JP5547076B2 - 半導体光素子アレイおよびその製造方法 - Google Patents
半導体光素子アレイおよびその製造方法 Download PDFInfo
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- JP5547076B2 JP5547076B2 JP2010526554A JP2010526554A JP5547076B2 JP 5547076 B2 JP5547076 B2 JP 5547076B2 JP 2010526554 A JP2010526554 A JP 2010526554A JP 2010526554 A JP2010526554 A JP 2010526554A JP 5547076 B2 JP5547076 B2 JP 5547076B2
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- H01L21/02518—Deposited layers
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- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/3203—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth on non-planar substrates to create thickness or compositional variations
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- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010526554A JP5547076B2 (ja) | 2008-09-01 | 2009-08-27 | 半導体光素子アレイおよびその製造方法 |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008224131 | 2008-09-01 | ||
| JP2008224131 | 2008-09-01 | ||
| JP2008224129 | 2008-09-01 | ||
| JP2008224129 | 2008-09-01 | ||
| PCT/JP2009/004173 WO2010023921A1 (ja) | 2008-09-01 | 2009-08-27 | 半導体光素子アレイおよびその製造方法 |
| JP2010526554A JP5547076B2 (ja) | 2008-09-01 | 2009-08-27 | 半導体光素子アレイおよびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013132114A Division JP5687731B2 (ja) | 2008-09-01 | 2013-06-24 | 半導体光素子アレイおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2010023921A1 JPWO2010023921A1 (ja) | 2012-01-26 |
| JP5547076B2 true JP5547076B2 (ja) | 2014-07-09 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010526554A Active JP5547076B2 (ja) | 2008-09-01 | 2009-08-27 | 半導体光素子アレイおよびその製造方法 |
| JP2013132114A Expired - Fee Related JP5687731B2 (ja) | 2008-09-01 | 2013-06-24 | 半導体光素子アレイおよびその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013132114A Expired - Fee Related JP5687731B2 (ja) | 2008-09-01 | 2013-06-24 | 半導体光素子アレイおよびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9224595B2 (enExample) |
| EP (1) | EP2333847B1 (enExample) |
| JP (2) | JP5547076B2 (enExample) |
| KR (1) | KR101567121B1 (enExample) |
| CN (1) | CN102187479B (enExample) |
| TW (1) | TWI470828B (enExample) |
| WO (1) | WO2010023921A1 (enExample) |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010012711A1 (de) * | 2010-03-25 | 2011-09-29 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements |
| KR101710159B1 (ko) | 2010-09-14 | 2017-03-08 | 삼성전자주식회사 | Ⅲ족 질화물 나노로드 발광소자 및 그 제조 방법 |
| EP2636078B1 (en) | 2010-11-04 | 2015-12-30 | Koninklijke Philips N.V. | Solid state light emitting devices based on crystallographically relaxed structures |
| GB201020843D0 (en) * | 2010-12-09 | 2011-01-19 | Univ Nottingham | Solar cells based on InGaN |
| FR2983639B1 (fr) * | 2011-12-01 | 2014-07-18 | Commissariat Energie Atomique | Dispositif optoelectronique comprenant des nanofils de structure coeur/coquille |
| WO2013121289A2 (en) * | 2012-02-14 | 2013-08-22 | Qunano Ab | Gallium nitride nanowire based electronics |
| SE537434C2 (sv) | 2012-06-26 | 2015-04-28 | Polar Light Technologies Ab | Grupp III-nitridstruktur |
| TWI476953B (zh) | 2012-08-10 | 2015-03-11 | Univ Nat Taiwan | 半導體發光元件及其製作方法 |
| JP2014060198A (ja) * | 2012-09-14 | 2014-04-03 | Oki Electric Ind Co Ltd | 窒化物半導体発光ダイオードの製造方法、及び窒化物半導体発光ダイオード |
| JP6060652B2 (ja) * | 2012-11-28 | 2017-01-18 | 富士通株式会社 | 太陽電池及びその製造方法 |
| US9899566B2 (en) | 2012-12-28 | 2018-02-20 | Aledia | Optoelectronic device comprising microwires or nanowires |
| FR3000612B1 (fr) | 2012-12-28 | 2016-05-06 | Commissariat Energie Atomique | Dispositif optoelectronique a microfils ou nanofils |
| WO2014138904A1 (en) * | 2013-03-14 | 2014-09-18 | The Royal Institution For The Advancement Of Learning/Mcgill University | Methods and devices for solid state nanowire devices |
| DE102013104273A1 (de) * | 2013-04-26 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Anordnung mit säulenartiger Struktur und einer aktiven Zone |
| US9054233B2 (en) | 2013-06-07 | 2015-06-09 | Glo Ab | Multicolor LED and method of fabricating thereof |
| KR102190675B1 (ko) * | 2013-10-10 | 2020-12-15 | 삼성전자주식회사 | 반도체 소자의 미세 패턴 형성 방법 |
| FR3023410A1 (fr) * | 2014-07-02 | 2016-01-08 | Aledia | Dispositif optoelectronique a elements semiconducteurs et son procede de fabrication |
| FR3026564B1 (fr) * | 2014-09-30 | 2018-02-16 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a elements semiconducteurs tridimensionnels |
| KR102212557B1 (ko) | 2014-11-03 | 2021-02-08 | 삼성전자주식회사 | 나노구조 반도체 발광소자 |
| DE102014116999B4 (de) * | 2014-11-20 | 2025-09-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| FR3029015B1 (fr) * | 2014-11-24 | 2018-03-02 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a elements semiconducteurs tridimensionnels et son procede de fabrication |
| DE102016104616B4 (de) * | 2016-03-14 | 2021-09-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlichtquelle |
| FR3050322B1 (fr) * | 2016-04-18 | 2019-01-25 | Centre National De La Recherche Scientifique (Cnrs) | Dispositif photorecepteur multicouche, a parametres de maille differents |
| JP6873409B2 (ja) * | 2016-04-21 | 2021-05-19 | 富士通株式会社 | 発光素子及びその製造方法 |
| FR3053434B1 (fr) * | 2016-06-30 | 2019-06-28 | Valeo Vision | Module d'emission de lumiere blanche a spectre enrichi |
| KR102172865B1 (ko) * | 2016-09-29 | 2020-11-02 | 니치아 카가쿠 고교 가부시키가이샤 | 발광소자 |
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| JP7333666B2 (ja) * | 2017-02-28 | 2023-08-25 | 学校法人上智学院 | 光デバイスおよび光デバイスの製造方法 |
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| JP6947386B2 (ja) * | 2017-06-29 | 2021-10-13 | 学校法人 名城大学 | 半導体発光素子および半導体発光素子の製造方法 |
| FR3068517B1 (fr) * | 2017-06-30 | 2019-08-09 | Aledia | Dispositif optoelectronique comportant des structures semiconductrices tridimensionnelles en configuration axiale |
| US10263151B2 (en) * | 2017-08-18 | 2019-04-16 | Globalfoundries Inc. | Light emitting diodes |
| CN107482094A (zh) * | 2017-09-21 | 2017-12-15 | 山西飞虹微纳米光电科技有限公司 | 基于GaN基轴向纳米棒阵列的LED及其制备方法 |
| JP7053209B2 (ja) * | 2017-10-02 | 2022-04-12 | 株式会社小糸製作所 | 半導体成長用基板、半導体素子、半導体発光素子及び半導体成長用基板の製造方法 |
| JP7329798B2 (ja) * | 2018-02-01 | 2023-08-21 | 株式会社レゾナック | ナノ結晶膜の製造方法 |
| JP7105442B2 (ja) * | 2018-08-06 | 2022-07-25 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| CN109148651B (zh) * | 2018-08-06 | 2019-10-15 | 复旦大学 | 基于GaN条纹模板的多色发光InGaN量子阱外延片的制备方法 |
| JP7188690B2 (ja) * | 2018-08-22 | 2022-12-13 | セイコーエプソン株式会社 | プロジェクター |
| KR102652501B1 (ko) | 2018-09-13 | 2024-03-29 | 삼성디스플레이 주식회사 | 발광 소자의 제조방법 및 발광 소자를 포함하는 표시 장치 |
| JP7320770B2 (ja) * | 2018-09-28 | 2023-08-04 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| JP7312997B2 (ja) * | 2018-11-09 | 2023-07-24 | 学校法人 名城大学 | 半導体発光素子 |
| CN111463659B (zh) * | 2019-01-21 | 2021-08-13 | 华为技术有限公司 | 量子点半导体光放大器及其制备方法 |
| KR20210118180A (ko) * | 2019-01-29 | 2021-09-29 | 오스람 옵토 세미컨덕터스 게엠베하 | μ-LED, μ-LED 조립체, 디스플레이 및 이를 위한 방법 |
| EP3696300A1 (de) | 2019-02-18 | 2020-08-19 | Aixatech GmbH | Verfahren zur herstellung eines verbundmaterialkörpers insbesondere für die verwendung bei der herstellung von elektronischen oder optoelektronischen bauelementen |
| JP7207012B2 (ja) | 2019-02-27 | 2023-01-18 | セイコーエプソン株式会社 | 発光装置の製造方法、発光装置、およびプロジェクター |
| JP7232461B2 (ja) | 2019-02-28 | 2023-03-03 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| JP7232464B2 (ja) | 2019-03-26 | 2023-03-03 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| JP7232465B2 (ja) | 2019-03-26 | 2023-03-03 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
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| US11637219B2 (en) * | 2019-04-12 | 2023-04-25 | Google Llc | Monolithic integration of different light emitting structures on a same substrate |
| WO2020229576A2 (de) * | 2019-05-14 | 2020-11-19 | Osram Opto Semiconductors Gmbh | Beleuchtungseinheit, verfahren zur herstellung einer beleuchtungseinheit, konverterelement für ein opto-elektronisches bauelement, strahlungsquelle mit einer led und einem konverterelement, auskoppelstruktur, und optoelektronische vorrichtung |
| FR3098019B1 (fr) * | 2019-06-25 | 2022-05-20 | Aledia | Dispositif optoélectronique comprenant des éléments semi-conducteurs tridimensionnels et procédé pour sa fabrication |
| JP7392426B2 (ja) | 2019-11-28 | 2023-12-06 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| RU2758776C2 (ru) * | 2019-12-05 | 2021-11-01 | Федеральное государственное бюджетное учреждение науки Физико-технический институт им. А.Ф. Иоффе Российской академии наук | Способ изготовления наноколончатой гетероструктуры на основе соединений iii-n |
| US11923398B2 (en) | 2019-12-23 | 2024-03-05 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
| US11404473B2 (en) | 2019-12-23 | 2022-08-02 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
| FR3111016B1 (fr) * | 2020-06-01 | 2023-01-13 | Aledia | Dispositif optoélectronique et procédé de fabrication |
| US11581450B2 (en) * | 2020-06-11 | 2023-02-14 | Globalfoundries U.S. Inc. | Photodiode and/or pin diode structures with one or more vertical surfaces |
| US20230335400A1 (en) * | 2020-06-22 | 2023-10-19 | Kyocera Corporation | Method for producing semiconductor device, semiconductor device, electronic device, method for producing semiconductor epitaxial substrate, and semiconductor epitaxial substrate |
| JP7176700B2 (ja) * | 2020-07-31 | 2022-11-22 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| JP7520305B2 (ja) * | 2020-08-31 | 2024-07-23 | 株式会社小糸製作所 | 半導体発光素子および半導体発光素子の製造方法 |
| US11094846B1 (en) | 2020-08-31 | 2021-08-17 | 4233999 Canada Inc. | Monolithic nanocolumn structures |
| US11322649B2 (en) * | 2020-09-15 | 2022-05-03 | Applied Materials, Inc. | Three color light sources integrated on a single wafer |
| JP7556246B2 (ja) * | 2020-09-23 | 2024-09-26 | セイコーエプソン株式会社 | 発光装置、発光装置の製造方法およびプロジェクター |
| FR3114682B1 (fr) * | 2020-09-29 | 2023-05-19 | Aledia | Dispositif optoelectronique a diodes electroluminescentes a affichage couleur |
| JP7203390B2 (ja) | 2020-10-13 | 2023-01-13 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| US11631786B2 (en) | 2020-11-12 | 2023-04-18 | Lumileds Llc | III-nitride multi-wavelength LED arrays with etch stop layer |
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| US20240158691A1 (en) * | 2021-03-12 | 2024-05-16 | Sharp Kabushiki Kaisha | Quantum dot, quantum dot layer, light-emitting element, and solar cell |
| JP7320794B2 (ja) * | 2021-03-15 | 2023-08-04 | セイコーエプソン株式会社 | 発光装置、プロジェクター、およびディスプレイ |
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| JP2022190630A (ja) * | 2021-06-14 | 2022-12-26 | 豊田合成株式会社 | 半導体発光素子の製造方法 |
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| US20240332339A1 (en) * | 2021-07-08 | 2024-10-03 | Koito Manufacturing Co., Ltd. | Semiconductor light emitting element and method for producing semiconductor light emitting element |
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| US11799054B1 (en) | 2023-02-08 | 2023-10-24 | 4233999 Canada Inc. | Monochromatic emitters on coalesced selective area growth nanocolumns |
| WO2024164078A1 (en) * | 2023-02-08 | 2024-08-15 | 4233999 Canada Inc. | Light emitters on coalesced selective area growth nanocolumns |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003282942A (ja) * | 2001-08-22 | 2003-10-03 | Sony Corp | 窒化物半導体素子及び窒化物半導体素子の製造方法 |
| WO2006025407A1 (ja) * | 2004-08-31 | 2006-03-09 | Akihiko Kikuchi | 発光素子及びその製造方法 |
| JP2007027298A (ja) * | 2005-07-14 | 2007-02-01 | Matsushita Electric Works Ltd | 半導体発光素子およびそれを用いる照明装置ならびに半導体発光素子の製造方法 |
| JP2008022014A (ja) * | 2006-07-13 | 2008-01-31 | Sharp Corp | 窒化物半導体を加工してなる発光デバイスの処理方法 |
| JP2008034483A (ja) * | 2006-07-26 | 2008-02-14 | Matsushita Electric Works Ltd | 化合物半導体素子およびそれを用いる照明装置ならびに化合物半導体素子の製造方法 |
| JP2008034482A (ja) * | 2006-07-26 | 2008-02-14 | Matsushita Electric Works Ltd | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体素子の製造方法 |
| WO2008048704A2 (en) * | 2006-03-10 | 2008-04-24 | Stc.Unm | Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices |
| JP2008108757A (ja) * | 2006-10-23 | 2008-05-08 | Matsushita Electric Works Ltd | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体素子の製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0504851B1 (en) | 1991-03-22 | 1997-07-16 | Hitachi, Ltd. | Semiconductor optical device |
| JP3556916B2 (ja) | 2000-09-18 | 2004-08-25 | 三菱電線工業株式会社 | 半導体基材の製造方法 |
| JP4780113B2 (ja) | 2000-09-18 | 2011-09-28 | 三菱化学株式会社 | 半導体発光素子 |
| JP4381397B2 (ja) | 2000-10-04 | 2009-12-09 | 三洋電機株式会社 | 窒化物系半導体素子および窒化物系半導体の形成方法 |
| JP3863720B2 (ja) | 2000-10-04 | 2006-12-27 | 三洋電機株式会社 | 窒化物系半導体素子および窒化物系半導体の形成方法 |
| JP3679720B2 (ja) | 2001-02-27 | 2005-08-03 | 三洋電機株式会社 | 窒化物系半導体素子および窒化物系半導体の形成方法 |
| JP3454791B2 (ja) | 2001-03-01 | 2003-10-06 | 三洋電機株式会社 | 窒化物系半導体素子および窒化物系半導体の形成方法 |
| EP1420463A4 (en) * | 2001-08-22 | 2008-11-26 | Sony Corp | NITRID SEMICONDUCTOR ELEMENT AND METHOD FOR THE PRODUCTION THEREOF |
| DE10213643A1 (de) | 2002-03-27 | 2003-10-09 | Geka Brush Gmbh | Kosmetikeinheit |
| US7485902B2 (en) | 2002-09-18 | 2009-02-03 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor light-emitting device |
| US6936851B2 (en) * | 2003-03-21 | 2005-08-30 | Tien Yang Wang | Semiconductor light-emitting device and method for manufacturing the same |
| JP2004354617A (ja) | 2003-05-28 | 2004-12-16 | Sharp Corp | フォトニック結晶とその製造方法 |
| US7132677B2 (en) * | 2004-02-13 | 2006-11-07 | Dongguk University | Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same |
| JP2006339534A (ja) | 2005-06-03 | 2006-12-14 | Sony Corp | 発光ダイオード、発光ダイオードの製造方法、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器 |
| EP2064745A1 (en) * | 2006-09-18 | 2009-06-03 | QuNano AB | Method of producing precision vertical and horizontal layers in a vertical semiconductor structure |
| JP2008108924A (ja) | 2006-10-26 | 2008-05-08 | Matsushita Electric Works Ltd | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体発光素子の製造方法 |
| US8030108B1 (en) * | 2008-06-30 | 2011-10-04 | Stc.Unm | Epitaxial growth of in-plane nanowires and nanowire devices |
-
2009
- 2009-08-27 KR KR1020117007423A patent/KR101567121B1/ko not_active Expired - Fee Related
- 2009-08-27 WO PCT/JP2009/004173 patent/WO2010023921A1/ja not_active Ceased
- 2009-08-27 EP EP09809577.1A patent/EP2333847B1/en active Active
- 2009-08-27 JP JP2010526554A patent/JP5547076B2/ja active Active
- 2009-08-27 US US13/061,425 patent/US9224595B2/en active Active
- 2009-08-27 CN CN200980141161.XA patent/CN102187479B/zh active Active
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-
2013
- 2013-06-24 JP JP2013132114A patent/JP5687731B2/ja not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003282942A (ja) * | 2001-08-22 | 2003-10-03 | Sony Corp | 窒化物半導体素子及び窒化物半導体素子の製造方法 |
| WO2006025407A1 (ja) * | 2004-08-31 | 2006-03-09 | Akihiko Kikuchi | 発光素子及びその製造方法 |
| JP2007027298A (ja) * | 2005-07-14 | 2007-02-01 | Matsushita Electric Works Ltd | 半導体発光素子およびそれを用いる照明装置ならびに半導体発光素子の製造方法 |
| WO2008048704A2 (en) * | 2006-03-10 | 2008-04-24 | Stc.Unm | Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices |
| JP2008022014A (ja) * | 2006-07-13 | 2008-01-31 | Sharp Corp | 窒化物半導体を加工してなる発光デバイスの処理方法 |
| JP2008034483A (ja) * | 2006-07-26 | 2008-02-14 | Matsushita Electric Works Ltd | 化合物半導体素子およびそれを用いる照明装置ならびに化合物半導体素子の製造方法 |
| JP2008034482A (ja) * | 2006-07-26 | 2008-02-14 | Matsushita Electric Works Ltd | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体素子の製造方法 |
| JP2008108757A (ja) * | 2006-10-23 | 2008-05-08 | Matsushita Electric Works Ltd | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体素子の製造方法 |
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| CN102187479B (zh) | 2014-06-18 |
| KR20110063799A (ko) | 2011-06-14 |
| JPWO2010023921A1 (ja) | 2012-01-26 |
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| US20110169025A1 (en) | 2011-07-14 |
| KR101567121B1 (ko) | 2015-11-06 |
| EP2333847A4 (en) | 2015-02-25 |
| US9224595B2 (en) | 2015-12-29 |
| TW201027800A (en) | 2010-07-16 |
| EP2333847B1 (en) | 2018-02-14 |
| JP2013239718A (ja) | 2013-11-28 |
| CN102187479A (zh) | 2011-09-14 |
| WO2010023921A1 (ja) | 2010-03-04 |
| EP2333847A1 (en) | 2011-06-15 |
| JP5687731B2 (ja) | 2015-03-18 |
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