JP5441206B2 - 半導体素子及びその製造方法 - Google Patents
半導体素子及びその製造方法 Download PDFInfo
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- JP5441206B2 JP5441206B2 JP2008181864A JP2008181864A JP5441206B2 JP 5441206 B2 JP5441206 B2 JP 5441206B2 JP 2008181864 A JP2008181864 A JP 2008181864A JP 2008181864 A JP2008181864 A JP 2008181864A JP 5441206 B2 JP5441206 B2 JP 5441206B2
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- 239000004065 semiconductor Substances 0.000 title claims description 88
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910052721 tungsten Inorganic materials 0.000 claims description 144
- 239000010937 tungsten Substances 0.000 claims description 144
- 238000000034 method Methods 0.000 claims description 139
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 110
- 239000010410 layer Substances 0.000 claims description 60
- 239000000376 reactant Substances 0.000 claims description 53
- 239000007789 gas Substances 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 50
- 238000005530 etching Methods 0.000 claims description 46
- 230000004888 barrier function Effects 0.000 claims description 39
- -1 tungsten nitride Chemical class 0.000 claims description 33
- 150000004767 nitrides Chemical class 0.000 claims description 28
- 239000011229 interlayer Substances 0.000 claims description 17
- 238000010926 purge Methods 0.000 claims description 14
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 10
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 239000000460 chlorine Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000005468 ion implantation Methods 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 3
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims 1
- UNRFQJSWBQGLDR-UHFFFAOYSA-N methane trihydrofluoride Chemical compound C.F.F.F UNRFQJSWBQGLDR-UHFFFAOYSA-N 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 129
- 239000002184 metal Substances 0.000 description 129
- 238000000231 atomic layer deposition Methods 0.000 description 13
- 239000007769 metal material Substances 0.000 description 13
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000005368 silicate glass Substances 0.000 description 6
- 230000002950 deficient Effects 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 150000003657 tungsten Chemical class 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
- H01L21/76846—Layer combinations
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
- H01L21/76865—Selective removal of parts of the layer
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/488—Word lines
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Description
本発明の他の目的は、金属配線構造物のプラグと絶縁膜との間にヴォイド(void)を有しない半導体素子を提供することにある。
図7を参照すると、半導体基板100上に複数の導電性構造物間の空間を埋め立て、上部面が平坦化した絶縁膜200を形成する。
110 素子分離膜
112 ドレイン領域
200 絶縁膜
220 開口
300 障壁層
310 金属膜
312 残留金属膜
320 金属窒化膜
400 導電膜
410 金属プラグ
500 層間絶縁膜
520 ビアホール
600 導電ライン
900 配線構造物
Claims (23)
- 導電性構造物を具備する半導体基板上に該導電性構造物間の空間を埋め立てて上面が平坦化された絶縁膜を形成する段階と、
前記絶縁膜を部分的に除去して前記半導体基板の一部を露出する開口を形成する段階と、
前記開口の下部側壁及び底面に沿って形成された残留タングステン膜と前記開口の上部側壁及び前記残留タングステン膜の表面に沿って形成されたタングステン窒化膜とを含む障壁層を形成する段階と、
前記障壁層を含む前記開口を埋め立ててタングステンプラグを形成する段階と、を有し、
前記障壁層を形成する段階は、
前記開口の側壁及び底面と前記絶縁膜の上面とに沿ってタングステン膜を形成する段階と、
前記開口の上部側壁及び前記絶縁膜の上面から前記タングステン膜を部分的に除去して前記残留タングステン膜を形成する段階と、
前記絶縁膜の上面と前記開口の上部側壁及び前記残留タングステン膜上とにタングステン窒化膜を形成する段階と、を含み、
前記タングステン膜を形成する段階は、
タングステンを含む第1反応物質を供給して前記開口の内側壁及び底面と前記絶縁膜の上面とに化学吸着する段階と、
パージガスを用いて化学吸着されていない前記第1反応物質を除去する段階と、
第2反応物質を供給して前記開口の内側壁及び底面と前記絶縁膜の上面とに前記タングステンを蒸着する段階と、を含むことを特徴とする半導体素子の製造方法。 - 前記絶縁膜を形成する段階は、テトラエトキシシラン(Si(OC2H5)4:tetra−ethoxy silane)ガスと酸素(O2)又はオゾン(O3)ガスとをソースガスとして用いる化学気相蒸着(CVD)工程によって行われることを特徴とする請求項1に記載の半導体素子の製造方法。
- 前記化学気相蒸着工程は、プラズマ増強CVD(PECVD)工程又は高密度プラズマCVD(HDPCVD)工程を含むことを特徴とする請求項2に記載の半導体素子の製造方法。
- 前記開口を形成する段階は、
前記絶縁膜の上面に前記導電性構造物間の半導体基板に対応する絶縁膜を露出するマスクパターンを形成する段階と、
前記マスクパターンをエッチングマスクとして用いて乾式エッチング工程を行う段階と、を含むことを特徴とする請求項1に記載の半導体素子の製造方法。 - 前記第1反応物質は、WF6、WCl5、WBr6、WCo6、W(C2H2)6、W(PF3)6、W(allyl)4、(C2H5)WH2、[CH3(C5H4)2]2WH2、(C5H5)W(CO)3(CH3)、W(butadiene)3、W(methylvinyl−ketone)3、(C5H5)HW(CO)3、(C7H8)W(CO)3、及びこれらの化合物からなる群より選択されるいずれか一種を含み、前記第2反応物質は、H2、Si2H6、B2H6、PH3、SiH4、及びこれらの化合物からなる群より選択されるいずれか一種を含むことを特徴とする請求項1に記載の半導体素子の製造方法。
- 前記パージガスは、He、Ne、Ar、Xe、N2からなる群より選択されるいずれか一種を含むことを特徴とする請求項1に記載の半導体素子の製造方法。
- 前記タングステン膜は、前記開口の内側壁及び底面と前記絶縁膜の上面とから約5Å〜200Åの厚さまで蒸着されることを特徴とする請求項1に記載の半導体素子の製造方法。
- 前記残留タングステン膜を形成する段階は、
前記絶縁膜を具備する前記半導体基板が位置する工程チャンバの内部にエッチングプラズマを生成する段階と、
前記エッチングプラズマを前記絶縁膜の上面及び前記開口の上部側壁に加速し、前記開口の下部に加速される前記エッチングプラズマを抑制する可変バイアスを提供する段階と、
前記エッチングプラズマを用いて前記開口の上部側壁及び前記絶縁膜の上面に形成されたタングステン膜をエッチングする段階と、を含むことを特徴とする請求項1に記載の半導体素子の製造方法。 - 前記エッチングプラズマを生成する段階は、
前記工程チャンバの内部にソースガスを提供する段階と、
前記ソースガスを前記エッチングプラズマに変換するソース電源を供給する段階と、を更に含むことを特徴とする請求項8に記載の半導体素子の製造方法。 - 前記工程チャンバの内部は0.005Torr〜50Torrの圧力に維持され、前記ソース電源は10W〜3000Wの範囲で印加されることを特徴とする請求項9に記載の半導体素子の製造方法。
- 前記可変バイアスは80W〜120Wの範囲で印加されるラジオ周波数(RF)バイアスを含むことを特徴とする請求項10に記載の半導体素子の製造方法。
- 前記ソースガスは、前記タングステン膜をエッチングしうるエッチング用ソースガスと前記タングステン膜に対するエッチング速度を調節するポリマガスを含むことを特徴とする請求項9に記載の半導体素子の製造方法。
- 前記エッチング用ソースガスは塩素(Cl2)又は四フッ化炭素(CF4)を含み、前記ポリマガスは三フッ化メタン(CHF3)ガス及び塩化ホウ素(BCl3)ガスを含むことを特徴とする請求項12に記載の半導体素子の製造方法。
- 前記タングステン窒化膜を形成する段階は、
タングステンを含む第1反応物質を供給して前記開口の上部側壁及び前記絶縁膜の上面と前記残留タングステン膜の表面とに化学吸着する段階と、
パージガスを供給して化学吸着されていない前記第1反応物質を除去する段階と、
第2反応物質を供給して前記開口の上部側壁及び前記絶縁膜の上面と前記残留タングステン膜の表面とにタングステンのみを蒸着させることで臨時タングステン膜を形成する段階と、
パージガスを供給して前記第1反応物質と反応しない前記第2反応物質と前記第1反応物質及び第2反応物質の化学反応によって生成された反応生成物とを除去する段階と、
窒素を含む第3反応物質を供給してタングステンを含む臨時タングステン膜を窒化させる段階と、を含むことを特徴とする請求項1に記載の半導体素子の製造方法。 - 前記第1反応物質は、WF6、WCl5、WBr6、WCo6、W(C2H2)6、W(PF3)6、W(allyl)4、(C2H5)WH2、[CH3(C5H4)2]2WH2、(C5H5)W(CO)3(CH3)、W(butadiene)3、W(methylvinyl−ketone)3、(C5H5)HW(CO)3、(C7H8)W(CO)3、及びこれらの化合物からなる群より選択されるいずれか一種を含み、前記第2反応物質は、H2、Si2H6、B2H6、PH3、SiH4、及びこれらの化合物からなる群より選択されるいずれか一種を含み、前記第3反応物質は、窒素又はアンモニアガスを含むことを特徴とする請求項14に記載の半導体素子の製造方法。
- 前記タングステンプラグを形成する段階は、
前記タングステン窒化膜の上面にタングステンを蒸着して前記開口を埋め立てるプラグ用タングステン膜を形成する段階と、
前記絶縁膜の上面が露出するように前記タングステン窒化膜及び前記プラグ用タングステン膜を平坦化して前記プラグ用タングステン膜を前記開口の内部にのみ残留させる段階と、を含むことを特徴とする請求項1に記載の半導体素子の製造方法。 - 前記タングステン窒化膜及び前記プラグ用タングステン膜に対する平坦化工程は、化学機械的研磨(CMP)工程によって行われることを特徴とする請求項16に記載の半導体素子の製造方法。
- 前記タングステンプラグを形成した後、
前記タングステンプラグを含む前記絶縁膜の上部に層間絶縁膜を形成する段階と、
前記層間絶縁膜を部分的に除去して前記タングステンプラグを露出させるビアホールを形成する段階と、
前記ビアホールの内部を満たし、前記タングステンプラグと電気的に接触する導電ラインを形成する段階と、を更に有することを特徴とする請求項1に記載の半導体素子の製造方法。 - 前記ビアホールを形成する段階はダマシン工程によって行われ、前記導電ラインは、タングステン、アルミニウム、及び銅のいずれかを含むことを特徴とする請求項18に記載の半導体素子の製造方法。
- 複数の導電性構造物を具備する半導体基板と、
前記半導体基板上において前記導電性構造物間の空間を埋め立てて上面が平坦化した絶縁膜と、
前記絶縁膜を貫通して前記半導体基板の一部と接触するタングステンプラグと、
前記タングステンプラグを含む前記絶縁膜の上部に位置して前記タングステンプラグを露出させるビアホールを具備する層間絶縁膜と、
前記タングステンプラグと前記絶縁膜との間に位置して、前記半導体基板に隣接する下部がタングステン膜及びタングステン窒化膜で構成され、前記層間絶縁膜に隣接する上部が前記タングステン窒化膜で構成される障壁層と、
前記タングステンプラグと電気的に接続されて前記ビアホールの内部に位置する導電ラインと、を備えることを特徴とする半導体素子。 - 前記導電性構造物は、素子分離膜によって限定され、前記半導体基板上から第1方向に沿って延長する活性領域に位置するストリング選択トランジスタ、複数のセル選択トランジスタ、及び接地選択トランジスタを含み、
前記第1方向と直角をなす第2方向に延長する複数のストリング選択トランジスタ、複数のセル選択トランジスタ、及び複数の接地選択トランジスタは、それぞれフラッシュメモリ素子のストリング選択ライン、ワードライン、及び接地ラインを含むことを特徴とする請求項20に記載の半導体素子。 - 前記導電性構造物は、素子分離膜によって限定され、前記半導体基板上で第1方向に沿って延長するゲートラインと該ゲートラインの周辺に位置して前記半導体基板の表面にイオン注入工程によって形成されたソース及びドレイン領域を具備するDRAMメモリ素子の単位トランジスタとを含むことを特徴とする請求項20に記載の半導体素子。
- 前記導電ラインは銅を含むことを特徴とする請求項20に記載の半導体素子。
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