mechanism that moves the workpiece relatively to the dicing blade while making the dicing blade form a constant cut depth on the workpiece and supplying fine particles to the dicing blade.
  • a dicing method which performs cutting process on a workpiece, includes the steps of: forming a constant cut depth on the workpiece while rotating a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains 80 vol % or more of the diamond abrasive grains; and moving the workpiece relatively to the dicing blade in a state in which the constant cut depth is formed on the workpiece by the dicing blade.
  • the dicing blade forms a cut on the workpiece while rotating in a down-cutting direction.
  • recessed parts fine cutting edges which are formed on the surface of the diamond sintered body are continuously provided on an outer circumferential part of the dicing blade along a circumferential direction.
  • the diamond sintered body is a substance formed by sintering the diamond abrasive grains with the use of a sintering aid of a soft metal.
  • an average particle size of the diamond abrasive grains is 25 ⁇ m or less.
  • the outer circumferential part of the dicing blade is formed so as to be thinner than an inside portion of the outer circumferential part, and it is more preferable that a thickness of the outer circumferential part of the dicing blade is 50 ⁇ m or less.
  • a flange surface which is made from a metal and is vertical to a rotation axis around which the dicing blade is rotated, and the dicing blade includes a reference plane portion on one side surface, and is fixed to the rotation axis in a state in which the reference plane portion is made to abut on the flange surface.
  • the reference plane portion of the dicing blade is formed into an annular shape around the rotation axis.
  • the dicing blade according to the present invention is integrally formed into a discoid shape from the diamond sintered body containing 80% or more diamond abrasive grains. Because of this, it becomes possible that the dicing blade controls the cut depth for the workpiece with high precision, as compared with a conventional electroformed blade. Thereby, the workpiece can be moved relatively to the dicing blade so that a constant cut depth is formed on the workpiece while avoiding formation of an excessive cut.
  • FIG. 1 is a perspective view showing an appearance of a dicing device.
  • FIG. 2 is a front view of a dicing blade.
  • FIG. 3 is a side sectional view showing a cross section taken along the line A-A in FIG. 2 .
  • FIG. 4A is an enlarged sectional view showing one example of a structure of a cutting edge part.
  • FIG. 4B is an enlarged sectional view showing another example of the structure of the cutting edge part.
  • FIG. 4C is an enlarged sectional view showing further another example of the structure of the cutting edge part.
  • FIG. 5 is a schematic diagram schematically showing a state in the vicinity of the surface of a diamond sintered body.
  • FIG. 6 is a diagram showing a state of the surface of a workpiece when the blade which is formed of the diamond abrasive grains having an average particle size of 50 ⁇ m is used for performing the grooving process on the workpiece, and showing an example in which a crack occurs.
  • FIG. 7 is a sectional view showing a state in which the dicing blade is mounted on a spindle.
  • FIG. 8A is a diagram showing a result of Comparative Experiment 1 (grooving process on silicon) (present embodiment).
  • FIG. 8B is a diagram showing a result of Comparative Experiment 1 (grooving process on silicon) (conventional technology).
  • FIG. 9A is a diagram showing a result of Comparative Experiment 2 (grooving process on sapphire) (present embodiment).
  • FIG. 9B is a diagram showing a result of Comparative Experiment 2 (grooving process on sapphire) (conventional technology).
  • FIG. 10A is a diagram showing a result of Comparative Experiment 3 (case of blade thickness of 20 ⁇ m).
  • FIG. 10B is a diagram showing a result of Comparative Experiment 3 (case of blade thickness of 50 ⁇ m).
  • FIG. 10C is a diagram showing a result of Comparative Experiment 3 (case of blade thickness of 70 ⁇ m).
  • FIG. 11A is a diagram (surface of workpiece) showing a result of Comparative Experiment 4.
  • FIG. 11B is a diagram (cross section of workpiece) showing a result of Comparative Experiment 4.
  • FIG. 12A is a diagram (surface of workpiece) showing a result of Comparative Experiment 5.
  • FIG. 12B is a diagram (cross section of workpiece) showing a result of Comparative Experiment 5.
  • FIG. 13A is a diagram showing a result of Comparative Experiment 6 (present embodiment).
  • FIG. 13B is a diagram showing a result of Comparative Experiment 6 (conventional technology).
  • FIG. 14 is an explanatory diagram schematically illustrating a state at the time when a dicing process is performed with the use of a blade having a double-side tapered type of cutting edge part.
  • FIG. 15 is a diagram illustrating states where a burr and chipping are caused.
  • FIG. 16 is an explanatory diagram in the case where a maximum cut depth when the blade parallelly moves to machine the workpiece, is geometrically calculated.
  • FIG. 17A is a diagram showing a measurement result of the outer peripheral end of the blade with a roughness meter.
  • FIG. 17B is a diagram showing a result obtained by having measured the outer peripheral end of the blade with the roughness meter.
  • FIG. 18A is a diagram showing the surface state of the outer peripheral end of the blade (side face of tip of blade).
  • FIG. 18B is a diagram showing the surface state of the outer peripheral end of the blade (tip of blade).
  • FIG. 19 is a schematic diagram showing a state in which the tip of the blade cuts the workpiece material.
  • FIG. 20A is an explanatory diagram which is used in the description concerning the thickness of the blade.
  • FIG. 20B is an explanatory diagram which is used in the description concerning the thickness of the blade (case where thickness of blade is larger than thickness of workpiece).
  • FIG. 20C is an explanatory diagram which is used in the description concerning the thickness of the blade (case where thickness of blade is smaller than thickness of workpiece).
  • FIG. 21 is a schematic diagram showing a state of the surface of an electroformed blade.
  • FIG. 22A is a schematic diagram showing a state of intervals between diamond abrasive grains, which corresponds to a content of the abrasive grains (case where content of abrasive grains is 80% or more).
  • FIG. 22B is a schematic diagram showing a state of the intervals between the diamond abrasive grains, which corresponds to the content of the abrasive grains (case where content of abrasive grains is 70% or less).
  • FIG. 23 is a sectional view of the outer peripheral end of the blade in the case where the cutting edge is formed by a fiber laser (holes of 50 ⁇ m at intervals of 100 ⁇ m).
  • FIG. 24 is a front view of a fine-particle supply mechanism.
  • FIG. 25 is a side view of the fine-particle supply mechanism.
  • FIG. 1 is a perspective view showing an appearance of a dicing device.
  • the dicing device 10 includes: a load port 12 which delivers a cassette having a plurality of workpieces W accommodated therein, between the dicing device and an external apparatus; transporting means 16 which has an adsorbing portion 14 and transports the workpiece W to each unit of the apparatus; imaging means 18 which takes an image on the surface of the workpiece W; a machining unit 20 ; a spinner 22 which cleans the workpiece W which has been worked, and dries the cleaned workpiece; and a controller 24 which controls the operation of each unit of the apparatus.
  • two air-bearing type spindles 28 are arranged so as to face each other, each of which has a blade 26 mounted on the tip and incorporates a high-frequency motor, and each independently perform an operation of index feeding in a Y direction and an operation of cut feeding in a Z direction in the figure, while rotating at high speed at a predetermined rotational speed.
  • a worktable 30 which absorbs and mounts the workpiece W thereon is structured so as to be capable of rotating around the central axis in the Z direction, and is also structured so as to be fed for grinding in an X direction in the figure by the movement of an X table 32 .
  • the worktable 30 includes a porous chuck (porous body) which absorbs the workpiece W by vacuum while using the negative pressure.
  • the workpiece W mounted on the worktable 30 is held and fixed by the porous chuck (not shown) in the state of being vacuum-absorbed.
  • the porous chuck not shown
  • the whole surface of the workpiece W which is a tabular sample is uniformly absorbed by the porous chuck in the state of being straightened into a flat surface. Because of this, the displacement of the workpiece W does not occur, even when a shearing stress has worked on the workpiece W during a dicing process.
  • Such a workpiece holding method of vacuum-absorbing the whole workpiece leads to an action of the blade that the blade always gives a constant cut depth to the workpiece.
  • the workpiece is a sample which is not straightened into a tabular shape, for instance, it is difficult to define the reference surface of the surface of the workpiece. Because of this, it becomes difficult to determine how much degree of cut depth by the blade should be set from the reference surface. If a constant cut depth of the blade with respect to the workpiece cannot be set, the critical cut depth that one cutting edge always stably gives a cut also cannot be set, and it is difficult to perform stable ductile mode dicing.
  • the reference surface of the surface of the workpiece can be defined, and the cut depth of the blade from the reference surface can be set. Accordingly, the critical cut depth per one cutting edge can be set, and the stable ductile mode dicing is enabled.
  • the workpiece holding method may not be the vacuum absorption method, and may be a form in which the whole surface is bonded onto a hard substrate. If the face onto which the whole surface has been strongly bonded can be specified as reference surface, even though the substrate is a thin substrate, the stable ductile mode dicing is enabled.
  • FIG. 2 is a front view of the dicing blade.
  • FIG. 3 is a side sectional view showing the cross section taken along the line A-A in FIG. 2 .
  • the dicing blade (hereinafter referred to simply as “blade”) 26 of the present embodiment is a ring-shaped blade, and a mounting hole 38 for being thereby mounted on the spindle 28 of the dicing device 10 is formed in the central part.
  • the blade 26 is formed of a sintered diamond, and has a discoid shape or a ring shape.
  • the structure is a concentric structure, the temperature distribution becomes axially symmetric.
  • a shearing stress associated with a Poisson ratio does not work in the radial direction.
  • the outer peripheral end part keeps an ideally annular shape, and the outer peripheral end is kept on the same plane. Accordingly, the blade works on the straight line on the workpiece by the rotation.
  • the blade 26 is integrally formed into the discoid shape by a diamond sintered body (PCD) which has been formed by sintering diamond abrasive grains.
  • PCD diamond sintered body
  • the content of the diamond abrasive grains is 80% or more, and each of the diamond abrasive grains is bonded to others by a sintering aid (for instance, cobalt or the like).
  • the outer circumferential part of the blade 26 is a part which cuts into the workpiece W, and has a cutting edge part 40 which is formed into a shape of a thinner edge than the inside portion.
  • cutting edges fine cutting edges which are composed of fine recesses that are formed on the surface of the diamond sintered body are continuously formed with a fine pitch (for instance, 10 ⁇ m) along the circumferential direction of an outer peripheral end part (outer peripheral brim) 26 a of the blade.
  • the thickness (thickness of edge) of the cutting edge part 40 is formed so as to be thinner at least than the thickness of the workpiece W.
  • the cutting edge part 40 is formed so as to have the thickness of preferably 50 ⁇ m or less, more preferably of 30 ⁇ m or less, and further preferably of 10 ⁇ m or less.
  • the cross-sectional shape of the cutting edge part 40 may be formed into such a tapered shape that the thickness becomes gradually thinner toward the outside (tip side), or may be formed into a straight shape having uniform thickness.
  • FIGS. 4A to 4C are enlarged sectional views showing structure examples of the cutting edge part 40 .
  • FIGS. 4A to 4C correspond to the portion in which the part B in FIG. 3 is enlarged.
  • the cutting edge part 40 A shown in FIG. 4A is a one-side tapered type (one side V type) in which only the side face part in one side is diagonally worked into a tapered shape.
  • a thickness T 1 of the outer peripheral end part to be most thinly formed is 10 ⁇ m
  • a taper angle ⁇ 1 of the portion is set at 20 degrees, in which the side face part in one side is made into the tapered shape.
  • a thickness of an inside portion (except annular part 36 which will be described later) of the blade 26 is 1 mm (which is similar also in FIGS. 4B and 4C ).
  • a cutting edge part 40 B shown in FIG. 4B is a double-side tapered type (double-side V type) in which the side face parts in both sides are diagonally made into tapered shapes.
  • a thickness T 2 of the outer peripheral end part to be most thinly formed is 10 ⁇ m, and a taper angle ⁇ 2 of the portion is set at 15 degrees, in which the side face parts in both sides are made into the tapered shapes.
  • the cutting edge part 40 C shown in FIG. 4C is a straight type (parallel type) in which the side face parts in both sides are made into a straight shape in parallel.
  • a thickness T 3 of the tip part is set at, for instance, 50 ⁇ m, which has been most thinly formed into the straight shape.
  • the side face part in one side in the inside portion (central side portion) of the straight-shaped tip part is made into a tapered shape, and a taper angle ⁇ 3 of the side face part is set at 20 degrees.
  • part is made into a tapered shape, and a taper angle ⁇ 3 of the side face part is set at 20 degrees.
  • FIG. 5 is a schematic diagram schematically showing a state in the vicinity of the surface of the diamond sintered body.
  • the diamond sintered body 80 shows the state in which the diamond abrasive grains (diamond particles) 82 are bonded to each other with high density by a sintering aid 86 .
  • cutting edges (fine cutting edges) 84 are formed which are composed of fine recesses (recessed parts). The recesses are formed by a process in which the sintering aid 86 such as cobalt is selectively abraded by mechanically processing the diamond sintered body 80 .
  • the diamond sintered body 80 contains a high density of the abrasive grains, accordingly each of the recesses to be formed in a place in which the sintering aid 86 has been worn has a fine pocket shape, and there is no projection of a sharp diamond abrasive grain as in the electroformed blade (see FIG. 19 ). Because of this, each recess which is formed on the surface of the diamond sintered body 80 functions as a pocket which transports swarf that are generated when the workpiece W is subjected to the cutting process, and also functions as the cutting edge 84 which gives the cut onto the workpiece W. Thereby, the discharge performance for the swarf are enhanced, and the cut depth of the blade 26 for the workpiece W can be controlled with high precision.
  • the blade 26 of the present embodiment is integrally composed of the diamond sintered body 80 which has been formed by sintering the diamond abrasive grains 82 with the use of the sintering aid 86 , as is shown in FIG. 5 . Because of this, there slightly exists the sintering aid 86 in gaps between the diamond sintered body 80 , but the sintering aid diffuse also into the diamond abrasive grains itself, and actually the diamonds show a form of being strongly bonded to each other.
  • Cobalt, nickel or the like is used as the sintering aid 86 of which the hardness is low in comparison with that of the diamond, and a portion in which the sintering aid is rich becomes slightly weak in strength in comparison with the single crystal diamond, though the diamonds are bonded to each other. Such a portion is worn and reduced when the workpiece W is processed, and forms a moderate recess with respect to the surface (reference plane) of the diamond sintered body 80 . In addition, the diamond sintered body 80 is subjected to the wearing treatment process, and thereby the recess from which the sintering aid has been removed is formed on the surface of the diamond sintered body 80 .
  • the diamond sintered body is dressed by a grinding stone for dressing, which is formed of GC (green carborundum), or occasionally when the diamond sintered body is used for cutting a super hard alloy which is formed of a hard brittle material, a part of diamonds in addition to the sintering aid is missed, and moderate roughness is formed in the outer circumferential part of the diamond sintered body.
  • the roughness of this outer circumferential part is controlled to be larger than the particle size of the diamond, thereby missing of fine diamond abrasive grains occurs in one cutting edge, and the wear of the cutting edge is unlikely to occur.
  • the recess formed on the surface of the diamond sintered body 80 effectively acts on the process in the ductile mode. Specifically, as has been described above, this recess functions as a pocket for discharging swarf which are generated when the workpiece W is subjected to the cutting process, and also functions as the cutting edge 84 which gives a cut onto the workpiece W. Because of this, the cut amount for the workpiece W is naturally restricted to a predetermined range, and avoids a fatal cut.
  • the blade 26 of the present embodiment is integrally composed of the diamond sintered body 80 , and accordingly also the number, the pitch and the width of the recesses which are formed on the surface of the diamond sintered body 80 can be arbitrarily adjusted.
  • the diamond sintered body 80 which constitutes the blade 26 of the present embodiment is formed by bonding the diamond abrasive grains 82 to each other with the use of the sintering aid 86 . Because of this, there exist the sintering aid 86 among the diamond abrasive grains 82 which are bonded to each other and the grain boundary is present. This grain boundary portion corresponds to the recess, and accordingly, when the particle size (average particle size) of the diamond abrasive grains 82 is set, the pitch and the number of the recesses is naturally determined In addition, the sintering aid 86 which employs a soft metal is used, thereby enabling to selectively process the recesses and also to selectively wearing the sintering aid 86 .
  • the roughness can be adjusted by setting the conditions of the wearing treatment or the dressing treatment while rotating the blade 26 .
  • the pitch, the width, the depth and the number of the cutting edge 84 as in the above description play an important role when the blade performs the process of the ductile mode.
  • a desired interval between the cutting edges 84 can be attained along the grain boundary of the crystal with high precision, by appropriately adjusting parameters which have adequate controllability, such as the selection of the particle size of the diamond abrasive grains 82 , the wearing treatment and the dressing treatment.
  • the cutting edges 84 which are composed of the recesses that are formed on the surface of the diamond sintered body 80 can be arranged in a straight line along a circumferential direction.
  • a wheel as a similar blade, which relates to a wheel formed by sintering the diamond abrasive grains and is used in a scribing process.
  • the difference will be positively described.
  • the wheel which is used in the scribing process is shown in Japanese Patent Application Laid-Open No. 2012-030992, for instance.
  • a wheel is disclosed which is formed of the sintered diamond, and of which the toric edge has blade tip in the outer circumferential part.
  • the scribing process and the dicing process of the present invention tend to be considered to be both technologies for dividing a material and be in the same category, but are completely different in process principles and specific structures associated with the process principle.
  • the scribing process in the above described document is an apparatus which forms a scribing line (longitudinal cracking) on the surface of a substrate formed of a brittle material, as is described in a paragraph [0020] of the above described document, and a vertical crack extending in a vertical direction occurs due to the scribing process (see paragraph [0022] of the above described document).
  • the material is cut and divided by using this crack.
  • a process method which removes a material in a shearing manner without forming a crack or chipping, and the principles are completely different.
  • the blade itself rotates at high speed, and works in an approximately horizontal direction to the surface of the workpiece to remove the workpiece, and accordingly a stress is not exerted on the workpiece face in the perpendicular direction.
  • the cut depth is kept within a deformation region of the material, and the material is worked in such a cut depth that the crack does not occur. As a result, a surface having no crack is obtained after the process. From the above description, the work principle is completely different.
  • the blade In the scribing process, the blade only causes a crack in the inner part of a material, and accordingly does not almost enter into a material. Only the ridge line of the blade tip is made to act, and accordingly the angle of the blade tip is ordinarily a blunt angle (see paragraph [0070] of above described document). It is not considered at all to set the angle at an acute angle, much less 20 degrees or less, in consideration of a fracture due to twisting, and the like.
  • the blade tip In contrast to this, in the dicing process, the blade tip enters the inner part of the material and removes the portion in which the blade tip has entered. Accordingly, the blade tip is straight or the vertex angle of the blade tip is a V shape at most in such a degree that bucking due to a dicing resistance in a traveling direction of the blade is considered. The vertex angle is 20 degrees or less at the maximum.
  • the vertex angle when the vertex angle is set at 20 degrees or more, the cross section after the cutting process becomes diagonal, the cross-sectional area increases, and besides, also in the viewpoint of a mechanism of the process, a volume of the material which is ground by the side face of the blade increases rather than a factor that the tip of the blade performs cutting. As a result, the efficiency of the process is lowered, and in some cases, the process is not proceeded.
  • the cutting edges are formed on the outer circumference of the blade and the cutting edges on the tip progressively efficiently cut into the workpiece; and on the other hand, it is required for the blade to enhance lubricity between the side face of the blade and the workpiece, and to form a minor-finished surface on the workpiece while decreasing the grinding amount.
  • the grinding amount by the side face of the blade increases, the grinding amount on the side face naturally increases, and the cross section after the cutting process cannot be minor-finished. Therefore, in the dicing process, a straight shape is most desirable, but it is adequate that the shape is an extremely small V shape at the minimum in such a degree that the blade is not buckled, and the vertex angle is at most 20 degrees or less.
  • the blade tip is occasionally fractured by a stress due to the twisting. Because of this, even though the wheel is formed of the same diamond sintered body, the content of the diamond is set at 65% to 75% by weight. As a result, not only the wear resistance and the impact resistance but also twisting strength properties are enhanced. If the content of the diamond is set at 75% by weight or more, the hardness of the wheel itself increases, but the twisting strength properties decrease. Therefore, the content of the diamond is set at a comparatively small value.
  • the blade rotates at high speed, and linearly advances while removing a fixed amount of the material. Because of this, the stress due the twisting is not exerted on the blade. Instead, in the case where the content of the diamond is small, when the blade cuts, the apparent hardness is lowered. Accordingly, there is the case where the blade cannot keep a predetermined cut depth because of the reaction force from the workpiece, or because the elasticity of the workpiece recovers within a time period in which the cutting edge of the blade cuts.
  • the hardness of the blade has sufficiently high hardness in comparison with the hardness of the workpiece so that the blade can progressively cut the workpiece without causing a bounce while keeping a predetermined cut.
  • the surface hardness is needed to be equivalent to that of the single crystal diamond (approximately 10,000 by Knoop hardness), and approximately 8,000 by the Knoop hardness becomes necessary. As a result, the content of the diamond needs to be 80% or more.
  • the content of the diamond is 98% or more, a ratio of the sintering aid extremely decreases. Accordingly, the power of bonding the diamonds to each other becomes weak, the toughness of the blade itself is lowered, and the blade becomes fragile and tends to be easily chipped. Therefore, the content of the diamond needs to be 80% or more, and is desirably 98% or less, in consideration of a practical point.
  • the PCD which is used in the scribing wheel and the PCD which is used in the dicing blade of the present invention use the same material, but have completely different work principles, and accordingly required compositions of the PCD, specifically, contents of the diamond become completely different.
  • the scribing wheel has a holder, and the holder is an element of rotatably holding the scribing wheel.
  • the holder mainly has a pin and a support frame body, and accordingly the portion (portion of shaft) of the pin does not rotate.
  • the inner diameter part of the wheel becomes a bearing, relatively rubs on the portion of the pin which is a shaft, thereby rotates and forms a scribing line (longitudinal cracking) in a direction perpendicular to the surface of the material.
  • the blade according to the present invention is coaxially mounted on the rotating spindle.
  • the spindle and the blade integrally rotate at high speed. It is necessary to mount the blade vertically to the spindle shaft, and to eliminate run-out due to the rotation.
  • the reference plane exists in the blade.
  • the reference surface existing in the blade is abutted on the reference end face of the flange which has been previously mounted vertically on the spindle, and is fixed. Thereby, the vertical degree to the spindle rotation axis of the blade is secured. Only when this vertical degree is secured, the cutting edges formed in the outer circumferential part work on the workpiece on a straight line by the rotation of the blade.
  • the reference surface in the case of the scribing process is specified on the basis of a premise that a cylindrical plane in parallel with the shaft of a discoid blade vertically presses the blade.
  • the reference surface of the blade in the blade according to the present invention is a side part end face (discoid plane) of the blade, which faces the flange of the spindle, as has been described above.
  • the reference surface of the blade is determined to be a side face (discoid plane) of the blade, and thereby the blade rotates with high precision in the state of being balanced with respect to the center of the blade.
  • the cutting edge which has been formed on the tip of the blade works in a predetermined height position which is defined by a fixed radial position with reference to the center of the blade, with high precision, and horizontally works on the workpiece face to just remove the workpiece without exerting a vertical stress on the workpiece of a predetermined height. Because of this, even if the workpiece is a brittle material, the blade does not cause a crack by a stress vertical to the workpiece face.
  • the groove of the outer circumferential edge in the case of the scribing process, is to cause a crack vertical to the material while the projecting part of the blade tip of the wheel abuts on (entering) a substrate of the brittle material (see paragraph [0114] of above described document).
  • the groove is such a groove that a portion other than the groove can form such a degree of the scribing line as to enter the material and cause a vertical crack. Therefore, it becomes important how a mountain portion between the grooves enters the material, rather than the groove.
  • the recessed part provided on the outer peripheral end part plays a role of the cutting edge.
  • the portion between the recessed parts forms a contour of the outer circumference, and the cutting edge provided therebetween is set so as to give the critical cut depth in such a degree as not to cause the crack onto the surface of the workpiece. Therefore, in the case of the dicing process, it is necessary to form the cutting edge.
  • the groove depth in the case of the scribing process is formed into a groove depth in such a degree as to give the entering amount for forming the scribing line, but in the case of the dicing process, the cutting edge enters into the workpiece, and each of the cutting edges must grind and remove the workpiece. Because of this, the cutting edge must act vertically on the workpiece face down to the deep part of the material while the tip of the blade completely enters into the workpiece, and the run-out of the blade is not allowed.
  • the blade according to the present invention has the cutting edges of the recessed parts at constant intervals in the outer peripheral end part.
  • the interval between the cutting edges may be such a degree that the critical cut depth given by one cutting edge does not cause the crack, as will be described later. For this purpose, it is necessary to properly keep the interval between the cutting edges.
  • the direction of the blade tip of the scribing wheel is changed by 90 degrees while the scribing wheel abuts on the brittle material. This effect is referred to as a caster effect.
  • the blade In the dicing blade, the blade enters into the material, and accordingly the direction of the blade tip cannot be changed by 90 degrees. For instance, when the blade tip having a straight shape or the vertex angle of 20 degrees or less is shifted while the blade is abutting on the material, the blade is broken.
  • the diamond sintered body 80 which has been sintered by using the sintering aid 86 composed of a soft metal wearing treatment, dressing treatment and the like are the most suitable as a method for forming the recess on the surface, but the method is not limited to the treatments.
  • the sintering aid such as cobalt and nickel is used, for instance, it is also possible to form the recesses on the surface of the diamond sintered body 80 , by chemically dissolving the diamond sintered body partially with acidic etching.
  • the diamond abrasive grains themselves play a role of the cutting edges, but in order to adjust the pitch, the width and the like of the cutting edges, the adjustment needs to rely on the dispersion degree of dispersing the diamond abrasive grains in an early stage, and accordingly the adjustment is technically difficult.
  • the pitch and the width largely include the ambiguity of the dispersion of the diamond abrasive grains, and substantially cannot be controlled.
  • the average particle size of the diamond abrasive grains contained in the diamond sintered body is preferably 25 ⁇ m or less (more preferably is 10 ⁇ m or less, and further preferably is 5 ⁇ m or less).
  • the average particle size of the diamond abrasive grains is 50 ⁇ m, in the case where a wafer material is SiC, the crack has occurred when the dicing process has been performed in the cut amount of 0.1 mm. Probably, it should be a factor that the diamond has fallen off.
  • the diamond abrasive grains with the diamond average particle size of 50 ⁇ m or more have been sintered, an area decreases in which the diamond particles adhere to each other, and the large particles are bonded to each other at a local area. Because of this, the blade has disadvantages of having extremely weak impact resistance, and being easily chipped, in the viewpoint of the composition of the material.
  • the cutting edge behaves as an isolated cutting edge, and gives a cut depth of a predetermined critical cut or more. As a result, it stochastically becomes extremely high to cause chipping and cracks.
  • the diamond of approximately 50 ⁇ m has fallen off, not only the cutting edge in a remaining portion becomes large, but also the diamond abrasive grains themselves, which have fallen off, are entangled between the workpiece and the blade, and occasionally further cause the cracks.
  • the diamond abrasive grains are fine particles of 25 ⁇ m or less, there is no result that the cracks regularly occur.
  • FIG. 6 shows a state of the surface of a workpiece in the case where the grooving process has been performed by a blade formed of diamond abrasive grains having an average particle size of 50 ⁇ m, and shows an example in which the cracks have occurred.
  • Table 2 shows results obtained by having evaluated the occurrence ratio of the cracks or chipping when the grooving process has been performed by the blades of which the average particle sizes of the diamond abrasive grains are each set at 50 ⁇ m, 25 ⁇ m, 10 ⁇ m, 5 ⁇ m, 1 ⁇ m and 0.5 ⁇ m.
  • the evaluation results show that the occurrence ratio of the cracks or chipping becomes higher, in order of A, B, C and D. Other conditions are as follow.
  • the crack occurred when the cut was 0.2 ⁇ m.
  • the crack occurred also in quartz and silicon when the cut was similar to that in the sapphire.
  • the average particle size of the diamond abrasive grains is 50 ⁇ m
  • edge thickness thickness of outer peripheral end part of blade
  • large gaps were formed in some portions, and furthermore the blade was occasionally broken by a little shock. Thus, it was practically difficult to stably manufacture the blade.
  • the average particle sizes of the diamond abrasive grains were 25 ⁇ m, 5 ⁇ m, 1 ⁇ m and 0.5 ⁇ m, even when the cut similar to the case of the average particle size of 50 ⁇ m was performed, the cracks did not occur even in each of the brittle materials of the SiC, the sapphire, the quartz and the silicon. Specifically, in these brittle materials, when the average particle size of the diamond abrasive grains is 50 ⁇ m, the cracks occur by the cut of sub-micron order, and when the diamond abrasive grains having the average particle size of more than 50 ⁇ m are used, the cut naturally becomes large, which causes a fatal crack.
  • the cut can be controlled to be small, and it becomes possible to control the cut depth with high precision.
  • the outer diameter of the blade is 50.8 mm
  • the size of the wafer is 2 inches
  • the grooving process is performed with the cut of 10 ⁇ m
  • the rotation number of the spindle is 20,000 rpm
  • the table feeding speed is 5 mm/s.
  • fine powders of diamond are placed on a base which contains tungsten carbide as a main component, and are charged in a mold. Subsequently, a solvent metal (sintering aid) such as cobalt is added into this mold, as the sintering aid. Subsequently, the powders are fired and sintered under an atmosphere of a high pressure of 5 GPa or higher and a high temperature of 1,300° C. or higher. Thereby, the diamond abrasive grains are directly bonded to each other, and an extremely strong ingot of the diamond is formed.
  • a solvent metal sintering aid
  • a columnar ingot which has a size of, for instance, a diameter of 60 mm, a sintered diamond layer (diamond sintered body) of 0.5 mm and a tungsten carbide layer of 3 mm.
  • DA200 made by Sumitomo Electric Hardmetal Corp., and the like, as the diamond sintered body which has been formed on the tungsten carbide.
  • the blade 26 of the present embodiment can be obtained by taking out only the diamond sintered body, and subjecting the blade substrate to outer circumference wearing treatment or outer circumference dressing treatment work so as to be formed into a predetermined shape.
  • the surface (except cutting edge part 40 ) of the diamond of the columnar ingot by scaif (scaif: disc for polishing) beforehand so as to have a mirror surface having a surface roughness (arithmetic average roughness Ra) of approximately 0.1 ⁇ m, in order to form the reference surface for eliminating run-out during the rotation.
  • the wearing treatment and dressing treatment in the above described manufacturing method can be set at the following conditions.
  • the conditions for the dressing treatment may be the following.
  • the outer peripheral end part of the blade and the side face part of the blade have different roughness from each other.
  • the outer peripheral end part of the blade corresponds to the cutting edge, and the interval between the cutting edges shall be adjusted along the crystal grain boundary by the wearing treatment.
  • the outer peripheral end part of the blade in particular, machines and removes the workpiece material largely to some extent while entering the cut into the workpiece material, and accordingly is processed so as to be slightly rougher.
  • the side face part of the blade does not positively perform machining and removing, and may be roughened in such a degree as to skive the side face part of the groove of the workpiece material when having come in contact with the side face part of the groove.
  • the projection induces cracking on the side face part of the groove. Accordingly, it is necessary to process the side face part of the blade so as not to have a projection part formed thereon, and on the other hand, to reduce a contact area between the side face part of the blade and the side face part of the groove, and alleviate the generation of heat due to friction even slightly. For the purpose, it is desirable to finely roughen the side face part.
  • the conventional electroformed blade or the like is manufactured so that the abrasive grains are fixed by plating, and accordingly the whole surface shows uniform abrasive grain distribution, and as a result, it has been impossible to largely differentiate the deposition form of the abrasive grains between the outer peripheral end of the blade and the side face of the blade. Specifically, it has been impossible to clearly differentiate the conditions of the roughness between the outer peripheral end part of the blade for progressively cutting into the workpiece and the side face part only for finely shave the workpiece while being rubbed with the workpiece.
  • the blade according to the present invention is composed mostly of the diamond, and can be subjected to forming process from that state.
  • the blade according to the present invention may be subjected to diamond wrapping so that the side face part is roughened.
  • the surface is roughened by fine diamonds (with particle size of 1 ⁇ m to 150 ⁇ m), the roughness of which the Ra is approximately 0.1 ⁇ m to 20 ⁇ m, for instance, can be formed.
  • the outer circumferential part of the blade needs to progressively cut into the workpiece while machining the workpiece. Accordingly, it is better to give roughness functioning as the cutting edge to the outer circumferential part, which is different from the side face part.
  • Such a roughness can be formed on the outer circumferential part, for instance, by a pulse laser or the like.
  • the following conditions are preferably used.
  • Laser oscillator Fiber laser made by IPG Photonics Corporation in U.S.A.: YLR-150-1500-QCW
  • sharp cutting edges can be formed which have semicircular shape with a diameter of 0.05 mm, and are continuously arranged on the outer peripheral end of the blade at constant intervals with a pitch of 0.1 mm, as is shown in FIG. 23 .
  • one cutting edge itself can be formed into a cutting edge of 50 ⁇ m, though the particle size of diamond is 5 ⁇ m.
  • apparent intervals become small by increasing the rotation number to high, and the dicing in the ductile mode is enabled (for instance, when rotation number of spindle is 10,000 rpm or more, and the like).
  • the cutting edges can be formed to have such various pore diameters that the sizes of one cutting edge are approximately 5 ⁇ m to 1 mm which is large, but usually the cutting edge can be formed to have a size of approximately 5 ⁇ m to 200 ⁇ m, because of the beam diameter of the laser.
  • a notch is formed from a material in which diamond is fixed by plating. Unlike that method, the material is formed of the sintered diamond into a discoid shape, and fine notches are continuously formed on the outer peripheral end of the discoid shape. Thereby, each of the notches works as the cutting edge.
  • Japanese Patent Application Laid-Open No. 2005-129741 describes a method for forming notches on the outer circumferential part of the blade which has been manufactured by the electroforming method, but the notch in this case is provided as a function of discharging swarf and a function of preventing clogging, and is not provided as the cutting edge.
  • the diamond does not necessarily exist in the edge portion of the notch, but exists together with the bonding material. Accordingly, because the bonding material is worn along with the process, the notch of the material does not work as the cutting edge.
  • the tip of the cutting edge which has been opened on the outer circumferential part works as the cutting edge in that state.
  • the size of the diamond abrasive grain is 5 ⁇ m which is small in comparison with the size of the cutting edge of 50 ⁇ m, and accordingly it also becomes possible that a small cutting edge is spontaneously generated in the cutting edge, due to a phenomenon that one diamond abrasive grain is chipped and falls off in one cutting edge.
  • the diamond abrasive grain works as the cutting edge in the state, and accordingly the size of the cutting edge and the spontaneous generation unit is the same.
  • the arbitrary cutting edges are formed, and thereby the size of the cutting edge and the unit of the spontaneous generation of the diamond in the cutting edge can be changed. As a result, the sharpness can be secured for a long period.
  • the roughness of the outer peripheral end part of the blade is made large in comparison with the roughness of the side face part of the blade, and thereby while the outer peripheral end of the blade progressively cuts into the workpiece, the side face of the blade can grind the workpiece with its finely roughened surface to mirror-polish the workpiece.
  • the sintered diamond is used as in the present invention, it becomes possible to arbitrarily form the cutting edges at even intervals on the outer peripheral end part, while forming a finely roughened surface on the side face of the blade. Thereby, it becomes possible that while securing the sharpness of the outer circumference and efficiently progressively cutting the workpiece, the blade completely independently performs a minor-finish process on the side face of the workpiece.
  • the cutting edges may be formed at even intervals, but are not formed of an integral disc-shaped PCD. Accordingly, as has been described above, it is clear that the structure is completely different from that of the blade according to the present invention, in the points of the thermal conduction, the flatness of the shape, the continuity of the flat surface, a property of exerting a locally effective shearing force on the workpiece without absorbing the impact caused by the work, and a property of performing the process in the ductile mode.
  • the interval between the cutting edges and the roughness of the surface of the side face part are appropriately adjusted according to the material to be processed.
  • FIG. 7 is a sectional view showing a state in which the blade 26 is mounted on a spindle 28 .
  • the spindle 28 mainly includes: a spindle main body 44 which houses a motor (high-frequency motor) (not shown) therein; and a spindle shaft 46 which is rotatably supported by the spindle main body 44 and is arranged in the state in which the tip part projects from the spindle main body 44 .
  • a hub flange 48 is a member which is placed between the spindle shaft 46 and the blade 26 , has a mounting hole 48 a provided therein which is formed into a tapered shape, and has a cylindrical projection part 48 b provided thereon.
  • This hub flange 48 has a flange surface 48 c provided thereon which becomes a reference surface for determining a vertical degree of the blade 26 to the spindle shaft 46 (rotation axis).
  • a blade reference surface 36 a of the blade 26 abuts on this flange surface 48 c, which will be described later.
  • the blade 26 has an annular part (abutting region) 36 provided on an end face of one side, which is formed in the inner side and has a thicker wall than the cutting edge part 40 (see FIG. 2 and FIG. 3 ).
  • This annular part 36 has the blade reference surface 36 a formed thereon on which the flange surface 48 c of the hub flange 48 abuts.
  • the blade reference surface 36 a is preferably provided at a position higher than the other positions on the end face on which the annular part 36 is formed, and the flatness is thereby easily obtained.
  • the thickness of the annular part 36 which includes the blade reference surface 36 a needs to be controlled to be sufficiently thick in comparison with the cutting edge part 40 provided on the outer circumferential part of the blade.
  • the outer circumferential part of the blade needs to have also cutting width thinly formed so as not to cause a brittle fracture on the surface of the material during the cutting process, and the thickness needs to be controlled to 50 ⁇ m or less.
  • the processing distortion becomes a large problem, which occurs when the blade has been machined in a process of flattening.
  • the whole surface of the blade has been manufactured so as to have a thickness of approximately 50 ⁇ m, in particular, the blade is warped in one side due to the balance of mutual distortions occurring in both side faces of the blade.
  • the blade is warped even with a small extent, the blade is buckled and deformed to a side in which the blade is originally warped by an extremely small stress, because the outer peripheral end part is extremely thin, and consequently the blade cannot be used.
  • a portion at which the blade reference surface is formed should not have such a thickness as to cause the warpage due to the distortion even if the processing distortion has remained on the surface of the blade.
  • the blade is a circle plate having a diameter of approximately 50 mm
  • such a thickness of the reference surface portion of the blade as not to cause the warpage due to the processing distortion is 0.25 mm or more at the minimum, and is preferably 0.5 mm or more.
  • the blade reference surface portion needs to have a thickness of that degree, otherwise, the blade cannot keep the flat surface as the blade reference surface. When the flat surface cannot be kept, it becomes difficult to make the outer peripheral end part of the blade work on the workpiece on a straight line.
  • the blade 26 of the present embodiment needs to satisfy the following conditions.
  • the blade reference surface 36 a must keep the flat surface even when the processing distortions on both side faces of the blade 26 have been unbalanced, and accordingly the thickness of the reference surface part needs to be 0.3 mm or more at the minimum.
  • the outer peripheral end part of the blade must perform process so as to occupy an extremely small region, also in order not to induce the crack on the material.
  • the thickness of the cutting edge part 40 which is provided on the outer circumferential part of the blade needs to be controlled to 50 ⁇ m or less.
  • a mirror-finish process by scaif polishing or the like can be used as the method for enhancing the flatness.
  • the hub flange 48 is positioned on and fixed over the spindle shaft 46 by fixing means (not shown), in a state in which the mounting hole 48 a of the hub flange 48 is fitted to the spindle shaft 46 that has been formed into a tapered shape. Subsequently, a blade nut 52 is screwed to a screw part which is formed on the tip of the projection part 48 b in the state in which a mounting hole 38 of the blade 26 is fitted to the projection part 48 b of the hub flange 48 , and thereby the blade 26 is positioned and fixed to the hub flange 48 .
  • the vertical degree of the blade 26 to the spindle shaft 46 is determined by the flatness of the flange surface 48 c of the hub flange 48 , the flatness of the blade reference surface 36 a of the blade 26 , and the mounting precision at the time when both of the flange surface 48 c and the blade reference surface 26 a are overlapped.
  • the flange surface (surface perpendicular to rotation axis) 48 c of the hub flange 48 and the blade reference surface 36 a of the blade 26 which comes in contact with this flange surface 48 c, are flattened by the mirror-finish process, for instance, and are formed so that the vertical degree to the spindle shaft 46 becomes highly precise.
  • the precision of the central position of the blade 26 is determined by the fitting precision between the mounting hole 38 of the blade 26 and the projection part 48 b of the hub flange 48 ; and accordingly the coaxiality of the blade 26 and the hub flange 48 can be secured by enhancing the machining precision of the inner peripheral surface of the mounting hole 38 and the outer peripheral surface of the projection part 48 b, and adequate mounting precision can be achieved.
  • the blade 26 in order to perform process in the ductile mode, the blade 26 needs not only to have the thickness of the cutting edge part 40 thinly structured, but also to be mounted with high precision on the rotation axis so that the cutting edge part 40 can work on an approximately straight line in a direction perpendicular to the rotation axis (spindle shaft 46 ) of the blade 26 . At this time, the required precision can be sufficiently satisfied.
  • the hub flange 48 and the spindle shaft 46 which support the blade 26 are formed from a metal material such as stainless steel (SUS304, for instance; stainless steel in SUS304 is stainless steel based on Japanese Industrial Standards (JIS: Japan Industrial Standards), and stainless steel in the present invention is hereinafter based on Japanese Industrial Standards).
  • the blade 26 is integrally formed of the diamond sintered body 80 , as has been described above.
  • the blade reference surface 36 a is structured so as to be supported by the metal reference surface.
  • the heat is uniformly conducted to the inside of the blade 26 .
  • the blade 26 is formed of the diamond sintered body 80 having extremely high thermal conductivity, but in contrast to this, the hub flange 48 and the spindle shaft 46 which support the blade 26 are formed from stainless steel having remarkably low thermal conductivity in comparison with the diamond sintered body 80 . Because of this, the heat generated in the components conducts in the circumferential direction along the blade 26 , and is uniformized in the circumferential direction of the blade 26 at once. Accordingly, the temperature distribution becomes a radial shape.
  • the heat conducts only to the diamond portions at once, and the heat resists conducting to the spindle shaft 46 and the hub flange 48 which are formed from the stainless steel, because of the cross-sectional area and the like, and also because there are few contact parts. Consequently, the uniformization of the heat is further promoted in the diamond portion, and thermal balance is secured in the uniformized state.
  • the outer circumferential part of the blade there exists no member which obstructs thermal expansion, and there is no bimetal effect. Accordingly, the outer circumferential part of the blade 26 can adequately keep circularity and flatness. As a result, the cutting edges 84 which are provided on the outer peripheral end part of the blade work on a straight line on the workpiece W.
  • the blade 26 shown in the present embodiment is structured so as to be mounted on the spindle shaft 46 through the hub flange 48 , but the blade 26 may be structured so as to be mounted directly on the spindle shaft 46 . A similar effect can be obtained.
  • This dicing method is a method which plastically deforms a brittle material such as silicon, sapphire, SiC (silicon carbide) and glass without causing a brittle fracture such a cracking and chipping therein, and can simultaneously stably perform the cutting process on the brittle material with high precision.
  • a brittle material such as silicon, sapphire, SiC (silicon carbide) and glass
  • the workpiece W is taken out from the cassette mounted on the load port 12 , and is mounted on the worktable 30 with the transporting means 16 .
  • the surface of the workpiece W mounted on the worktable 30 is imaged by the imaging means 18 , and the position of the line on the workpiece W, on which the workpiece W is diced, and the position of the blade 26 are aligned by the worktable 30 of which the position is adjusted by each of the moving shafts of X, Y and ⁇ (not shown).
  • the spindle 28 starts rotating, and the spindle 28 moves down to a predetermined height in a Z direction only by the amount of the cut or grooving which the blade 26 performs on the workpiece W.
  • the blade 26 rotates at high speed.
  • the workpiece W is fed for the machining to the blade position together with the worktable 30 in an X direction shown in FIG. 1 , by the moving shaft (not shown), and is subjected to dicing by the blade 26 which is mounted on the tip of the spindle that has been moved down to the predetermined height.
  • the cut depth (cut amount) of the blade 26 with respect to the workpiece W is set.
  • the cut depth must be set so that when the blade 26 which has a large number of cutting edges on the outer circumference rotates at high speed, one cutting edge (fine cutting edge) 84 reaches a critical cut depth (Dc value) or shallower.
  • This critical cut depth is the maximum cut depth at which the blade can perform the cutting process in the ductile mode by the plastic deformation without causing the brittle fracture of the brittle material.
  • the critical cut depth is 0.15 ⁇ m, and accordingly the cut depth of the blade 26 into the workpiece W is set at 0.15 ⁇ m or less. If the cut depth exceeds 0.15 ⁇ m, it cannot be avoided that the crack occurs in the workpiece material.
  • the critical cut depth (0.15 ⁇ m) of the silicon is smallest, and silicon is easily broken in comparison with the other materials. From the relationship, in most materials, when the cut depth is 0.15 ⁇ m or less, the process in the ductile mode is enabled in which the process can be proceeded in a deformation range of the material without causing the crack in principle.
  • peripheral velocity of the blade 26 with respect to the workpiece W is set to be sufficiently high in comparison with the relative feeding speed of the blade 26 with respect to the workpiece W (feeding speed for machining).
  • the relative feeding speed of the blade 26 is set at 10 mm/s with respect to the rotational speed of the blade 26 of 53.17 m/s.
  • the cut depth and the rotational speed of the blade 26 , and the relative feeding speed of the blade 26 to the workpiece W are controlled by the controller 24 shown in FIG. 1 .
  • the dicing processes in such a ductile mode are repeatedly performed until the groove depth of the cut line becomes the final cut depth, in the state in which the cut depth per one cut is set at the critical cut depth or less.
  • the blade 26 is indexing-fed to an adjacent cut line to be processed next, and is positioned there. Then, the dicing process along the cut line is performed according to the process procedure which is similar to the above described procedure.
  • the workpiece W is rotated at 90 degrees together with the worktable 30 , and the dicing process along a cut line in a direction perpendicular to the above described cut line is performed according to the process procedure which is similar to the above described procedure.
  • the workpiece W is cut and divided into a large number of chips.
  • a double-side tapered type (V type on both sides) of the blade 26 was used as the blade 26 of the present embodiment.
  • a blade having a thickness of 50 ⁇ m was used as a conventional electroformed blade.
  • Other conditions are as follow.
  • FIGS. 8A and 8B show a state of the surface of the workpiece after having been subjected to the grooving process.
  • the blade 26 of the present embodiment did not cause cracking, and could stably perform the cutting process in the ductile mode with high precision, in comparison with the case where the conventional electroformed blade was used.
  • FIGS. 9A and 9B each show a state of the surface of the workpiece after having been subjected to the grooving process; and FIG. 9A shows the case where the blade 26 of the present embodiment was used, and FIG. 9B shows the case where the conventional electroformed blade was used.
  • the comparative experiment was performed on the following conditions with the use of a straight-shaped blade.
  • the comparative experiment was performed on the condition that the thicknesses of the blades were each 20 ⁇ m, 50 ⁇ m and 70 ⁇ m.
  • FIGS. 10A to 10C each show a state of the surface of the workpiece after having been subjected to the grooving process by the blade 26 of the present embodiment; and FIG. 10A shows the case where the thickness of the blade was 20 ⁇ m,
  • FIG. 10B shows the case where the thickness of the blade was 50 ⁇ m
  • FIG. 10C shows the case where the thickness of the blade was 70 ⁇ m.
  • the comparative experiment was performed on the following conditions with the use of the straight-shaped blade, similarly to Comparative Experiment 3.
  • the comparative experiment was performed on the condition that the thickness of the blade was 20 ⁇ m.
  • FIGS. 11A and 11B show the states of the surface ( FIG. 11A ) of the workpiece and the cross section ( FIG. 11B ) of the workpiece after having been subjected to the grooving process by the blade 26 of the present embodiment, respectively. As in the figure, it is shown that an ideal work in a ductile mode can be performed even on a hard material such as the superhard WC.
  • the comparative experiment was performed on the following conditions with the use of the straight-shaped blade, similarly to Comparative Experiment 4.
  • the comparative experiment was performed on the condition that the thickness of the blade was 50 ⁇ m.
  • FIGS. 12A and 12B show the states of the surface of the workpiece and the cross section of the workpiece after having been subjected to the grooving process by the blade 26 of the present embodiment, respectively.
  • FIG. 12A a sharp cut line is observed when viewed from the surface of the workpiece.
  • FIG. 12B it is understood that a minor-finished cut surface is obtained even when having been compared to the conventional electroformed blade.
  • the comparative experiment was performed on the following conditions with the use of the straight-shaped blade, similarly to Comparative Experiment 5.
  • the comparative experiment was performed on the condition that the thickness of the blade was 50 ⁇ m.
  • FIGS. 13A and 13B each show a state of the surface of the workpiece after having been subjected to the grooving process; and FIG. 13A shows the case where the blade 26 of the present embodiment was used, and FIG. 13B shows the case where the conventional electroformed blade was used.
  • the electroformed blade tears off each fiber, and accordingly a clean cross section of the fiber cannot be observed.
  • the fibers are not entangled and each of the fibers is not torn off; and the cut surface having a sharp end face of the fiber can be obtained.
  • the continuous cutting edges are formed, and each of the recessed portions becomes the cutting edge; and also the diamonds are bonded to each other. Because of this, the cutting edge in the blade according to the present invention does not absorb the instantaneous shock and sharply functions due to the shear stress of the diamond, though the cutting edge of the electroformed blade does not sharply function when cutting one fiber, because the soft bonding material absorbs the shock.
  • the cutting edges (fine cutting edge) formed along the crystal grain boundaries shall be provided along the circumferential direction at approximately 10 ⁇ m pitch, on the outer peripheral end part of the blade.
  • the length of the outer circumference of the blade is 157 mm (157,000 ⁇ m), and accordingly approximately 15,700 cutting edges are formed on the outer circumferential part.
  • the critical cut depth which does not cause a crack in SiC, Si, sapphire, SiO 2 and the like is usually a sub-micron order (for instance, approximately 0.15 ⁇ m).
  • the blade can proceed with the process theoretically of approximately 0.314 mm (314 ⁇ m) per one rotation of the blade.
  • the spindle of the dicing process When the spindle of the dicing process is determined to be 10,000 rpm, the spindle rotates 166 times per second. Therefore, the distance in which the outer peripheral end part of the blade advances while cutting, removing and discharging the workpiece per second is 52.124 mm. For instance, when the feeding speed of the blade is set at 20 mm/s, the speed of machining and removing the workpiece material in a shear direction is faster than the speed of advancing in the workpiece material while pressing the workpiece material.
  • the blade when the blade cuts the workpiece material, the blade takes a form of making into the workpiece material a fine cut of such a degree as not to cause a fracture in the workpiece material, machining the workpiece material in a horizontal direction perpendicular to the traveling direction of the blade and sweeping the machined workpiece material, and advancing in the swept and removed portion. Because of this, there is not a space into which the blade makes a cut of 0.1 ⁇ m or more of such a degree that the crack occurs, and accordingly the blade can perform the cutting process in the ductile mode process region based on the plastic deformation, without causing the brittle fracture.
  • the process is performed with a slight allowance in consideration of some eccentricity of the blade. Specifically, when the blade diameter is ⁇ 50.8 mm and if the blade machines the material at a feeding speed of approximately 10 mm/s while being rotated at 20,000 rpm, cracks do not occur in the material.
  • a double-side tapered type (V type on both sides) shown in FIG. 4B is preferably employed as the cross-sectional shape of the cutting edge part 40 which is provided on the outer circumferential part of the blade 26 .
  • FIG. 14 is an explanatory diagram schematically showing a state at the time when a dicing process is performed with the use of a blade 26 having a double-side tapered type of cutting edge part 40 .
  • a tip part 40 a which is provided at an arbitrary position of the cutting edge part 40 of the blade 26 grinds the workpiece W while gradually moving from the surface portion of the workpiece W to the deepest portion (lowest point), as is shown in portion (A) to portion (C) in FIG. 14 .
  • the tip part 40 a of the cutting edge part 40 gradually moves from the deepest portion of the workpiece W toward the surface portion.
  • a gap S is formed between the side face of the grinding groove and the side face of the blade 26 .
  • an upstream side of the rotating direction of the blade becomes a cutting portion 60 by which the workpiece W is ground; and on the other hand, in a downstream side, the gap S is formed between the side face of the blade (side face of cutting edge part 40 ) and the side face of the groove, the workpiece W is not ground there, and the downstream side becomes an ejecting portion 62 by which the swarf that have been ground by the cutting portion 60 in the upstream side are ejected into the groove.
  • a burr and chipping are generally produced by such an action that the blade is rubbed by the side face of the groove, when the blade is extracted from the material. Because of this, when a straight-type blade 90 is used in which the side face parts in both sides are fabricated to have a straight shape so as to be parallel to each other, as is shown in FIG. 15 , the side faces of the blade continually come into contact with the side faces of the cutting groove until the tip part (cutting edge part) of the blade exits to the outside of the workpiece W after having entered into the inside of the workpiece W.
  • the side faces of the blade tend to be easily rubbed with the side faces of the cutting groove when the tip part of the blade is extracted from the inside of the workpiece W, as compared with the double-side tapered-type blade 26 . Consequently, the rubbing becomes a factor of causing the bun and chipping (see portion (D) and portion (E) in FIG. 15 ).
  • the electroformed blade is used in which the abrasive grains of the diamond are embedded, the abrasive grains which project from the side faces of the blade scratch the side faces of the groove, which tends to easily promote the occurrence of the bun and chipping on the side faces of the groove.
  • the gap S is generated between the side faces of the blade and the side faces of the groove when the blade 26 is extracted from the workpiece W. Accordingly, the bun and chipping are not generated.
  • the blade 26 can simultaneously discharge heat which is generated during grinding, together with the swarf. Thereby, it becomes possible to prevent the warpage of the blade 26 .
  • the cutting edge part 40 of the blade 26 cuts into the workpiece W from the time when the blade 26 enters into the workpiece W till the time when the blade 26 reaches the lowest point. After that, in a process in which the blade 26 passes through the lowest point of the workpiece W and the blade 26 exits from the workpiece W, the blade 26 exits from the workpiece W in a state in which the gap S is formed between the side faces of the blade and the side faces of the groove. Accordingly, it becomes possible that the blade 26 effectively suppresses the occurrence of the chipping and the like.
  • the cutting process when the cutting process is performed as in the above description, the cutting process also contributes to suppress the generation of heat as much as possible that is generated by the friction which is associated with the contact between the side faces of the blade and the side faces of the groove.
  • the above described cutting process can suppress the increase of cutting resistance which is caused by the rise of the heat, and can prevent the cut swarf from depositing onto the blade 26 .
  • the blade 26 forms the gap S in a process of exiting from the workpiece W and leaves the cut swarf in the groove, which also achieve an effect of imparting heat to the cut swarf and exhausting the heat. Such cut swarf can be washed out by subsequent washing.
  • the arrangement of the abrasive grains in the circumferential direction of the blade 26 needs to be considered. The reason is as follows.
  • the cutting edge (fine cutting edge) for entering the cut desirably has such sizes of the abrasive grain and an interval between the cutting edges as to be larger than 0.15 ⁇ m by approximately one order.
  • the interval between the cutting edges is larger than 0.15 ⁇ m by three or more orders, it is difficult to enter a fine cut, when considering also the dispersion of the intervals between the cutting edges.
  • a maximum cut depth will be geometrically calculated, the maximum cut depth which is a depth when the blade having the cutting edges which are arranged at approximately even intervals machines the tabular sample while being moved in parallel to the tabular sample.
  • a hatched portion is hereafter assumed to be a swarf portion per one edge with reference to FIG. 16
  • a length AC which is determined by a line that connects the center O of the blade with one point A on the swarf becomes the maximum cut depth g max per one edge.
  • D shall represent a diameter of the blade
  • Z shall represent the number of the cutting edges of the blade
  • N shall represent the number of revolutions of the blade per minute
  • V s shall represent a circumferential velocity (iDN) of the blade
  • Vw shall represent the feeding speed for the workpiece
  • Sz shall represent the feeding amount per one edge of the blade
  • a shall represent the cut depth.
  • ⁇ DN is clearly equal to the peripheral velocity V s of the blade.
  • a relationship between the interval ⁇ between the cutting edges and the maximum cut depth per one edge is given by the following expression.
  • g max is a cut depth per unit of cutting edges
  • ⁇ is an interval between cutting edges
  • V ⁇ is a workpiece feeding speed
  • V s is a speed of a blade
  • a is a cut depth of the blade
  • D is a blade diameter
  • the cut amount is only a level of 0.027 ⁇ m, and becomes the cut amount of 0.1 ⁇ m or less. If being in this range, the cut amount is the critical cut depth or less, and accordingly is in a range of the process in the ductile mode.
  • a thickness of the workpiece is set at 0 5 mm
  • a feeding speed of the workpiece is set at 10 mm/s
  • the interval between the cutting edges in the outer circumferential portion of the blade is formed at a pitch of 1 mm (V ⁇ : 10 mm/s, V s : 157 ⁇ 10 4 mm/s, a: 0.5 mm, D: 50 mm, and ⁇ : 1 mm)
  • the critical cut depth which one edge enters becomes 0.08 ⁇ m, and still becomes a cut depth of 0.1 ⁇ m or less. Therefore, in the case where it is assumed that the blade is not decentered and all of the cutting edges ideally function for a removal process for the workpiece, if the interval between the cutting edges which can be formed on the outer circumferential part of the blade is critically 1 mm or less, it becomes possible to proceed with the process without giving an excessive cut which causes a fatal crack to the workpiece.
  • the critical cut depth which does not cause the crack is approximately 0.1 ⁇ m, but in other materials of sapphire, glass, silicon and the like, the critical cut depth which does not cause the crack is approximately 0.2 to 0.5 ⁇ m, and accordingly when the critical cut depth is set at 0.1 ⁇ m or less, most of the brittle materials do not cause the crack therein, and the process can be performed in the plastic deformation region of the material.
  • the interval between the cutting edges to be provided on the periphery of the blade is 1 mm or less.
  • the interval between the cutting edges in the periphery of the blade is 1 ⁇ m or more. If the average interval between the cutting edges is 1 ⁇ m or less, in other words, when the blade has the interval between the cutting edges of a sub-micron order, the amount of the critical cut depth and the unit of the depth of the material removal become approximately the same level. Specifically, both of the amount and the unit become the sub-micron order, but on such a condition, it is actually difficult that one cutting edge reaches the expected removal amount, and on the contrary, the process speed rapidly decreases due to a clogging mode.
  • the above described thought holds true when the cross-sectional area at which the workpiece is cut is constant. Specifically, the thought coincides with the content concerning an approximately tabular sample and a blade which rotates at high speed, is set so that the cut depth of the blade is a certain cut depth with respect to the tabular workpiece, and performs cutting process on the workpiece while the workpiece is being slid.
  • the above described expression also shows that the critical cut depth given by one cutting edge depends on the interval between the cutting edges, which is important.
  • the amount to be cut by one cutting edge affects the interval between the present cutting edge and the next cutting edge, and shows a possibility that the cutting edge enters a deeper cut than the desired critical cut depth into the workpiece to cause the crack, when there is a portion in which the interval between the cutting edges is large. Therefore, the interval between the cutting edges is an important factor, and in order to obtain a stable interval between the cutting edges, a PCD material formed by sintering the single crystal diamonds is preferably used so that the interval between the cutting edges is naturally set from the composition of the material.
  • the diamond abrasive grains have a particle size desirably of approximately 1 ⁇ m to 5 ⁇ m as an ideal particle size.
  • the particle size does not necessarily become the interval between the cutting edges.
  • the interval between the cutting edges may correspond to the particle size, but usually, in the state in which the blade is cut and dressed, the interval between the cutting edges becomes larger than the particle size of the abrasive grains.
  • the pitch of the cutting edges can be formed by uniformly roughening the blade.
  • FIGS. 17A and 17B show a result obtained by having measured the outer peripheral end of the blade with a roughness meter. Furthermore, FIGS. 18A and 18B show photographs of the surface state. Because the blade is the sintered body, all of portions which are viewed on the surface are basically formed of the diamonds that are abrasive grains.
  • the convexoconcaves of the surface is formed of the diamond grain boundaries, and the uneven shapes having naturally approximately even intervals are formed.
  • Each of the recessed parts functions as a cutting edge for entering the cut into the material.
  • this pitch of the cutting edges there are 260 peaks and 263 of peaks in a range of 4 mm, and accordingly it is understood that the interval between the cutting edges corresponds to a pitch of approximately 15 ⁇ m.
  • the present material is formed of DA 200 made by SUMITOMO ELECTRIC HARDMETAL CORP., and the particle size of the constituting diamond particles is nominally 1 ⁇ m.
  • the interval between the cutting edges is formed so as to be larger than the particle size, and is formed so as to be an approximately even interval, as is understood from the figures.
  • Such cutting edges at the even intervals are formed because the blade itself is formed of the diamond sintered body which is formed by sintering the fine particles of the single crystal.
  • the tip portion of the blade has convexoconcaves largely formed, in order to progressively cut into the workpiece, but in contrast to this, the side face portion of the blade grinds the workpiece so that the end face of the workpiece after having been subjected to the cutting process has a mirror-finished surface, in comparison with the tip portion of the blade. Because of this, the tip part of the blade is roughly formed so as to progressively cut into the workpiece, and in contrast to this, the side face part of the blade is finely formed.
  • the interval between the diamond abrasive grains is remarkably large in comparison with the particle size. This is because the diamond abrasive grains which are sparsely scattered are simply plated, and the intervals are completely different at the time when the grains are plated.
  • the diamond sintered body is formed to be extremely hard and have high strength.
  • the diamond sintered body has a relatively large content of the diamond in comparison with that of the electroformed blade, (for instance, see Japanese Patent Application Laid-Open No. 61-104045), and has relatively a high strength in comparison with the electroformed blade.
  • the volume of other parts (including sintering aid) than the diamond can be made smaller than the volume of the diamond; and in the case of the diamond sintered body, even if the particle size is large, the gap between the diamond abrasive grains can be substantially controlled to a size of a micron order.
  • the recessed portion between the diamond abrasive grains plays an extremely important role in the present invention.
  • the diamond abrasive grains are extremely hard.
  • a part of cobalt which is contained as the sintering aid permeates into the diamond, but a part thereof remains between the diamond abrasive grains.
  • This portion is slightly soft in comparison with the diamond, accordingly is easily worn in the cutting process, and is formed into a slightly recessed shape.
  • there is a portion sandwiched between the diamonds, and the recess therebetween is formed into a fine cutting edge. Thereby, the blade is intended to provide a stable cut without giving an excessive cut to the workpiece.
  • the fine cutting edge is not only formed of the recess sandwiched between the diamonds, but also the recessed portion which has been formed by the missing of the diamond abrasive grain itself occasionally works as the cutting edge.
  • This interval between the cutting edges may be set at an interval in such a degree as not to exceed the critical cut depth per one edge shown in the above expression.
  • the diamond abrasive grains having a particle size of 25 ⁇ m are fixed by sintering.
  • the diamond abrasive grain is a cube with a 25 mm square.
  • portions of 1 ⁇ m on both sides on the outside of 25 ⁇ m shall be used as a bonding portion for being bonded to other particles.
  • the diamond abrasive grain becomes a cube with 27 ⁇ m square.
  • the volume percentage which is occupied by the portion of the diamond abrasive grains becomes approximately 78.6%.
  • the gap between the diamond abrasive grains specifically, the interval between the particles becomes substantially 1 to 2 ⁇ m at most, and the recessed portion becomes the cutting edge (fine cutting edge) for giving the cut to the workpiece.
  • the interval between the particles is approximately 2 ⁇ m, even when the particles arranged at the pitch are pressed into the workpiece material in the interval between the particles, the displacement of the workpiece material becomes smaller by one order or more in comparison with the interval between the diamond abrasive grains. Specifically, the displacement becomes equal to or less than 0.15 ⁇ m.
  • the cutting edges are formed at a pitch of 25 ⁇ m.
  • the blade diameter is 50 mm
  • 6,280 pieces of the cutting edges are formed per whole perimeter of approximately 157 mm. If the blade is rotated at 20,000 rpm, 2,093,333 pieces of cutting edges can function per second.
  • this one cutting edge enters a cut of 0.15 ⁇ m or less into the workpiece, and removes approximately 0.03 ⁇ m which is 1 ⁇ 5 of the 0.15 ⁇ m per second. Then, if there are 2,093,333 pieces of the fine cutting edges, the fine cutting edges are capable of removing 62,799 ⁇ m per second, and can theoretically progressively cut into the workpiece at approximately 6 cm per second.
  • the blade can give the cut amount of 0.15 ⁇ m to the workpiece as a stable cut amount, without giving the excessive cut amount to the workpiece.
  • the particle size of the diamond abrasive grains is not 25 ⁇ m but less than 25 ⁇ m, if the content of the diamond is controlled to 80% or more, there is no problem because the values do not exceed the critical cut depth in the points of the cut and the material removal amount, and it becomes possible to perform the process in the ductile mode without causing the crack.
  • the diamond abrasive grains are densely packed, accordingly the content of the diamond is extremely high, and each of the diamond abrasive grains works as the cutting edge having the size of the diamond abrasive grain.
  • the distance between the diamond abrasive grains becomes remarkably small in comparison with the particle size of the diamond abrasive grains, and it becomes possible to precisely control the cut amount.
  • the cut depth does not become larger than a predetermined cut depth which has been originally intended, and the stable cut depth is always ensured during the work. As a result, it becomes possible to perform the cutting process of the ductile mode without failure.
  • the content of the diamond abrasive grains can be further increased.
  • a ratio of the sintering aid is further decreased, in other words, the gap between the diamond abrasive grains becomes actually minute.
  • the particle size is sufficient in the point of the interval between the cutting edges when the process in the ductile mode is performed, but on the other hand, when the edge thickness of the blade is set at 50 ⁇ m or less, the cutting edge cannot be manufactured from such large abrasive grains.
  • the blade when the cutting edge is manufactured so as to have an edge thickness of 40 ⁇ m, for instance, the blade must contain at least two or more diamond abrasive grains in the cross section of the blade, but two diamond abrasive grains do not theoretically enter the cross section but 1 . 6 diamond abrasive grains enter.
  • the cut in a depth direction needs to be controlled to approximately 0.15 ⁇ m or less, as has been described above.
  • the displacement in the thickness direction (displacement in vertical direction) of the workpiece material, which is considered from the cut width also needs to be considered.
  • the cut width needs to be set at a value limited to some extent. The reason is because when the cut depth is made extremely large, an aftereffect of the deformation affects the material also in the vertical direction due to the deformation of the material caused by the influence of the Poisson's ratio. Thereby, the cut amount having a predetermined critical cut depth which has been set or more enters into the workpiece, and as a result, occasionally induces the cracking of the workpiece W.
  • the edge thickness (width of blade) of the blade will be investigated, which can stably give the cut to the workpiece when the influence of the Poisson's ratio is taken into consideration.
  • Table 4 shows a relationship between the Young's modulus of a brittle material and the Poisson's ratio.
  • one cutting edge shall enter into the workpiece material.
  • the cross-sectional shape of the tip of a thin straight blade becomes a substantially semicircular shape when the blade is normally manufactured without arbitrarily sharpening particularly.
  • the width of the blade which cuts into the material needs to be controlled to be approximately 50 ⁇ m or less at most.
  • the blade works on the material simultaneously planarly on each of the points, which occasionally leads to induce the fine crack.
  • the cutting edge basically works more locally than in the above described state. Accordingly, the horizontal width of the cutting edge does not basically affect the cut depth, and the blade can stably cut the workpiece.
  • the width of the blade there is a viewpoint of performing the process in the ductile mode, but the width of the blade largely relates also to a buckling strength of a single body of the blade.
  • the above described width of the blade receives restriction also from the thickness of the workpiece.
  • the workpiece is generally supported by a dicing tape.
  • the dicing tape is an elastic body, accordingly is different from a hard material such as the workpiece, and tends to easily cause displacement in the vertical direction (Z direction) by a small stress.
  • Z direction the vertical direction
  • the cross-sectional shape of a portion to be cut in the workpiece becomes important, in other words, a shaded portion shown in FIG. 20A becomes important.
  • the maximum flexure is inversely proportional to the cube of the thickness h of the workpiece, and is proportional to the fourth power of the contact region l of the blade.
  • the contact region of the blade When the contact region of the blade is larger than the thickness of the workpiece (l>h), the flexure occurs in the workpiece in the contact region, but when the workpiece is bent, the vibration of the run-out of the workpiece occurs, due to the flexure occurring in the plane intermittently and vertically, and the blade is incapable of attaining the predetermined cut. As a result, the fatal cut is given from the blade into the workpiece due to the vibration in the vertical direction of the workpiece, and thereby cracking occurs in the surface of the workpiece.
  • the work by the PCD blade of the present invention needs to stably and faithfully keep a predetermined cut depth, in order to perform a process in a crack-free manner.
  • it is necessary to precisely secure the predetermined cut by suppressing the vertical vibration which occurs when the workpiece itself is worked, in addition to an operation of setting the cut depth by controlling the intervals between the cutting edges.
  • the thickness of the blade must be controlled so as to be thinner than the thickness of the workpiece of an object, as is shown in FIG. 20C .
  • the width (thickness) of the blade needs to be naturally set at 50 ⁇ m or less.
  • the workpiece is bent in the contact region.
  • a stress for curving or compressing the workpiece works in the contact region, but the workpiece is a densely continuous body in the transverse direction, and the deformation of the workpiece is restrained by the Poisson's ratio. Because of this, the workpiece locally reacts with the stress which has been given from the blade as the reaction force from the workpiece, and as a result, the blade is capable of performing the machining of the predetermined cut on the workpiece without causing the cracking in the workpiece.
  • the film is formed by a CVD method, and there is not a projecting crack.
  • the nonuniformity of the film thickness at the time of film formation directly corresponds to the nonuniformity of the thickness of the blade.
  • the surface itself of the formed film is an untreated surface. Accordingly, the surface comes into full contact with a side face of a material, and may induce frictional heat; and has fine waviness, and the waviness may also break the material into pieces.
  • the blade 26 of the present embodiment is integrally formed of the diamond sintered body which is sintered with the use of a sintering aid of soft metal, and accordingly it becomes possible to form the outer peripheral end part of the blade and the side face part of the blade by wearing treatment.
  • the outer peripheral end part of the blade becomes the cutting edge, in particular, and accordingly it is also possible to further change a condition of the wearing treatment so as to form the predetermined cutting edge, as has been described above.
  • the role of the side face part of the blade is firstly to remove swarf.
  • the side face part of the blade comes into contact with the side face of the workpiece to some extent, but does not excessively come into contact therewith, and is roughened to such a degree that the side face part of the blade stably and finely cuts the side face of the workpiece.
  • the technology in any one of the cited literatures cannot achieve a process of designing a desired surface state according to each of the states of the outer peripheral end part of the blade and the side face part of the blade, and manufacturing surfaces of the blade into the surfaces as in the above.
  • the blade which is used for a scribing process, the blade is not suitable for the work in the ductile mode, because of the following reason.
  • the blade itself is not rotated, and accordingly fine cutting edges that are arrayed at an even interval themselves are not needed.
  • the cutting edges even if there exist the cutting edges, in the case where the cutting edge is not a fine cutting edge formed along the crystal grain boundary of a micron order but is a large cutting edge, the cutting edge gives a crack to the material in the dicing process in which the blade rotates at high speed, and the blade cannot be used at all.
  • the fine cutting edge does not function as a cutting edge which gives the crack for the scribing process.
  • the scribing apparatus is configured so as to give a stress in downward vertical direction to a shaft which passes through the inside of the blade, and to make the blade slide with respect to the shaft.
  • the shaft and the blade are not fixed in service, and accordingly the clearance of the blade with respect to the shaft is low.
  • the blade itself does not rotate at high speed. Accordingly, it is also unnecessary to provide a reference surface on one side face of the blade.
  • the blade for the scribing process which has a thin blade tip of 50 ⁇ m or less, especially 30 ⁇ m or less, the precise straightness with respect to the workpiece cannot be secured, because a thin bearing receives the blade and one side face of the blade does not have the reference surface which receives the bearing with a wide face. As a result, the blade having the thin blade tip is buckled and deformed, and cannot be used.
  • the blade material In order that the blade cuts a fixed amount in the workpiece and progressively cuts the workpiece in the state, the blade material needs to have a larger strength than that of the workpiece material.
  • the blade material is formed of simply a softer material than the workpiece material, specifically is formed of a material having small Young's modulus, and suppose that it is intended to make an extremely fine tip portion of the blade act on the surface of the workpiece and make the blade move forward.
  • the workpiece material is a member having high elastic modulus
  • the blade cannot finely deform the surface of the workpiece, and the blade itself is buckled and deformed if the blade is made to forcibly deform the surface of the workpiece. Because of this, the process consequently is not proceeded.
  • a buckling load P of a long column of which both of the ends are supported is given by the following expression.
  • the blade has an elastic modulus lower than the workpiece material, and suppose that the blade proceeds with the process while suppressing the buckling and deformation.
  • Such a degree of a second moment of area (cross-sectional secondary moment) that the blade is not buckled and deformed becomes necessary, and specifically the blade cannot help increasing the thickness of itself.
  • the blade deforms the surface of the workpiece material, and presses and breaks the workpiece material. Therefore, the thickness of the blade must be set so as to be thinner than the thickness of the workpiece.
  • the blade material to be used must have higher elastic modulus than the workpiece material.
  • Such a relation corresponds to a difference between the conventional electroformed blade and the blade 26 of the present embodiment.
  • diamond abrasive grains are bonded with the use of the bonding material such as nickel, and the base material becomes a nickel base.
  • the Young's modulus of nickel is 219 GPa, but the Young's modulus of SiC, for instance, is 450 GPa.
  • the Young's modulus of the diamond abrasive grain itself is 970 GPa, which is electrodeposited by nickel, but the grains independently and individually exist in nickel, and as a result, the grains are controlled by the Young's modulus of nickel.
  • the blade subordinately must increase the thickness to cope with the high elastic modulus. As a result, it is obliged to thicken the thickness of the electroformed blade and enlarge the contact area, which induces cracking and breaking.
  • the Young's modulus of the diamond sintered body corresponds to 700 to 800 GPa.
  • the value is almost equal to the Young's modulus of the diamond.
  • the elastic modulus of the blade 26 is large as compared with the elastic modulus of the workpiece W
  • the blade 26 is not deformed but the surface of the workpiece W side is deformed. It becomes possible to enter the cut into the workpiece in the state in which the workpiece W side is deformed, and to machine and remove the workpiece. Besides the above, the blade 26 is not buckled and deformed in the process. Therefore, even though being very sharp, the blade 26 can proceed with the process without being buckled.
  • the Young's modulus of each material is shown in Table 5. As is clear from Table 4, the Young's modulus of the diamond sintered body (PCD) is markedly high even as compared with those of most materials such as sapphire and SiC. Because of this, the blade is enabled to machine the workpiece even though being thinner than the thickness of the workpiece material.
  • PCD diamond sintered body
  • the relationship of the hardness between the workpiece material and the blade material will be described.
  • the relationship of the hardness is also similar to the previous elastic modulus.
  • the hardness of the blade material is low as compared with the hardness of the workpiece material, for instance, in the case of the electroformed blade, soft copper and nickel support the diamond.
  • the diamond abrasive grain on the surface has extremely high hardness, but the hardness of nickel which supports the diamond abrasive grain under the grain is very low as compared with diamond. Therefore, when a shock is given to the diamond abrasive grain, nickel under the grain absorbs the shock. As a result, in the case of the electroformed blade, the hardness of nickel becomes dominant.
  • the bonding material absorbs the shock, and accordingly as a result, it becomes difficult to give a predetermined cut to the workpiece. Therefore, in order to proceed with the process, it is necessary to rotate the blade at a fixed rotation number or more to shockingly give a force to the diamond. Otherwise, the process is not proceeded.
  • the shock is absorbed by nickel for a moment at this time, and the reaction force pushes the diamond abrasive grain and presses the workpiece material with a big force, which causes a brittle fracture in the workpiece material.
  • the diamond sintered body has the hardness equivalent to a diamond single crystal, and the hardness is markedly high hardness even as compared with that of hard brittle materials such as sapphire and SiC.
  • the cutting edge (fine cutting edge) formed of the recessed part which is formed on the surface of the diamond sintered body acts on the workpiece material, the shock acts locally on the fine cutting edge part in the state, and the blade is enabled to precisely machine and remove an extremely fine portion in cooperation with its sharp tip portion.
  • the blade 26 is integrally formed into a discoid shape by the diamond sintered body 80 which contains 80% or more of the diamond abrasive grains 82 , and in the outer circumferential part of the blade 26 , a cutting edge part 40 is provided in which cutting edges (fine cutting edge) formed of recessed parts which are formed on the surface of the diamond sintered body 80 are continuously arranged along a circumferential direction. Because of this, it becomes possible that the blade 26 controls the cut depth (cut amount) for the workpiece W with high precision, as compared with a conventional electroformed blade. Thereby, the workpiece W can be moved relatively to the blade 26 , while an excessive cut is not given and a constant cut depth is given to the workpiece W.
  • the recessed part formed on the surface of the diamond sintered body 80 functions as a pocket for transporting the swarf which are produced when the workpiece W is subjected to the process.
  • the discharge properties for the swarf are enhanced, and the heat generated during the process can also be discharged together with the swarf.
  • the diamond sintered body 80 has high thermal conductivity, accordingly the heat generated at the time of the cutting process is not accumulated in the blade 26 , and the diamond sintered body 80 shows also an effect of preventing the increase of a cutting resistance and the warpage of the blade 26 .
  • the rotating direction of the blade 26 is a down-cutting direction. Specifically, when the blade 26 moves relatively to the workpiece W while giving the cut to the workpiece W, as shown in FIG. 14 , such an aspect is preferable that the blade 26 performs the dicing process while rotating in a rotating direction in which the cutting edge of the blade 26 cuts into the surface of the workpiece.
  • such an aspect is preferable that when the blade 26 is moved relatively to the workpiece W while giving a constant cut depth to the workpiece W, the blade 26 is moved while fine particles are given to the blade 26 .
  • a recess is formed in a grain boundary portion which is a boundary between diamond particles.
  • the recessed portion works as a cutting edge.
  • the cutting edge is formed by convexoconcaves originating from the roughness which is naturally formed, and the cutting edge is formed in the recessed part in particular.
  • the cutting edge In the function of the outer circumferential portion of the blade, the cutting edge must work mainly so that the cutting edge enters into the workpiece, and then while progressively cutting into the workpiece, the cutting edge removes the swarf.
  • the side faces of the blade it becomes important for the side faces of the blade to smoothen the side faces of the workpiece while scraping, with the side faces of the blade, the side faces of the workpiece which has been already progressively cut by the tip part of the blade, rather than to progressively cut into the workpiece.
  • the cutting edge it is necessary for the cutting edge to scrape the side faces of the workpiece while being smoothly lubricated so that the side faces of the blade does not stick to the side faces of the workpiece, rather than to actively work.
  • the sintered diamond has many portions of the recess on the grain boundary portion and in the uneven surface formed of the natural roughness, as has been previously described.
  • the fine particles are taken in the recessed portion.
  • the fine particles which have accumulated in the recessed portion formed of the diamond sintered body, fly out and continuously roll between the side faces of the blade and the side faces of the workpiece. This continuous rolling motion of the fine particles is referred to as “bearing effect” and prevents the blade from sticking to the surface of the workpiece, and achieves the lubrication effect between the blade and the workpiece.
  • this lubrication effect is not simply the lubrication effect of preventing the blade from sticking to the workpiece.
  • the rolling fine particles also has an effect of polishing the side faces of the workpiece.
  • the fine particles When the fine particles roll, the fine particles are rubbed with the side faces of the workpiece, and thereby polishes the side faces of the workpiece. As a result, the side faces of the workpiece can be formed into a clean mirror-finished surface, without leaving such a grinding mark which is to be formed when being simply ground with fixed abrasive grains.
  • the fine particles show a different behavior from that of the fixed abrasive grains, and individual fine particles work randomly to some extent while changing their directions. Accordingly, the grinding mark in one direction does not remain, and a polishing effect is shown on the side faces of the workpiece material. Consequently, it becomes possible that the side faces of the workpiece acquires a minor-finished surface in which the grinding mark has been removed.
  • a blade may be recollected that is formed of the solidified fine particles which have been previously solidified by calcining fine particles or the like, and performs a minor-finishing process by a process in which the fine particles drop off from the surface of the blade that has been formed of the solidified fine particles, and the fine particles that have dropped off roll on the side faces of the blade.
  • the blade in which fine particles to be thus rolled have been previously formed on the surface by calcination, the blade becomes gradually thinner by an amount of the fine particles which have fallen off, as the process is proceeded. Specifically, the blade cannot stably form a constant groove width. In addition, it also becomes difficult to stably continue incessantly supplying the fine particles.
  • the fine particles need to be supplied while the side faces of the blade are continuously worn. It is difficult for such a blade to stably form a recessed portion which accumulates the fine particles therein, and the recessed portion cannot be formed from diamond having high hardness.
  • the blade member itself such a blade cannot be supplied as to have high rigidity and have arbitrary convexoconcaves formed therein.
  • the blade itself cannot ensure the hardness for supporting an underlayer, and accordingly it becomes difficult that the blade forms a constant cut on the workpiece while the fine particles are rolling.
  • a conventional electroformed blade formed by fixing with a bonding material such as nickel cannot provide the lubrication effect as described above. Because the electroformed blade has such a form that diamonds project from the surface of the bonding material in places. Specifically, the electroformed blade has such a surface form that there are projections in places on the flat surface.
  • the blade causes a fatal crack on the side face of the workpiece.
  • the side face of the workpiece may be partially mirror-finished in some cases although the recess is not formed.
  • the grinding mark still remains on the side face portion of the workpiece, and a potential crack due to the projection enters into the workpiece.
  • the blade when the surface of the blade is observed, the blade is in such a state that the projecting diamonds are scattered in the flat surface. In other words, there exists no portion of the recess which accumulates the fine particles therein on the side face of the blade.
  • the recessed portion which is formed from a metal material such as the nickel has low hardness, as compared with that of the material which is used for the fine particle. Even when the fine particles have exited from the recessed portion, the recessed portion of which the periphery is formed from the metal material such as the nickel does not have a function of the cutting edge. On the contrary, in the portion from which the fine particles have exited, the blade side formed of the soft metal such as nickel is just worn, and the portion shows almost no effect of polishing and removing the workpiece. As a result, the blade itself is just gradually shaved off, and it cannot be expected that the blade shows an effect of polishing the workpiece.
  • the case means that the thickness of the blade changes even on the way of machining due to the polishing and removing function on the bonding material by the fine particles.
  • the groove width is strictly controlled in the grooving process, for instance, the blade cannot be used at all in such a process that the blade is rapidly worn, and does not make sense as a machining blade.
  • the blade which is formed of the diamond sintered body as in the present embodiment, firstly, it is presupposed that the blade is formed of a sintered body of a diamond. In addition, it is also desirable that the content of the diamond is 80% or more.
  • the fine particles are accumulated in the recessed part of the sintered body, are taken out therefrom to the outside by being rubbed with the workpiece, and roll in that state.
  • the periphery of the recessed part is formed of diamond, and accordingly the fine particles work in the portion of the edge of the recessed part which is formed of the very diamond, and polish the workpiece.
  • a ratio of a sintering aid is comparatively high, and accordingly the sintering aid is selectively removed by the friction to form the recess.
  • the diamond is rich, and the portion has usually higher hardness than that of the workpiece material. Therefore, the fine particles which have exited from the recessed portion are supported by the diamond having high hardness in the portion of the edge of the recess, and the fine particles roll and work on the edge which is formed of the diamond having high hardness. As a result, a polishing pressure is applied to the workpiece side, and the workpiece is efficiently polished.
  • a method for supplying fine particles is not limited in particular, as long as the above described functional effect is obtained, but for instance, the following methods (first to third examples) can be preferably adopted.
  • a method for supplying the fine particles there is a method of applying fine particles contained in a liquid, to the blade itself with a capillary structure.
  • Fine particles such as a WA white alumina abrasive grain, a GC green carbon random abrasive grain and a diamond abrasive grain are preferably used as the fine particle to be used.
  • the fine particle having various particle sizes of approximately 0.01 ⁇ m to 10 ⁇ m may be used.
  • the particle size and the material of the fine particle to be used may be appropriately optimized according to the workpiece material and the purpose. In the case of the cutting for the purpose of removing the grinding mark of the cut side face of a PC substrate and a copper substrate, for instance, the WA having a particle size of approximately 1 ⁇ m is suitable.
  • a suspending solvent includes water as the simplest liquid, but in order to effectively deposit the fine particles on the surface of the blade, a suspension is also acceptable in which the fine particles are suspended in ethanol, IPA (isopropyl alcohol) or the like.
  • a lubricant oil such as a lapping oil may be used.
  • the solvent for suspending the fine particles therein may be appropriately optimized according to the characteristics of the workpiece or the like. Even when the lapping oil or the like is used, the oil is supplied only to the blade, and is not supplied directly to the workpiece.
  • the liquid which contains the fine particles and has been supplied to the blade works only on the cut surface of the workpiece, and does not work on the surface of the workpiece. Therefore, from the viewpoint of the workpiece, the liquid which contains the fine particles prevents the generation of the heat by the lubrication effect, and also a particular liquid is not supplied onto the surface of the workpiece. Because of this, the dicing method according to the present invention can machine even such a workpiece that elements are damaged when chips on its surface get wet in a conventional wet environment, as if the dicing method was a dry machining
  • the liquid is entered at a place where just before the blade cuts into the workpiece. Because the blade is rotated at high speed, a part of a liquid may be blown off by a centrifugal force. Accordingly, it is desirable that the place is just before the blade enters into the workpiece.
  • the liquid which does not contain the fine particles has low viscosity.
  • an interfacial tension between the fine particle and the liquid works and a bonding force is enhanced.
  • the viscosity of the whole If the viscosity can be enhanced, even when the liquid has been applied to the blade, the liquid containing the fine particles is not blown off by the centrifugal force of the blade, and the liquid containing the fine particles can be efficiently applied to the side face of the blade and also to the tip of the blade.
  • the slurry when the liquid slurry is supplied along the workpiece, the slurry needs to have such low viscosity as not to stick to the workpiece but as to flow along the workpiece.
  • the slurry comes in contact with the blade which rotates at high speed, the slurry is blown off.
  • the recessed portion In the blade formed of the diamond sintered body, in particular, the recessed portion is very small; and when the fine particles are efficiently taken in the pocket of such a portion, there is the case where the wind pressure and the centrifugal force on the blade are dominant, and occasionally the fine particles is difficult to stay on the blade.
  • the fine particles are suspended in a liquid, and the suspension is applied to the side face of the blade.
  • a method for applying the liquid such a method is considered as to supply the liquid to the rotating solid blade from the solid according to a principle of a capillary of a liquid while applying the liquid with the use of a capillary structure such as a brush, leaves the fine particle component contained in the liquid in the blade, and make the fine particles work on the blade.
  • an efficient and an adequate method is a method of using a liquid, dissolving the fine particles in the liquid to form a state of a suspension, and making the fine particles work on the surface of the blade in the state.
  • the fine particles are dissolved into the liquid, thereby the viscosity rises, the surface tension increases, and the liquid becomes gel-like.
  • the liquid enters between the fine particles, and it becomes possible that the surface tension increases.
  • a mechanism for supplying the fine particles shown in FIG. 24 and FIG. 25 can be preferably adopted as the method of applying the liquid containing the fine particles to the surface of the blade.
  • the blade 26 is surrounded by a flange cover 100 which is fixed on a spindle 28 side (see FIG. 1 ).
  • a supply mechanism 106 is arranged which includes: a liquid supply pipe 102 that is mounted on a portion of this flange cover 100 and functions as liquid supply means; and a capillary structure member 104 that receives the supply of the liquid containing the fine particles from the liquid supply pipe 102 and transfers the supplied liquid containing the fine particles, which the capillary structure member 104 has received, to the sides of both side faces of the blade 26 by a capillary phenomenon.
  • any one of a brush-like member, an ink-brush-like member and a foam member is used as the capillary structure member 104 .
  • a structural member is used in which small spaces continuously exist in the gaps.
  • the capillary structure member 104 is slightly bent in between the lower end part of the liquid supply pipe 102 and the circumferential side face of the blade 26 , and the respective tips come in contact with both circumferential side faces of the blade 26 from both sides along the rotating direction of the blade 26 , as is shown in FIG. 25 .
  • the capillary structure member 104 is formed so as to have a required width, in order to uniformly apply the liquid containing the fine particles onto the circumferential side face of the blade 26 .
  • a guide member 108 which is made from a rigid material and guides the tip part of the capillary structure member 104 to the circumferential side face of the blade 26 is provided on the lower end part of the liquid supply pipe 102 .
  • a component of the capillary structure member 104 such as the brush-like member and the ink-brush-like member, for instance, a wire material made from a polyester material and a soft linear member such as a cotton fiber can also be preferably used. If the soft linear member and the like are used, even when the member comes in contact with the side face of the blade 26 which rotates at high speed, the member does not excessively damage the side face of the blade 26 .
  • the guide member 108 which is made from the rigid material guides the tip part of the capillary structure member 104 to the circumferential side face of the blade 26 .
  • the tip part of the capillary structure member 104 which is made of the soft linear member can be guided so as to come in contact with the blade 26 without being affected by the influence of the gravity of the liquid that exists in the gap in the capillary structure member 104 , and the like.
  • the capillary structure member 104 surely supplies the liquid containing the fine particles to the circumferential side face of the blade 26 which rotates at high speed.
  • the method for supplying the fine particles it is enabled to apply the liquid containing the fine particles to the side face of the blade.
  • the capillary structure being an application object that makes the liquid work on the blade itself, is brought into contact with the blade, and the fine particles contained in the liquid can be carried into the side face portion of the workpiece by using the interfacial tension which works between the liquid and the solid.
  • the liquid In a method of spraying a liquid to the blade which rotates at high speed, the liquid flies on the blade, and as a result, the method cannot make the fine particles efficiently work on the blade.
  • the liquid is applied to the blade by using the interfacial tension, and thereby is enabled to effectively supply the fine particles along the side face of the blade.
  • the liquid containing the fine particles When the liquid containing the fine particles has been applied to the blade, the liquid deposits on the recessed portion on the surface of the blade due to the interfacial tension of the liquid.
  • the blade vertically rotates at high speed, and accordingly a part of the liquid which has deposited on the blade dries, and can remove the heat which has been generated by polishing by the fine particles, by evaporation heat. Thereby, the blade can perform the polishing without excessively generating heat even when performing the polishing.
  • the liquid containing the fine particles is applied to the blade, and another operation of cooling the workpiece such as sprinkling water or the like is not needed. In some cases, only a small amount of the liquid is made to work on the blade, the workpiece can be machined in a dry environment.
  • the fine particles when the fine particles exit from the recessed portion, the fine particles are sandwiched to roll between the edge portion of the recess which is formed of the diamond particle existing below the fine particles and the workpiece. Accordingly, the workpiece can be surely polished while the rolling fine particle surely gives the cut to the workpiece.
  • the fine particles are previously suspended in a small amount of water so as to be high concentration, and the suspension is deposited on the portion to which the blade advances, in a thin linear shape.
  • a method for depositing the suspension on the blade it is acceptable to extrude the suspension with an injector or the like, and deposit the extruded suspension on the workpiece.
  • the fine particles are previously applied onto the thin sheet so as to become high density.
  • the thin sheet is stuck to a substrate which is subjected to cutting process or a grooving process.
  • the substrate When a predetermined portion on the substrate is machined, the portion ends up being machined together with the thin sheet which has been stuck onto the surface.
  • the substrate is machined while the thin sheet is machined, thereby the thin sheet naturally supplies the fine particles onto the surface of the blade while depositing the fine particles which have been applied to the thin sheet onto the surface of the blade, and it becomes possible that the substrate is machined while involving the fine particles which have deposited on the surface of the blade.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170338100A1 (en) * 2014-11-19 2017-11-23 Sumitomo Electric Industries, Ltd. Method of manufacturing silicon carbide semiconductor device
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JP7394712B2 (ja) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN117300844B (zh) * 2023-11-28 2024-02-02 中铁工程装备集团(天津)有限公司 一种具有圆跳动检测功能的磨削设备

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3156077A (en) * 1963-02-06 1964-11-10 Continental Machines Diamond edge saw blade
US3371452A (en) * 1965-02-08 1968-03-05 Christensen Diamond Prod Co Diamond saw or milling blades
US3574580A (en) * 1968-11-08 1971-04-13 Atomic Energy Commission Process for producing sintered diamond compact and products
US3912500A (en) * 1972-12-27 1975-10-14 Leonid Fedorovich Vereschagin Process for producing diamond-metallic materials
US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
US4180048A (en) * 1978-06-12 1979-12-25 Regan Barrie F Cutting wheel
US4636253A (en) * 1984-09-08 1987-01-13 Sumitomo Electric Industries, Ltd. Diamond sintered body for tools and method of manufacturing same
US4874398A (en) * 1984-08-24 1989-10-17 Ringwood Alfred E Diamond compacts and process for making same
US5010043A (en) * 1987-03-23 1991-04-23 The Australian National University Production of diamond compacts consisting essentially of diamond crystals bonded by silicon carbide
US5479911A (en) * 1994-05-13 1996-01-02 Kulicke And Soffa Investments Inc Diamond impregnated resinoid cutting blade
US5778751A (en) * 1993-03-08 1998-07-14 Tokyo Seimitsu Co., Ltd Mounting structure for cutting blade of dicing apparatus
US5888129A (en) * 1996-05-15 1999-03-30 Neff; Charles E. Grinding wheel
US5997382A (en) * 1997-01-23 1999-12-07 Toyota Jidosha Kabushiki Kaisha Method of processing sealing surface of casting and grindstone suitable for use therein
US6432150B1 (en) * 1997-07-16 2002-08-13 The Ishizuka Research Institute, Ltd. Diamond-containing stratified composite material and method of manufacturing the same
US20030126800A1 (en) * 2001-12-05 2003-07-10 Siemens Westinghouse Power Corporation Mixed powder deposition of components for wear, erosion and abrasion resistant applications
US20030159555A1 (en) * 2002-02-22 2003-08-28 Perry Edward Robert Thin wall singulation saw blade and method
US20040112359A1 (en) * 1997-04-04 2004-06-17 Chien-Min Sung Brazed diamond tools and methods for making the same
US20040112360A1 (en) * 1998-02-12 2004-06-17 Boucher John N. Substrate dicing method
US20050210755A1 (en) * 2003-09-05 2005-09-29 Cho Hyun S Doubled-sided and multi-layered PCBN and PCD abrasive articles
US20050272349A1 (en) * 2004-06-04 2005-12-08 General Electric Company Method for conditioning superabrasive tools
US20060063478A1 (en) * 2004-09-17 2006-03-23 Toyoda Koki Kabushiki Kaisha Grinding wheel
US20060118097A1 (en) * 2003-06-12 2006-06-08 Hirokazu Ishikawa Diamond wheel and scribing device
US20060160481A1 (en) * 2002-12-19 2006-07-20 Kabushiki Kaisha Miyanaga Diamond disk
JP2006253441A (ja) * 2005-03-11 2006-09-21 Kumamoto Univ ブレード加工方法
US20070023026A1 (en) * 2005-07-28 2007-02-01 Broyles Michelle Dicing blade
US7220168B2 (en) * 2001-01-16 2007-05-22 Nikon Corporation Processes for producing a whetstone and whetstone pellets with uniform abrasion layers
US20080251061A1 (en) * 2005-06-27 2008-10-16 Anthony Baratta Tools and Methods for Making and Using Tools, Blades and Methods of Making and Using Blades
US20090011693A1 (en) * 2005-05-03 2009-01-08 Chang Shin Cho Structure of cutting tip and saw blade including the structure
US20100075580A1 (en) * 2007-09-22 2010-03-25 Bohle Ag Small cutting wheel
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US20100294256A1 (en) * 2006-11-16 2010-11-25 Shinhan Diamond Ind. Co., Ltd. Diamond tool and method for manufacturing segment thereof
US20110073094A1 (en) * 2009-09-28 2011-03-31 3M Innovative Properties Company Abrasive article with solid core and methods of making the same
US20110132954A1 (en) * 2008-06-05 2011-06-09 Maoko Tomei Scribing wheel and method for scribing brittle material substrate
US7959841B2 (en) * 2003-05-30 2011-06-14 Los Alamos National Security, Llc Diamond-silicon carbide composite and method
US8192256B2 (en) * 1998-07-31 2012-06-05 Saint-Gobain Abrasives, Inc. Rotary dressing tool containing brazed diamond layer
US20130059510A1 (en) * 2011-09-07 2013-03-07 Ehwa Diamond Industrial Co., Ltd. Brazing bond type diamond tool with excellent cuttability and method of manufacturing the same
US20130065496A1 (en) * 2010-05-21 2013-03-14 Honda Motor Co., Ltd. Grindstone, grindstone manufacturing method, boring tool, abrasive grain positioning jig, and relief surface forming method
US20140080394A1 (en) * 2011-08-24 2014-03-20 Nippon Steel & Sumikin Materials Co., Ltd. Beveling grindstone
US9316059B1 (en) * 2012-08-21 2016-04-19 Us Synthetic Corporation Polycrystalline diamond compact and applications therefor

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104045A (ja) 1984-10-26 1986-05-22 Sumitomo Electric Ind Ltd 工具用ダイヤモンド焼結体
JPH05144937A (ja) * 1991-11-18 1993-06-11 Fujitsu Miyagi Electron:Kk ダイシングブレード
JPH06151586A (ja) * 1992-11-12 1994-05-31 Sony Corp ダイシング方法および装置
JPH07276137A (ja) 1994-03-31 1995-10-24 Osaka Diamond Ind Co Ltd 切削・研削用工具
JP2001038636A (ja) * 1999-07-26 2001-02-13 Kimiko Sueda ホイールカッターの薄刃ブレード
JP3308246B2 (ja) 1999-08-18 2002-07-29 株式会社リード 希土類磁石切断用ダイヤモンドブレードの芯金
JP3892204B2 (ja) 2000-03-29 2007-03-14 株式会社リード 希土類磁石切断用ブレード及びその製造方法
JP2002192469A (ja) * 2000-12-27 2002-07-10 Allied Material Corp 超砥粒薄刃切断砥石
JP4189156B2 (ja) * 2002-02-22 2008-12-03 株式会社トクヤマ チップ貼設シート
JP2003282490A (ja) * 2002-03-27 2003-10-03 Hitachi Ltd 半導体装置及びその製造方法
JP2003326466A (ja) 2002-05-09 2003-11-18 Read Co Ltd 高剛性切断用ブレード及びその製造方法
JP2005082414A (ja) * 2003-09-04 2005-03-31 Tokyo Metropolis セラミック材の切削方法及び切削装置
JP2005129741A (ja) * 2003-10-24 2005-05-19 Tokyo Seimitsu Co Ltd ダイシングブレード及びダイシング方法
JP4340184B2 (ja) * 2004-04-13 2009-10-07 株式会社ナノテム 砥石
JP4714453B2 (ja) 2004-10-25 2011-06-29 株式会社リード ダイヤモンドまたはｃＢＮ工具及びその製造方法
JP2007118581A (ja) * 2005-09-28 2007-05-17 Hiroshi Ishizuka 硬脆性材料の薄板及びその製造方法
JP2007216377A (ja) * 2006-01-20 2007-08-30 Tokyo Seimitsu Co Ltd ダイシング装置及びダイシング方法
WO2008004365A1 (fr) * 2006-07-07 2008-01-10 Tokyo Seimitsu Co., Ltd. Appareil et procédé de découpage en dés
EP2049306B1 (en) * 2006-07-31 2013-07-03 Element Six Abrasives S.A. Abrasive compacts
JP2010005778A (ja) 2008-06-30 2010-01-14 Mitsubishi Materials Corp 電鋳ブレード
GB0902230D0 (en) * 2009-02-11 2009-03-25 Element Six Production Pty Ltd Polycrystalline super-hard element
JP5357580B2 (ja) * 2009-03-09 2013-12-04 三星ダイヤモンド工業株式会社 溝加工ツールおよびこれを用いた薄膜太陽電池の溝加工方法
JP2010234597A (ja) 2009-03-31 2010-10-21 Mitsubishi Materials Corp 切断ブレード、切断ブレードの製造方法及び切断加工装置
JP5534181B2 (ja) * 2010-03-12 2014-06-25 住友電気工業株式会社 ダイヤモンド多結晶体
CN101870008B (zh) * 2010-06-11 2012-01-11 西安点石超硬材料发展有限公司 基于锯式切割qfn封装基板的烧结金属基金刚石锯刀
JP5067457B2 (ja) * 2010-07-29 2012-11-07 三星ダイヤモンド工業株式会社 スクライビングホイール、スクライブ装置、およびスクライブ方法
JP5195981B2 (ja) * 2010-10-26 2013-05-15 三星ダイヤモンド工業株式会社 スクライブヘッドおよびスクライブ装置
JP4852178B1 (ja) * 2011-04-26 2012-01-11 株式会社テクノホロン ダイシング装置

Patent Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3156077A (en) * 1963-02-06 1964-11-10 Continental Machines Diamond edge saw blade
US3371452A (en) * 1965-02-08 1968-03-05 Christensen Diamond Prod Co Diamond saw or milling blades
US3574580A (en) * 1968-11-08 1971-04-13 Atomic Energy Commission Process for producing sintered diamond compact and products
US3912500A (en) * 1972-12-27 1975-10-14 Leonid Fedorovich Vereschagin Process for producing diamond-metallic materials
US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
US4180048A (en) * 1978-06-12 1979-12-25 Regan Barrie F Cutting wheel
US4874398A (en) * 1984-08-24 1989-10-17 Ringwood Alfred E Diamond compacts and process for making same
US4636253A (en) * 1984-09-08 1987-01-13 Sumitomo Electric Industries, Ltd. Diamond sintered body for tools and method of manufacturing same
US5010043A (en) * 1987-03-23 1991-04-23 The Australian National University Production of diamond compacts consisting essentially of diamond crystals bonded by silicon carbide
US5778751A (en) * 1993-03-08 1998-07-14 Tokyo Seimitsu Co., Ltd Mounting structure for cutting blade of dicing apparatus
US5479911A (en) * 1994-05-13 1996-01-02 Kulicke And Soffa Investments Inc Diamond impregnated resinoid cutting blade
US5888129A (en) * 1996-05-15 1999-03-30 Neff; Charles E. Grinding wheel
US5997382A (en) * 1997-01-23 1999-12-07 Toyota Jidosha Kabushiki Kaisha Method of processing sealing surface of casting and grindstone suitable for use therein
US20040112359A1 (en) * 1997-04-04 2004-06-17 Chien-Min Sung Brazed diamond tools and methods for making the same
US6432150B1 (en) * 1997-07-16 2002-08-13 The Ishizuka Research Institute, Ltd. Diamond-containing stratified composite material and method of manufacturing the same
US20040112360A1 (en) * 1998-02-12 2004-06-17 Boucher John N. Substrate dicing method
US8192256B2 (en) * 1998-07-31 2012-06-05 Saint-Gobain Abrasives, Inc. Rotary dressing tool containing brazed diamond layer
US7220168B2 (en) * 2001-01-16 2007-05-22 Nikon Corporation Processes for producing a whetstone and whetstone pellets with uniform abrasion layers
US20030126800A1 (en) * 2001-12-05 2003-07-10 Siemens Westinghouse Power Corporation Mixed powder deposition of components for wear, erosion and abrasion resistant applications
US20030159555A1 (en) * 2002-02-22 2003-08-28 Perry Edward Robert Thin wall singulation saw blade and method
US20060160481A1 (en) * 2002-12-19 2006-07-20 Kabushiki Kaisha Miyanaga Diamond disk
US7959841B2 (en) * 2003-05-30 2011-06-14 Los Alamos National Security, Llc Diamond-silicon carbide composite and method
US20060118097A1 (en) * 2003-06-12 2006-06-08 Hirokazu Ishikawa Diamond wheel and scribing device
US20050210755A1 (en) * 2003-09-05 2005-09-29 Cho Hyun S Doubled-sided and multi-layered PCBN and PCD abrasive articles
US20050272349A1 (en) * 2004-06-04 2005-12-08 General Electric Company Method for conditioning superabrasive tools
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US20060063478A1 (en) * 2004-09-17 2006-03-23 Toyoda Koki Kabushiki Kaisha Grinding wheel
JP2006253441A (ja) * 2005-03-11 2006-09-21 Kumamoto Univ ブレード加工方法
US20090011693A1 (en) * 2005-05-03 2009-01-08 Chang Shin Cho Structure of cutting tip and saw blade including the structure
US20080251061A1 (en) * 2005-06-27 2008-10-16 Anthony Baratta Tools and Methods for Making and Using Tools, Blades and Methods of Making and Using Blades
US20070023026A1 (en) * 2005-07-28 2007-02-01 Broyles Michelle Dicing blade
US20100294256A1 (en) * 2006-11-16 2010-11-25 Shinhan Diamond Ind. Co., Ltd. Diamond tool and method for manufacturing segment thereof
US20100075580A1 (en) * 2007-09-22 2010-03-25 Bohle Ag Small cutting wheel
US20110132954A1 (en) * 2008-06-05 2011-06-09 Maoko Tomei Scribing wheel and method for scribing brittle material substrate
US20110073094A1 (en) * 2009-09-28 2011-03-31 3M Innovative Properties Company Abrasive article with solid core and methods of making the same
US20130065496A1 (en) * 2010-05-21 2013-03-14 Honda Motor Co., Ltd. Grindstone, grindstone manufacturing method, boring tool, abrasive grain positioning jig, and relief surface forming method
US20140080394A1 (en) * 2011-08-24 2014-03-20 Nippon Steel & Sumikin Materials Co., Ltd. Beveling grindstone
US20130059510A1 (en) * 2011-09-07 2013-03-07 Ehwa Diamond Industrial Co., Ltd. Brazing bond type diamond tool with excellent cuttability and method of manufacturing the same
US9316059B1 (en) * 2012-08-21 2016-04-19 Us Synthetic Corporation Polycrystalline diamond compact and applications therefor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170338100A1 (en) * 2014-11-19 2017-11-23 Sumitomo Electric Industries, Ltd. Method of manufacturing silicon carbide semiconductor device
US10056247B2 (en) * 2014-11-19 2018-08-21 Sumitomo Electric Industries, Ltd. Method of manufacturing silicon carbide semiconductor device
US10707146B2 (en) * 2016-04-21 2020-07-07 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing same, for releaved stress and high heat conductivity
US20210074559A1 (en) * 2019-09-05 2021-03-11 Disco Corporation Workpiece cutting method
US11682569B2 (en) * 2019-09-05 2023-06-20 Disco Corporation Workpiece cutting method
US11348798B2 (en) * 2020-02-07 2022-05-31 Akoustis, Inc. Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices
TWI832179B (zh) * 2022-03-22 2024-02-11 盛新材料科技股份有限公司 晶圓定位治具及使用其的晶圓加工方法

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JP2015164215A (ja) 2015-09-10
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