JP5332168B2 - Ｉｉｉ族窒化物結晶の製造方法 - Google Patents

Ｉｉｉ族窒化物結晶の製造方法 Download PDF

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Publication number
JP5332168B2
JP5332168B2 JP2007258567A JP2007258567A JP5332168B2 JP 5332168 B2 JP5332168 B2 JP 5332168B2 JP 2007258567 A JP2007258567 A JP 2007258567A JP 2007258567 A JP2007258567 A JP 2007258567A JP 5332168 B2 JP5332168 B2 JP 5332168B2
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crystal
group iii
iii nitride
substrates
nitride crystal
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Expired - Fee Related
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Japanese (ja)
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JP2008143772A5 (cg-RX-API-DMAC7.html
JP2008143772A (ja
Inventor
奈保 水原
康二 上松
倫正 宮永
圭祐 谷崎
英章 中幡
成二 中畑
拓司 岡久
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Priority to JP2007258567A priority Critical patent/JP5332168B2/ja
Priority to KR1020097008369A priority patent/KR101410534B1/ko
Priority to PCT/JP2007/072096 priority patent/WO2008059875A1/ja
Priority to EP07831826.8A priority patent/EP2083099B1/en
Publication of JP2008143772A publication Critical patent/JP2008143772A/ja
Priority to US12/467,297 priority patent/US8258051B2/en
Publication of JP2008143772A5 publication Critical patent/JP2008143772A5/ja
Priority to US13/564,731 priority patent/US8404042B2/en
Priority to US13/762,401 priority patent/US8709923B2/en
Application granted granted Critical
Publication of JP5332168B2 publication Critical patent/JP5332168B2/ja
Priority to US14/194,830 priority patent/US8872309B2/en
Priority to US14/491,962 priority patent/US9064706B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/405—Orientations of crystalline planes
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B19/00—Liquid-phase epitaxial-layer growth
    • C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/025—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C30B25/20—Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/38—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C30B29/406—Gallium nitride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02387—Group 13/15 materials
    • H01L21/02389—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/02433—Crystal orientation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02658—Pretreatments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24752—Laterally noncoextensive components

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2007258567A 2006-11-17 2007-10-02 Ｉｉｉ族窒化物結晶の製造方法 Expired - Fee Related JP5332168B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2007258567A JP5332168B2 (ja) 2006-11-17 2007-10-02 Ｉｉｉ族窒化物結晶の製造方法
KR1020097008369A KR101410534B1 (ko) 2006-11-17 2007-11-14 Ⅲ족 질화물 결정의 제조 방법
PCT/JP2007/072096 WO2008059875A1 (fr) 2006-11-17 2007-11-14 Procédé de fabrication d'un cristal de nitrure d'élément du groupe iii
EP07831826.8A EP2083099B1 (en) 2006-11-17 2007-11-14 Method of manufacturing iii-nitride crystal
US12/467,297 US8258051B2 (en) 2006-11-17 2009-05-17 Method of manufacturing III-nitride crystal, and semiconductor device utilizing the crystal
US13/564,731 US8404042B2 (en) 2006-11-17 2012-08-02 Group-III nitride crystal composite
US13/762,401 US8709923B2 (en) 2006-11-17 2013-02-08 Method of manufacturing III-nitride crystal
US14/194,830 US8872309B2 (en) 2006-11-17 2014-03-03 Composite of III-nitride crystal on laterally stacked substrates
US14/491,962 US9064706B2 (en) 2006-11-17 2014-09-19 Composite of III-nitride crystal on laterally stacked substrates

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006311622 2006-11-17
JP2006311622 2006-11-17
JP2007258567A JP5332168B2 (ja) 2006-11-17 2007-10-02 Ｉｉｉ族窒化物結晶の製造方法

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JP2008143772A5 JP2008143772A5 (cg-RX-API-DMAC7.html) 2010-11-04
JP5332168B2 true JP5332168B2 (ja) 2013-11-06

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US (4) US8258051B2 (cg-RX-API-DMAC7.html)
EP (1) EP2083099B1 (cg-RX-API-DMAC7.html)
JP (1) JP5332168B2 (cg-RX-API-DMAC7.html)
KR (1) KR101410534B1 (cg-RX-API-DMAC7.html)
WO (1) WO2008059875A1 (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015224143A (ja) * 2014-05-26 2015-12-14 株式会社サイオクス Ｉｉｉ族窒化物基板の製造方法
JP2018058737A (ja) * 2016-10-07 2018-04-12 古河機械金属株式会社 Ｉｉｉ族窒化物半導体基板、及び、ｉｉｉ族窒化物半導体基板の製造方法
US11662374B2 (en) 2017-03-17 2023-05-30 Furukawa Co., Ltd. Group III nitride semiconductor substrate

Families Citing this family (97)

* Cited by examiner, † Cited by third party
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US9518340B2 (en) 2006-04-07 2016-12-13 Sixpoint Materials, Inc. Method of growing group III nitride crystals
JP5332168B2 (ja) * 2006-11-17 2013-11-06 住友電気工業株式会社 Ｉｉｉ族窒化物結晶の製造方法
US9064706B2 (en) 2006-11-17 2015-06-23 Sumitomo Electric Industries, Ltd. Composite of III-nitride crystal on laterally stacked substrates
WO2008100502A1 (en) 2007-02-12 2008-08-21 The Regents Of The University Of California Al(x)ga(1-x)n-cladding-free nonpolar iii-nitride based laser diodes and light emitting diodes
JP2010006685A (ja) * 2008-05-28 2010-01-14 Sumitomo Electric Ind Ltd ＡｌｘＧａ１−ｘＮ単結晶および電磁波透過体
JP2009286652A (ja) * 2008-05-28 2009-12-10 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶、ｉｉｉ族窒化物結晶基板および半導体デバイスの製造方法
US20110104438A1 (en) * 2008-07-01 2011-05-05 Sumitomo Electric Industries, Ltd. AlxGa(1-x)N SINGLE CRYSTAL, METHOD OF PRODUCING AlxGa(1-x)N SINGLE CRYSTAL, AND OPTICAL COMPONENT
JP5012700B2 (ja) * 2008-07-01 2012-08-29 住友電気工業株式会社 Ｉｉｉ族窒化物結晶接合基板およびその製造方法ならびにｉｉｉ族窒化物結晶の製造方法
US8673074B2 (en) * 2008-07-16 2014-03-18 Ostendo Technologies, Inc. Growth of planar non-polar {1 -1 0 0} M-plane and semi-polar {1 1 -2 2} gallium nitride with hydride vapor phase epitaxy (HVPE)
JP2010042980A (ja) * 2008-07-17 2010-02-25 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶の製造方法およびｉｉｉ族窒化物結晶
US8502337B2 (en) * 2008-08-05 2013-08-06 Sumitomo Electric Industries, Ltd. Schottky barrier diode and method for manufacturing Schottky barrier diode
JP4908467B2 (ja) * 2008-08-06 2012-04-04 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体結晶の製造方法
JP5112983B2 (ja) * 2008-08-06 2013-01-09 豊田合成株式会社 Ｉｉｉ族窒化物半導体製造方法およびｉｉｉ族窒化物半導体育成用の種結晶
JPWO2010024285A1 (ja) * 2008-09-01 2012-01-26 住友電気工業株式会社 窒化物基板の製造方法および窒化物基板
JP2010068109A (ja) * 2008-09-09 2010-03-25 Sumitomo Electric Ind Ltd 弾性表面波素子
JP2010068097A (ja) * 2008-09-09 2010-03-25 Sumitomo Electric Ind Ltd 弾性表面波素子
JP4730422B2 (ja) * 2008-10-24 2011-07-20 住友電気工業株式会社 Ｉｉｉ族窒化物半導体電子デバイス、ｉｉｉ族窒化物半導体電子デバイスを作製する方法、及びｉｉｉ族窒化物半導体エピタキシャルウエハ
JP5515341B2 (ja) * 2009-03-16 2014-06-11 住友電気工業株式会社 Ｉｉｉ族窒化物結晶の成長方法
US8742459B2 (en) 2009-05-14 2014-06-03 Transphorm Inc. High voltage III-nitride semiconductor devices
JP5509680B2 (ja) * 2009-06-01 2014-06-04 三菱化学株式会社 Ｉｉｉ族窒化物結晶及びその製造方法
WO2010140564A1 (ja) 2009-06-01 2010-12-09 三菱化学株式会社 窒化物半導体結晶およびその製造方法
JP5888317B2 (ja) * 2009-06-29 2016-03-22 住友電気工業株式会社 Ｉｉｉ族窒化物結晶
JP5446622B2 (ja) * 2009-06-29 2014-03-19 住友電気工業株式会社 Ｉｉｉ族窒化物結晶およびその製造方法
JP2011016676A (ja) 2009-07-07 2011-01-27 Sumitomo Electric Ind Ltd 窒化物半導体基板の製造方法
JP5447289B2 (ja) * 2009-08-19 2014-03-19 三菱化学株式会社 窒化物半導体結晶およびその製造方法
US8598685B2 (en) 2009-09-04 2013-12-03 Sumitomo Electric Industries, Ltd. GaN single crystal substrate and method of manufacturing thereof and GaN-based semiconductor device and method of manufacturing thereof
JP5549158B2 (ja) * 2009-09-04 2014-07-16 住友電気工業株式会社 ＧａＮ単結晶基板およびその製造方法、ならびにＧａＮ系半導体デバイスおよびその製造方法
JP5549157B2 (ja) * 2009-09-04 2014-07-16 住友電気工業株式会社 ＧａＮ単結晶基板およびその製造方法、ならびにＧａＮ系半導体デバイスおよびその製造方法
JP5471251B2 (ja) * 2009-09-30 2014-04-16 住友電気工業株式会社 ＧａＮ単結晶基板およびＧａＮ系半導体デバイス
JP5381581B2 (ja) * 2009-09-30 2014-01-08 住友電気工業株式会社 窒化ガリウム基板
JP5365454B2 (ja) * 2009-09-30 2013-12-11 住友電気工業株式会社 Ｉｉｉ族窒化物半導体基板、エピタキシャル基板及び半導体デバイス
JP5423294B2 (ja) * 2009-09-30 2014-02-19 住友電気工業株式会社 窒化物半導体発光素子
US8629065B2 (en) 2009-11-06 2014-01-14 Ostendo Technologies, Inc. Growth of planar non-polar {10-10} M-plane gallium nitride with hydride vapor phase epitaxy (HVPE)
JP5445105B2 (ja) * 2009-12-18 2014-03-19 三菱化学株式会社 Ｉｉｉ族窒化物結晶の製造方法及びｉｉｉ族窒化物結晶
JP5573225B2 (ja) * 2010-02-26 2014-08-20 三菱化学株式会社 第１３族金属窒化物結晶の製造方法、該製造方法により得られる第１３族金属窒化物結晶および半導体デバイスの製造方法
CN102782966B (zh) * 2010-03-04 2017-04-26 加利福尼亚大学董事会 在C‑方向错切小于+/‑15度的m‑平面基底上的半极性III‑氮化物光电子装置
US8761218B2 (en) 2010-04-05 2014-06-24 The Regents Of The University Of California Aluminum gallium nitride barriers and separate confinement heterostructure (SCH) layers for semipolar plane III-nitride semiconductor-based light emitting diodes and laser diodes
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
JP2012006772A (ja) * 2010-06-22 2012-01-12 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶の成長方法およびｉｉｉ族窒化物結晶基板
JP2012019069A (ja) * 2010-07-08 2012-01-26 Toshiba Corp 電界効果トランジスタおよび電界効果トランジスタの製造方法
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